CN210725836U

CN210725836U - Heat dissipation structure and electronic device

Info

Publication number: CN210725836U
Application number: CN201921738691.XU
Authority: CN
Inventors: 萧毅豪
Original assignee: Henan Sili New Material Technology Co Ltd
Current assignee: Henan Sili New Material Technology Co Ltd
Priority date: 2019-10-16
Filing date: 2019-10-16
Publication date: 2020-06-09
Anticipated expiration: 2029-10-16

Abstract

The utility model discloses a heat radiation structure and electron device who has this heat radiation structure. The heat dissipation structure comprises a metal heat conduction layer, a first heat dissipation film, a protection film and a heat conduction adhesion layer. The metal heat conduction layer has a surface. The first heat dissipation film is arranged on the surface of the metal heat conduction layer. The protective film is arranged on one side of the metal heat conduction layer, which is back to the surface. The heat conduction adhesion layer is arranged between the metal heat conduction layer and the protection film. The utility model discloses a heat radiation structure and electron device who has this heat radiation structure can be applied to heat conduction and the heat dissipation demand of large tracts of land.

Description

Heat dissipation structure and electronic device

Technical Field

The utility model relates to a heat radiation structure and electron device who has this heat radiation structure.

Background

With the development of technology, the design and development of electronic devices are not optimized for thin, large size and high performance. In the case where high-speed operation, large size, and thin profile are required, the electronic device inevitably generates more heat than ever, and thus "heat dissipation" is an indispensable required function of the electronic device.

Most of the prior art uses heat dissipation fins, fans, or heat dissipation members (such as heat pipes) disposed on the device to conduct the waste heat generated during operation. The heat sink fins or heat dissipation plates are generally made of a metal material with high thermal conductivity or a polymer composite material doped with an inorganic material with high thermal conductivity, such as boron nitride and aluminum nitride. However, although the metal material has a good heat conduction effect, the metal material has a high density, which increases the overall weight and thickness. The polymer composite material doped with the inorganic material has poor structural strength and may not be suitable for being applied to certain products.

Therefore, it is an important subject how to develop a heat dissipation structure, which not only has a high heat conduction effect, but also can be suitable for the heat conduction and dissipation requirements of a large-area heat source.

SUMMERY OF THE UTILITY MODEL

The present invention provides a heat dissipation structure and an electronic device having the same, which not only has higher heat conduction and heat dissipation effects, but also can be properly applied to the large-area heat conduction and heat dissipation requirements of different electronic products.

To achieve the above object, the heat dissipation structure of the present invention includes a metal heat conduction layer, a first heat dissipation film, a protection film, and a heat conduction adhesive layer. The metal heat conduction layer has a surface. The first heat dissipation film is arranged on the surface of the metal heat conduction layer. The protective film is arranged on one side of the metal heat conduction layer, which is back to the surface. The heat conduction adhesion layer is arranged between the metal heat conduction layer and the protection film.

To achieve the above object, an electronic device according to the present invention includes a heat source, a heat dissipation structure and a second heat-conducting adhesive layer. The heat dissipation structure is arranged on the heat source and comprises a metal heat conduction layer, a first heat dissipation film, a protection film and a first heat conduction adhesion layer, wherein the metal heat conduction layer is provided with a surface, the first heat dissipation film is arranged on the surface of the metal heat conduction layer, the protection film is arranged on one side, back to the surface, of the metal heat conduction layer, and the first heat conduction adhesion layer is arranged between the metal heat conduction layer and the protection film. The second heat-conducting adhesion layer is arranged between the heat source and the heat dissipation structure.

Bearing the utility model discloses an among the heat radiation structure, through the surface of first heat dissipation film setting at the metal heat-conducting layer, the protection film sets up in one side on this surface of metal heat-conducting layer dorsad, and the structural design of heat conduction adhesion layer setting between metal heat-conducting layer and protection film, can make heat radiation structure have higher heat conduction and radiating effect, can guide and dissipate the produced heat energy of electron device's heat source to the external world fast. In addition, the characteristic that the metal heat conduction layer is resistant to bending can protect the heat dissipation structure from heat energy transmission interruption caused by damage caused by bending. Furthermore, the utility model discloses a heat radiation structure can be based on electron device's heat source shape and size preparation for heat radiation structure has outside with low costs advantage, still can suitably use in the heat conduction and the heat dissipation demand of the large tracts of land of different electronic products.

Drawings

Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention.

Fig. 2A and fig. 2B are schematic diagrams of heat dissipation structures according to different embodiments of the present invention.

Fig. 3 is a schematic diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

The heat dissipation structure and the electronic device having the same according to some embodiments of the present invention will be described with reference to the accompanying drawings, wherein like elements are denoted by like reference numerals. The dimensions (length, width, or height) and ratios of the components shown in the following figures are merely illustrative of the interrelationships between the components, and are not dependent on the dimensions and ratios of the actual components.

The utility model discloses a heat radiation structure except can having higher heat conduction and radiating effect, still can suitably use in the heat conduction and the heat dissipation demand of the large tracts of land of different electronic products. The heat dissipation structure of the present invention can be applied to electronic devices, such as but not limited to, notebook computers, mobile phones, tablets, displays, and related computer devices in servers, or other electronic devices. The heat dissipation structure can be attached to a heat source of the electronic device and connected with the heat source so as to guide and dissipate heat generated by the heat source. The heat source may be a display panel, a battery, a control chip, a motherboard, a Central Processing Unit (CPU), a memory, or a display adapter of the electronic device, or other components or units that generate heat.

Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention. As shown in fig. 1, the heat dissipation structure 1 of the present embodiment includes a metal heat conduction layer 11, a first heat dissipation film 12, a protection film 13, and a heat conduction adhesive layer 14.

The metallic heat conductive layer 11 has a surface 111 and another surface 112 opposite the surface 111. As the name implies, the metallic heat conductive layer 11 is made of a metallic material with a high thermal conductivity, such as, but not limited to, copper, aluminum, iron, silver, gold, or alloys thereof. The aforementioned metal materials such as copper, aluminum, iron, silver, and gold have high thermal conductivity, and their ductility and bending resistance are also excellent. The material of the metal heat conduction layer 11 of the present embodiment is copper, for example. Copper is suitable as a heat dissipating material resistant to bending because of its excellent flexibility, ductility, and thermal conductivity. The metal heat conductive layer 11 of the copper material of the present embodiment can be Electrolytic copper foil (Electrolytic copper foil) or Rolled copper foil (Rolled copper foil), but is not limited thereto.

The first heat dissipation film 12 is disposed on the surface 111 of the metal heat conduction layer 11. Here, the first heat dissipation film 12 and the metal heat conduction layer 11 are disposed to overlap each other. The material of the first heat dissipation film 12 may include, for example and without limitation, graphene, carbon, artificial graphite, natural graphite, or carbon nanotubes, or a combination thereof. In the present embodiment, the material of the first heat dissipation Film 12 is, for example, Graphene, so that the first heat dissipation Film 12 is a Graphene Thermal Film (GTF). In some embodiments, after the graphene nanoplatelets (the material of the first heat dissipation film 12) are formed into a paste, the paste is disposed on the surface 111 of the metal heat conduction layer 11 by a process such as coating or printing, and after curing, the first heat dissipation film 12 is formed on the surface 111 of the metal heat conduction layer 11; alternatively, the first heat dissipation film 12 is prepared by using the paste, and then attached to the surface 111 of the metal heat conduction layer 11 in an adhering manner, which is not limited in the present invention. The coating process may be, for example, but not limited to, spray coating (spray coating) or spin coating (spin coating), and the printing process may be, for example, but not limited to, inkjet printing (inkjet printing) or screen printing (screen printing).

Four formulations of the above slurry are presented below: the first is 60% graphene nanoplatelets mixed with 40% Binder (Binder); the second is that 70 percent of graphene micro-sheets are mixed with 30 percent of adhesive; the third is 60% graphene nanoplatelets, 30% binder and 10% filler mixed; the fourth is 10% graphene nanoplatelets, 10% binder mixed with 80% filler. Wherein, the adhesive can be water-based adhesive or oil-based adhesive (solvent-based adhesive). The aqueous binder can be aqueous polyurethane, aqueous acrylic emulsion, styrene-acrylic emulsion, aqueous epoxy resin emulsion, styrene-butadiene rubber emulsion, polypropylene emulsion, polyurethane modified acrylic emulsion or a mixed solution; the oily binder (solvent type) can be polyurethane, polyvinylidene fluoride, acrylic acid, polyimide, saturated/unsaturated polyester resin, amino resin, polyester polyol resin, phenolic resin, etc. The filler can be ceramic powder, and the material can be boron nitride, aluminum nitride, alumina, a mixture of boron nitride and aluminum nitride, or a mixture of multiple boron nitride and aluminum nitride.

The protective film 13 is disposed on a side of the metal heat conduction layer 11 opposite to the surface 111, and the heat conductive adhesive layer 14 is disposed between the metal heat conduction layer 11 and the protective film 13. Here, the protective film 13 is attached (adhered) to the surface 112 of the metal heat conductive layer 11 by the heat conductive adhesive layer 14. The material of the protective film 13 may include, for example, an acrylic material, such as but not limited to a Mylar protective film. The protective film 13 can protect the metal heat conduction layer 11 and prevent the material of the metal heat conduction layer 11 from being corroded due to oxidation. In addition, the thermally conductive adhesive layer 14 may include an adhesive material and a thermally conductive material mixed with the adhesive material. In some embodiments, the thermally conductive material may be, for example, but not limited to, graphene microchip, and the adhesive material may include, for example, adhesive resin (binder resin), which may be a single resin or a mixture of two or more resins, and the resin may be selected from the group consisting of polyvinyl alcohol-based resin (pva-based resin), silicon-based resin (silicone-based) resin, epoxy-based resin (epoxy-based) resin, acrylate-based resin (acrylate-based) resin, urethane-based resin (urethane-based) resin, polyamide-based resin (polyamide-based) resin, or polyimide-based resin (polyimide-based) resin. Therefore, unlike a common adhesive tape (e.g., a double-sided adhesive tape), the thermal conductive adhesive layer 14 of the present embodiment not only has an adhesive function, but also can assist in the conduction of heat energy through the graphene, so as to improve the thermal conduction performance. In some embodiments, the thickness of the thermally conductive adhesive layer 14 is, for example, 2 microns.

In view of the above, in the heat dissipation structure 1 of the present embodiment, the first heat dissipation film 12 is disposed on the surface 111 of the metal heat conduction layer 11, the protection film 13 is disposed on a side of the metal heat conduction layer 11 opposite to the surface 111, and the heat conductive adhesive layer 14 is disposed between the metal heat conduction layer 11 and the protection film 13, so that the heat dissipation structure 1 has high heat conduction and heat dissipation effects, and when the heat dissipation structure 1 is applied to heat dissipation of an electronic device, heat generated by a heat source of the electronic device can be quickly guided and dissipated to the outside. In addition, due to the characteristics of bending resistance and hard breaking of the metal heat conduction layer 11, the heat dissipation structure 1 can be protected from heat energy transmission interruption caused by damage due to bending. In addition, the metal heat conduction layer 11, the first heat dissipation film 12, the protection film 13 and the heat conduction adhesion layer 14 of the embodiment are respectively planar, and can be manufactured according to the shape and size of the heat source of the electronic device, so that the heat dissipation structure 1 has the advantage of low cost, and can be suitably applied to the large-area heat conduction and heat dissipation requirements of different electronic products. For example, if the heat source is a flat plate, the shapes of the metal heat conduction layer 11 and the first heat dissipation film 12 may correspond to the shape of the heat source, preferably, the shapes and the sizes are the same, so that the heat generated by the heat source is quickly guided and dissipated to the outside through the heat dissipation structure 1, thereby meeting the requirements of large-area heat conduction and heat dissipation.

As shown in fig. 2A, the heat dissipation structure 1a of the present embodiment is substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that in the heat dissipation structure 1a of the present embodiment, an adhesive layer 15 is further included, and the first heat dissipation film 12 is disposed on the surface 111 of the metal heat conduction layer 11 in an adhesive manner through the adhesive layer 15. Wherein the adhesive layer 15 and the thermally conductive adhesive layer 14 may have the same material and characteristics.

As shown in fig. 2B, the heat dissipation structure 1B of the present embodiment is substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the heat dissipation structure 1b of the present embodiment further includes a second heat dissipation film 12a, the second heat dissipation film 12a is disposed between the metal heat conduction layer 11 and the heat conductive adhesive layer 14, and the protection film 13 is disposed (attached) on a surface of the second heat dissipation film 12a opposite to the metal heat conduction layer 11 through the heat conductive adhesive layer 14. Of course, according to the embodiment of fig. 2A, the adhesive layers 15 may also be disposed between the first heat dissipation film 12 and the metal heat conduction layer 11 and/or between the second heat dissipation film 12A and the metal heat conduction layer 11, respectively, so as to attach the first heat dissipation film 12 and/or the second heat dissipation film 12A to the surface of the metal heat conduction layer 11 through the adhesive layers 15.

In addition, the first heat dissipation film 12 and the second heat dissipation film 12a of the present embodiment may have the same material (e.g., graphene); or the first and second

heat dissipating films

12 and 12a may have different materials (e.g., one of which has graphene and the other of which has graphene and carbon nanotubes). In addition, the metal heat conduction layer 11, the first heat dissipation film 12, the second heat dissipation film 12a, the protection film 13 and the heat conduction adhesion layer 14 of the embodiment are respectively planar, and a suitable heat dissipation structure can be manufactured according to the shape and size of a heat source of the electronic device, so that the advantage of low cost is also achieved, and the heat conduction and heat dissipation requirements of different electronic products in large areas can be properly applied. For example, if the heat source is a flat plate, the shapes of the metal heat conduction layer 11, the first heat dissipation film 12 and the second heat dissipation film 12a can correspond to the shape of the heat source, so that the heat generated by the heat source can be quickly guided and dissipated to the outside through the heat dissipation structure 1b, thereby achieving the requirements of large-area heat conduction and heat dissipation.

Fig. 3 is a schematic view of an electronic device according to an embodiment of the invention.

The electronic device 2 includes a heat source 21, a heat dissipation structure 22, and a (second) thermally conductive adhesive layer 23. The heat dissipation structure 22 is disposed on the heat source 21, and the thermal conductive adhesive layer 23 is disposed between the heat source 21 and the heat dissipation structure 22. Here, the heat dissipation structure 22 is disposed (attached) on the heat source 21 of the electronic device by the heat conductive adhesive layer 23, so as to transfer and dissipate the heat energy of the heat source 21 to the outside. The heat source 21 may be a flat plate-shaped heat source, such as but not limited to a display panel, and the heat dissipation structure 22 may be one of the heat dissipation structures 1, 1a, and 1b, or a variation thereof, or a combination thereof. In addition, the material of the thermal adhesive layer 23 can be the same as the thermal adhesive layer 14, and the detailed technical content is described in detail above and will not be described further. In some embodiments, the thermal adhesive layer 23 may be disposed between the heat source 21 and the first heat dissipation film of the heat conducting structure 22, so that the first heat dissipation film of the heat conducting structure 22 is disposed (attached) to the heat source 21 by the thermal adhesive layer 23.

The electronic apparatus 2 may be, for example, but not limited to, a notebook computer, a mobile phone, a tablet, a display, and a related computer device in a server, or other electronic devices. In some embodiments, when the electronic device 2 is a mobile phone or a display, such as but not limited to a display including a Light Emitting Diode (LED) display device or an Organic Light Emitting Diode (OLED) display device, the heat source 21 may be a display screen and has a display surface, and the heat dissipation structure 22 may be attached to a surface opposite to the display surface (i.e., a back surface of the display screen) through the heat conductive adhesive layer 23, so that the heat dissipation structure 22 is connected to the heat source 21 through the heat conductive adhesive layer 23, thereby achieving higher heat conduction and heat dissipation performance.

To sum up, the utility model discloses an among the heat radiation structure, through the surface of first heat dissipation film setting at the metal heat-conducting layer, the protection film sets up in the one side on this surface of metal heat-conducting layer dorsad, and the structural design of heat conduction adhesion layer setting between metal heat-conducting layer and protection film, can make heat radiation structure have higher heat conduction and radiating effect, can guide the produced heat energy of electron device's heat source fast and dissipate to the external world. In addition, the characteristic that the metal heat conduction layer is resistant to bending can protect the heat dissipation structure from heat energy transmission interruption caused by damage caused by bending. Furthermore, the utility model discloses a heat radiation structure can be based on electron device's heat source shape and size preparation for heat radiation structure has outside with low costs advantage, still can suitably use in the heat conduction and the heat dissipation demand of the large tracts of land of different electronic products.

The foregoing is by way of example only and is not intended as limiting. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A heat dissipation structure, comprising:

a metal heat conducting layer having a surface;

the first heat dissipation film is arranged on the surface of the metal heat conduction layer;

the protective film is arranged on one side, back to the surface, of the metal heat conduction layer; and

and the heat conduction adhesion layer is arranged between the metal heat conduction layer and the protection film.

2. The heat dissipation structure of claim 1, further comprising:

and the second heat dissipation film is arranged between the metal heat conduction layer and the heat conduction adhesion layer.

3. The heat dissipation structure of claim 2, wherein the first and second heat dissipation films are of the same material.

4. The heat dissipation structure of claim 2, wherein the first and second heat dissipation films are of different materials.

5. An electronic device, comprising:

a heat source;

the heat dissipation structure is arranged on the heat source and comprises a metal heat conduction layer, a first heat dissipation film, a protection film and a first heat conduction adhesion layer, wherein the metal heat conduction layer is provided with a surface, the first heat dissipation film is arranged on the surface of the metal heat conduction layer, the protection film is arranged on one side, back to the surface, of the metal heat conduction layer, and the first heat conduction adhesion layer is arranged between the metal heat conduction layer and the protection film; and

the second heat conduction adhesion layer is arranged between the heat source and the heat dissipation structure.

6. The electronic device of claim 5, wherein the second thermally conductive adhesive layer is disposed between the heat source and the first heat spreading film.

7. The electronic device of claim 5, wherein the heat dissipation structure further comprises a second heat dissipation film disposed between the metal thermal conduction layer and the first thermal conductive adhesive layer.

8. The electronic device of claim 7, wherein the first and second heat spreading films are of the same material.

9. The electronic device of claim 7, wherein the first and second heat spreading films are of different materials.

10. The electronic device of claim 7, wherein the heat source is a flat plate, and the shape of the metal heat conducting layer, the first heat spreading film, and the second heat spreading film corresponds to the shape of the heat source.