TWI789149B - Heat dissipation structure and electronic device - Google Patents

Abstract

The present invention discloses a heat dissipation structure and an electronic device. The heat dissipation structure includes a metal layer, a heat dissipation protection layer and a first adhesive layer. The heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes an overlapping structure of a polymer material layer and a heat dissipation coating. The first adhesive layer is disposed between the metal layer and the heat dissipation protection layer; wherein, the heat dissipation coating includes a filling member and a bonded member, the filling member is mixed in the bonded member. The filling member includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof. The present invention can quickly dissipate the heat generated by the heat source to the outside, and improve the heat dissipation performance of the electronic device.

Description

Heat dissipation structure and electronic device

The present invention relates to a heat dissipation structure, in particular to a heat dissipation structure with good heat dissipation effect and thin profile, and an electronic device with the heat dissipation structure.

With the development of science and technology, for the design and development of electronic devices, thinness and high performance are always given priority. In the case of high-speed computing and thinning, the electronic components of electronic devices will inevitably generate more heat than before. Therefore, "heat dissipation" has become an indispensable function of these components or devices. Especially for high-power components, due to the substantial increase in heat generated during work, the temperature of electronic products will rise rapidly. When electronic products are subjected to excessive temperatures, it may cause permanent damage to components or shorten the lifespan. significantly reduced.

Most of the known technologies use heat dissipation fins, fans, or heat dissipation elements (such as heat pipes) disposed on the components or devices to guide out the waste heat generated during operation. Wherein, the cooling fins or cooling fins generally have a certain thickness, and are made of metal materials with high thermal conductivity, or are made of doped inorganic materials with high thermal conductivity. However, although the heat conduction effect of the metal material is very good, the density is high, which will increase the weight and thickness of the cooling fin or the overall cooling fin. However, the structural strength of polymer composite materials doped with inorganic materials is not good, and may not be suitable for application in certain products.

Therefore, how to develop a heat dissipation structure that is more suitable for high-power components or devices, which can be applied to different product fields to meet the thinning requirements, has been one of the goals that related factories continue to pursue.

In view of the above, the purpose of the present invention is to provide a heat dissipation structure and an electronic device using the heat dissipation structure, which can quickly conduct and dissipate the waste heat generated by the operation of electronic components to the outside, and improve the heat dissipation performance of the electronic device. The invention can be applied to different product fields to meet the requirement of thinning.

The invention provides a heat dissipation structure, which includes a metal layer, a heat dissipation protection layer and a first adhesive layer. The heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes a laminated structure of a polymer material layer and a heat dissipation coating. The first adhesive layer is arranged between the metal layer and the heat dissipation protection layer; wherein, the heat dissipation coating includes a filler and a binder, the filler is mixed in the binder, and the filler includes graphene, carbon nanotubes, nitride Boron, silicon carbide, aluminum nitride, ceramic nitride, or combinations thereof.

In one embodiment, the material of the metal layer includes copper, aluminum, copper alloy, aluminum alloy, or a combination thereof.

In one embodiment, the first adhesive layer is double-sided adhesive tape or thermally conductive double-sided adhesive tape.

In one embodiment, the thickness of the heat dissipation coating is between 5 microns and 100 microns.

In one embodiment, the polymer material layer is located between the heat dissipation coating and the first adhesive layer.

In one embodiment, the heat dissipation coating is located between the polymer material layer and the first adhesive layer.

In one embodiment, the material of the bonding member includes acrylic, epoxy, polyurethane, or a combination thereof.

In one embodiment, the heat dissipation structure further includes a thermally conductive coating, which is disposed on the surface of the metal layer facing or away from the first adhesive layer. The material of the thermally conductive coating includes graphene, carbon nanotubes, boron nitride, and silicon carbide. , aluminum nitride, or combinations thereof.

In one embodiment, the heat dissipation structure further includes a second adhesive layer disposed on a side of the metal layer away from the heat dissipation protection layer.

The invention also provides a heat dissipation structure, which includes a heat conduction element and a heat dissipation coating. The heat conducting element has a surface. The heat dissipation coating is arranged on the surface of the heat conduction element; wherein, the material of the heat dissipation coating includes a filler and a bonding element, the filler is mixed in the bonding element, and the filler includes graphene, carbon nanotubes, boron nitride, carbide Silicon, aluminum nitride, ceramic nitride, or combinations thereof.

In one embodiment, the surface of the heat conduction element includes a plurality of protrusions, and the heat dissipation coating covers the protrusions and the two side surfaces of the heat conduction element.

In one embodiment, the material of the heat conducting element includes copper, aluminum, copper alloy, aluminum alloy, or a combination thereof.

The present invention further proposes an electronic device, which includes an electronic component and the heat dissipation structure of the above-mentioned embodiments. The electronic component generates waste heat during operation, and the heat dissipation structure is in contact with the electronic component.

In one embodiment, the electronic component includes a battery, a chip, an image processor, a memory, a motherboard, a display card, a display panel, a light emitting element, a light emitting module or a lighting module.

As mentioned above, in the heat dissipation structure of the present invention, the heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes a laminated structure of a polymer material layer and a heat dissipation coating; the first adhesive layer is disposed on the metal layer and the heat dissipation protection layer. Between the layers; wherein, the heat dissipation coating includes a filler and a bonding member, the filler is mixed in the bonding member, and the filler includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride , or a combination thereof; or, the heat dissipation coating is arranged on the surface of the heat conduction member; wherein, the material of the heat dissipation coating includes a filler and a bonding member, the filler is mixed in the bonding member, and the filler includes graphene, carbon nanotubes , boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof, when the heat dissipation structure is in contact with electronic components that generate waste heat during operation, the waste heat generated by the electronic components can be quickly and effectively conducted And dissipate to the outside, thereby improving the heat dissipation performance of the electronic device. In some embodiments, even in some airtight and high-temperature environments, the heat dissipation structure still has a good heat dissipation effect. In addition, the heat dissipating structure of the present invention can be applied to different product fields to meet the requirement of thinning the electronic device.

The heat dissipation structures and electronic devices according to some embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols. The components in the following embodiments are only used to illustrate their relative relationship, and do not represent the proportion or size of real components.

The heat dissipation structure of the present invention can be applied to different product fields to meet the requirement of thinning, and at the same time, it can improve the heat dissipation efficiency of the electronic device. Electronic devices such as mobile phones, tablets, notebook computers, lighting devices or lighting devices, when in operation, the internal electronic components will generate waste heat. Electronic components may include batteries, control chips (such as central control unit (CPU)), driver chips, image processors, memory (such as but not limited to SSD, solid state drive), motherboards, graphics cards, display panels, light emitting components (such as LED), lighting modules or lighting modules, or other components, units or modules that generate heat are not limited.

FIG. 1 is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention. As shown in FIG. 1 , the heat dissipation structure 1 of this embodiment includes a metal layer 11 , a heat dissipation protection layer 12 and a first adhesive layer 13 .

The metal layer 11 includes a metal sheet, metal foil, metal layer or metal film with high thermal conductivity, and its material may, for example but not limited to, include copper, aluminum, copper alloy (copper and other metal alloy), aluminum alloy (aluminum and other metal alloy), or a combination thereof. The metal layer 11 in this embodiment is an example of aluminum foil.

The heat dissipation protection layer 12 is disposed on the metal layer 11 , the heat dissipation protection layer 12 can protect the metal layer 11 , and at the same time can enhance heat radiation and heat exchange, and increase heat dissipation effect. The heat dissipation protection layer 12 includes a laminated structure of a polymer material layer 121 and a heat dissipation coating 122 . Among them, the polymer material layer 121 may include, but not limited to, polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (PC), acrylonitrile- Butadiene-styrene copolymer (ABS), or a film layer made of its combination, or a film layer made of other polymer materials.

The heat dissipation coating 122 can be water-based or oil-based, and can include a filling part 1221 and a bonding part 1222 , and the filling part 1221 is mixed in the bonding part 1222 . The filler 1221 may include, for example, graphene, carbon nanotubes, boron nitride (BN), silicon carbide (SiC), aluminum nitride (AlN), ceramic nitride, or a combination thereof. By mixing fillers 1221 of different dimensions (that is, graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride or ceramic nitride), synergistic effects can be obtained and different shapes and particle sizes can be achieved. A complete three-dimensional (3D) heat conduction network is stacked to enhance heat radiation and heat exchange, and increase heat dissipation efficiency. In some embodiments, the preferred material combination (and its ratio) of the filler 1221 is: graphene (20-60%), boron nitride and/or carbon black (20-40%), carbon nanotubes ( 20~40%). Wherein, the sheet diameter (D ₅₀ ) of graphene, for example, can be between 1 micron (μm) and 30 μm, and the thickness can be, for example, between 1 nanometer (nm) and 70 nm; the particle size of boron nitride or carbon black (D ₅₀ ) may be, for example, between 0.01 μm and 0.5 μm; the diameter of the single-wall or multi-wall carbon nanotubes may be, for example, between 5 nm and 30 nm, and the length, for example, may be between 5 μm and 30 μm.

The adhesive member 1222 can be resin, for example, and its material can include one of acrylic, epoxy resin, polyurethane, or a combination thereof. In addition, hardener and other materials can also be added to the heat dissipation coating 122 . The hardener is, for example, melamine resin or isocyanate, which can increase the crosslinking density to improve the adhesion, hardness and chemical resistance of the heat dissipation coating 122 .

The thickness of the heat dissipation coating 122 may be, for example, between 5 μm˜100 μm. In some embodiments, the heat dissipation coating 122 can be formed by disposing a slurry containing fillers 1221, adhesives 1222, hardeners, etc. on the polymer material layer 121 through a coating process, and then baked and cured. Thermal protection layer 12. Wherein, the coating process may be, for example but not limited to, spray coating, spin coating or precision coating. In some embodiments, the preferred material combination of the heat dissipation coating 122 can be, for example: 20% to 30% of the adhesive 1222 (such as resin), 0.5% to 1.5% of the filler 1221, neutralizer (pH regulator ) is 0.5%~1%, defoamer is 0.1%~0.5%, leveling agent is 0.1%~0.5%, adhesive agent<0.5%, acid catalyst<0.1%, thickener<0.1%, slow drying The curing agent is 0.5-1.5%, the hardening agent is 5%-10%, etc.

The first adhesive layer 13 is disposed between the metal layer 11 and the heat dissipation protection layer 12 . The heat dissipation coating 122 in this embodiment is set on the surface of the polymer material layer 121 away from the first adhesive layer 13 as an example, the polymer material layer 121 is located between the heat dissipation coating 122 and the first adhesive layer 13, and the The heat dissipation protection layer 12 is adhered to the metal layer 11 through the first adhesive layer 13 . The first adhesive layer 13 can be double-sided adhesive tape or thermally conductive double-sided adhesive tape. The thermally conductive double-sided adhesive can include adhesive material and thermally conductive material, and the thermally conductive material is mixed in the adhesive material. In addition to being viscous, the thermally conductive double-sided adhesive can also assist in the conduction of heat through the thermally conductive material. The thermally conductive material may include, for example, graphene, reduced graphene oxide, ceramic materials, or combinations thereof. The ceramic material is, for example but not limited to, boron nitride, aluminum oxide, aluminum nitride, silicon carbide, . In addition, the adhesive material can be, for example but not limited to, pressure sensitive adhesive (PSA), and its material can include, for example, rubber-based, acrylic-based, silicone-based, or a combination thereof; and the chemical composition can be rubber-based, Acrylic, silicone, or combinations thereof. In some embodiments, the thermally conductive double-sided adhesive is, for example, graphene double-sided adhesive.

In some embodiments, the heat dissipation structure may further include two release layers (not shown), which are correspondingly arranged on the upper and lower sides of the heat dissipation structure (for example, the lower surface of the metal layer 11 in FIG. 1 with thermal coating 122 on the upper surface). When using the heat dissipation structure, as long as the two release layers are removed, the heat dissipation structure can be attached and contacted with the heat source (electronic component) through double-sided adhesive or thermally conductive double-sided adhesive. The material of the release layer may be, for example but not limited to, paper, cloth, polyester (such as polyethylene terephthalate, PET), or a combination thereof, without limitation. It should be reminded that the upper and lower surfaces of the heat dissipation structure have release layers, which can also be applied to other embodiments of the present invention.

Please refer to FIG. 2A to FIG. 2F , which are schematic diagrams of heat dissipation structures according to different embodiments of the present invention.

As shown in FIG. 2A , the heat dissipation structure 1 a of this embodiment is substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the heat dissipation coating 122 of the heat dissipation structure 1 a in this embodiment is located between the polymer material layer 121 and the first adhesive layer 13 . The feature that the heat dissipation coating 122 is located between the polymer material layer 121 and the first adhesive layer 13 can also be applied to other embodiments of the present invention.

In addition, as shown in FIG. 2B and FIG. 2C , the heat dissipation structures 1 b and 1 c of this embodiment are substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the heat dissipation structures 1b and 1c of this embodiment may further include a thermally conductive coating 14 , and the thermally conductive coating 14 is disposed on the surface of the metal layer 11 facing or away from the first adhesive layer 13 . Here, the thermally conductive coating 14 in FIG. 2B is set on the surface of the metal layer 11 facing the first adhesive layer 13 as an example (the thermally conductive coating 14 is located between the metal layer 11 and the first adhesive layer 13), while the thermally conductive coating 14 in FIG. 2C The thermally conductive coating 14 is disposed on the surface of the metal layer 11 away from the first adhesive layer 13 as an example (the metal layer 11 is located between the thermally conductive coating 14 and the first adhesive layer 13 ). The thermally conductive coating 14 may include fillers, adhesives, hardeners, and other materials. Among them, the filler may include graphene, carbon nanotubes, ceramic materials (such as boron nitride, silicon carbide, aluminum nitride), or a combination thereof, and is disposed on the metal layer 11 by a coating process, and then through the first adhesive Layer 13 is connected to heat dissipation protection layer 12 . Here, the laminated structure of the metal layer 11 and the thermally conductive coating 14 is collectively referred to as a thermally conductive composite layer.

In addition, as shown in FIG. 2D , the heat dissipation structure 1 d of this embodiment is substantially the same as the heat dissipation structure 1 a of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the heat dissipation structure 1d of this embodiment can further include a heat conduction coating 14, the heat conduction coating 14 is located between the first adhesive layer 13 and the metal layer 11, and the heat dissipation coating 122 is located between the polymer material layer 121 and the second Between one adhesive layer 13 .

In addition, as shown in FIG. 2E , the heat dissipation structure 1 e of this embodiment is substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the heat dissipation structure 1 e of this embodiment further includes a second adhesive layer 15 , and the second adhesive layer 15 is disposed on the side of the metal layer 11 away from the heat dissipation protection layer 12 . The second adhesive layer 15 is used for connecting the heat source of the electronic device. The second adhesive layer 15 can be the same as the first adhesive layer 13 , and can be double-sided adhesive tape or thermally conductive double-sided adhesive tape. The second adhesive layer 15 can be applied in other embodiments of the present invention.

In addition, as shown in FIG. 2F , the heat dissipation structure 1f of this embodiment is substantially the same as the heat dissipation structure 1b of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the heat dissipation structure 1f of this embodiment further includes a second adhesive layer 15 , and the second adhesive layer 15 is disposed on the side of the metal layer 11 away from the heat dissipation protection layer 12 . The second adhesive layer 15 can be used to connect the heat source of the electronic device.

3A and 3B are schematic diagrams of heat dissipation structures of different embodiments of the present invention, respectively. As shown in FIG. 3A , the heat dissipation structure 2 a includes a heat conduction element 21 and a heat dissipation coating 22 . The heat conducting element 21 has a surface 211 . Here, the surface 211 may be the upper surface of the heat conduction element 21 and is a flat surface, and the heat dissipation coating 22 may be disposed on the surface 211 of the heat conduction element 21 by, for example, spraying. The heat conduction element 21 can be a heat conduction substrate, and its material includes, but is not limited to, copper, aluminum, copper alloy, aluminum alloy, or a combination thereof, but is not limited thereto. In some embodiments, the heat conduction element 21 can also be other types of heat conduction/dissipation structures, such as heat conduction film or heat dissipation film. The heat dissipation coating 22 at least includes a filling part 221 and a bonding part 222 , and the filling part 221 is mixed in the bonding part 222 . The heat dissipation coating 22 may have the same technical content as the above heat dissipation coating 122 , for details, refer to the above, and no further description is given.

In some embodiments, the thickness of the heat dissipation coating 22 is, for example, between 5 micrometers and 100 micrometers. In some embodiments, in addition to being disposed on the upper surface (surface 211 ) of the heat conduction element 21 , the heat dissipation coating 22 may also be disposed on both sides of the heat conduction element 21 to increase heat radiation performance. In some embodiments, the surface of the heat-conducting element 21 away from the heat-dissipating coating 22 (ie, the lower surface of the heat-conducting element 21 in FIG. 3A ) can be connected to the electronic component (heat source) to guide the waste heat generated by the electronic component and dissipate it to the outside. . The heat dissipation coating 22 can, for example, be coated on the surface of the heat conducting element 21 with any shape away from the heat source, so as to increase the heat radiation efficiency and improve the cooling effect.

In addition, as shown in FIG. 3B , the heat dissipation structure 2 b of this embodiment is substantially the same as the heat dissipation structure 2 a of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the surface 211 of the heat conduction element 21 of the heat dissipation structure 2b of this embodiment includes a plurality of protrusions P, and the heat dissipation coating 22 covers these protrusions P, the surface between the protrusions P, and both sides of the heat conduction element 21. side surface. In some embodiments, the protruding portion P can be, for example, a heat dissipation fin to increase the heat dissipation area, and through the heat dissipation coating 22 , the heat radiation and heat exchange can be increased to improve the cooling effect.

In some test cases, the above-mentioned heat dissipation structure 2 or 2b still has a good heat dissipation effect in an airtight environment with high ambient temperature. In some application examples, the heat dissipation structure 2 or 2b can be applied to components (heat sources) such as light source modules and lighting modules of light-emitting diodes, or to high-temperature electronic components (such as CPU, SSD), and modules Or for heat dissipation of the device.

FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the present invention. As shown in FIG. 4 , the present invention also proposes an electronic device 3 . The electronic device 3 includes an electronic component 31 and a heat dissipation structure 32 . The electronic component generates waste heat during operation, and the heat dissipation structure 32 contacts and connects with the electronic component 31 . In some embodiments, the heat dissipation structure 32 can be connected to the electronic component 31 through an adhesive layer 33 (such as double-sided tape or thermally conductive double-sided tape). Here, the heat dissipation structure 32 can be one of the heat dissipation structures 1 , 1 a to 1 f , 2 a or 2 b mentioned above, or a combination thereof. The specific technical content of the heat dissipation structures 1, 1a to 1f, 2a, 2b has been described in detail above, and will not be further described here. It can be understood that, if the heat dissipation structure 32 itself has the above-mentioned second adhesive layer, the adhesive layer 33 does not need to be provided.

The electronic device 3 is, for example but not limited to, a flat panel display, a lighting device or a lighting device, such as but not limited to a mobile phone, a notebook computer, a tablet computer, a TV, a monitor, a backlight module, a lighting or lighting device, or other electronic devices. The heat source can be batteries of electronic devices, control chips (such as central control unit (CPU)), driver chips, image processors, memory (such as but not limited to SSD, solid state hard disk), motherboards, display cards, display panels , lighting or lighting modules with light emitting diodes, or other components, modules or units that generate high heat are not limited. In some embodiments, when the electronic device 3 is a flat-panel display, such as but not limited to a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, or a liquid crystal display (LCD), the electronic component 31 can be The display panel has a display surface, and the heat dissipation structure 32 can be directly or indirectly attached to the opposite surface of the display surface, thereby assisting heat conduction and heat dissipation, and improving the heat dissipation performance of the flat panel display. In some other embodiments, when the electronic device 3 is a light emitting device or a lighting device, such as but not limited to a backlight module, an LED lighting or lighting (LED lighting) module, or an OLED lighting or lighting (OLED lighting) module, The electronic components 31 may include light-emitting components such as LEDs or OLEDs and have a light-emitting surface, and the heat dissipation structure 32 may be directly or indirectly attached to the surface opposite to the light-emitting surface, thereby assisting heat conduction and heat dissipation, and improving heat dissipation performance.

In addition, please refer to Table 1, under the condition of the same heat source and the same heat dissipation structure size (for example, 12mm*26mm), use three different heat dissipation structures to conduct cooling experiments. Wherein, #1 is a heat dissipation structure of an embodiment, and #2 and #3 are heat dissipation structures proposed by the present invention. It can be proved from Table 1 that the heat dissipation protection layer is arranged on the metal layer in the present invention, and the heat dissipation protection layer includes a laminated structure of a polymer material layer and a heat dissipation coating, which can effectively conduct the waste heat generated by the electronic components quickly and effectively. It dissipates to the outside world, and compared with the heat dissipation structure of #1, it can further increase the cooling effect by 3-3.5 degrees. If the size of the heat dissipation structure is increased to, for example, 18mm*29mm, the cooling effect can be increased to 7-8 degrees. Heat dissipation structure (from bottom to top) temperature (°C) temperature difference #1 (Second Adhesive) Adhesive Layer, Aluminum Foil (Metal Layer), First Adhesive Layer, PI (Polymer Material Layer) 138.6 - #2 (Second Adhesive) Adhesive Layer, Aluminum Foil (Metal Layer), First Adhesive Layer, PI (Polymer Material Layer), Thermal Coating 135.6 -3 #3 (Second Adhesive) Adhesive Layer, Aluminum Foil (Metal Layer), First Adhesive Layer, Thermal Coating, PI (Polymer Material Layer) 135.1 -3.5 Table I

In addition, please refer to Table 2, in the case of the same heat source and the same size of heat dissipation structure (for example, 12mm*26mm), use three different heat dissipation structures to conduct cooling experiments. Among them, #1 is a heat dissipation structure of an embodiment, and #2 and #3 are heat dissipation structures with a thermally conductive composite layer (metal layer, thermally conductive coating) proposed by the present invention. It can be proved from Table 2 that, compared with #1, the present invention has a heat dissipation structure of heat conduction composite layer and heat dissipation coating, which can indeed increase the cooling effect by 1-1.7 degrees. Heat dissipation structure (from bottom to top) temperature (°C) temperature difference #1 (Second) adhesive layer, aluminum foil (metal layer), (first) adhesive layer, PI (polymer material layer) 136.9 - #2 (Second) adhesive layer, aluminum foil (metal layer), thermal conductive coating, (first) adhesive layer, PI (polymer material layer), heat dissipation coating 135.2 -1.7 #3 (Second) adhesive layer, aluminum foil (metal layer), thermal conductive coating, (first) adhesive layer, heat dissipation coating, PI (polymer material layer) 135.9 -1 Table II

     

     

     

     

表三 In addition, please refer to Table 3, under the condition of the same heat source (such as SSD) and the same size of heat dissipation structure (such as 20mm*68mm), five different heat dissipation structures are used to conduct cooling experiments. Among them, #1 is a heat dissipation structure of an embodiment, and #2-#5 are heat dissipation structures proposed by the present invention (the graphene composite material is the above-mentioned heat conduction composite layer). It can also be proved from Table 3 that compared with #1, the cooling structure of the different embodiments proposed by the present invention can indeed increase the cooling effect by 0.2-1.3 degrees. #1 #2 #3 #4 #5 Black Mylar PET 25μm heat dissipation coating 25μm facing up PET 25μm heat dissipation coating 25μm facing down PI 25μm heat dissipation coating 20μm facing up PI 25μm Thermal coating 20μm facing down Temperature A measured on the surface of the heat source (°C) 58.1 57.2 57.9 - - Temperature difference with black Mylar - -0.9 -0.2 - - Temperature B measured on the surface of the heat source (°C) 59.7 58.4 59.2 58.6 59.3 Temperature difference with black Mylar - -1.3 -0.5 -1.1 -0.4 laminated structure

Table three

In addition, please refer to Table 4, in the case of the same heat source, heat dissipation experiments were conducted using four different heat dissipation coatings of fillers. Among them, #1 only has the aluminum plate, and #2~#4 are the heat dissipation coatings sprayed with different fillers on the aluminum plate. It can also be proved from Table 4 that compared with the pure aluminum plate #1, the heat dissipation coatings of different fillers proposed by the present invention can indeed increase the cooling effect by 8.0-10.1 degrees. project Spray thickness (μm) heat source temperature temperature difference temperature (surface) temperature difference #1: Aluminum plate (metal layer) (100mm*100mm*2mm) 0 72.1 0 60.3 0 #2: Aluminum plate sprayed with heat dissipation coating (filler is graphene) 30 63.4 -8.7 52 -8.3 #3: Spray heat dissipation coating on aluminum plate (filler is graphene mixed with boron nitride and carbon black) <10 64.1 -8.0 52.1 -8.2 #4: Spray heat dissipation coating on aluminum plate (filler is graphene mixed carbon nanotubes and carbon black) <10 63.1 -9.0 51.4 -8.9 30 62.0 -10.1 50.8 -9.5 Table four

In addition, please refer to Table 5, which shows that in the above-mentioned heat dissipation structure 2b with the protruding portion P, heat dissipation experiments were performed on three heat sources with different temperatures. Among them, the temperature settings of the heat source are respectively 80°C, 90°C and 100°C, but the measured temperatures after heat dissipation by the heat dissipation structure 2b are 68.3°C, 79.3°C and 88°C respectively, which proves that the present invention will The layer covering the protruding part of the heat conduction element and the surfaces on both sides can indeed improve the cooling effect by 10.7 to 12 degrees. Heat source set temperature 80°C 90°C 100°C Measured temperature 68.3°C 79.3°C 88°C temperature difference 11.7°C 10.7°C 12°C Table five

In addition, please refer to Table 6, which shows the heat dissipation experiments conducted on LED lamps as the heat source in a closed oven in a high temperature (heat balance 60°C) environment in the heat dissipation structure 2b with the protruding portion P above. Among them, "blank lamp" refers to an LED lamp without a heat dissipation structure 2b, and "anodizing" refers to anodizing the heat conducting member 21 (including a plurality of protrusions P) of an LED lamp provided with a heat dissipation structure 2b ( protection, anti-rust effect), "spraying" refers to spraying the heat dissipation coating 22 in addition to anodizing the heat conduction element 21 (including a plurality of protrusions P) of the LED lamp with the heat dissipation structure 2b. It can be proved from Table 6 that even if the LED lamp is in a high temperature environment (such as 60°C), the heat dissipation structure 2b of this case can indeed greatly improve the cooling effect (the maximum temperature can be reduced by 18.4°C). Ambient temperature 60°C Blank light fixture (A) Anodizing (B) Spraying (C) Temperature difference (BA) Temperature difference (CA) Power: 13W 1. (heat source) 193.9 192.1 175.5 -2.8 -18.4 2. (bottom) 111.8 101.7 97.6 -10.1 -14.2 3. (side) 99.8 100.7 97 1.1 -2.8 Power: 3.5W 1. (heat source) 100.0 100.7 94.9 0.7 -5.1 2. (bottom) 74.4 71.9 69.8 -2.5 -4.6 3. (side) 74.3 72.1 69.7 -2.2 -4.6 Table six

In addition, please refer to Table 7, which is the heat dissipation experiment conducted on LED lamps as the heat source in a closed oven and high temperature (heat balance 80°C) environment in the heat dissipation structure 2b with the protruding part P above. It can be proved from Table 7 that even if the LED lamp is in a high temperature environment (such as 80°C), the heat dissipation structure 2b of this case can indeed greatly improve the cooling effect (up to 14.9°C). Ambient temperature 80°C Blank light fixture (A) Anodizing (B) Spraying (C) Temperature difference (BA) Temperature difference (CA) Power: 12W 1. (heat source) 198.7 196 183.8 -2.7 -14.9 2. (bottom) 124.5 116.6 112.4 -7.9 -12.1 3. (side) 113.3 115.5 112.6 2.2 -0.7 Power: 1.9W 1. (heat source) 101.3 101 95.2 0.3 -6.1 2. (bottom) 84.1 85.8 82.1 1.7 -2 3. (side) 84.0 85.8 81.9 1.8 -2.1 Table seven

In summary, in the heat dissipation structure of the present invention, the heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes a laminated structure of a polymer material layer and a heat dissipation coating; the first adhesive layer is disposed on the metal layer and the heat dissipation protection layer. Between the layers; wherein, the heat dissipation coating includes a filler and a bonding member, the filler is mixed in the bonding member, and the filler includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride , or a combination thereof; or, the heat dissipation coating is arranged on the surface of the heat conduction member; wherein, the material of the heat dissipation coating includes a filler and a bonding member, the filler is mixed in the bonding member, and the filler includes graphene, carbon nanotubes , boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof, when the heat dissipation structure is in contact with electronic components that generate waste heat during operation, the waste heat generated by the electronic components can be quickly and effectively conducted And dissipate to the outside, thereby improving the heat dissipation performance of the electronic device. In some embodiments, even in some airtight and high-temperature environments, the heat dissipation structure still has a good heat dissipation effect. In addition, the heat dissipating structure of the present invention can be applied to different product fields to meet the requirement of thinning the electronic device.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

1,1a,1b,1c,1d,1e,1f,2a,2b,32: heat dissipation structure 11: metal layer 12: Thermal protection layer 121: polymer material layer 122,22: heat dissipation coating 1221,221: Filler 1222,222: Adhesive parts 13: The first adhesive layer 14: Thermally conductive coating 15: Second adhesive layer 21: Heat conduction parts 211: surface 3: Electronic device 31: Electronic components 33: Adhesive layer P: protrusion

FIG. 1 is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention. 2A to 2F are schematic diagrams of heat dissipation structures according to different embodiments of the present invention. 3A and 3B are schematic diagrams of heat dissipation structures of different embodiments of the present invention, respectively. FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the present invention.

1: Heat dissipation structure

11: metal layer

12: Thermal protection layer

121: polymer material layer

122: heat dissipation coating

1221: filler

1222: Adhesive parts

13: The first adhesive layer

Claims (11)

A heat dissipation structure, comprising: a metal layer; a heat dissipation protection layer disposed on the metal layer, the heat dissipation protection layer comprising a laminated structure of a polymer material layer and a heat dissipation coating; and a first adhesive layer disposed on the metal layer Between the metal layer and the heat dissipation protection layer; wherein, the heat dissipation coating includes a filler and a bonding element, the filler is mixed in the bonding element, and the filler includes graphene, carbon nanotubes, nitride Boron, silicon carbide, aluminum nitride, ceramic nitride, or combinations thereof. The heat dissipation structure according to claim 1, wherein the material of the metal layer includes copper, aluminum, copper alloy, aluminum alloy, or a combination thereof. The heat dissipation structure according to claim 1, wherein the first adhesive layer is double-sided adhesive or thermally conductive double-sided adhesive. The heat dissipation structure according to claim 1, wherein the thickness of the heat dissipation coating is between 5-100 microns. The heat dissipation structure according to claim 1, wherein the polymer material layer is located between the heat dissipation coating and the first adhesive layer. The heat dissipation structure according to claim 1, wherein the heat dissipation coating is located between the polymer material layer and the first adhesive layer. The heat dissipation structure according to claim 1, wherein the material of the bonding member includes acrylic, epoxy resin, polyurethane, or a combination thereof. The heat dissipation structure as described in claim 1, further comprising: a thermally conductive coating, disposed on the surface of the metal layer facing or away from the first adhesive layer, the material of the thermally conductive coating includes graphene, carbon nanotubes, nitrogen boron carbide, silicon carbide, aluminum nitride, or combinations thereof. The heat dissipation structure according to claim 1 further includes: a second adhesive layer disposed on a side of the metal layer away from the heat dissipation protection layer. An electronic device, comprising: an electronic component that generates waste heat during operation; and the heat dissipation structure according to any one of claims 1 to 9, the heat dissipation structure is in contact with the electronic component. The electronic device according to claim 10, wherein the electronic component includes a battery, a chip, an image processor, a memory, a motherboard, a display card, a display panel, a light emitting element, a light emitting module or a lighting module.

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