CN214476726U

CN214476726U - High-power precise chip resistor

Info

Publication number: CN214476726U
Application number: CN202120849412.8U
Authority: CN
Inventors: 朱丽明
Original assignee: Shenzhen Yixinda Technology Co ltd
Current assignee: Shenzhen Yixinda Technology Co ltd
Priority date: 2021-04-23
Filing date: 2021-04-23
Publication date: 2021-10-22
Anticipated expiration: 2031-04-23

Abstract

The utility model belongs to the technical field of chip resistors, and discloses a high-power precise chip resistor, which comprises a ceramic body, wherein a mark layer is arranged at the top of the ceramic body, both sides of the ceramic body are connected with external electrode layers, the bottom end of the ceramic body is provided with a heating panel, the ceramic body comprises a substrate, the top of the substrate is connected with an internal electrode layer, the bottom of the substrate is fixed with a reinforced layer, the bottom of the reinforced layer is connected with a flame-retardant layer, a protective layer is arranged between the ceramic body and the mark layer, and a drying layer is connected between the ceramic body and the external electrode layer, the utility model can prevent the ceramic body from burning due to overhigh temperature through the flame-retardant layer, can greatly enhance the waterproof protection effect of the chip resistor through the matching of the protective layer and the drying layer, effectively avoids the internal structure from being wetted by water, and can greatly improve the heat conduction effect between the internal layer and the layer through the reinforced layer, thereby further improving the heat dissipation efficiency of the chip resistor.

Description

High-power precise chip resistor

Technical Field

The utility model belongs to the technical field of the chip resistor, concretely relates to accurate chip resistor of high power.

Background

The chip resistor is a metal glass glaze resistor, which is made by mixing metal powder and glass glaze powder and printing the mixture on a substrate by a screen printing method, can greatly save the circuit space cost, and has the advantages of more refined design, small volume, light weight, high installation density, strong anti-interference capability, good high-frequency characteristic and the like, and is widely applied to computers, mobile phones, electronic dictionaries, medical electronic products, video cameras, electronic kilowatt-hour meters, VCD (video command recorder) and the like.

In chinese patent with patent number CN202011240439.3, a high-power precise chip resistor is disclosed, the device sets up the cooling heat dissipation plate through the outside at the chip resistor, first heat-conducting plate and second heat-conducting plate, thereby the problem of chip resistor because the higher electrical property stability and the reliability that lead to resistance of heat reduce has been solved, nevertheless the device still has more defect when in actual use, for example, chip resistor's waterproof protection effect is relatively poor, the easy intaking wets, and the heat conduction effect between each inside substrate is relatively poor, the radiating efficiency has been reduced, chip resistor's anti-seismic performance is weak simultaneously, low strength, the easy emergence is damaged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high power precision chip resistor to the water proof protection effect of the chip resistor who provides in solving above-mentioned background art is relatively poor, and the weak problem of anti-seismic performance.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a accurate chip resistor of high power, includes the ceramic body, the mark layer is installed at the top of ceramic body, and the both sides of ceramic body all are connected with external electrode layer, the heating panel is installed to the bottom of ceramic body, the ceramic body includes the substrate, the top of substrate is connected with inside electrode layer, and the bottom of substrate is fixed with the enhancement layer, the bottom of enhancement layer is connected with fire-retardant layer, install the protective layer between ceramic body and the mark layer, and be connected with the drying layer between ceramic body and the external electrode layer.

Preferably, composite layers are installed at two ends of the ceramic body and comprise toughening layers, a first glass fiber layer is fixed on one side of each toughening layer, and a second glass fiber layer is connected to the other side of each toughening layer.

Preferably, the heat dissipation holes are formed in the heat dissipation plate, and the intervals between every two adjacent heat dissipation holes are equal.

Preferably, the top of the heat dissipation plate is connected with an anticorrosive coating, and one side of the anticorrosive coating, which is far away from the heat dissipation plate, is connected with one of the flame retardant coatings.

Preferably, the outer side of the external electrode layer is provided with two heat conducting plates.

Preferably, the first glass fiber layer and the second glass fiber layer are symmetrically arranged, and the thicknesses of the first glass fiber layer and the second glass fiber layer are both larger than that of the toughening layer.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses a fire-retardant layer can prevent that the high temperature ceramic body from taking place the burning, through the cooperation on protective layer and dry layer, can strengthen chip resistor's water proof protection effect greatly, and the effectual inner structure of having avoided intakes and wets, can improve the heat conduction effect between inside layer and the layer greatly through the enhancement layer to chip resistor's radiating efficiency has further been improved.

(2) The utility model discloses a toughening layer, first glass fiber layer and second glass fiber layer's cooperation can strengthen the structural strength of ceramic body greatly to improved chip resistor's antidetonation protective properties, makeed chip resistor not fragile, prolonged the life of device.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the composite layer of the present invention;

FIG. 3 is an enlarged view of portion A of FIG. 1;

in the figure: 1. a protective layer; 2. compounding layers; 21. a toughening layer; 22. a first fiberglass layer; 23. a second fiberglass layer; 3. a ceramic body; 31. an internal electrode layer; 32. a substrate; 4. a heat dissipation plate; 5. heat dissipation holes; 6. an anticorrosive layer; 7. a flame retardant layer; 8. a reinforcing layer; 9. drying the layer; 10. a heat conducting plate; 11. an external electrode layer; 12. and a code layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: a high-power precise chip resistor comprises a ceramic body 3, a code layer 12 is installed at the top of the ceramic body 3, two sides of the ceramic body 3 are connected with external electrode layers 11, a heat dissipation plate 4 is installed at the bottom end of the ceramic body 3, the ceramic body 3 comprises a base material 32, the top of the base material 32 is connected with an internal electrode layer 31, a reinforcing layer 8 is fixed at the bottom of the base material 32, a flame-retardant layer 7 is connected at the bottom of the reinforcing layer 8, the flame-retardant layer 7 is made of a halogen-free cross-linked polyethylene material and has good flame-retardant performance, the ceramic body 3 can be prevented from burning due to overhigh temperature through the flame-retardant layer 7, a protective layer 1 is installed between the ceramic body 3 and the code layer 12, the protective layer 1 is made of a nano carbon fiber material and has good hydrophobicity, so that water vapor can be prevented from being eroded, meanwhile, a drying layer 9 is made of vinyl chloride resin and acrylic varnish paint, under the combined action of the protective layer 1 and the drying layer 9, can strengthen chip resistor's water proof protection effect greatly, effectually avoided the inner structure to intake and wet, and be connected with drying layer 9 between ceramic body 3 and the external electrode layer 11, enhancement layer 8 is made by oxidation graphite alkene, and the oxidation graphite alkene material is two-dimentional plane network structure, can improve heat radiating area, can adhere to for adjacent two-layer providing simultaneously to the heat conduction effect between the inner layer and the layer has been improved greatly, and then has further improved chip resistor's radiating efficiency.

Further, composite bed 2 is all installed at ceramic body 3's both ends, composite bed 2 is including toughening layer 21, one side of toughening layer 21 is fixed with first glass fiber layer 22, and toughening layer 21's opposite side is connected with second glass fiber layer 23, first glass fiber layer 22 and second glass fiber layer 23 are made by glass fiber, it has high temperature resistant, and the advantage that intensity is high, toughening layer 21 adopts the polyester fiber material to make simultaneously, it has outstanding high elasticity recovery rate, toughening layer 21, under the cooperation of first glass fiber layer 22 and second glass fiber layer 23, can strengthen ceramic body 3's structural strength greatly, thereby the antidetonation protective properties of chip resistor has been improved, make chip resistor not fragile, the life of device has been prolonged.

Furthermore, heat dissipation holes 5 are formed in the heat dissipation plate 4, the heat dissipation holes 5 have a heat dissipation effect, and the intervals between every two adjacent heat dissipation holes 5 are equal.

Specifically, the top of the heat dissipation plate 4 is connected with an anticorrosive coating 6, the anticorrosive coating 6 has an acid-resistant and alkali-resistant protection effect, and one side of the anticorrosive coating 6, which is far away from the heat dissipation plate 4, is connected with one of the flame retardant coatings 7.

Specifically, the heat conductive plate 10 is installed outside the external electrode layer 11, the heat conductive plate 10 has a function of rapidly conducting heat, and the heat conductive plate 10 is provided with two in total.

Specifically, the first glass fiber layer 22 and the second glass fiber layer 23 are symmetrically disposed, and the thicknesses of the first glass fiber layer 22 and the second glass fiber layer 23 are both greater than the thickness of the toughening layer 21.

The utility model discloses a theory of operation and use flow: the utility model discloses a when using, cooperation through protective layer 1 and dry layer 9, can strengthen the water proof protection effect of chip resistor greatly, the effectual inner structure that has avoided is intake and is made damp, while is toughening layer 21, under the cooperation of first glass fiber layer 22 and second glass fiber layer 23, can strengthen ceramic body 3's structural strength greatly, thereby the shock resistance protection performance of chip resistor has been improved, make chip resistor not fragile, the life of device has been prolonged, can prevent that high temperature ceramic body 3 from taking place the burning through fire-retardant layer 7, can improve heat radiating area through enhancement layer 8, and can be adjacent two-layer adhesion point that provides, thereby the heat conduction effect between inner layer and the layer has been improved greatly, and then further improved chip resistor's radiating efficiency.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high-power precise chip resistor is characterized in that: including ceramic body (3), mark layer (12) are installed at the top of ceramic body (3), and the both sides of ceramic body (3) all are connected with external electrode layer (11), heating panel (4) are installed to the bottom of ceramic body (3), ceramic body (3) include substrate (32), the top of substrate (32) is connected with inside electrode layer (31), and the bottom of substrate (32) is fixed with enhancement layer (8), the bottom of enhancement layer (8) is connected with fire-retardant layer (7), install protective layer (1) between ceramic body (3) and mark layer (12), and be connected with between ceramic body (3) and external electrode layer (11) dry layer (9).

2. The high-power precise chip resistor according to claim 1, wherein: composite layer (2) are all installed at the both ends of ceramic body (3), composite layer (2) are including toughening layer (21), one side of toughening layer (21) is fixed with first glass fiber layer (22), and the opposite side of toughening layer (21) is connected with second glass fiber layer (23).

3. The high-power precise chip resistor according to claim 1, wherein: radiating holes (5) are formed in the radiating plate (4), and the intervals of the two adjacent radiating holes (5) are equal.

4. The high-power precise chip resistor according to claim 1, wherein: the top of heating panel (4) is connected with anticorrosive coating (6), and anticorrosive coating (6) keep away from one side of heating panel (4) and be connected with one of them fire-retardant layer (7).

5. The high-power precise chip resistor according to claim 1, wherein: and the outer side of the external electrode layer (11) is provided with two heat-conducting plates (10), and the two heat-conducting plates (10) are arranged.

6. The high-power precise chip resistor according to claim 2, characterized in that: the first glass fiber layer (22) and the second glass fiber layer (23) are symmetrically arranged, and the thicknesses of the first glass fiber layer (22) and the second glass fiber layer (23) are both larger than that of the toughening layer (21).