CN219698363U - Wave absorbing plate with good thermal conductivity - Google Patents
Wave absorbing plate with good thermal conductivity Download PDFInfo
- Publication number
- CN219698363U CN219698363U CN202320785297.1U CN202320785297U CN219698363U CN 219698363 U CN219698363 U CN 219698363U CN 202320785297 U CN202320785297 U CN 202320785297U CN 219698363 U CN219698363 U CN 219698363U
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- Prior art keywords
- wave
- wave absorbing
- absorbing plate
- layer
- plate
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- 239000010410 layer Substances 0.000 claims abstract description 54
- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 5
- 239000004917 carbon fiber Substances 0.000 claims abstract description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a wave absorbing plate with good heat conductivity, which relates to the technical field of wave absorbing plates and comprises a first wave absorbing plate, a second wave absorbing plate is arranged on one side of the first wave absorbing plate, connecting strips are arranged between the first wave absorbing plate and the second wave absorbing plate, gaps are formed in two sides of the connecting strips, adhesive layers are arranged on one sides of the first wave absorbing plate and the second wave absorbing plate, protective paper is arranged on one side of the adhesive layers, auxiliary heat conducting layers are arranged on the outer surfaces of the first wave absorbing plate and the second wave absorbing plate, and the auxiliary heat conducting layers are made of carbon fiber materials.
Description
Technical Field
The utility model relates to the technical field of wave absorbing plates, in particular to a wave absorbing plate with good thermal conductivity.
Background
The heat conduction wave absorbing plate integrates heat conduction and electromagnetic wave absorption functions, absorbs leaked electromagnetic radiation while guiding out heat, solves double problems in a limited space, achieves the purposes of simplifying mechanism design and reducing cost, adopts silica gel, neoprene and the like as base materials, can absorb microwaves and electromagnetic energy and reflect and scatter smaller materials, and is mainly used for solving the EMI problems in microwave devices and high-frequency electronic equipment.
The prior art publication No. CN214960843U is a composite wave absorbing plate which comprises a wear-resistant protective layer, a flexible protective layer, a metal layer, a first wave absorbing layer and a second wave absorbing layer, wherein the metal layer is provided with a bulge embedded into the flexible protective layer, one side of the flexible protective layer, facing the metal layer, is provided with a conical groove, and the bulge is matched with the conical groove. The wear-resistant protective layer has excellent wear resistance and insulating properties, the flexible protective layer has insulating properties and excellent flexibility, the metal layer provides electromagnetic shielding properties, the first wave absorbing layer provides main wave absorbing properties, and the magnetic permeability is higher than that of the second wave absorbing layer, and although the patent has good wear resistance, shielding properties, heat dissipation and high magnetic permeability, in actual use, the current wave absorbing plate is mostly single, when the wave absorbing plate is required to be applied to a circuit board, due to different contact areas of surfaces of different circuit boards, and when the single wave absorbing plate is stuck to the circuit board with a larger area, only a part of heat conducting effect can be provided, so that the whole heat dissipation of the circuit board is inconvenient.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a wave absorbing plate with good heat conductivity.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a wave plate is inhaled to good heat conductivity, includes that wave plate is inhaled to the first one, one side that wave plate was inhaled to the first one is provided with No. two wave plates, install the connecting strip between wave plate is inhaled to the first one and No. two wave plates, the breach has all been seted up to the both sides of connecting strip, one side that wave plate was inhaled to the first one and No. two wave plates all is provided with the adhesion layer, one side of adhesion layer is provided with the protective paper, the surface that wave plate was inhaled to the first one and No. two wave plates all is provided with supplementary heat conduction layer.
In order to improve the heat conduction effect of the first wave absorbing plate and the second wave absorbing plate, the utility model is improved in that the auxiliary heat conduction layer is made of carbon fiber materials.
In order to fix the first wave absorbing plate and the second wave absorbing plate on the circuit board, the utility model is improved in that the adhesive layer is made of organic silicon elastic glue.
In order to prolong the service lives of the first wave absorbing plate and the second wave absorbing plate, the utility model is improved in that the surfaces of the first wave absorbing plate and the second wave absorbing plate are respectively provided with an auxiliary layer, the auxiliary layers comprise sealing waterproof layers, the sealing waterproof layers are respectively arranged at the positions of the sides of the first wave absorbing plate and the second wave absorbing plate, and the outer surfaces of the sealing waterproof layers are also provided with reinforcing layers.
In order to reduce the infiltration of water vapor, the utility model is improved in that the sealing waterproof layer is made of polyurethane waterproof paint.
In order to improve the edge strength of the first wave absorbing plate and the second wave absorbing plate, the utility model is improved in that the reinforcing layer is made of an epoxy resin composite material.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. in actual use, the utility model adopts the mode that the connecting strips are connected in series with a plurality of groups of the first wave absorbing plate and the second wave absorbing plate, so that the whole wave absorbing plate can be covered on the surface of the circuit board with larger contact area, the heat conducting area and the heat conductivity are increased, and the heat dissipation of the circuit board is facilitated.
2. In actual use, the auxiliary layer plays a role in improving the waterproofness and the self strength of the first wave absorbing plate and the second wave absorbing plate, and prolongs the service lives of the first wave absorbing plate and the second wave absorbing plate.
Drawings
FIG. 1 is a schematic diagram showing the overall structure of a wave absorbing plate with good thermal conductivity;
FIG. 2 is a schematic diagram showing the structure of the surface of a first wave absorbing plate in the wave absorbing plate with good thermal conductivity;
fig. 3 is a schematic structural diagram of a side wall of a first wave absorbing plate in the wave absorbing plate with good thermal conductivity.
Legend description:
1. a first wave absorbing plate; 2. a second wave absorbing plate; 3. a connecting strip; 4. a notch; 5. an adhesive layer; 6. protective paper; 7. an auxiliary heat conductive layer; 8. sealing the waterproof layer; 9. and a reinforcing layer.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Referring to fig. 1-2, the present utility model provides a technical solution: the utility model provides a wave plate that inhales that heat conductivity is good, includes that a wave plate 1 is inhaled to a wave plate 1, and one side that inhales wave plate 1 is provided with No. two wave plates 2, and a wave plate 1 is inhaled to a wave plate 1 and No. two wave plates 2 between install connecting strip 3, and the wave plate 1 is inhaled to a wave plate 2 is inhaled to a multiunit through connecting strip 3, has played when increasing circuit board heat conduction area, avoids people to appear crookedly when bonding different wave plates in succession and then leads to the condition that overlaps or is the dislocation to appear between the wave plates.
Referring to fig. 1-2, the two sides of the connecting strip 3 are provided with notches 4, one side of the first wave absorbing plate 1 and one side of the second wave absorbing plate 2 are provided with adhesive layers 5, the adhesive layers 5 are made of organic silicon elastic glue, the first wave absorbing plate 1 and the second wave absorbing plate 2 can be fixed on a circuit board by arranging the adhesive layers 5, one side of the adhesive layers 5 is provided with protective paper 6, the outer surfaces of the first wave absorbing plate 1 and the second wave absorbing plate 2 are provided with auxiliary heat conducting layers 7, the auxiliary heat conducting layers 7 are made of carbon fiber materials, and the heat conducting performance of the first wave absorbing plate 1 and the second wave absorbing plate 2 and the strength of the surface of the self are improved by arranging the auxiliary heat conducting layers 7.
In the second embodiment, referring to fig. 1 and 3, the surfaces of the first wave absorbing plate 1 and the second wave absorbing plate 2 are provided with auxiliary layers, each auxiliary layer comprises a sealing waterproof layer 8, the sealing waterproof layers 8 are respectively arranged on the side surfaces of the first wave absorbing plate 1 and the second wave absorbing plate 2 and are located at the peripheral positions, the sealing waterproof layers 8 are made of polyurethane waterproof paint, and the effect of reducing water vapor infiltration at the gaps of the first wave absorbing plate 1 and the second wave absorbing plate 2 is achieved through the arrangement of the polyurethane waterproof paint.
Referring to fig. 1 and 3, a reinforcing layer 9 is further disposed on the outer surface of the sealing waterproof layer 8, the reinforcing layer 9 is made of an epoxy resin composite material, and the epoxy resin composite material can effectively inhibit cracking of the material, so that the effect of improving the edge strength of the first wave absorbing plate 1 and the second wave absorbing plate 2 is achieved.
Working principle: through setting up a inhale wave plate 1, no. two inhale wave plate 2, connecting strip 3, breach 4, paste layer 5, guard paper 6 and supplementary heat conduction layer 7, in the course of working of inhaling the wave plate, can inhale wave plate 1 and No. two inhale wave plate 2 with a single group or multiunit and establish ties through connecting strip 3, during the use, can be according to actual circuit board's size, inhale wave plate 1 and No. two inhale wave plate 2 in proper order and paste at circuit board surface, when pasting, only need to tear down the guard paper 6 of pasting layer 5 bottom surface, then inhale wave plate 1 and No. two inhale wave plate 2 side paste layer 5 again and paste at circuit board surface can, a plurality of a wave plate 1 and No. two inhale wave plate 2's combination can effectively increase the heat conduction area simultaneously, and then the holistic range heat dissipation of circuit board of being convenient for, and No. two carbon fiber material's supplementary heat conduction layer 7 have excellent heat conduction ability, thereby improved a wave plate 1 and No. two inhale wave plate 2's effect, when needs inhale wave plate 1 or No. 2 to separate with a plurality of, need inhale wave plate 1 or No. 2 and take off the heat conduction layer 3 and take place by a plurality of, can also take place in order to seal the crack with No. 2 and take place at 1 and No. 2, no. two and the position of tearing crack 1 and No. 2, no. 1 and No. two inhale wave plate 2 and the position 1 and No. 1 and the water-absorbing wave plate 2 side seal layer 1 and the position is provided with a crack.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.
Claims (6)
1. The utility model provides a wave absorbing plate that heat conductivity is good, includes wave absorbing plate (1), its characterized in that: one side of wave plate (1) is provided with No. two wave plates (2) of inhaling, install connecting strip (3) between wave plate (1) and No. two wave plates (2) of inhaling, breach (4) have all been seted up to the both sides of connecting strip (3), one side of wave plate (1) and No. two wave plates (2) of inhaling all is provided with adhesive layer (5), one side of adhesive layer (5) is provided with protective paper (6), the surface of wave plate (1) and No. two wave plates (2) of inhaling all is provided with supplementary heat conduction layer (7).
2. The thermally highly conductive wave plate of claim 1, wherein: the auxiliary heat conduction layer (7) is made of carbon fiber materials.
3. The thermally highly conductive wave plate of claim 1, wherein: the adhesive layer (5) is made of organic silicon elastic glue.
4. The thermally highly conductive wave plate of claim 1, wherein: the surface that wave plate (1) and No. two wave plates (2) are inhaled to a No. one all is provided with the auxiliary layer, the auxiliary layer include sealed waterproof layer (8), sealed waterproof layer (8) set up respectively in wave plate (1) and No. two wave plates (2) are inhaled the side and are located position department all around, the surface of sealed waterproof layer (8) still is provided with enhancement layer (9).
5. The thermally highly conductive wave plate of claim 4, wherein: the sealing waterproof layer (8) is made of polyurethane waterproof paint.
6. The thermally highly conductive wave plate of claim 4, wherein: the reinforcing layer (9) is made of an epoxy resin composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320785297.1U CN219698363U (en) | 2023-04-11 | 2023-04-11 | Wave absorbing plate with good thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320785297.1U CN219698363U (en) | 2023-04-11 | 2023-04-11 | Wave absorbing plate with good thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219698363U true CN219698363U (en) | 2023-09-15 |
Family
ID=87943165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320785297.1U Active CN219698363U (en) | 2023-04-11 | 2023-04-11 | Wave absorbing plate with good thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219698363U (en) |
-
2023
- 2023-04-11 CN CN202320785297.1U patent/CN219698363U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |