CN219698012U - 具有焊接结构的印刷电路板组件 - Google Patents
具有焊接结构的印刷电路板组件 Download PDFInfo
- Publication number
- CN219698012U CN219698012U CN202190000601.6U CN202190000601U CN219698012U CN 219698012 U CN219698012 U CN 219698012U CN 202190000601 U CN202190000601 U CN 202190000601U CN 219698012 U CN219698012 U CN 219698012U
- Authority
- CN
- China
- Prior art keywords
- solder
- printed circuit
- circuit board
- board assembly
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000000155 melt Substances 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004512 die casting Methods 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 230000006355 external stress Effects 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/122—Dielectric loaded (not air)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200081729A KR20220003902A (ko) | 2020-07-02 | 2020-07-02 | 솔더 기판 조립체 |
| KR10-2020-0081729 | 2020-07-02 | ||
| PCT/KR2021/008416 WO2022005245A1 (ko) | 2020-07-02 | 2021-07-02 | 솔더 기판 조립체 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219698012U true CN219698012U (zh) | 2023-09-15 |
Family
ID=79317091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202190000601.6U Active CN219698012U (zh) | 2020-07-02 | 2021-07-02 | 具有焊接结构的印刷电路板组件 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20220003902A (ko) |
| CN (1) | CN219698012U (ko) |
| WO (1) | WO2022005245A1 (ko) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002509639A (ja) * | 1994-11-15 | 2002-03-26 | フォームファクター，インコーポレイテッド | 超小型電子素子の相互接続要素 |
| GB9503954D0 (en) * | 1995-02-28 | 1995-04-19 | Plessey Semiconductors Ltd | Filter and resonator structures |
| JP2000314759A (ja) * | 1999-04-30 | 2000-11-14 | Fujitsu Ltd | バーンインボード及び半導体装置の試験方法 |
| KR102241217B1 (ko) * | 2018-11-26 | 2021-04-16 | 주식회사 에이스테크놀로지 | 세라믹 웨이브가이드 필터 및 이의 제조 방법 |
| KR20190116175A (ko) * | 2019-09-18 | 2019-10-14 | 삼성전기주식회사 | 전자 부품 및 그 실장 기판 |
-
2020
- 2020-07-02 KR KR1020200081729A patent/KR20220003902A/ko unknown
-
2021
- 2021-07-02 WO PCT/KR2021/008416 patent/WO2022005245A1/ko active Application Filing
- 2021-07-02 CN CN202190000601.6U patent/CN219698012U/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220003902A (ko) | 2022-01-11 |
| WO2022005245A1 (ko) | 2022-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |