CN219677237U - Concentric adjusting tool for wafer assembly - Google Patents

Concentric adjusting tool for wafer assembly Download PDF

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Publication number
CN219677237U
CN219677237U CN202320485172.7U CN202320485172U CN219677237U CN 219677237 U CN219677237 U CN 219677237U CN 202320485172 U CN202320485172 U CN 202320485172U CN 219677237 U CN219677237 U CN 219677237U
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China
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fixing
block
concentric
adjusting
limiting
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Active
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CN202320485172.7U
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Chinese (zh)
Inventor
赵明山
魏祥红
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Hefei Kaiyue Semiconductor Technology Co ltd
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Hefei Kaiyue Semiconductor Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The utility model provides a concentric adjusting tool for wafer assembly, which comprises an adjusting mechanism arranged on a manipulator for adjusting the concentricity of a plurality of wafers, wherein the adjusting mechanism comprises a plurality of fixing components capable of fixing the wafers, an adjusting component arranged on the manipulator and connected with the fixing components, and a concentric component capable of concentrically operating the wafers on the plurality of fixing components, and the adjusting component drives the fixing components to move on the manipulator; the fixing assembly comprises a plurality of fixing blocks which are arranged on the adjusting assembly and are parallel to each other, and a fixing piece which is arranged on the upper end surface of the fixing block and is provided with a fixing groove, and the bottom wall of the fixing groove is provided with a through hole; the concentric assembly comprises a limiting disc capable of being arranged in the fixed groove and a limiting rod capable of penetrating through the end faces of the limiting discs to form limiting holes; the utility model can conveniently adjust the position of each layer of fixed block, avoids the problem of yield caused by inaccurate position of the manipulator in the wafer transmission process, improves the production efficiency and reduces the production cost.

Description

Concentric adjusting tool for wafer assembly
Technical Field
The utility model relates to the technical field of semiconductor manufacturing, in particular to a concentric adjusting tool for wafer assembly.
Background
The photoresist coating and developing equipment is an essential processing equipment in the chip manufacturing process, and utilizes a mechanical arm to realize the transmission and processing of wafers among all systems, and the photoresist coating, curing, developing and other technological processes of the wafers are completed by perfect matching with a photoetching machine. The problem that the wafer position is not accurately taken and placed, the sensor cannot sense equipment and the like often occurs in the transmission process of the manipulator among the systems, the problems are used as input of a photoetching machine, namely photoresist coating before exposure and output, namely development of patterns after exposure, the performance of a photoresist coating developing machine directly influences the formation of fine exposure positions, and the pattern quality and error control of a developing process are difficult to ensure.
The utility model provides a wafer, including a plurality of wafers, including the wafer, wherein current manipulator is provided with a plurality of handles that are used for fixed removal wafer, when driving a plurality of wafers through the handle under the effect of manipulator and remove, need guarantee that a plurality of wafers are being parallel to each other, and a plurality of wafer height concentricity keeps unanimous, but current manipulator can cause the wafer of placing on the handle to take place to skew or long-time use can lead to the position of a plurality of handles to take place to shift and lead to a plurality of wafers to be located a plurality of handles when unable assurance height concentricity unanimous, leads to the yields problem that the manipulator is inaccurate in the position of wafer transmission in-process.
Disclosure of Invention
According to the wafer assembling concentric adjusting tool, the position of each layer of fixed block can be conveniently adjusted, the problem of yield caused by inaccurate position of a manipulator in the wafer transmission process is avoided, the production efficiency is improved, and the production cost is reduced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the wafer assembling concentric adjusting tool comprises an adjusting mechanism which is arranged on a manipulator and used for adjusting the concentricity of a plurality of wafers, wherein the adjusting mechanism comprises a plurality of fixing components capable of fixing the wafers, an adjusting component which is arranged on the manipulator and connected with the fixing components, and a concentric component which can concentrically operate the wafers on the plurality of fixing components, and the adjusting component drives the fixing components to move on the manipulator;
the fixing assembly comprises a plurality of fixing blocks which are arranged on the adjusting assembly and are parallel to each other, and a fixing piece which is arranged on the upper end surface of the fixing block and is provided with a fixing groove, and the bottom wall of the fixing groove is provided with a through hole;
the concentric assembly includes a limiting plate positionable in the fixed slot and a limiting rod defining a bore through an end face of the limiting plate.
Preferably, the fixing groove is in a cylindrical structure; the opening position of the through hole is positioned at the center position of the bottom wall of the fixed groove.
Preferably, the concentric assembly further comprises four clamping rods which movably penetrate through the bottom wall of the fixed groove in the vertical direction and are arranged in a circumferential array, two limiting rods which are parallel to each other and are respectively arranged on the bottom ends of the two adjacent clamping rods and are positioned on the bottom end of the fixed block, and a control piece which is arranged on the fixed block and drives the two limiting rods to be close to each other or away from each other, wherein the clamping rods penetrate through the bottom wall of the fixed groove and are arranged in a through groove which is formed in the center position of the bottom wall of the fixed groove, and the bottom ends of the clamping rods are arranged in a sliding groove which is formed in the side face of the limiting rods in the length direction through sliding blocks.
Preferably, the control piece is including setting up on the terminal surface of fixed block bottom and the second cylinder of one of them gag lever post shaft of output perpendicular connection, two sets up at two gag lever post one end positions and respectively with the linkage rack of different gag lever post end connection to and set up between two linkage racks and with the linkage gear of two linkage racks all meshing, two linkage racks are parallel to each other.
Preferably, the adjusting mechanism is arranged on a mounting block at the output end of the manipulator, a plurality of supporting blocks which are arranged on the side surface of the mounting block at equal intervals along the vertical direction, a first air cylinder which is arranged on the mounting block and is connected with a connecting block arranged on the supporting block at the output end, and a first rotating block and a second rotating block which are respectively arranged on the side surfaces of the supporting block and the fixed block and are rotationally connected, wherein the first rotating block and the second rotating block are connected through a fixed screw; the direction of the output end of the first cylinder is perpendicular to the side surface of the mounting block adjacent to the supporting block.
Preferably, the bottom wall of the fixed groove is provided with a plurality of vacuum grooves at equal intervals around the opening position of the through hole, and the plurality of vacuum grooves are communicated through a linkage channel arranged in the fixed block; the fixing piece comprises an air pump which is connected with the linkage channel through a pipeline.
The utility model has the beneficial effects that: the position of the wafer on each fixed block is convenient to keep consistent through the concentric component, the position of each fixed block is regulated through the regulating component, the limiting disc is placed in the fixed block to be provided with the fixed groove, and the limiting rod passes through the limiting hole provided on the limiting disc, so that the limiting disc fixed in the fixed groove is convenient to concentrically regulate, the height of the wafer can be ensured to be concentric and consistent when the wafer is fixed in the fixed groove, the position of the fixed block on the mounting block is regulated through the regulating component, the height of each fixed block is ensured to be concentric and consistent when the wafer is fixed, the occurrence of the condition that the yield is reduced due to the non-uniform position of the wafer on the fixed block is avoided, the wafer is damaged, the problem of the yield caused by the inaccurate position of the manipulator in the wafer transmission process is avoided, the production efficiency is improved, and the production cost is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate and together with the embodiments of the utility model and do not constitute a limitation to the utility model, and in which:
fig. 1 is a schematic diagram of a wafer assembling concentric adjusting tool and a simple structure of a manipulator according to the present utility model.
Fig. 2 is a schematic structural view of an adjusting mechanism of the present utility model.
Fig. 3 is a schematic bottom view of the adjusting mechanism of the present utility model.
Fig. 4 is a schematic structural view of a fixing assembly according to the present utility model.
Fig. 5 is a schematic bottom view of the fixing assembly of the present utility model.
Fig. 6 is a schematic view of the structure of the stop lever and the clamping lever of the present utility model.
In the figure: 1. a manipulator; 2. a mounting block; 3. a support block; 4. a first rotating block; 5. a second rotating block; 6. a fixed block; 7. a fixing groove; 8. a restriction plate; 9. a limiting rod; 10. a first cylinder; 11. a connecting block; 12. a through hole; 13. defining a hole; 14. a vacuum tank; 15. a through groove; 16. a clamping rod; 17. a limit rod; 18. a linkage rack; 19. a linkage gear; 20. a second cylinder; 21. a chute; 22. a sliding block.
Detailed Description
In order that the manner in which the above recited features, objects and advantages of the present utility model are attained and can be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, but which are appended drawings. Based on the examples in the embodiments, those skilled in the art can obtain other examples without making any inventive effort, which fall within the scope of the utility model.
Referring to fig. 1-6, a concentric adjusting tool for assembling wafers includes an adjusting mechanism disposed on a robot 1 for adjusting concentricity of a plurality of wafers, the adjusting mechanism includes a plurality of fixing components capable of fixing the wafers, an adjusting component disposed on the robot 1 and connected to the fixing components, and a concentric component capable of concentrically operating the wafers on the plurality of fixing components, the adjusting component drives the fixing components to move on the robot 1;
the fixing assembly comprises a plurality of fixing blocks 6 which are arranged on the adjusting assembly and are mutually parallel, fixing pieces which are arranged on the upper end face of the fixing blocks 6 and are arranged in fixing grooves 7, and through holes 12 are formed in the bottom wall of the fixing grooves 7;
the concentric assembly comprises a limiting disc 8 which can be arranged in a fixed groove 7, and a limiting rod 9 which can be provided with limiting holes 13 through the end surfaces of a plurality of limiting discs 8.
The fixed groove 7 is in a cylindrical structure; the opening position of the through hole 12 is located at the center position of the bottom wall of the fixing groove 7.
As shown in fig. 1-6, the adjusting assembly is convenient for adjusting the fixing assembly to move on the manipulator 1, the limiting disc 8 is placed in the fixing groove 7, the concentric assembly arranged in the fixing groove 7 is convenient for controlling the axes of the limiting disc 8 and the fixing groove 7 to keep consistent, the limiting rod 9 passes through the limiting hole 13, so that the axes of the limiting discs 8 on the fixing blocks 6 are convenient to ensure consistent, the adjusting assembly is used for fixing the positions of the fixing blocks 6, at the moment, the wafer is placed in the fixing groove 7, the axes of the limiting wafer are convenient to keep consistent with the axes of the fixing groove 7 through the concentric assembly, the positions of the fixing blocks 6 on the fixing blocks 6 can be conveniently and rapidly adjusted, the yield problem caused by inaccurate positions of the manipulator 1 in the wafer transmission process is avoided, the production efficiency is improved, and the production cost is reduced.
Wherein be convenient for guarantee through concentric subassembly that different size wafers are placed in fixed slot 7, all can guarantee that the wafer axis keeps unanimous with the axis of fixed slot 7 to be convenient for guarantee when fixed slot 7 internal fixation different size wafers, a plurality of wafer height concentricity are unanimous.
The concentric assembly further comprises four clamping rods 16 which movably penetrate through the bottom wall of the fixed groove 7 in the vertical direction and are arranged in a circumferential array, two limiting rods 17 which are parallel to each other and are respectively arranged on the bottom ends of the two adjacent clamping rods 16 and are positioned on the bottom ends of the fixed blocks 6, and control pieces which are arranged on the fixed blocks 6 and drive the two limiting rods 17 to be close to each other or far away from each other, wherein the clamping rods 16 penetrate through the bottom wall of the fixed groove 7 and are arranged in a through groove 15 formed in the central position of the bottom wall of the fixed groove 7, and the bottom ends of the clamping rods 16 are arranged in a sliding groove 21 formed in the side surface of the limiting rods 17 in the length direction through sliding blocks 22.
As shown in fig. 3-5, when the limiting disc 8 or the wafer is placed in the fixed slot 7, the two limiting rods 17 are driven to approach each other by the control member, at this time, the clamping rods 16 penetrating through the through slots 15 are arranged at the bottom ends of the clamping rods 16 and move towards the axis direction of the fixed slot 7 under the action of the sliding blocks 22 arranged in the sliding slots 21 and the through slots 15, and the four clamping rods 16 are convenient for driving the limiting disc 8 or the wafer to synchronously move in the fixed slot 7 under the condition of synchronous movement, so that the limiting disc 8 or the wafer is convenient to fix the position of the limiting disc 8 or the wafer placed in the fixed slot 7 by the four clamping rods 16, the axes of the limiting disc 8 and the wafer are ensured to be consistent with the axis of the fixed slot 7, and the limiting rods 9 penetrate through the limiting holes 13, so that the positions of the limiting discs 8 or the wafers fixed on the fixed blocks 6 are ensured to be concentric and consistent, the position of each layer of the fixed blocks 6 can be conveniently adjusted, the problem of good product rate caused by inaccurate positions of the mechanical arm 1 in the wafer transmission process is avoided, the production cost is improved, and the production cost is reduced.
The control piece comprises a second cylinder 20, two linkage racks 18 and a linkage gear 19, wherein the second cylinder 20 is arranged on the end face of the bottom end of the fixed block 6, the output end of the second cylinder is vertically connected with the rod body of one of the limiting rods 17, the linkage racks 18 are arranged at one end position of the two limiting rods 17 and are respectively connected with the end parts of the different limiting rods 17, the linkage gears 19 are arranged between the two linkage racks 18 and are respectively meshed with the two linkage racks 18, and the two linkage racks 18 are mutually parallel.
As shown in fig. 5, when one of the limiting rods 17 is driven to move by the output end of the second air cylinder 20, one of the linkage racks 18 is driven to move, and the linkage gear 19 is meshed with the two linkage racks 18, so that the other linkage rack 18 drives the other limiting rod 17 to move in the opposite direction, that is, the two limiting rods 17 are mutually close to or far away from each other, so that the clamping rod 16 is driven to limit and fix the limiting disc 8 or the wafer placed in the fixing groove 7, and the axis of the limiting disc 8 or the wafer is ensured to be consistent with the axis of the fixing groove 7.
The device comprises a mounting block 2, a plurality of supporting blocks 3, a first air cylinder 10, a first rotating block 4 and a second rotating block 5, wherein the mounting block 2 is arranged at the output end of a manipulator 1, the supporting blocks 3 are arranged on the side surface of the mounting block 2 at equal intervals along the vertical direction, the first air cylinder 10 is arranged on the mounting block 2, the output end of the first air cylinder is connected with a connecting block 11 arranged on the supporting block 3, the first rotating block 4 and the second rotating block 5 are respectively arranged on the side surfaces of the supporting block 3 and a fixed block 6 and are rotationally connected, and the first rotating block 4 and the second rotating block 5 are connected through a fixed screw; the direction of the output end of the first cylinder 10 is perpendicular to the side of the mounting block 2 adjacent to the support block 3.
The bottom wall of the fixed groove 7 is provided with a plurality of vacuum grooves 14 at equal intervals around the opening position of the through hole 12, and the plurality of vacuum grooves 14 are communicated through a linkage channel arranged in the fixed block 6; the fixing piece comprises an air pump which is connected with the linkage channel through a pipeline.
As shown in fig. 2-4, after the wafer is placed in the fixed slot 7, the axis of the wafer and the axis of the fixed slot 7 are adjusted to be consistent through the concentric assembly, and at the moment, the vacuum pumping operation is performed in the vacuum slot 14 through the air pump, so that the wafer in the fixed slot 7 is convenient to adsorb and fix, the occurrence of the situation that the wafer moves when the manipulator 1 drives the wafer to move is avoided, the problem of yield caused by inaccurate position of the manipulator 1 in the wafer transmission process is avoided, the production efficiency is improved, and the production cost is reduced.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. The wafer assembling concentric adjusting tool comprises an adjusting mechanism arranged on a mechanical arm (1) for adjusting the concentricity of a plurality of wafers, and is characterized in that the adjusting mechanism comprises a plurality of fixing components capable of fixing the wafers, an adjusting component arranged on the mechanical arm (1) and connected with the fixing components, and a concentric component capable of concentrically operating the wafers on the fixing components, and the adjusting component drives the fixing components to move on the mechanical arm (1);
the fixing assembly comprises a plurality of fixing blocks (6) which are arranged on the adjusting assembly and are parallel to each other, and fixing pieces which are arranged on the upper end surface of the fixing blocks (6) and are arranged in fixing grooves (7), and through holes (12) are formed in the bottom wall of the fixing grooves (7);
the concentric assembly comprises a limiting disc (8) which can be arranged in the fixed groove (7), and a limiting rod (9) which can penetrate through the end surfaces of the limiting discs (8) to form limiting holes (13).
2. The wafer assembly concentric adjustment tool of claim 1, wherein: the fixed groove (7) is in a cylindrical structure; the opening position of the through hole (12) is positioned at the center of the bottom wall of the fixed groove (7).
3. The wafer assembly concentric adjustment tool of claim 2, wherein: the concentric assembly further comprises four clamping rods (16) which movably penetrate through the bottom wall of the fixed groove (7) along the vertical direction and are arranged in a circumferential array, two limiting rods (17) which are mutually parallel and are respectively arranged on the bottom ends of the two adjacent clamping rods (16) and are positioned on the bottom end of the fixed block (6), and control pieces which are arranged on the fixed block (6) and drive the two limiting rods (17) to be mutually close to or mutually far away from each other, the clamping rods (16) penetrate through the bottom wall of the fixed groove (7) and are arranged in through grooves (15) which are formed in the central position of the bottom wall of the fixed groove (7), and the bottom ends of the clamping rods (16) are arranged in sliding grooves (21) which are formed in the side surfaces of the limiting rods (17) along the length direction through sliding blocks (22).
4. A wafer assembly concentric adjustment tool according to claim 3, wherein: the control piece comprises a second cylinder (20) which is arranged on the end face of the bottom end of the fixed block (6) and the output end of which is vertically connected with the rod body of one of the limiting rods (17), two linkage racks (18) which are arranged at one end of the two limiting rods (17) and are respectively connected with the end parts of the different limiting rods (17), and linkage gears (19) which are arranged between the two linkage racks (18) and are meshed with the two linkage racks (18), wherein the two linkage racks (18) are mutually parallel.
5. The wafer assembly concentric adjustment tool of any one of claims 1 to 4, wherein: the device comprises a mounting block (2) arranged at the output end of a manipulator (1), a plurality of supporting blocks (3) arranged on the side surface of the mounting block (2) at equal intervals along the vertical direction, a first air cylinder (10) arranged on the mounting block (2) and connected with a connecting block (11) arranged on the supporting block (3) at the output end, and a first rotating block (4) and a second rotating block (5) which are respectively arranged on the side surfaces of the supporting block (3) and a fixed block (6) and are rotationally connected, wherein the first rotating block (4) and the second rotating block (5) are connected through a fixed screw; the direction of the output end of the first cylinder (10) is perpendicular to the side surface of the mounting block (2) adjacent to the supporting block (3).
6. The wafer assembly concentric adjustment tool of claim 1, wherein: the bottom wall of the fixed groove (7) is provided with a plurality of vacuum grooves (14) at equal intervals around the opening position of the through hole (12), and the plurality of vacuum grooves (14) are communicated through a linkage channel arranged in the fixed block (6); the fixing piece comprises an air pump which is connected with the linkage channel through a pipeline.
CN202320485172.7U 2023-03-14 2023-03-14 Concentric adjusting tool for wafer assembly Active CN219677237U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320485172.7U CN219677237U (en) 2023-03-14 2023-03-14 Concentric adjusting tool for wafer assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320485172.7U CN219677237U (en) 2023-03-14 2023-03-14 Concentric adjusting tool for wafer assembly

Publications (1)

Publication Number Publication Date
CN219677237U true CN219677237U (en) 2023-09-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320485172.7U Active CN219677237U (en) 2023-03-14 2023-03-14 Concentric adjusting tool for wafer assembly

Country Status (1)

Country Link
CN (1) CN219677237U (en)

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