CN219718910U - Radiating assembly and electronic equipment - Google Patents

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment, the heat dissipation assembly includes: a soaking piece, wherein the soaking piece is provided with a first side and a second side which are opposite, and the second side is provided with a groove; the heat conducting pipe is accommodated and fixed in the groove; wherein, soaking piece includes: a plurality of soaking films laminated in sequence; the grooves 111 penetrate at least two layers of soaking films arranged in succession from the second side. The heat dissipation component can rapidly conduct heat of a high-temperature region in the electronic equipment to a low-temperature region in the electronic equipment through the heat conduction pipe, and heat of different regions in the electronic equipment can be uniformly distributed through the soaking piece. Therefore, the electronic equipment adopting the heat radiation assembly can realize faster heat radiation to the internal electronic element, and can ensure that different areas of the electronic equipment have more uniform heat distribution, thereby avoiding heat concentration. In addition, the heat dissipation assembly is provided with the groove for accommodating the heat conduction pipe, so that the thickness of the heat dissipation assembly can be reduced, and the design of lightening and thinning of the electronic equipment is facilitated.

Description

Radiating assembly and electronic equipment

Technical Field

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation assembly and electronic equipment.

Background

Along with the continuous progress of science and technology, more and more electronic devices are widely applied to daily life and work of people, bring great convenience to daily life and work of people, and become an indispensable important tool for people at present.

The electronic equipment is provided with the heat dissipation assembly so as to improve the heat dissipation efficiency of the electronic components in the electronic equipment, so that heat generated by the operation of the electronic components can be rapidly dissipated, the electronic components are ensured to operate in a proper temperature environment, and the safe and reliable operation of the electronic components is further ensured.

In the existing electronic equipment, the adopted heat dissipation assembly is large in thickness, the electronic equipment is inconvenient to thin and thin, and the heat uniformity adjusting and controlling capability of different heat dissipation areas of the electronic equipment is poor.

Disclosure of Invention

In view of the above, the present utility model provides a heat dissipation assembly and an electronic device, and the scheme is as follows:

a heat dissipating assembly, comprising:

a soaking piece, wherein the soaking piece is provided with a first side and a second side which are opposite, and the second side is provided with a groove;

the heat conduction pipe is accommodated and fixed in the groove;

wherein, soaking piece includes: a plurality of soaking films laminated in sequence;

wherein the grooves penetrate at least two layers of soaking films which are continuously arranged from the second side.

Preferably, in the above heat dissipation assembly, adjacent soaking films are adhered and fixed by a heat conducting adhesive film; the groove also penetrates through the heat conducting adhesive film between at least two layers of soaking films.

Preferably, in the above heat dissipating assembly, the depth of the groove is smaller than the thickness of the soaking piece, and at least one soaking film and/or at least one heat conducting adhesive film is arranged between the bottom of the groove and the first side.

Preferably, in the above heat dissipating assembly, the soaking film is a flexible heat conducting film.

Preferably, in the above heat dissipating assembly, the thickness of the soaking film is in the range of 70 μm to 200 μm, and/or the thickness of the heat conductive adhesive film is in the range of 1 μm to 5 μm.

Preferably, in the above heat dissipating assembly, the highest position of the surface of the heat conducting tube is flush with the surface of the second side, or the highest position of the surface of the heat conducting tube is lower than the plane of the second side.

Preferably, in the above heat dissipating assembly, the heat conducting pipe is fixed in the groove by a heat conducting glue.

The utility model also provides an electronic device, which is characterized by comprising:

a circuit board;

an electronic component fixedly connected to the surface of the circuit board;

the heat sink assembly of any of the above, the heat sink assembly being in thermal contact with the electronic component.

Preferably, in the above electronic device, the first side of the soaking member is in thermal contact with the electronic component.

Preferably, in the above electronic apparatus, the surface of the electronic element has an electromagnetic shield;

the heat dissipation assembly is disposed on a surface of the electromagnetic shield.

As can be seen from the above description, in the heat dissipation assembly and the electronic device provided by the technical scheme of the present utility model, the heat dissipation assembly can rapidly conduct the heat of the high temperature region in the electronic device to the low temperature region in the electronic device through the heat conduction pipe, and can also realize uniform heat distribution of different regions in the electronic device through the soaking piece. Therefore, the electronic equipment adopting the heat radiation assembly can realize faster heat radiation to the internal electronic element, and can ensure that different areas of the electronic equipment have more uniform heat distribution, thereby avoiding heat concentration. In addition, the heat dissipation assembly is provided with the groove for accommodating the heat conduction pipe, so that the thickness of the heat dissipation assembly can be reduced, and the design of lightening and thinning of the electronic equipment is facilitated.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the related art, the drawings required for the description of the embodiments or the prior art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present utility model, and other drawings may be obtained according to the provided drawings without inventive effort to those skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the utility model, without affecting the effect or achievement of the objective.

Fig. 1 is a top view of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 2 is a cut-away view of the heat dissipating assembly of FIG. 1 in the direction A-A';

FIG. 3 is a cross-sectional view of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 4 is a cross-sectional view of another heat dissipating assembly according to an embodiment of the present utility model;

FIG. 5 is a cross-sectional view of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 6 is a cut-away view of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 7 is a cross-sectional view of a heat dissipating assembly according to an embodiment of the present utility model;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model;

fig. 9 is a top view of a circuit board and a heat dissipation assembly after being attached and fixed according to an embodiment of the present utility model.

Detailed Description

Embodiments of the present utility model will now be described more fully hereinafter with reference to the accompanying drawings, in which it is shown, however, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1, fig. 1 is a top view of a heat dissipating assembly according to an embodiment of the present utility model, and fig. 2 is a sectional view of the heat dissipating assembly shown in fig. 1 in A-A', where the heat dissipating assembly includes:

a soaking member 11, wherein the soaking member 11 has a first side S1 and a second side S2 opposite to each other, and the second side S2 has a groove 111;

a heat conducting pipe 12, wherein the heat conducting pipe 12 is accommodated and fixed in the groove 111;

wherein the soaking member 11 comprises: a plurality of soaking films 112 stacked in this order;

the grooves 111 extend through at least two layers of soaking films 112 arranged in succession from the second side S2.

In the embodiment of the utility model, the heat dissipation assembly is used for electronic equipment. The heat dissipation component can quickly conduct heat in a high-temperature region of the electronic equipment to a low-temperature region of the electronic equipment through the heat conduction pipe 12, and can also realize uniform heat distribution in different regions of the electronic equipment through the soaking piece 11. Therefore, the electronic equipment adopting the heat radiation assembly can realize faster heat radiation to the internal electronic element, and can ensure that different areas of the electronic equipment have more uniform heat distribution, thereby avoiding heat concentration. In addition, the heat dissipation assembly is provided with the groove 111 for accommodating the heat conduction pipe 12, so that the thickness of the heat dissipation assembly can be reduced, and the light and thin design of the electronic equipment is facilitated.

In the manner shown in fig. 2, two adjacent soaking films 112 in the soaking member 11 are directly adhered to each other. At this time, the soaking film 112 may be adhered and fixed to another soaking film 112 by electrostatic attraction or self-adhesion.

Referring to fig. 3, fig. 3 is a sectional view of a heat dissipating assembly according to an embodiment of the present utility model, which is different from the manner shown in fig. 2 in that, in the manner shown in fig. 3, adjacent soaking films 112 are adhered and fixed by a heat conductive adhesive film 113; the groove 111 also penetrates through the heat-conducting adhesive film 113 between the at least two soaking films 112. The bonding and fixing between two adjacent soaking films 112 can be realized through the heat conducting adhesive film 113, so that the peeling problem of the soaking films 112 is avoided.

The embodiment of the utility model provides a heat dissipation structure in which a heat conduction pipe 12 is embedded in a heat spreader 11, and the heat spreader 11 is provided with a plurality of layers of heat dissipation films 112 and heat conduction adhesive films 113 which are alternately laminated, compared with the conventional metal heat dissipation structure of a heat dissipation plate, the thickness of a heat dissipation assembly can be greatly reduced, and the thickness is reduced by 50%.

The heat conductive adhesive film 113 is a double-sided adhesive film with good flexibility. The soaking piece comprises a plurality of layers of soaking films 112 with thinner thickness, so that the single-layer soaking films 112 have better bending characteristics, the soaking films 112 and the heat-conducting adhesive films 113 with better flexibility are alternately laminated, the heat dissipation assembly has good bending characteristics, and good thermal contact can be formed between the heat dissipation assembly and the circuit board in the electronic equipment and the electronic element of which the surface needs heat dissipation.

As shown in fig. 3, the depth of the recess 111 is smaller than the thickness of the soaking member 11, so that there is at least one soaking film 112 and/or at least one heat conductive adhesive film 113 between the bottom of the recess 111 and the first side S1. The first side S1 of the heat dissipation assembly is used for being attached to and fixed with a surface of a circuit board in the electronic device, and covers an electronic component on the surface of the circuit board, which needs to dissipate heat. In other modes, the heat dissipation assembly can be attached and fixed to the surface of the circuit board in the electronic device through the second side S2.

The depth of the groove 111 is smaller than the thickness of the soaking piece 11, so that at least one soaking film 112 and/or at least one heat conducting adhesive film 113 can be arranged between the bottom of the groove 111 and the first side S1. In this way, when the heat dissipation assembly is attached to and fixed to the circuit board of the electronic device, the heat conduction tube 12 and the electronic component to be dissipated can be isolated based on at least one layer of soaking film 112 and/or at least one layer of heat conduction adhesive film 113, so that the heat conduction tube 12 with higher hardness is prevented from directly contacting with the electronic component, and further, surface damage to the electronic component caused by direct contact of the heat conduction tube 12 with the electronic component can be avoided.

Moreover, compared with the heat conducting tube 12, the heat soaking film 112 and the heat conducting adhesive film 113 have smaller hardness and better deformability, and the heat conducting tube 12 and the electronic component needing heat dissipation are isolated based on at least one layer of the heat soaking film 112 and/or at least one layer of the heat conducting adhesive film 113, so that good thermal contact can be formed between the heat conducting tube 12 and the electronic component needing heat dissipation, and the heat dissipation speed of the electronic component is prevented from being influenced due to the fact that an air gap is formed between the heat conducting tube 12 and the electronic component needing heat dissipation.

In the embodiment of the utility model, the soaking film 112 is a flexible heat conducting film, and has good heat conducting performance and good deformability. The heat-conducting adhesive film 113 is a flexible heat-conducting adhesive film, and also has good heat-conducting property and good deformability. Therefore, the heat dissipation soaking piece 11 has good bending property by setting the number and thickness of the laminated film layers of the soaking film 112 and the heat conduction adhesive film 113 in the soaking piece 11, so as to adapt to the surface morphology of the circuit board in the electronic equipment to be attached, form good thermal contact with the surface of the circuit board, and avoid generating air gaps between the circuit board and the electronic components needing heat dissipation, thereby ensuring the heat dissipation effect.

In the embodiment of the present utility model, for example, the soaking film 113 is a flexible heat-conducting film, and optionally, the flexible heat-conducting film may be a film structure with good flexibility and heat-conducting property, such as a graphite layer or a carbon nanotube layer. The graphite layer is a high-power graphite film and has good heat conduction performance.

The heat pipe 12 is an ultra-thin heat pipe, and the thickness of the ultra-thin heat pipe can be reduced to less than 1500 μm in the prior art, for example, the thickness of the ultra-thin heat pipe can be 1100 μm or 500 μm. The heat dissipation component adopts an ultrathin heat conduction pipe, and when the heat dissipation component is attached and fixed with a circuit board in electronic equipment, the ultrathin transistor can also be adapted to the surface morphology of the circuit board to be bent to a certain extent, so that the heat dissipation component and the surface of the circuit board form good thermal contact.

The total thickness of the soaking member 11 is set to not more than 2000 μm so as to avoid the excessive thickness of the soaking member 11 from affecting the flexibility thereof. Preferably, the soaking member 11 is provided to have a thickness of not more than 1000 μm.

Optionally, in the soaking member 11, the thickness of the soaking film 113 is in the range of 70 μm to 200 μm, and/or the thickness of the heat conductive adhesive film 113 is in the range of 1 μm to 5 μm.

In the embodiment of the utility model, the thickness of the soaking film 113 is 70 μm-200 μm, the thickness of the heat conducting film is 1 μm-5 μm, and the number of the soaking films 113 is not more than 5 layers, at this time, the soaking piece 11 is thinner, has good flexibility, can form good thermal contact with the circuit board and the electronic component of which the surface needs to dissipate heat in the electronic equipment, and has enough thickness to form the groove 111 enough to accommodate the heat conducting pipe 12.

In the manner shown in fig. 3, the highest position of the surface of the heat conducting pipe 12 is arranged to be flush with the surface on which the second side S2 is located.

Referring to fig. 4, fig. 4 is a sectional view of another heat dissipating assembly according to an embodiment of the present utility model, which is different from the heat dissipating assembly shown in fig. 3 in that, in the heat dissipating assembly shown in fig. 4, the surface of the heat conducting tube 12 is located at the highest position below the plane where the second side S2 is located.

Referring to fig. 5, fig. 5 is a sectional view of a heat dissipating assembly according to another embodiment of the present utility model, in the heat dissipating assembly shown in fig. 5, a heat pipe 12 is fixed in a groove 111 by a heat conducting glue 13.

On the basis of the heat dissipation assembly shown in fig. 3 in the mode shown in fig. 5, the heat conduction pipe 12 is fixed in the groove 111 through the heat conduction glue 13, and at the moment, the highest position of the surface of the heat conduction pipe 12 is flush with the surface where the second side S2 is located. Obviously, on the basis of fig. 4, the heat conducting pipe 12 can be fixed in the groove 111 through the heat conducting glue 13, and at the moment, the highest position of the surface of the heat conducting pipe 12 is lower than the plane of the second side S2.

The heat conducting glue 13 has good heat conductivity, so that the heat conducting pipe 12 and the side wall of the groove 111 form good thermal contact, and heat in the heat conducting pipe 12 can be quickly transferred to other areas through the soaking piece 11, and the soaking effect is realized.

In the embodiment of the utility model, the heat-conducting glue 13 is flexible glue, so that the heat-conducting pipe 12 and the groove 111 can be bonded and fixed, and the problem that the heat-conducting pipe 12 is peeled off and falls off can be avoided by buffering stress when the soaking piece 11 is adapted to the surface of the circuit board to deform in the bonding process of the circuit board with the electronic equipment.

Referring to fig. 6, fig. 6 is a sectional view of a heat dissipating assembly according to another embodiment of the present utility model, in this manner, based on the above embodiment, a first side S1 of the soaking member 11 in the manner shown in fig. 6 is a layer of heat conducting adhesive film 113, so that the heat dissipating assembly is adhered and fixed to a circuit board of an electronic device through the heat conducting adhesive film 113.

The manner shown in fig. 6 is based on the manner shown in fig. 5, in which the first side S1 is provided as a layer of the heat-conducting adhesive film 113, and it is obvious that any embodiment of the present utility model may be provided with the first side S1 as a layer of the heat-conducting adhesive film 113, which is not limited to the manner shown in fig. 5.

Referring to fig. 7, fig. 7 is a sectional view of a heat dissipation assembly according to another embodiment of the present utility model, in this manner, based on the above embodiment, the second side S2 of the soaking member 11 in the manner shown in fig. 7 is a layer of heat-conducting adhesive film 113, and after the heat dissipation assembly is attached to and fixed to a circuit board of an electronic device, the first side S1 is attached to and fixed to other structures of the electronic device, such as a device housing of the electronic device, through the heat-conducting adhesive film 113.

The manner shown in fig. 7 is based on the manner shown in fig. 5, in which the second side S2 is provided as a layer of the heat-conducting adhesive film 113, and it is obvious that any embodiment of the present utility model may provide the second side S2 as a layer of the heat-conducting adhesive film 113, which is not limited to the manner shown in fig. 5.

In the embodiment of the utility model, the first side S1 and the second side S2 are provided with the layer of the heat-conducting adhesive film 113, which is convenient for adhering and fixing the first side S1 of the soaking piece 11 and the circuit board in the electronic device, and adhering and fixing the second side S2 of the soaking piece 11 and other structures of the electronic device, without additionally laying an adhesive layer to adhere and fix the first side S1 of the soaking piece 11 and the circuit board, and without additionally laying an adhesive layer to adhere and fix the second side S2 of the soaking piece 11 and the other structures.

When the first side S1 and the second side S2 are respectively provided with the heat-conducting adhesive film 113, before the heat dissipation assembly and the circuit board of the electronic device are bonded and fixed, the first side S1 and the second side S2 can be respectively protected by the two release films, when the heat dissipation assembly and the electronic device are required to be bonded and fixed, the two release films are removed, so that the bonding and fixing of the first side S1 and the surface of the circuit board can be realized, and the other structures can be bonded and fixed by the second side S2.

The first side S1 may also be provided as a layer of soaking film 112. At this time, when laminating fixed with radiator unit and electronic equipment, need lay the one deck heat conduction colloid in the region that the fixed radiator unit of laminating was needed on the circuit board surface to this region and radiator unit laminating are fixed.

The second side S2 may also be provided as a layer of soaking film 112. At this time, after the heat dissipating component and the circuit board of the electronic device are adhered and fixed, a layer of heat conducting colloid may be separately laid on the second side S2 of the soaking component 11, or a layer of heat conducting colloid may be laid on a region where the other structures need to be adhered and fixed to the second side S2 of the soaking component 11, so as to fix the other structures on the second side S2 of the soaking component 11.

As can be seen from the above description, in the heat dissipation assembly provided by the embodiment of the utility model, the recess 111 for accommodating the heat conduction pipe 12 is provided in the soaking member 11, so that the thickness of the heat dissipation assembly can be reduced, and the light and thin design of the electronic device is facilitated. And set up soaking piece 11 and include multilayer and laminate soaking film 112 in proper order, further, can set up to bond fixedly through heat conduction glued membrane 113 between the adjacent two-layer soaking film 112, when soaking piece 11's thickness is fixed, soaking piece 11 adopts soaking film 112 and heat conduction glued membrane 113's alternative lamination structure, can improve its bending characteristics, thereby when its laminating is fixed with the circuit board surface, can adapt to the surface morphology of circuit board and carry out bending deformation, so that form good thermal contact effect with the circuit board surface, in order to improve the radiating efficiency to the electronic component that needs radiating on the circuit board surface.

Based on the above embodiment, another embodiment of the present utility model further provides an electronic device, which may be as shown in fig. 8.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model, where the electronic device includes:

a circuit board 21;

an electronic component 22 fixedly attached to the surface of the circuit board 21;

the heat sink assembly 23 in the above embodiment, the heat sink assembly 23 is in thermal contact with the electronic component 22. The heat dissipation assembly 23 is fixed on the surface of the circuit board 21 and covers the electronic component 22.

Optionally, the heat conducting pipe in the heat dissipation assembly 23 is disposed directly above the electronic component 22, so that the heat conducting pipe can be in thermal contact with the electronic component 22 directly above the electronic component 22, so that the heat conducting path between the electronic components 22 of the heat conducting pipe is shortest, and the heat dissipation efficiency of the electronic component 22 is improved. The structure of the electronic device at this time can be shown with reference to fig. 9 in the following embodiments.

In the embodiment of the utility model, the electronic equipment can be electronic devices such as a mobile phone, a tablet personal computer, a notebook computer, intelligent wearing equipment and the like.

For ease of clarity of illustration, the specific structure of the heat dissipating assembly 23 is not shown in fig. 8. The specific structure of the heat dissipating component 23 may be described with reference to the above embodiments, and will not be described in detail in the electronic device embodiments.

The electronic device employs the heat dissipation assembly 23 in the above-described embodiment. As described above, the heat spreader of the heat dissipating assembly 23 is provided with the groove for accommodating the heat conducting tube, which can reduce the thickness of the heat dissipating assembly 23, and facilitate the light and thin design of the electronic device. And set up the soaking piece and include the soaking film that the multilayer stacks gradually, further, can set up between the adjacent two-layer soaking film and bond fixedly through the heat conduction glued membrane, when the thickness of soaking piece is fixed, the soaking piece adopts the alternating lamination structure of soaking film and heat conduction glued membrane, can improve its bending characteristic, thereby can make it when being fixed with the laminating of circuit board surface, can adapt to the surface morphology of circuit board 21 and carry out bending deformation, so that form good thermal contact effect with circuit board surface and the electronic component 22 that needs radiating, in order to improve the radiating efficiency to the electronic component 22 that needs radiating on the circuit board surface.

In connection with the heat dissipating assembly 23 shown in the above embodiments, in the electronic device, the first side of the soaking member is arranged in thermal contact with the electronic component 22. Obviously, in other ways, the second side of the soaking element may also be arranged in thermal contact with the electronic component 22.

Referring to fig. 9, fig. 9 is a top view of a circuit board and a heat dissipating assembly according to an embodiment of the present utility model after the heat dissipating assembly 23 is attached and fixed, in the manner shown in fig. 9, when the heat dissipating assembly 23 is attached and fixed to a surface of the circuit board 21, the heat dissipating assembly 23 covers the electronic component 22 to be heat-dissipated, and the heat conducting tube 12 in the heat dissipating assembly 23 is in thermal contact with the top of the electronic component 22. On the one hand, through the heat conducting pipe 12 in thermal contact with the electronic component 22, heat generated by the operation of the electronic component 22 can be quickly guided from one end of the heat conducting pipe 12 to the other end of the heat conducting pipe, so that heat accumulation in the area where the electronic component 22 is located is avoided, and normal operation is ensured, and on the other hand, the heat in the heat conducting pipe 12 can be further conducted to the soaking piece in the heat dissipation assembly 23, so that the heat is uniformly distributed to different areas of the heat dissipation assembly 23, and local heat concentration in electronic equipment is avoided.

The electronic component 22 may be a control chip in an electronic device.

In order to avoid electromagnetic interference of the electronic component 22, the surface of the electronic component 22 may be provided with an electromagnetic shield; the heat dissipation assembly 23 is disposed on the surface of the electromagnetic shield. The electronic component 22 on the surface of the circuit board 21 is directly covered by the electromagnetic shielding piece in the mode, and then the radiating component 23 is fixedly bonded, so that a good electromagnetic shielding effect can be realized.

In other ways, the heat dissipation assembly 23 may be first covered on the electronic component 22, and then the electromagnetic shielding member is fixed on a surface of the heat dissipation assembly 23 facing away from the circuit board 21, and the electromagnetic shielding member covers the electronic component 22. The electromagnetic shielding piece is fixed on the surface of one side, away from the circuit board 21, of the heat radiating component 23, so that the problem that the electromagnetic shielding piece and the electronic component 22 are easily peeled off due to the stress applied to the circuit board 21 and the electronic component 22 by the heat radiating component 23 in the scheme that the electromagnetic shielding piece is directly electrified to cover the electronic component 22 positioned on the surface of the circuit board 21 and then the heat radiating component 23 is adhered and fixed can be avoided.

In the present specification, each embodiment is described in a progressive manner, or a parallel manner, or a combination of progressive and parallel manners, and each embodiment is mainly described as a difference from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the electronic device disclosed in the embodiment, the description is relatively simple because the electronic device corresponds to the heat dissipation assembly disclosed in the embodiment, and the relevant parts refer to the relevant parts of the heat dissipation assembly.

It should be noted that in the description of the present utility model, it is to be understood that the drawings and descriptions of the embodiments are illustrative and not restrictive. Like diagramming marks throughout the embodiments of the specification identify like structures. In addition, the drawings may exaggerate the thicknesses of some layers, films, panels, regions, etc. for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In addition, "on …" refers to positioning an element on or under another element, but not essentially on the upper side of the other element according to the direction of gravity.

The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or apparatus that comprises such element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A heat dissipating assembly, comprising:

a soaking member having opposite first and second sides, the second side having a recess;

the heat conducting pipe is accommodated and fixed in the groove;

wherein the soaking piece comprises: a plurality of soaking films laminated in sequence;

the grooves penetrate through at least two layers of soaking films which are continuously arranged from the second side.

2. The heat dissipating assembly of claim 1, wherein adjacent ones of said soaking films are adhesively secured by a thermally conductive adhesive film; the grooves also penetrate through the heat conducting adhesive film between the at least two layers of soaking films.

3. The heat dissipating assembly of claim 2, wherein the recess has a depth less than a thickness of the heat spreader, and wherein at least one layer of the heat spreader film and/or at least one layer of the heat conductive adhesive film is provided between a bottom of the recess and the first side.

4. The heat dissipating assembly of claim 1, wherein said soaking film is a flexible thermally conductive film.

5. The heat dissipating assembly of claim 2, wherein the thickness of the soaking film ranges from 70 μιη to 200 μιη, and/or the thickness of the heat conductive adhesive film ranges from 1 μιη to 5 μιη.

6. The heat dissipating assembly of claim 1, wherein the highest point of the surface of the heat conducting tube is flush with the surface of the second side or the highest point of the surface of the heat conducting tube is lower than the plane of the second side.

7. The heat dissipating assembly of claim 1, wherein said heat conducting tube is secured within said recess by a heat conducting glue.

8. An electronic device, comprising:

a circuit board;

an electronic component fixedly connected to the surface of the circuit board;

the heat sink assembly of any of claims 1-7, the heat sink assembly being in thermal contact with the electronic component.

9. The electronic device of claim 8, wherein the first side of the soaking member is in thermal contact with the electronic component.

10. The electronic device of claim 9, wherein a surface of the electronic component has an electromagnetic shield;

the heat dissipation assembly is disposed on a surface of the electromagnetic shield.