CN219697983U

CN219697983U - Circuit board

Info

Publication number: CN219697983U
Application number: CN202320278288.3U
Authority: CN
Inventors: 汤荣辉
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2023-02-08
Filing date: 2023-02-08
Publication date: 2023-09-15
Anticipated expiration: 2033-02-08

Abstract

The utility model discloses a circuit board which comprises a core board, at least one groove and at least one flying lead structure. The groove penetrates through the core plate along the thickness direction of the core plate, and the flying lead structure is placed in the groove. According to the circuit board, the flying lead structure is placed in the groove by arranging the groove on the core plate. Therefore, compared with the traditional flying lead plate, the space in the groove can be effectively utilized, the flying lead structure is prevented from protruding out of the core plate, so that the solder resist caused by the protruding of the flying lead structure can be optimized to be thin and expose copper, the tolerance precision of the flying lead structure is far higher than that of the flying lead structure formed by electroplating, meanwhile, the flying lead structure does not need to be locally thickened, the flying lead structure can be synchronously processed with other circuits of the circuit board, and the phenomenon that other circuits of the circuit board are scratched and expose copper can be avoided.

Description

Circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a circuit board.

Background

One product in the circuit board is a flying lead board, and the local area of the flying lead board needs to thicken a copper layer to more than 120 um. In the related art, the exposed flat cable is covered with a dry film after the copper layer of the circuit board is processed, then the copper layer is thickened by electroplating for a plurality of times, the end part of the flying cable is covered by adopting a solder resist, and finally the back surface of the circuit board is deeply controlled to suspend the flying cable so as to form the flying cable board. However, the design of the flying lead plate makes the flying lead far higher than other circuits on the flying lead plate, and other circuits are easy to scratch in the processing process, and meanwhile, the end part of the flying lead needs to be covered with solder resist, so that the solder resist is thinner and copper is easy to expose because the flying lead is prevented from being too high.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a circuit board, which can effectively utilize the space in the groove to avoid the protrusion of the flying lead structure from the core board, so as to optimize the solder resist caused by the protrusion of the flying lead structure to expose copper.

The circuit board according to the embodiment of the utility model comprises: a core plate; at least one groove penetrating through the core plate in a thickness direction of the core plate; at least one flying lead structure disposed within the recess.

According to the circuit board provided by the embodiment of the utility model, the groove is arranged on the core plate, and the flying lead structure is placed in the groove. Therefore, compared with the traditional flying lead plate, the space in the groove can be effectively utilized, the flying lead structure is prevented from protruding out of the core plate, so that the solder resist caused by the protruding of the flying lead structure can be optimized to be thin and expose copper, the tolerance precision of the flying lead structure is far higher than that of the flying lead structure formed by electroplating, meanwhile, the flying lead structure does not need to be locally thickened, the flying lead structure can be synchronously processed with other circuits of the circuit board, and the phenomenon that other circuits of the circuit board are scratched and expose copper can be avoided.

According to some embodiments of the utility model, the depth of the groove in the thickness direction of the core plate is greater than the thickness of the flying lead structure.

According to some embodiments of the utility model, a thickness-direction side surface of the flying lead structure is flush with a thickness-direction side surface of the core plate.

According to some embodiments of the utility model, a distance between one side surface in the thickness direction of the flying lead structure and one side surface in the thickness direction of the core plate is equal to or less than the thickness of the flying lead structure.

According to some embodiments of the utility model, the core plate comprises a plurality of dielectric layers and a plurality of copper layers, wherein the dielectric layers are positioned between two adjacent copper layers, the copper layer positioned on the front surface of the core plate in the plurality of copper layers is a first copper layer, and the flying lead structure is separated from the first copper layer.

According to some embodiments of the utility model, the thickness of the flying lead structure in the thickness direction of the core plate is D, wherein the D satisfies: d is not less than 120 mu m and not more than 150 mu m.

According to some embodiments of the utility model, the flying lead structure is a copper wire.

According to some embodiments of the utility model, the flying lead structure is interference fit within the groove.

According to some embodiments of the utility model, the plurality of grooves and the plurality of flying lead structures are all multiple, the plurality of grooves are in one-to-one correspondence with the plurality of flying lead structures, and the plurality of grooves are arranged at intervals along the length direction of the core plate.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic view of a circuit board according to an embodiment of the present utility model.

Reference numerals:

100. a circuit board;

1. a core plate; 11. a dielectric layer; 12. a first copper layer; 2. a groove; 3. plating layers; 4. a flying lead structure.

Detailed Description

A wiring board 100 according to an embodiment of the present utility model is described below with reference to fig. 1.

As shown in fig. 1, a circuit board 100 according to an embodiment of the present utility model includes a core board 1, at least one groove 2, and at least one flying lead structure 4.

Specifically, the groove 2 penetrates the core plate 1 in the thickness direction (for example, up-down direction in fig. 1) of the core plate 1, and the flying lead structure 4 is placed in the groove 2. For example, in the example of fig. 1, the core plate 1 is first subjected to a controlled deep process to form the grooves 2 in the thickness direction of the core plate 1, and the grooves 2 penetrate the entire core plate 1 in the thickness direction of the core plate 1, after the flying lead structure 4 is placed in the grooves 2, the whole flying lead structure 4 with the core plate 1 is electroplated to form the electroplated layer 3 on one side surface in the thickness direction of the core plate 1, so that the electroplated layer 3 can fill the gap between the flying lead structure 4 and the grooves 2 due to the processing error, finally the electroplated layer 3 is removed, and the core plate 1 is exposed and etched to form other lines on the core plate 1. Thereby, the arrangement of the flying lead structure 4 on the wiring board 100 is completed.

According to the wiring board 100 of the embodiment of the present utility model, the flying lead structure 4 is placed in the groove 2 by providing the groove 2 on the core board 1. Therefore, compared with the traditional flying lead board, the space in the groove 2 can be effectively utilized, the flying lead structure 4 is prevented from protruding out of the core board 1, so that the copper exposure caused by the solder resist of the flying lead structure 4 protruding can be optimized, the tolerance precision of the flying lead structure 4 is far higher than that of the flying lead structure 4 formed by electroplating, meanwhile, the flying lead structure 4 does not need to be locally thickened, the flying lead structure is synchronously processed with other circuits of the circuit board 100, and the copper exposure caused by scratch of other circuits of the circuit board 100 can be avoided.

According to some embodiments of the utility model, the depth of the groove 2 in the thickness direction of the core plate 1 is greater than the thickness of the flying lead structure 4. As shown in fig. 1, the thickness of the flying wire structure 4 is smaller than the depth of the groove 2, so that the groove 2 can have enough space to put the flying wire structure 4, and the flying wire structure 4 is in a suspended state. That is, one side surface in the thickness direction of the flying lead structure 4 is spaced apart from one side surface in the thickness direction of the core plate 1, so that the end face of the flying lead structure 4 can be prevented from being scratched.

According to some embodiments of the present utility model, one side surface in the thickness direction of the flying lead structure 4 is flush with one side surface in the thickness direction of the core plate 1. For example, in the example of fig. 1, the surface of one side in the thickness direction of the flying lead structure 4 is flush with the front face of the core board 1. By this arrangement, the regularity of the front face of the core board 1 is ensured, and the solder resist is prevented from being thinner due to excessive exceeding of the core board 1 when solder resist is performed on the flying lead structure 4, and at the same time, the thickness of the circuit board 100 can be reduced.

Further, referring to fig. 1, the distance between one side surface in the thickness direction of the flying lead structure 4 and one side surface in the thickness direction of the core plate 1 is equal to or smaller than the thickness of the flying lead structure 4. That is, the volume of the flying lead structure 4 occupies most of the space of the groove 2, thereby increasing the volume of the flying lead structure 4 and ensuring the conductive effect of the flying lead structure 4.

According to some embodiments of the utility model, the core plate 1 comprises a plurality of dielectric layers 11 and a plurality of copper layers, in the description of the utility model "plurality" meaning two or more. The dielectric layer 11 is located between two adjacent copper layers, the copper layer located on the front surface of the core board 1 in the plurality of copper layers is a first copper layer 12, and the flying lead structure 4 is spaced from the first copper layer 12. For example, in the example of fig. 1, there are two copper layers, which are respectively located at two sides of the thickness direction of the dielectric layer 11, and the first copper layer 12 is subjected to exposure and etching treatment, so that a gap is formed between the first copper layer 12 and the flying lead structure 4, preventing conductive connection between the flying lead structure 4 and the first copper layer 12, and forming other lines on the first copper layer 12.

According to some embodiments of the utility model, the thickness of the flying lead structure 4 in the thickness direction of the core plate 1 is D, wherein D satisfies: d is not less than 120 mu m and not more than 150 mu m. Specifically, when the thickness D of the flying lead structure 4 is less than 120 μm, the thickness of the flying lead structure 4 is too small, the structural strength of the flying lead structure 4 is low, and the installation of the flying lead structure 4 is not facilitated. When the thickness D of the flying lead structure 4 is greater than 150 μm, the thickness of the flying lead structure 4 is excessively large, which increases the depth of the groove 2, i.e., increases the thickness of the core plate 1. Thus, the thickness D of the flying lead structure 4 is set between 120 μm and 150 μm, so that the thickness of the core board 1 can be reduced and the cost of the circuit board 100 can be reduced while ensuring the structural strength of the flying lead structure 4 and facilitating the installation.

According to some embodiments of the utility model, flying lead structure 4 is a copper wire. Thereby, the conductive effect of the flying lead structure 4 can be achieved.

According to some embodiments of the utility model, the flying lead structure 4 is interference fit within the groove 2. The width and depth of the grooves 2 may be slightly greater than the width and depth of the flying lead structure 4, which may allow the flying lead structure 4 to more securely fit within the core 1.

According to some embodiments of the present utility model, the plurality of grooves 2 and the flying lead structures 4 are plural, the plurality of grooves 2 are in one-to-one correspondence with the plurality of flying lead structures 4, and the plurality of grooves 2 are arranged at intervals along the length direction (e.g., the left-right direction as shown in fig. 1) of the core board 1. By the arrangement, the number and the installation positions of the flying lead structures 4 can be guaranteed to meet the requirements of the circuit board 100, and the circuit board 100 can work normally.

Other configurations and operations of the circuit board 100 according to the embodiment of the present utility model are known to those skilled in the art, and will not be described in detail herein.

In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "inner," "outer," "axial," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A wiring board, comprising:

a core plate;

at least one groove penetrating through the core plate in a thickness direction of the core plate;

at least one flying lead structure disposed within the recess.

2. The wiring board of claim 1, wherein a depth of the recess in a thickness direction of the core plate is greater than a thickness of the flying lead structure.

3. The wiring board according to claim 2, wherein a thickness-direction side surface of the flying lead structure is flush with a thickness-direction side surface of the core board.

4. The wiring board according to claim 3, wherein a distance between one side surface in the thickness direction of the flying lead structure and one side surface in the thickness direction of the core board is equal to or smaller than the thickness of the flying lead structure.

5. The circuit board of claim 1, wherein the core board comprises a plurality of dielectric layers and a plurality of copper layers, the dielectric layers are positioned between two adjacent copper layers, the copper layer positioned on the front surface of the core board in the plurality of copper layers is a first copper layer, and the flying lead structure is spaced from the first copper layer.

6. The wiring board of claim 1, wherein the flying lead structure has a thickness D in a thickness direction of the core board, wherein the D satisfies: d is not less than 120 mu m and not more than 150 mu m.

7. The circuit board of claim 1, wherein the flying lead structure is a copper wire.

8. The circuit board of any one of claims 1-7, wherein the flying lead structure is interference fit within the groove.

9. The circuit board of any one of claims 1-7, wherein the plurality of grooves and the flying lead structure are plural, the plurality of grooves are in one-to-one correspondence with the plurality of flying lead structures, and the plurality of grooves are arranged at intervals along the length direction of the core board.