CN219778878U - Phase change heat transfer fin radiator with increased performance - Google Patents
Phase change heat transfer fin radiator with increased performance Download PDFInfo
- Publication number
- CN219778878U CN219778878U CN202320564410.3U CN202320564410U CN219778878U CN 219778878 U CN219778878 U CN 219778878U CN 202320564410 U CN202320564410 U CN 202320564410U CN 219778878 U CN219778878 U CN 219778878U
- Authority
- CN
- China
- Prior art keywords
- heat
- phase change
- composite superconducting
- transfer fin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 63
- 230000001965 increasing effect Effects 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000001704 evaporation Methods 0.000 claims abstract description 15
- 230000008020 evaporation Effects 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000009833 condensation Methods 0.000 claims abstract description 6
- 230000005494 condensation Effects 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims description 52
- 238000005452 bending Methods 0.000 claims description 30
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 8
- 230000002787 reinforcement Effects 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 description 26
- 238000003466 welding Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000001514 detection method Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010273 cold forging Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000001819 mass spectrum Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Abstract
The utility model discloses a phase change heat transfer fin radiator with increased performance, which comprises: the heat dissipation substrate is used for being arranged on the semiconductor power device; the phase change heat transfer fin, the phase change heat transfer fin is located on the radiating substrate, and, the phase change heat transfer fin includes: a closed plate microchannel having an interior of 1.0× (10 ‑2 ～10 ‑3 ) Negative of PaPressing, and arranging working fluid in the pressing; the area of the closed flat micro-channel close to the heat dissipation substrate is set as an evaporation end; the heat exchange fins are arranged on the heat dissipation substrate and the phase change heat exchange fins, and the area, close to the heat exchange fins, of the closed flat plate micro-channel is set as a condensation end; when the semiconductor power device on the heat dissipation substrate generates heat, the liquid in the evaporation end is gasified to transfer the heat, the condensing end is used for liquefying the gas to release the heat, a recyclable uniform temperature transfer is formed, and the heat exchange fins are used for carrying out efficient heat exchange.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a phase-change heat transfer fin radiator with increased performance.
Background
With the increasing market demands of high-power semiconductor devices such as communication, new energy, rail transit, smart grids, medical equipment and the like, high-power semiconductor devices such as GTO, MCT, IGBT and the like are rapidly developed. We are faced with the current situation of such a heat dissipation requirement: (1) the packaging density of the high-power semiconductor device is continuously improved, and the heat flux density is continuously increased; (2) as the performance of the high-power semiconductor device is continuously improved, the heating loss is higher and higher; (3) high-power semiconductor devices have been penetrated into various fields, and the application environments thereof are continuously expanding, and the thermal environments used are very different. These trends of high power semiconductor devices make the problem of overheating of electronic devices more and more prominent;
therefore, when the high-power semiconductor device runs with high power consumption or high heat flux density, the heat conductivity coefficient of the conventional forced air cooling radiator is only 90-220W/m.K generally; the radiator substrate contacts with a heat source of the high-power semiconductor device to form a high-temperature area, and heat is transferred to the periphery by conduction with the heat source as the center, so that a higher temperature gradient is formed; the temperature distribution is very uneven as the temperature of the fins is higher and the temperature of the fins is lower, so that the temperature of the fins in the high temperature area of the radiator substrate is higher, when air flows, a larger temperature difference is formed, the temperature of the fins away from the high temperature area is lower, the temperature difference between the fins and the air is lower, and the heat exchange efficiency is lower; the lower the heat exchange efficiency of the fins is, the volume and the weight are greatly improved, so the height of the fins is generally less than or equal to 85mm; the heat exchange area of the radiator is increased only by reducing the fin spacing so as to meet the heat dissipation requirement, and thus the flow resistance of the radiator is greatly increased.
Disclosure of Invention
Aiming at the problems existing in the prior art, the utility model provides a phase change heat transfer fin radiator with increased performance, which aims to solve the problems that the conventional forced air cooling radiator is very uneven in heat distribution in forced convection application, a high-temperature area is mainly concentrated in a substrate heat source area, fin heat exchange efficiency is low, temperature difference is large and the like.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a phase change heat transfer fin heat sink of increased performance comprising:
the heat dissipation substrate is used for being arranged on the semiconductor power device;
the phase change heat transfer fin, the phase change heat transfer fin is located on the radiating substrate, and, the phase change heat transfer fin includes: the device comprises a closed flat plate micro-channel, wherein the inside of the closed flat plate micro-channel is set to be a negative pressure of 1.0X (10-2-10-3) Pa, and working fluid is arranged in the closed flat plate micro-channel; the area of the closed flat micro-channel close to the heat dissipation substrate is set as an evaporation end;
the heat exchange fins are arranged on the heat dissipation substrate and the phase change heat exchange fins, the heat exchange fin material is an aluminum alloy material with the heat conductivity coefficient of 130-220W/m.K, and the area, close to the heat exchange fins, of the closed flat plate microchannel is a condensation end;
when the semiconductor power device on the heat dissipation substrate generates heat, the liquid in the evaporation end is gasified to transfer the heat, the condensing end is used for liquefying the gas to release the heat, a recyclable uniform temperature transfer is formed, and the heat exchange fins are used for carrying out efficient heat exchange.
Optionally, the heat dissipation substrate is a phase change substrate or a solid substrate, and the solid substrate is made of an aluminum alloy material with a heat conduction coefficient of 130-220W/m.K; the phase change substrate transfers heat through the phase change of working medium, wherein the phase change substrate comprises a shell, the inner surface of the shell is sintered with a capillary structure layer, the inner surface of the shell is provided with a structure reinforcing column and a structure supporting step, and the shell is further provided with a steam cavity and a structure locking hole.
Optionally, the phase change substrate further comprises a structural cover plate, the structural cover plate is brazed on the shell by vacuum brazing or atmosphere brazing, and the upper surface of the structural reinforcing column and the structural supporting step are equal in height to form a welding surface together.
Optionally, the pipeline of the closed flat micro-channel is set as a composite superconducting flat heat pipe, and the composite superconducting flat heat pipe includes: equidistant bending composite superconducting flat heat pipe and non-equidistant bending composite superconducting flat heat pipe;
the inner surface of the composite superconducting flat heat pipe is provided with structural reinforcing ribs, the spacing between the structural reinforcing ribs is 10.0-50.0 mm, and the width of the structural reinforcing ribs is 0.3-5.0 mm.
Optionally, the distance P between the equidistant bending composite superconducting flat plate heat pipes is set to be 5-25 mm, the horizontal length of the equidistant bending composite superconducting flat plate heat pipes is l=n×p (n is not less than 3), the thickness of the equidistant bending composite superconducting flat plate heat pipes is 2.0-5.0 mm, and the height H of the equidistant bending composite superconducting flat plate heat pipes is 50-400 mm.
Optionally, the non-equidistant bending composite superconducting flat plate heat pipes adjust the spacing of the flat plate heat pipes according to the heat flux density on the surface of the corresponding radiating substrate;
the interval between the high heat flux density areas is set to be P2, the interval between the low heat flux density areas is set to be P1, the P1 is set to be 5-20 mm, the P2 is set to be 15-30 mm, the horizontal length L=n1+n2 of the non-equidistant bending composite superconducting flat plate heat pipe is equal to P2, the thickness of the non-equidistant bending composite superconducting flat plate heat pipe is 2.0-5.0 mm, the height H of the non-equidistant bending composite superconducting flat plate heat pipe is 50-400 mm, and the width of the non-equidistant bending composite superconducting flat plate heat pipe is generally 30-200 mm.
Optionally, the inner surface of the composite superconducting flat heat pipe is provided with concave cavity capillary structures, and the spacing between the concave cavity capillary structures is 1.0-10.0 mm.
Optionally, a horn groove is arranged on the inner surface of the concave cavity capillary structure, wherein the angle theta of the horn groove is set to be 30-60 degrees, the opening width d of the surface of the horn groove is 0.2-3.0 mm, the horn groove is provided with a concave rectangular groove, the length l of the concave rectangular groove is 1.0-5.0 mm, and the thickness h of the concave rectangular groove is 0.3-2.0 mm.
Optionally, the phase change heat transfer fin further comprises a composite capillary structure, wherein the composite capillary structure provides capillary force for condensed liquid to flow back to the evaporation end.
A preparation method of a phase change heat transfer fin radiator with increased performance comprises the following steps:
the shell shape of the radiator base plate is processed through NC processing, die casting or cold forging and hot forging, a base plate cavity is formed by the radiator base plate and the structural cover plate, and a structural support step, a structural reinforcing column and a structural locking hole are formed on the phase-change base plate;
welding the radiator sealing shell through a welding sealing process such as vacuum brazing and the like and a structural cover plate, performing sealing test on the radiator sealing shell through a welded process tail pipe, performing leak detection by using helium mass spectrum leak detection equipment, wherein the helium leak detection pressure is 600+/-50 Kpa, the time is 60-90 s, and the judgment standard is <1.0 x 10 < -7 > mbar.l/s;
vacuumizing the sealed shell through a process tail pipe, wherein the vacuum degree is required to be less than 10Pa; injecting a phase change working medium through a process tail pipe, and calculating the quality of the working medium according to the thickness of the capillary structure and the heat transmission capacity of the steam cavity;
sealing the process tail pipe by using a sealing tool, fusing and sealing the sealing point by using TIG, high-power laser or electron beam welding, shaping, and NC processing the outer surface;
processing the phase-change heat transfer fins through an aluminum extrusion molding process, cutting the phase-change heat transfer fins according to the calculated blanking size, ultrasonically cleaning and drying, and mechanically sealing one end of the phase-change heat transfer fins through a mechanical sealing device; vacuumizing, wherein the vacuum degree is required to be less than 1 x 10 < -3 > Pa, and injecting a phase change working medium;
secondly vacuumizing for the second time, wherein the vacuum degree is less than 10Pa, mechanically sealing the end of the mechanical seal by a sealing device after reaching the required vacuum degree, and fusing and sealing the end of the mechanical seal by TIG, high-power laser or electron beam welding;
and (3) manufacturing the phase-change heat transfer fin radiator, namely welding the heat transfer fins together with the phase-change heat transfer fins and the solid or phase-change substrate through the heat transfer structural adhesive, wherein the distance between the phase-change heat transfer fins is 3.0-20.0 mm in order to improve the heat transfer area.
The technical scheme of the utility model has the following beneficial effects:
according to the utility model, the liquid in the heated cavity at the evaporation end is evaporated, the steam flows to the condensation end under a tiny pressure difference to emit heat, and is condensed into liquid, and the condensed liquid flows back to the evaporation end, so that the circulating heat is transferred from one end of the phase-change heat transfer fin to the other end to form rapid uniform temperature transfer, and the design ensures that the heat transfer distribution is very uniform, and the efficient heat exchange is performed by combining the heat transfer fins, thereby improving the heat exchange efficiency and reducing the problem of larger temperature difference.
Drawings
FIG. 1 is an overall block diagram of the present utility model;
FIG. 2 is a schematic diagram of the operation of the phase change heat transfer fin of the present utility model;
FIG. 3 is a schematic diagram of a phase change substrate according to the present utility model;
FIG. 4 is a schematic diagram of a non-equidistant bending composite superconducting flat heat pipe according to the present utility model;
FIG. 5 is a schematic view of the internal structure of a composite superconducting flat heat pipe of the present utility model;
FIG. 6 is an enlarged view of the interior of the hollow-core capillary structure of the present utility model;
FIG. 7 is a block diagram of an equidistantly bent composite superconducting flat heat pipe of the present utility model;
fig. 8 is a view showing the overall structure of the production of the present utility model.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, a first feature is "on" or "to a second feature unless explicitly specified and defined otherwise
"under" may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
Referring to fig. 1 to 2, the present utility model provides a phase change heat transfer fin heat sink with increased performance, comprising:
the heat dissipation substrate is used for being arranged on the semiconductor power device;
the phase change heat transfer fin 2, phase change heat transfer fin 2 locates on the radiating base plate 1, and, phase change heat transfer fin 2 includes: a closed flat plate microchannel 21, wherein the interior of the closed flat plate microchannel 21 is set to be a negative pressure of 1.0 x (10-2 to 10-3) Pa, and a working fluid is arranged in the closed flat plate microchannel; the area of the closed flat micro-channel 21 close to the heat dissipation substrate 1 is set as an evaporation end 211; the working fluid may be a refrigerated fluid.
The heat exchange fins 3 are arranged on the heat radiating substrate 1 and the phase change heat transfer fins 2, the heat exchange fins 3 are made of aluminum alloy materials with the heat conductivity coefficient of 130-220W/m.K, and the area, close to the heat exchange fins, of the closed flat plate micro-channel 21 is set as a condensation end;
specifically, when the heat generated by the semiconductor power device on the heat dissipating substrate 1 is generated, the liquid in the heat receiving tube body at the evaporation end 211 is evaporated, the vapor 214 flows to the condensation end 212 under a slight pressure difference to release heat and condense into liquid, the condensed liquid 213 flows back to the evaporation end 211, so that the circulating heat is transferred from one end to the other end of the phase-change heat transfer fin to form rapid uniform temperature transfer, and is subjected to efficient heat exchange with the heat exchange fin 3, thereby improving and enhancing the heat exchange efficiency.
In this embodiment, as shown in fig. 3: the heat dissipation substrate 1 is a phase change substrate 11 or a solid substrate, and the solid substrate is made of an aluminum alloy material with a heat conduction coefficient of 130-220W/m.K; the phase change substrate transfers heat through phase change of working medium, wherein the phase change substrate 11 comprises a shell, a capillary structure layer 116 is sintered on the inner surface of the shell, a structure reinforcing column 112 and a structure supporting step 114 are generated on the inner surface of the shell, and a steam cavity 117 and a structure locking hole 115 are further formed in the shell;
the thickness of the phase change substrate 11 is generally 10.0 mm-30.0 mm; the thickness of the shell is generally 3.0 mm-10.0 mm, and a structure locking hole 115 is formed in the shell of the phase change substrate 11, and the diameter is generally 5.0 mm-15.0 mm; the structural reinforcement columns 112 are generally columns, square columns and diamond columns, the diameter of the columns is 3.0 mm-15.0 mm, and the distribution interval of the structural reinforcement columns 112 in the shell is 10.0 mm-100.0 mm;
the phase change substrate 11 further includes a structural cover plate 113, the structural cover plate 113 is soldered on the housing by vacuum soldering or atmosphere soldering, and the upper surface of the structural reinforcing column 112 is equal to the surface of the structural supporting step 114 in height, so as to form a soldering surface 111;
wherein, the welding modes of the structural reinforcement column 112 and the cover plate are different, the upper surface of the structural reinforcement column 112 is a smooth plane, the upper surface of the structural reinforcement column 112 is a welding surface 111, and the height of the structural reinforcement column is equal to the height of the structural support step 114: 5.0 mm-15.0 mm, and the thickness of the structural cover plate 113 is 1.0 mm-5.0 mm;
sintering aluminum or aluminum alloy powder capillary structures on the inner surface of the shell of the phase-change substrate 11, wherein the particle diameter is 50-150 meshes, the capillary structures are layered, and the thickness of the capillary layers is 2.0-5.0 mm; the structural cover plate 113 is then welded to the phase change housing.
As shown in fig. 5: in this embodiment, the pipeline of the closed flat micro-channel is set as a composite superconducting flat heat pipe 21, and the composite superconducting flat heat pipe 21 includes: equidistant bending composite superconducting flat heat pipe and non-equidistant bending composite superconducting flat heat pipe;
the inner surface of the composite superconducting flat heat pipe is provided with structural reinforcing ribs 216, the spacing between the structural reinforcing ribs 216 is 10.0-50.0 mm, and the width of the structural reinforcing ribs is 0.3-5.0 mm;
as shown in fig. 7, the pitch P of the equidistant bending composite superconducting flat plate heat pipes is set to be 5-25 mm, the horizontal length of the equidistant bending composite superconducting flat plate heat pipes is l=n×p (n is equal to or greater than 3), the thickness of the equidistant bending composite superconducting flat plate heat pipes is 2.0-5.0 mm, and the height H of the equidistant bending composite superconducting flat plate heat pipes is 50-400 mm.
As shown in fig. 4, the non-equidistant bending composite superconducting flat plate heat pipes adjust the spacing of the flat plate heat pipes according to the heat flux density on the surface of the corresponding radiating substrate;
the interval between the high heat flux areas is set to be P2, the interval between the low heat flux areas is set to be P1, the P1 is set to be 5-20 mm, the P2 is set to be 15-30 mm, the horizontal length L=n1+n2 of the non-equidistant bending composite superconducting flat plate heat pipe is equal to or greater than P2 (n 1 and n2 are equal to or greater than 3), the thickness of the non-equidistant bending composite superconducting flat plate heat pipe is 2.0-5.0 mm, the height H of the non-equidistant bending composite superconducting flat plate heat pipe is 50-400 mm, and the width of the non-equidistant bending composite superconducting flat plate heat pipe is generally 30-200 mm.
In this embodiment, as shown in fig. 5 and 6: the inner surface of the composite superconducting flat heat pipe 21 is provided with concave cavity capillary structures 215, and the interval between the concave cavity capillary structures 215 is 1.0-10.0 mm;
the inner surface of the concave cavity capillary structure 215 is provided with a horn groove, wherein the angle theta of the horn groove is set to be 30-60 degrees, the opening width d of the surface of the horn groove is 0.2-3.0 mm, the horn groove is provided with a concave rectangular groove, the length l of the horn groove is 1.0-5.0 mm, and the thickness h of the concave rectangular groove is 0.3-2.0 mm;
in this embodiment, the phase change heat transfer fin 2 further includes a composite capillary structure, which provides capillary force for the condensed liquid 213 to flow back to the evaporation end 211.
Example 1:
as shown in fig. 8: a preparation method of a phase change heat transfer fin radiator with increased performance comprises the following steps:
the shell shape of the radiator base plate is processed through NC processing, die casting or cold forging and hot forging, and the shell shape and the structure cover plate 13 form a base plate cavity, and a structure supporting step 114, a structure reinforcing column 112 and a structure locking hole 115 are arranged on the phase-change base plate 11;
welding the radiator sealing shell with the structural cover plate 13 through a welding sealing process such as vacuum brazing, performing sealing test on the radiator sealing shell through a welded process tail pipe, performing leak detection by using helium mass spectrum leak detection equipment, wherein the helium leak detection pressure is 600+/-50 Kpa, the time is 60-90 s, and the judgment standard is <1.0 x 10 < -7 > mbar/s;
vacuumizing the sealed shell through a process tail pipe, wherein the vacuum degree is required to be less than 10Pa; injecting a phase change working medium through a process tail pipe, and calculating the quality of the working medium according to the thickness of the capillary structure and the heat transmission capacity of the steam 214 cavity;
sealing the process tail pipe by using a sealing tool, fusing and sealing the sealing point by using TIG, high-power laser or electron beam welding, shaping, and NC processing the outer surface;
processing the phase-change heat transfer fins 2 through an aluminum extrusion molding process, cutting the phase-change heat transfer fins 2 according to the calculated blanking size, ultrasonically cleaning and drying, and mechanically sealing one end of the phase-change heat transfer fins 2 through a mechanical sealing device; vacuumizing, wherein the vacuum degree is required to be less than 1 x 10 < -3 > Pa, and injecting a phase change working medium;
secondly vacuumizing for the second time, wherein the vacuum degree is less than 10Pa, mechanically sealing the end of the mechanical seal by a sealing device after reaching the required vacuum degree, and fusing and sealing the end of the mechanical seal by TIG, high-power laser or electron beam welding;
and (3) manufacturing the phase-change heat transfer fin radiator, namely welding the heat transfer fins 3, the phase-change heat transfer fins 2 and the solid or phase-change substrate 11 together through the heat conduction structural adhesive, wherein the space between the phase-change heat transfer fins 2 is 3.0-20.0 mm in order to improve the heat transfer area.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (9)
1. A phase change heat transfer fin heat sink with increased performance comprising:
the heat dissipation substrate is used for being arranged on the semiconductor power device;
the phase change heat transfer fin, the phase change heat transfer fin is located on the radiating substrate, and, the phase change heat transfer fin includes: a closed plate microchannel having an interior of 1.0× (10 -2 ～10- 3 ) The negative pressure of Pa, and the working fluid is arranged in the negative pressure; the area of the closed flat micro-channel close to the heat dissipation substrate is set as an evaporation end;
the heat exchange fins are arranged on the heat dissipation substrate and the phase change heat exchange fins, and the area, close to the heat exchange fins, of the closed flat plate micro-channel is set as a condensation end;
when the semiconductor power device on the heat dissipation substrate generates heat, the liquid in the evaporation end is used for evaporating and transferring the heat, the condensing end is used for liquefying the gas to release the heat, a recyclable uniform temperature transfer is formed, and the heat exchange fins are used for carrying out efficient heat exchange.
2. The increased performance phase change heat transfer fin heat sink of claim 1 wherein the heat dissipating substrate is a phase change substrate or a solid substrate, the solid substrate being an aluminum alloy material having a thermal conductivity of 130-220W/m.k; the phase change substrate transfers heat through the phase change of working medium, wherein the phase change substrate comprises a shell, the inner surface of the shell is sintered with a capillary structure layer, the inner surface of the shell is provided with a structure reinforcing column and a structure supporting step, and the shell is further provided with a steam cavity and a structure locking hole.
3. The increased performance phase change heat transfer fin heat sink of claim 2 wherein the phase change substrate further comprises a structural cover plate brazed to the housing using vacuum brazing or an atmosphere, and wherein the structural reinforcement post upper surface is flush with the structural support step to collectively form a welded surface with the cover plate.
4. The increased performance phase change heat transfer fin heat sink of claim 1 wherein the conduit of the closed flat plate microchannel is provided as a composite superconducting flat plate heat pipe, and wherein the composite superconducting flat plate heat pipe comprises: equidistant bending composite superconducting flat heat pipe and non-equidistant bending composite superconducting flat heat pipe;
the inner surface of the composite superconducting flat heat pipe is provided with structural reinforcing ribs, the spacing between the structural reinforcing ribs is 10.0-50.0 mm, and the width of the structural reinforcing ribs is 0.3-5.0 mm.
5. The increased performance phase change heat transfer fin heat sink of claim 4 wherein the pitch P of the equidistantly folded composite superconducting flat-plate heat pipes is set to 5-25 mm, the horizontal length of the equidistantly folded composite superconducting flat-plate heat pipes is L = n x P (n is 3 or more), the thickness of the equidistantly folded composite superconducting flat-plate heat pipes is 2.0-5.0 mm, and the height H of the equidistantly folded composite superconducting flat-plate heat pipes is 50-400 mm.
6. The increased performance phase change heat transfer fin heat sink of claim 4 wherein the non-equidistant bending composite superconducting flat plate heat pipes adjust the spacing of the flat plate heat pipes according to the heat flux density of the surface of the corresponding heat dissipation substrate;
the interval between the high heat flux density areas is set to be P2, the interval between the low heat flux density areas is set to be P1, the P1 is set to be 5-20 mm, the P2 is set to be 15-30 mm, the horizontal length L=n1+n2 of the non-equidistant bending composite superconducting flat plate heat pipe is equal to P2, the thickness of the non-equidistant bending composite superconducting flat plate heat pipe is 2.0-5.0 mm, the height H of the non-equidistant bending composite superconducting flat plate heat pipe is 50-400 mm, and the width of the non-equidistant bending composite superconducting flat plate heat pipe is generally 30-200 mm.
7. The heat sink of claim 4, wherein the inner surface of the composite superconducting flat-plate heat pipe is provided with concave cavity capillary structures, and the spacing between the concave cavity capillary structures is 1.0 mm-10.0 mm.
8. The heat sink of claim 7, wherein the inner surface of the concave cavity capillary structure is provided with a horn groove, wherein the angle θ of the horn groove is set to be 30 ° to 60 °, the width d of the opening on the surface of the horn groove is 0.2mm to 3.0mm, the horn groove is provided with a concave rectangular groove with a length l of 1.0mm to 5.0mm, and the thickness h of the concave rectangular groove is 0.3mm to 2.0mm.
9. The increased performance phase change heat transfer fin heat sink of claim 1 further comprising a composite capillary structure providing capillary force for condensed liquid to flow back to the evaporation end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320564410.3U CN219778878U (en) | 2023-03-22 | 2023-03-22 | Phase change heat transfer fin radiator with increased performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320564410.3U CN219778878U (en) | 2023-03-22 | 2023-03-22 | Phase change heat transfer fin radiator with increased performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219778878U true CN219778878U (en) | 2023-09-29 |
Family
ID=88129123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320564410.3U Active CN219778878U (en) | 2023-03-22 | 2023-03-22 | Phase change heat transfer fin radiator with increased performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219778878U (en) |
-
2023
- 2023-03-22 CN CN202320564410.3U patent/CN219778878U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7147045B2 (en) | Toroidal low-profile extrusion cooling system and method thereof | |
| CN101142459B (en) | RF power amplifier assembly with heat pipe enhanced pallet | |
| JP2012507680A (en) | MICRO HEAT PIPE ARRAY HAVING FINE TUBE ARRAY, ITS MANUFACTURING METHOD, AND HEAT EXCHANGE SYSTEM | |
| CN106033749B (en) | Parallel parallel microchannels multicore sheet heat radiator | |
| CN101453859B (en) | Loop type heat pipe radiator and manufacturing method thereof | |
| CN105716461A (en) | Temperature equalizing plate with gradient porous capillary cores in plane direction and manufacturing method for temperature equalizing plate | |
| CN110260697B (en) | Aluminum-based soaking plate | |
| CN111246708A (en) | Heat sink and method for manufacturing the same | |
| JP5112374B2 (en) | Heat dissipating device for electronic equipment and manufacturing method thereof | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| TWI819157B (en) | Ultra-thin vapor chamber and manufacturing method thereof | |
| CN206165061U (en) | Take phase transition cooling system of porous interior fin | |
| CN209877718U (en) | Phase change heat dissipation device | |
| CN219778878U (en) | Phase change heat transfer fin radiator with increased performance | |
| CN102261862A (en) | Flat heat pipe heat exchanger | |
| CN1869574B (en) | Radiator | |
| CN116230664A (en) | Phase change heat transfer fin radiator with increased performance and preparation method | |
| WO2010060302A1 (en) | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system | |
| CN112736046B (en) | Integrated chip heat dissipation device and heat dissipation method thereof | |
| CN211782949U (en) | Three-dimensional vacuum cavity vapor chamber radiator for high heat flux heat source | |
| CN206177107U (en) | Integration soaking radiator | |
| CN111551059A (en) | Plastic flat plate vapor chamber and manufacturing method thereof | |
| CN218353007U (en) | Radiator and communication equipment | |
| CN220398318U (en) | Radiating fin composite loop temperature equalizing plate | |
| CN1869575B (en) | Radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |