CN219800823U - Semiconductor element assembly platform with circumferential positioning function - Google Patents
Semiconductor element assembly platform with circumferential positioning function Download PDFInfo
- Publication number
- CN219800823U CN219800823U CN202320707058.4U CN202320707058U CN219800823U CN 219800823 U CN219800823 U CN 219800823U CN 202320707058 U CN202320707058 U CN 202320707058U CN 219800823 U CN219800823 U CN 219800823U
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- platform
- annular
- assembly platform
- circumferential positioning
- assembly
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000005538 encapsulation Methods 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor element assembling platform with circumferential positioning, which relates to the technical field of semiconductor element assembling platforms and aims to solve the problems that the existing semiconductor elements are assembled flatly, and the assembling and arranging precision is low due to the fact that the number of circumferential positioning is large when semiconductors are assembled and arranged.
Description
Technical Field
The utility model relates to the technical field of semiconductor element assembly platforms, in particular to a semiconductor element assembly platform with circumferential positioning.
Background
In the conventional semiconductor device assembly platform device, as in the application number: 201921209667.7; the name is: an assembly platform for semiconductor light emitting device production, the apparatus comprising: the fixing frame is of a C-shaped structure, an electric telescopic rod is fixedly arranged on the inner top surface of the fixing frame, a pressing plate is fixedly arranged at the lower end of the electric telescopic rod, a rotating assembly is arranged on the inner bottom surface of the fixing frame, a disc is fixedly arranged at the upper end of the rotating assembly, the pressing plate is matched with the disc, evenly-distributed placing grooves are formed in the edge of the upper surface of the disc in a surrounding mode, clamping plates are symmetrically arranged on the inner side surfaces of the placing grooves, sliding rods are fixedly arranged on the outer side surfaces of the clamping plates, and the sliding rods are embedded into the disc in a sliding mode; through design standing groove and splint, pressing the heating panel and can realizing the fixed to the heating panel between two splint, be convenient for carry out the centre gripping equipment to the heating panel of equidimension not, and rotate the disc and can place a plurality of heating panels and semiconductor device fast, packaging efficiency is high, has reduced manufacturing cost.
However, the conventional semiconductor elements are assembled flatly, and the problem of low assembly and arrangement positioning accuracy is caused by the fact that the number of circumferential positioning is large and crowded during the assembly and arrangement of the semiconductors; therefore, the existing requirements are not satisfied, and for this reason, we propose a semiconductor device assembly platform with circumferential positioning.
Disclosure of Invention
The present utility model is directed to a semiconductor device assembling platform with circumferential positioning, so as to solve the problem in the above background art that the assembling and positioning accuracy is low due to the fact that the number of circumferential positioning is large during the assembling and arrangement of the semiconductors.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor component assembling platform with annular location, includes assembling platform, annular platform, the upper end of assembling platform is provided with the fan, the inside of assembling platform is provided with annular platform, one side of assembling platform is provided with the automatically controlled board, drops into the semiconductor from the equipment slide in the annular platform earlier, later the semiconductor gets into the inside of annular platform, because the rotatory of encapsulation drive stake drive first drive frame strip, second drive frame strip to make the semiconductor arrange in order rotatory, thereby make single semiconductor arrange in order to get into the encapsulation locating hole in order to arrange and assemble, solved current semiconductor component equipment level, because the crowded condition many of annular location quantity when its semiconductor equipment is arranged, cause the problem that the equipment is arranged positioning accuracy is low.
Further, the inside of annular platform is provided with encapsulation drive stake, the outside week of encapsulation drive stake all is provided with the connecting plate, the outside of connecting plate is provided with first drive frame strip.
Further, one end of the outer side of the first driving frame strip is provided with a second driving frame strip.
Further, an assembly slideway is arranged on one side of the annular table, and the assembly slideway and the annular table are integrally formed, and the assembly slideway is used for guiding and arranging semiconductors.
Further, the front end and the rear end of the annular table are respectively provided with a packaging robot.
Further, the lower extreme of annular platform is provided with the support, the up end of annular platform is provided with encapsulation locating hole, and encapsulation locating hole and annular platform integrated into one piece set up, and single semiconductor can be arranged in order to the ring and get into encapsulation locating hole and arrange and assemble.
Further, a working lamp is arranged on one side of the fan and used for prompting the working state of the device.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, through the arrangement of the assembly platform, the annular table and the packaging robot, the semiconductors are firstly put into the assembly slide way in the annular table, and then the semiconductors enter the annular table, and the packaging driving pile drives the first driving frame strip and the second driving frame strip to rotate, so that the semiconductors are orderly arranged and rotated, and accordingly, the single semiconductors can be orderly arranged in a circumferential direction and enter the packaging positioning holes for arrangement and assembly, and the problem that the assembly positioning precision is low due to the fact that the number of circumferential positioning is large when the semiconductors are assembled and arranged in the conventional semiconductor element assembly plane is solved.
2. Through the setting of fan, the fan blows in the assembled platform after with outside air suction filtration to make the inside atmospheric pressure of assembled platform slightly be greater than outside atmospheric pressure, thereby effectively prevent that the dust from getting into from assembled platform's gap.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the annular table structure of the present utility model;
FIG. 3 is a schematic view of a blower structure according to the present utility model;
FIG. 4 is an enlarged view of a portion of the utility model at A;
in the figure: 1. assembling a platform; 2. a blower; 3. an electric control board; 4. a work light; 5. an annular table; 6. a bracket; 7. packaging the robot; 8. packaging the driving pile; 9. a connecting plate; 10. a first driving frame bar; 11. a second driving frame bar; 12. packaging the positioning holes; 13. and assembling the slideway.
Detailed Description
Referring to fig. 1-4, an embodiment of the present utility model is provided: the utility model provides a semiconductor component assembling platform with circumferential positioning, includes assembling platform 1, annular platform 5, the upper end of assembling platform 1 is provided with fan 2, the inside of assembling platform 1 is provided with annular platform 5, one side of assembling platform 1 is provided with automatically controlled board 3.
The inside of annular platform 5 is provided with encapsulation drive stake 8, the outside week of encapsulation drive stake 8 all is provided with connecting plate 9, the outside of connecting plate 9 is provided with first drive frame strip 10, the outside one end of first drive frame strip 10 is provided with second drive frame strip 11, one side of annular platform 5 is provided with equipment slide 13, and equipment slide 13 and annular platform 5 integrated into one piece set up, both ends are provided with encapsulation robot 7 respectively around the annular platform 5, the lower extreme of annular platform 5 is provided with support 6, the up end of annular platform 5 is provided with encapsulation locating hole 12, and encapsulation locating hole 12 and annular platform 5 integrated into one piece set up, one side of fan 2 is provided with work light 4.
Firstly, semiconductors are put into the assembly slide ways 13 in the annular table 5, then the semiconductors enter the annular table 5, and the packaging driving piles 8 drive the first driving frame strips 10 and the second driving frame strips 11 to rotate, so that the semiconductors are orderly arranged and rotated, and then single semiconductors can enter the packaging positioning holes 12 to be arranged and assembled in a circular order, and the problem that the assembly positioning accuracy is low due to the fact that the number of circular positioning is large when the semiconductors are assembled and arranged in the prior semiconductor element assembly plane is solved.
Working principle: when the semiconductor packaging machine is used, semiconductors are firstly put into the packaging slideway 13 in the annular table 5, then enter the annular table 5, and the packaging driving pile 8 drives the first driving frame strip 10 and the second driving frame strip 11 to rotate, so that the semiconductors are orderly arranged and rotated, and then the single semiconductors can be annularly orderly arranged to enter the packaging positioning holes 12 for arrangement and assembly, the problem that the assembly positioning accuracy is low due to the fact that the number of annularly positioned semiconductors is large when the semiconductors are assembled and arranged is solved, and the fan 2 sucks and filters external air and then blows the external air into the assembly table 1, so that the internal air pressure of the assembly table 1 is slightly larger than the external air pressure, and dust is effectively prevented from entering from a gap of the assembly table 1.
Claims (7)
1. The utility model provides a semiconductor component assembly platform with circumferential location, includes assembly platform, annular platform, its characterized in that: the upper end of the assembly platform is provided with a fan, the inside of the assembly platform is provided with an annular table, and one side of the assembly platform is provided with an electric control plate.
2. A semiconductor device assembly platform with circumferential positioning according to claim 1, wherein: the inside of annular platform is provided with encapsulation drive stake, the outside week of encapsulation drive stake all is provided with the connecting plate, the outside of connecting plate is provided with first drive frame strip.
3. A semiconductor device assembly platform with circumferential positioning according to claim 2, wherein: and a second driving frame strip is arranged at one end of the outer side of the first driving frame strip.
4. A semiconductor device assembly platform with circumferential positioning according to claim 1, wherein: an assembly slideway is arranged on one side of the annular table, and the assembly slideway and the annular table are integrally formed.
5. A semiconductor device assembly platform with circumferential positioning according to claim 1, wherein: the front end and the rear end of the annular table are respectively provided with a packaging robot.
6. A semiconductor device assembly platform with circumferential positioning according to claim 1, wherein: the lower extreme of annular platform is provided with the support, the up end of annular platform is provided with encapsulation locating hole, and encapsulation locating hole and annular platform integrated into one piece set up.
7. A semiconductor device assembly platform with circumferential positioning according to claim 1, wherein: a working lamp is arranged on one side of the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320707058.4U CN219800823U (en) | 2023-04-03 | 2023-04-03 | Semiconductor element assembly platform with circumferential positioning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320707058.4U CN219800823U (en) | 2023-04-03 | 2023-04-03 | Semiconductor element assembly platform with circumferential positioning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800823U true CN219800823U (en) | 2023-10-03 |
Family
ID=88187680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320707058.4U Active CN219800823U (en) | 2023-04-03 | 2023-04-03 | Semiconductor element assembly platform with circumferential positioning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800823U (en) |
-
2023
- 2023-04-03 CN CN202320707058.4U patent/CN219800823U/en active Active
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