CN219698276U - Heat dissipation type integrated circuit board - Google Patents
Heat dissipation type integrated circuit board Download PDFInfo
- Publication number
- CN219698276U CN219698276U CN202320621062.9U CN202320621062U CN219698276U CN 219698276 U CN219698276 U CN 219698276U CN 202320621062 U CN202320621062 U CN 202320621062U CN 219698276 U CN219698276 U CN 219698276U
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- CN
- China
- Prior art keywords
- circuit board
- heat
- heat dissipation
- integrated circuit
- board main
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Links
- 230000017525 heat dissipation Effects 0.000 title claims description 62
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of integrated circuit boards, in particular to a heat-dissipating integrated circuit board, which comprises a circuit board main body, a heat-dissipating assembly and a fixing seat, wherein the fixing seat is provided with a plurality of supporting columns, the circuit board main body is fixedly connected with the supporting columns, the heat-dissipating assembly is connected with the fixing seat, the heat-dissipating assembly comprises a heat-dissipating bracket and a heat-dissipating fan, one end of the heat-dissipating bracket is detachably connected with the circuit board main body, the heat-dissipating fan is arranged at the other end of the heat-dissipating bracket in an inclined manner, the heat-dissipating fan is obliquely arranged at the upper end of the circuit board main body, and the heat-dissipating fan is obliquely arranged on the heat-dissipating bracket through the heat-dissipating bracket which is obliquely arranged, so that the circuit board main body can be subjected to cold air blown by the heat-dissipating fan in a large area, the surface temperature is reduced, and the heat of the circuit board main body is effectively discharged.
Description
Technical Field
The present utility model relates to the field of integrated circuit boards, and more particularly, to a heat dissipation type integrated circuit board.
Background
An integrated circuit board is a carrier on which integrated circuits are mounted. The integrated circuit board is made up by using semiconductor manufacturing process, and making several components of transistor, resistor and capacitor on a small monocrystalline silicon wafer, and combining them into a complete electronic circuit according to the method of multilayer wiring or tunnel wiring.
At present, the heat dissipation effect of the integrated circuit board on the market is poor, so that heat is easily accumulated in the circuit board, and components welded on the circuit board are easily damaged due to long-term high-temperature environment. Therefore, it is necessary to design a heat dissipation type integrated circuit board to overcome the defects in the prior art.
Disclosure of Invention
The utility model aims to provide a heat dissipation type integrated circuit board, which aims to solve the technical problem that components are easy to damage in a high-temperature environment because heat is accumulated in the circuit board due to poor heat dissipation effect of the integrated circuit board in the prior art.
In order to achieve the above object, an embodiment of the present utility model provides a heat dissipation type integrated circuit board, which includes a circuit board main body, a heat dissipation assembly and a fixing base, wherein the fixing base is provided with a plurality of support columns, the circuit board main body is fixedly connected with the support columns, the heat dissipation assembly is connected with the fixing base, the heat dissipation assembly includes a heat dissipation bracket and a heat dissipation fan, one end of the heat dissipation bracket is detachably connected with the circuit board main body, the heat dissipation fan is mounted at the other end of the heat dissipation bracket, and the heat dissipation fan is obliquely arranged at the upper end of the circuit board main body.
Optionally, the heat dissipation support includes first connecting plate, second connecting plate and loading board, the rear side of fixing base is equipped with the fixed orifices, the bottom of first connecting plate is provided with first connecting hole, first connecting plate pass through a double-screw bolt with the fixing base is perpendicular to be connected, the top of first connecting plate with the second connecting plate is connected, the loading board install in the second connecting plate, the heat dissipation fan is fixed in the loading board.
Optionally, the second connecting plate is disposed at an upper end of the first connecting plate and is disposed obliquely.
Optionally, the first connecting plate and the second connecting plate are integrally formed.
Optionally, the number of the heat dissipation fans is two.
Optionally, the number of the support columns is four, the four support columns are arranged in a matrix shape, and the four support columns are respectively in one-to-one correspondence with four end corners of the circuit board main body.
Optionally, a gap exists between the circuit board main body and the fixing base.
Optionally, a heat conducting layer is connected to the lower surface of the circuit board main body, and heat radiating fins are equidistantly arranged on the heat conducting layer.
Optionally, the joint of the heat dissipation fin and the heat conduction layer is coated with silicone grease.
Optionally, the surface of the circuit board main body is provided with a tin coating layer, and a plurality of electronic components are welded on the surface of the circuit board main body.
The above technical solutions in the heat dissipation type integrated circuit board provided by the embodiments of the present utility model have at least one of the following technical effects:
according to the utility model, the detachable radiating bracket is arranged on the fixing seat, and the radiating fan is obliquely arranged on the radiating bracket, so that the circuit board main body can be subjected to large-area cold air blown by the radiating fan, the surface temperature is reduced, the heat of the circuit board main body is effectively discharged, the accumulation of the heat is avoided, the damage of the circuit board main body is prevented, and the circuit board main body has extremely high practicability.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a heat dissipation type integrated circuit board according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a circuit board main body and a fixing base according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present utility model.
Wherein, each reference sign in the figure:
1. a circuit board main body; 2. A heat dissipation assembly; 21. A heat dissipation bracket;
211. a first connection plate; 212. A second connecting plate; 213. A carrying plate;
214. a first connection hole; 22. A heat dissipation fan; 3. A fixing seat;
31. a support column; 32. A fixing hole; 4. A heat conducting layer;
41. a heat radiation fin; 5. An electronic component.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.
In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
In an embodiment of the present utility model, as shown in fig. 1 to 3, a heat dissipation type integrated circuit board is provided, which includes a circuit board main body 1, a heat dissipation assembly 2 and a fixing base 3, the fixing base 3 is provided with a plurality of support columns 31, the circuit board main body 1 is fixedly connected with the support columns 31, the heat dissipation assembly 2 is connected with the fixing base 3, the heat dissipation assembly 2 includes a heat dissipation bracket 21 and a heat dissipation fan 22, one end of the heat dissipation bracket 21 is detachably connected with the circuit board main body 1, the heat dissipation fan 22 is mounted at the other end of the heat dissipation bracket 21, and the heat dissipation fan 22 is obliquely arranged at the upper end of the circuit board main body 1.
According to the utility model, the detachable radiating bracket 21 is arranged on the fixed seat 3, and the radiating fan 22 is obliquely arranged on the radiating bracket 21, so that the circuit board main body 1 can receive cold air blown by the radiating fan 22 in a large area due to the obliquely arranged radiating fan 22, the surface temperature is reduced, the heat of the circuit board main body 1 is effectively discharged, the accumulation of the heat is avoided, the damage of the circuit board main body 1 is prevented, and the circuit board has extremely high practicability.
Specifically, in another embodiment of the present utility model, as shown in fig. 1 to 3, the heat dissipation bracket 21 includes a first connection plate 211, a second connection plate 212 and a bearing plate 213, the rear side of the fixing base 3 is provided with a fixing hole 32, the bottom of the first connection plate 211 is provided with a first connection hole 214, the first connection plate 211 is vertically connected with the fixing base 3 through a stud, the top of the first connection plate 211 is connected with the second connection plate 212, the bearing plate 213 is mounted on the second connection plate 212, and the heat dissipation fan 22 is fixed on the bearing plate 213. Therefore, by arranging the first connecting hole 214, the user can detach the first connecting hole 214 through the detaching stud, so that the heat dissipation bracket 21 is detached from the fixing base 3, and the heat dissipation bracket 21 is convenient to detach from the fixing base 3, thereby cleaning the heat dissipation fan 22 and dust on the heat dissipation bracket 21.
Further, the second connection plate 212 is disposed at the upper end of the first connection plate 211 and is inclined, and by arranging the second connection plate 212 obliquely, the cooling fan 22 can be inclined to blow air to the circuit board main body 1, so that cold air can fully cover the circuit board main body 1, and heat dissipation is effectively performed. Further, the first connection plate 211 and the second connection plate 212 are integrally formed.
Specifically, in another embodiment of the present utility model, as shown in fig. 1 to 3, the number of the heat dissipation fans 22 is two. It should be understood that the number of the heat dissipation fans 22 should be set according to the actual size of the circuit board main body 1, and the present utility model is not limited thereto.
Specifically, in another embodiment of the present utility model, as shown in fig. 1 to 3, the number of the support columns 31 is four, the four support columns 31 are arranged in a matrix, and the four support columns 31 are respectively corresponding to four end corners of the circuit board main body 1 one by one. When the circuit board main body 1 is installed, the through holes on the circuit board main body 1 are aligned with the supporting columns 31 to be inserted, after the circuit board main body 1 is installed, the circuit board main body 1 is erected on the surface of the supporting columns 31, and the end parts of the supporting columns 31 penetrate through the circuit board main body 1, so that the connection stability of the circuit board main body 1 and the fixing base 3 is ensured.
Further, a gap exists between the circuit board main body 1 and the fixing base 3. Through being equipped with the clearance between circuit board main part 1 and fixing base 3, avoid the circuit board to hug closely fixing base 3 with heat transfer and can't dispel the heat in the air, can effectively improve the heat dispersion of circuit board main part 1.
Specifically, in another embodiment of the present utility model, as shown in fig. 1 to 3, a heat conducting layer 4 is connected to the lower surface of the circuit board body 1, and the heat conducting layer 4 is provided with heat dissipation fins 41 at equal distances. Then, the cooling fan 22 blows cool air into the circuit board main body 1, the heat is re-blown from the circuit board main body 1, the heat is sent to the outside by the cooling fan 22, the heat of the circuit board main body 1 is transferred to the heat conduction layer 4, and the heat is transferred to the heat dissipation fins 41 by the heat conduction layer 4 to dissipate heat. Further, the connection between the heat dissipation fins 41 and the heat conduction layer 4 is coated with silicone grease. The heat dissipation effect is improved by applying a small amount of silicone grease to strengthen the heat dissipation fins 41 to be in contact with the heat conduction layer 4.
Specifically, in another embodiment of the present utility model, as shown in fig. 1 to 3, the surface of the circuit board body 1 has a tin coating layer, and the surface thereof is soldered with a plurality of electronic components 5. The tin coating layer is arranged on the surface of the circuit board main body 1, so that the anti-oxidation corrosion effect can be achieved, and the subsequent welding of the electronic element 5 can be facilitated.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (10)
1. The utility model provides a heat dissipation type integrated circuit board, its characterized in that, includes circuit board main part, radiator unit and fixing base, the fixing base is provided with a plurality of support column, the circuit board main part with support column fixed connection, radiator unit with the fixing base is connected, radiator unit includes heat dissipation support and heat dissipation fan, the one end of heat dissipation support with the circuit board main part can dismantle and be connected, the heat dissipation fan install in the other end of heat dissipation support, the heat dissipation fan be the slope set up in the upper end of circuit board main part.
2. The heat dissipation type integrated circuit board according to claim 1, wherein the heat dissipation bracket comprises a first connecting plate, a second connecting plate and a bearing plate, a fixing hole is formed in the rear side of the fixing seat, a first connecting hole is formed in the bottom of the first connecting plate, the first connecting plate is vertically connected with the fixing seat through a stud, the top of the first connecting plate is connected with the second connecting plate, the bearing plate is mounted on the second connecting plate, and the heat dissipation fan is fixed on the bearing plate.
3. The heat dissipation type integrated circuit board according to claim 2, wherein the second connection board is disposed at an upper end of the first connection board and is disposed in an inclined manner.
4. A heat dissipating integrated circuit board according to claim 3, wherein said first connection plate and said second connection plate are integrally formed.
5. The heat dissipating integrated circuit board of any of claims 1-4, wherein the number of heat dissipating fans is two.
6. The heat dissipation type integrated circuit board according to any one of claims 1 to 4, wherein the number of the support columns is four, the four support columns are arranged in a matrix shape, and the four support columns are respectively in one-to-one correspondence with the four end corners of the circuit board main body.
7. The heat dissipating integrated circuit of claim 6, wherein a gap exists between the circuit board body and the mounting base.
8. The heat dissipating integrated circuit board of any of claims 1-4, wherein a heat conducting layer is attached to a lower surface of the circuit board body, and heat dissipating fins are disposed equidistantly on the heat conducting layer.
9. The heat dissipating integrated circuit board of claim 8, wherein the heat dissipating fin is coated with silicone grease at the junction with the thermally conductive layer.
10. The heat dissipating integrated circuit board of any of claims 1-4, wherein the surface of the circuit board body has a tin coating and the surface is soldered with a plurality of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320621062.9U CN219698276U (en) | 2023-03-24 | 2023-03-24 | Heat dissipation type integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320621062.9U CN219698276U (en) | 2023-03-24 | 2023-03-24 | Heat dissipation type integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219698276U true CN219698276U (en) | 2023-09-15 |
Family
ID=87945730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320621062.9U Active CN219698276U (en) | 2023-03-24 | 2023-03-24 | Heat dissipation type integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219698276U (en) |
-
2023
- 2023-03-24 CN CN202320621062.9U patent/CN219698276U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |