CN219778844U - Silicon wafer stick section suction means - Google Patents
Silicon wafer stick section suction means Download PDFInfo
- Publication number
- CN219778844U CN219778844U CN202321324737.XU CN202321324737U CN219778844U CN 219778844 U CN219778844 U CN 219778844U CN 202321324737 U CN202321324737 U CN 202321324737U CN 219778844 U CN219778844 U CN 219778844U
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- cylinder
- guide rail
- silicon wafer
- rail cylinder
- feeding guide
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 27
- 239000010703 silicon Substances 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 56
- 230000000007 visual effect Effects 0.000 claims abstract description 29
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 238000007689 inspection Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 238000007667 floating Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 238000011179 visual inspection Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of silicon wafer rod production, and discloses a silicon wafer rod slicing and sucking device. Comprises a cylinder positioning mechanism, a visual detection mechanism and a sucker grabbing mechanism; the bottom of the cylinder positioning mechanism for moving and positioning the sucking disc grabbing mechanism is connected with the sucking disc grabbing mechanism, and the visual detection mechanism is arranged at the adjacent part of the cylinder positioning mechanism. The automatic degree of the factory is improved to a certain extent, and the automatic degree control device has the advantages of being accurate in work, improving work efficiency, reducing labor cost, being high in work efficiency and the like.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer rod production, and relates to a silicon wafer rod slicing and sucking device. In particular to a silicon wafer rod slice suction device for various specifications, which can be used in a full-automatic production line.
Background
The photovoltaic industry is an important component of the new energy industry, and has achieved great achievements at home and abroad in recent years. With the vigorous development of the photovoltaic industry, monocrystalline silicon is used as the most important photovoltaic material, and the market demand of the monocrystalline silicon is also increasing. After the monocrystalline silicon is produced, a series of working procedures are needed, including the working procedures of crystal pulling, cutting, detecting, circle cutting, external circle grinding, slicing and the like, and finally the finished silicon wafer is processed.
Wherein the slice suction of the silicon wafer rod is an important step in the production of monocrystalline silicon. At present, the silicon wafer rod slice suction device is mainly manually transported to the next working procedure after being manually sliced. The above mode has low working efficiency, high labor intensity and potential safety hazard.
Disclosure of Invention
The utility model aims to overcome the defects in the background technology and provides a silicon wafer rod slice sucking device. The device can absorb and move the cut slices. The automatic degree of the factory is improved to a certain extent, and the automatic degree control device has the advantages of being accurate in work, improving work efficiency, reducing labor cost, being high in work efficiency and the like.
The technical scheme adopted for solving the technical problems is as follows: a silicon wafer rod slice suction device comprises an air cylinder positioning mechanism, a visual detection mechanism and a sucker grabbing mechanism; the bottom of the cylinder positioning mechanism for moving and positioning the sucking disc grabbing mechanism is connected with the sucking disc grabbing mechanism, and the visual detection mechanism is arranged at the adjacent part of the cylinder positioning mechanism.
The cylinder positioning mechanism comprises a connecting support, a descending guide rail cylinder used for driving the feeding guide rail cylinder to move up and down is arranged on the connecting support, the descending guide rail cylinder is connected with the feeding guide rail cylinder through a cylinder support, the feeding guide rail cylinder is arranged below the descending guide rail cylinder, the front end of the feeding guide rail cylinder is provided with a connecting plate, and the front end of a cylinder rod of the feeding guide rail cylinder is connected with the sucking disc grabbing mechanism through the connecting plate.
The sucking disc snatchs mechanism and includes the sucking disc fixing base, and the sucking disc fixing base sets up a plurality of sucking disc, and the equidistance is established on the preferential sucking disc fixing base and is set up six sucking discs, and six sucking discs set up on a circumference.
The visual detection mechanism comprises a visual detection bracket, and the visual detection bracket is provided with an industrial camera and a visual sensor. The visual detection mechanism is used for controlling the position of the cut round wafer and the safety and accuracy of the placement of the cut round wafer. The industrial camera and the vision sensor are not limited to specific models, and the working functions of the industrial camera and the vision sensor can be realized.
The visual detection mechanism is arranged on the truss or other machine tools adjacent to the cylinder positioning mechanism through the visual detection bracket.
Further, a cylinder floating joint for protecting the cylinder rod is arranged at the front end of the feeding guide rail cylinder.
Further, the front end of the cylinder rod of the feeding guide rail cylinder is connected with the sucker fixing seat through a connecting plate.
Further, the feeding guide rail cylinder and the descending guide rail cylinder are respectively connected with an air source through pipelines. The feeding guide rail cylinder and the descending guide rail cylinder are provided with electromagnetic valves. The suction cup is provided with a vacuum generator.
Further, each sucking disc is fixed on the sucking disc fixing seat through double nuts.
The device is also provided with a PLC control system, and the feeding guide rail cylinder, the descending guide rail cylinder, the vacuum generator, the electromagnetic valve, the industrial camera and the visual sensor are respectively connected with the PLC control system, and are not limited by any model, and the working function of the device can be realized, wherein the descending guide rail cylinder is preferably of the HLSL25X150-S-AS (0) type, and the feeding guide rail cylinder is preferably of the HLSL25X40-S-AS (0) type.
The silicon wafer rod slice suction device is fixed on a truss or other equipment through a connecting bracket.
According to the utility model, six suckers can be uniformly distributed according to different diameters of the round bars, and the suction force of each sucker is calculated to meet the requirements; 2 cylinder floating joints are arranged for preventing the clamping in the running process of the feeding guide rail cylinder; the descending guide rail cylinder is adopted as a guide rail sliding table cylinder, so that the operation is stable, the use is convenient, and the space is saved; the travel requirement is met, and the stable operation is ensured; the cylinder support is welded by carbon steel, so that the firmness of the structure is ensured, and the cost is reduced; the bolt and the locating pin are adopted to be fixed with the feeding guide rail cylinder and the descending guide rail cylinder. The connecting bracket adopts a carbon steel welding mode, supports the reinforcing ribs, ensures the strength and reduces the cost, and is integrally connected with other equipment or trusses in a bolt fixing mode; the visual inspection support adopts the form that the panel beating was bent, and is pleasing to the eye firm.
Compared with the prior art, the utility model has the following beneficial effects:
according to the silicon wafer rod slice suction device, the problems of manual operation and the like are solved by sucking and placing after slicing the crystal rod through the visual detection mechanism and the sucker grabbing mechanism. The method not only ensures the accuracy of the action, but also improves the economical efficiency of the equipment, and because the whole process is fully automatic, the slicing is not required to be carried manually, the labor cost is saved, and meanwhile, the working efficiency is greatly improved. The full-automatic machining production line is fully automated, the whole process is safe and reliable, the operation efficiency is improved, the operation intensity of personnel is eliminated, and the potential safety hazard caused by workpiece transportation to people is avoided.
Drawings
The utility model is further illustrated by the following examples in conjunction with the accompanying drawings:
fig. 1 is a front view of a silicon wafer bar slice suction apparatus according to the present utility model.
Fig. 2 is a side view of a silicon wafer bar slice suction device according to the present utility model.
Fig. 3 is a C-C cross-sectional view of fig. 2.
In the figure, a sucker 1, a sucker fixing seat 2, a cylinder floating joint 4, a feeding guide rail cylinder 5, a cylinder support 6, a descending guide rail cylinder 7, a connecting bracket 8, a visual detection bracket 9, a visual sensor and a solenoid valve 10.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to the following examples. In the embodiment, a feeding guide rail cylinder, a descending guide rail cylinder, a vacuum generator, an electromagnetic valve, an industrial camera and a visual sensor which are connected with the PLC system are not limited to a specific model, and the functions of the feeding guide rail cylinder, the descending guide rail cylinder, the vacuum generator, the electromagnetic valve, the industrial camera and the visual sensor can be realized.
Example 1
The silicon wafer rod slice suction device comprises a cylinder positioning mechanism, a visual detection mechanism and a sucker grabbing mechanism, as shown in figures 1-3; the bottom of the cylinder positioning mechanism for moving and positioning the sucking disc grabbing mechanism is connected with the sucking disc grabbing mechanism, and the visual detection mechanism is arranged at the adjacent part of the cylinder positioning mechanism.
The cylinder positioning mechanism comprises a connecting support 7, a descending guide rail cylinder 6 for driving the feeding guide rail cylinder 4 to move up and down is arranged on the connecting support 7, the descending guide rail cylinder 6 is connected with the feeding guide rail cylinder 4 through a cylinder support 5, the feeding guide rail cylinder 4 is arranged below the descending guide rail cylinder 6, a connecting plate is arranged at the front end of the feeding guide rail cylinder 4, and the front end of a cylinder rod of the feeding guide rail cylinder 4 is connected with the sucking disc grabbing mechanism through the connecting plate.
The sucking disc snatchs mechanism and includes sucking disc fixing base 2, and sucking disc fixing base 2 sets up a plurality of sucking disc 1, and the equidistance is established on the preferential sucking disc fixing base 2 and is set up six sucking discs 1, and six sucking discs 1 set up on a circumference.
The visual inspection mechanism comprises a visual inspection support 8, and the visual inspection support 8 is provided with an industrial camera and a visual sensor 9. The visual detection mechanism is used for controlling the position of the cut round wafer and the safety and accuracy of the placement of the cut round wafer. The industrial camera and vision sensor 9 is not limited to a specific model, and can realize the working function thereof.
The visual detection mechanism is fixed on the truss or other machine tools adjacent to the cylinder positioning mechanism through the visual detection bracket 8.
The front end of the feed guide cylinder 4 is provided with a cylinder floating joint 3 for protecting the cylinder rod.
The front end of a cylinder rod of the feeding guide rail cylinder 4 is connected with the sucker fixing seat 2 through a connecting plate.
The feeding guide rail cylinder 4 and the descending guide rail cylinder 6 are respectively connected with an air source through pipelines. The feed rail cylinder 4 and the descent rail cylinder 6 are provided with solenoid valves 10. The suction cup 1 is provided with a vacuum generator.
Each sucker 1 is fixed on a sucker fixing seat 2 through double nuts.
The specific working flow of the silicon wafer rod slice suction device provided by the utility model is as follows:
firstly, a silicon wafer rod slice suction device is fixed on a truss through a connecting bracket, and a visual detection mechanism is arranged on a machine tool adjacent to a cylinder positioning mechanism through a visual detection bracket 8. The whole round bar is placed on a machine table of a machine tool by a truss manipulator in charge of carrying in other procedures, and the whole round bar with the length of 6 meters is cut into each 850-length single-section round bar according to requirements; an industrial camera and a visual sensor 9 in the visual detection mechanism detect the position and the distance of the round bar; the descending guide rail cylinder 6 acts to downwards move the feeding guide rail cylinder 4, and the feeding guide rail cylinder 4 sucks the section of the round bar with the sucker 1; other working procedures are responsible for detecting the corresponding thickness of the slice by a slicing cutter and an industrial camera; the cutter starts to act to prevent the slicing from falling off; when the cutter penetrates through the whole round bar, the suction cup 1 of the suction cup grabbing mechanism moves to a designated slice placing position with the cut slice through the feeding guide rail cylinder 4 and the descending guide rail cylinder 6; complete one-time complete sucking and carrying action is completed.
While the utility model has been described in detail in the foregoing general description and specific examples, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the utility model and are intended to be within the scope of the utility model as claimed.
Claims (8)
1. The silicon wafer rod slice suction device is characterized by comprising an air cylinder positioning mechanism, a visual detection mechanism and a sucker grabbing mechanism; the bottom of the cylinder positioning mechanism for moving and positioning the sucking disc grabbing mechanism is connected with the sucking disc grabbing mechanism, and the visual detection mechanism is arranged at the adjacent part of the cylinder positioning mechanism.
2. The silicon wafer rod slice suction device according to claim 1, wherein the cylinder positioning mechanism comprises a connecting bracket (7), a descending guide rail cylinder (6) for driving the feeding guide rail cylinder (4) to move up and down is arranged on the connecting bracket (7), the descending guide rail cylinder (6) is connected with the feeding guide rail cylinder (4) through a cylinder support (5), the feeding guide rail cylinder (4) is arranged below the descending guide rail cylinder (6), a connecting plate is arranged at the front end of the feeding guide rail cylinder (4), and the front end of a cylinder rod of the feeding guide rail cylinder (4) is connected with the sucking disc grabbing mechanism through the connecting plate.
3. A silicon wafer rod slice suction device as claimed in claim 2, characterized in that the suction cup gripping mechanism comprises a suction cup fixing seat (2), the suction cup fixing seat (2) is provided with a plurality of suction cups (1).
4. A silicon wafer rod slice suction apparatus as claimed in claim 3 wherein the vision inspection mechanism comprises a vision inspection support (8), the vision inspection support (8) being provided with an industrial camera and a vision sensor (9).
5. A silicon wafer rod slice suction device as claimed in claim 4, characterized in that the front end of the feed rail cylinder (4) is provided with a cylinder float joint (3) for protecting the cylinder rod.
6. A silicon wafer rod slice suction device according to claim 5, wherein the front end of the cylinder rod of the feed guide cylinder (4) is connected with the sucker fixing seat (2) through a connecting plate.
7. A silicon wafer rod slice suction device according to claim 6, wherein the feed rail cylinder (4) and the drop rail cylinder (6) are connected with the air source through pipelines respectively.
8. A silicon wafer rod slice suction device as claimed in claim 7, characterized in that six suction cups (1) are equidistantly arranged on the suction cup holder (2), the six suction cups (1) being arranged on a circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321324737.XU CN219778844U (en) | 2023-05-29 | 2023-05-29 | Silicon wafer stick section suction means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321324737.XU CN219778844U (en) | 2023-05-29 | 2023-05-29 | Silicon wafer stick section suction means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219778844U true CN219778844U (en) | 2023-09-29 |
Family
ID=88129246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321324737.XU Active CN219778844U (en) | 2023-05-29 | 2023-05-29 | Silicon wafer stick section suction means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219778844U (en) |
-
2023
- 2023-05-29 CN CN202321324737.XU patent/CN219778844U/en active Active
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