CN220382074U - Dynamics adjustable silicon chip fixture - Google Patents
Dynamics adjustable silicon chip fixture Download PDFInfo
- Publication number
- CN220382074U CN220382074U CN202321562676.0U CN202321562676U CN220382074U CN 220382074 U CN220382074 U CN 220382074U CN 202321562676 U CN202321562676 U CN 202321562676U CN 220382074 U CN220382074 U CN 220382074U
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- CN
- China
- Prior art keywords
- driving
- silicon wafer
- clamping
- rotate
- box body
- Prior art date
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 59
- 239000010703 silicon Substances 0.000 title claims abstract description 59
- 230000007306 turnover Effects 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 28
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of clamping mechanisms, in particular to a silicon wafer clamping mechanism with adjustable strength, which comprises a base and a base plate, wherein a driving box and a box body are arranged on the base plate, and the base plate is arranged on the base, and further comprises: the clamping part comprises a first clamping plate and a second clamping plate, and is used for clamping the silicon wafer, and a turnover part used for driving the clamping part to rotate is arranged in the box body. According to the utility model, the rotating shaft is arranged, the rotating shaft is driven by the second motor to rotate, the connecting column is driven by the rotating shaft to rotate, the mounting block is driven by the connecting column to rotate, and the mounting block drives the first clamping plate and the second clamping plate to rotate, so that the turnover of the silicon wafer clamped by the first clamping plate and the second clamping plate is realized, the processing surface of the silicon wafer is turned over, the time for replacing the processing surface of the silicon wafer is shortened, and the processing efficiency of the silicon wafer is improved.
Description
Technical Field
The utility model relates to the technical field of clamping mechanisms, in particular to a silicon wafer clamping mechanism with adjustable strength.
Background
The silicon slice is a slice cut from monocrystalline silicon, has the diameters of 6 inches, 8 inches, 12 inches and other specifications, is mainly used for producing integrated circuits, is an important material for manufacturing the integrated circuits, and can be manufactured into various semiconductor devices by means of photoetching, ion implantation and the like; the chip made of the silicon chip has a remarkable operation capability, the silicon chip is clamped by the clamping mechanism in the processing process, and the silicon chip cannot be disturbed in the processing process.
In the prior art, the following defects also exist: in the process of processing the silicon wafer, the multiple surfaces of the silicon wafer are required to be processed, generally, in the process of processing the silicon wafer, a machine is usually stopped, and the processing surface is changed by disassembling the silicon wafer, so that the processing time of the silicon wafer is prolonged, and meanwhile, the processing efficiency of the silicon wafer is reduced. In view of this, we propose a dynamics adjustable silicon chip fixture.
Disclosure of Invention
In order to make up for the defects, the utility model provides the silicon wafer clamping mechanism with adjustable force.
The technical scheme of the utility model is as follows:
the utility model provides a dynamics adjustable silicon chip fixture, includes base and base plate, be equipped with drive box and box on the base plate, and the base plate is located on the base, still includes:
the clamping part comprises a first clamping plate and a second clamping plate, is used for clamping the silicon wafer, and is internally provided with a turnover part for driving the clamping part to rotate;
the first driving part is arranged in the driving box and used for driving the box body to move along the horizontal direction, and a guiding part is arranged between the box body and the base plate and used for guiding the box body.
Further, the turnover part comprises a rotating shaft arranged in the box body, a first power source used for driving the rotating shaft to rotate is arranged in the box body, a connecting column is arranged at one end of the rotating shaft, a mounting block is arranged on the connecting column, and a second driving part used for driving the second clamping plate to move along the vertical direction is arranged on the mounting block.
Further, be equipped with the machine case on the installation piece, drive portion two sets of screw rods including locating the quick-witted incasement, and the quick-witted incasement is equipped with the second power supply that is used for driving screw rod pivoted, be equipped with the connecting block on the screw rod, and be connected through the connecting rod between connecting block and the second splint.
Further, the first driving part comprises an electric push rod arranged in the driving box, a piston rod in the electric push rod is connected with the box body through a connecting rod, and a rod groove matched with the connecting rod is formed in the driving box.
Further, the guide part comprises a first sliding block fixed at the bottom of the box body, a first sliding groove matched with the first sliding block is formed in the base plate, first protruding blocks are arranged on two sides of the first sliding block, and a first strip-shaped groove matched with the first protruding blocks is formed in the inner wall of the first sliding groove.
Further, the base is connected with the base plate through the transmission shaft, a third power source for driving the transmission shaft to rotate is arranged in the base, a limiting ring is arranged on the transmission shaft, and a limiting groove matched with the limiting ring is formed in the base.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the rotating shaft is arranged, the rotating shaft is driven by the second motor to rotate, the connecting column is driven by the rotating shaft to rotate, the mounting block is driven by the connecting column to rotate, and the mounting block drives the first clamping plate and the second clamping plate to rotate, so that the turnover of the silicon wafer clamped by the first clamping plate and the second clamping plate is realized, the processing surface of the silicon wafer is turned over, the time for replacing the processing surface of the silicon wafer is shortened, and the processing efficiency of the silicon wafer is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the base of the present utility model;
FIG. 3 is a schematic view of the internal structure of the driving box of the present utility model;
FIG. 4 is a schematic view of the internal structure of the case of the present utility model;
fig. 5 is a schematic diagram of the internal structure of the chassis according to the present utility model.
In the figure:
1. a base;
2. a substrate; 21. a transmission shaft; 22. a first motor;
3. a drive box; 31. an electric push rod; 32. a connecting rod;
4. a mounting block;
5. a case; 51. a first slider; 52. a support plate; 53. a second motor; 54. a rotating shaft; 55. a connecting column;
6. a chassis; 61. a motor; 62. a screw; 63. a connecting block; 64. a connecting rod;
7. a first clamping plate;
8. a second clamping plate; 81. and a second slider.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-5, the present utility model is described in detail by the following embodiments:
the utility model provides a dynamics adjustable silicon chip fixture, includes base 1 and base plate 2, is equipped with drive box 3 and box 5 on the base plate 2, and base plate 2 locates on the base 1, still includes:
the clamping part comprises a first clamping plate 7 and a second clamping plate 8, and is used for clamping the silicon wafer, and a turnover part used for driving the clamping part to rotate is arranged in the box body 5; in this embodiment, the turnover part includes a rotating shaft 54 disposed in the box 5, and a first power source for driving the rotating shaft 54 to rotate is fixedly mounted in the box 5, the first power source is a second motor 53, a supporting plate 52 for supporting the second motor 53 is fixedly mounted in the box 5, a power output shaft of the second motor 53 is coaxially fixed with the rotating shaft 54, a connecting column 55 is fixedly mounted at one end of the rotating shaft 54, a mounting block 4 is fixedly mounted on the connecting column 55, and a second driving part for driving the second clamping plate 8 to move along the vertical direction is disposed on the mounting block 4. The second motor 53 drives the rotating shaft 54 to rotate, the rotating shaft 54 drives the connecting column 55 to rotate, the connecting column 55 drives the mounting block 4 to rotate, and the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to rotate, so that the turnover of silicon wafers on the first clamping plate 7 and the second clamping plate 8 is realized, and the processing surface of the silicon wafers is replaced.
In this embodiment, the mounting block 4 is fixedly provided with the casing 6, the driving part two includes a screw 62 disposed in the casing 6, and a second power source for driving the screw 62 to rotate is fixedly mounted in the casing 6, the power source is a motor 61, a power output shaft of the motor 61 is coaxially fixed with the screw 62, a connecting block 63 is disposed on the screw 62, the connecting block 63 is connected with the second clamping plate 8 through a connecting rod 64, the connecting block 63 is in threaded connection with the screw 62, the connecting rod 64 is fixedly connected with the connecting block 63, and the connecting rod 64 is fixedly connected with the second clamping plate 8. The motor 61 drives the screw 62 to rotate, the screw 62 drives the connecting block 63 to move along the vertical direction, the connecting block 63 drives the connecting rod 64 to move, and the connecting rod 64 drives the second clamping plate 8 to move, so that the clamping distance between the first clamping plate 7 and the second clamping plate 8 is adjusted according to the thickness of the silicon wafer.
The first driving part is arranged in the driving box 3 and used for driving the box body 5 to move along the horizontal direction, and a guiding part is arranged between the box body 5 and the substrate 2 and used for guiding the box body 5. In this embodiment, the first driving portion includes an electric push rod 31 disposed in the driving box 3, the driving box 3 is movably connected with the electric push rod 31, a piston rod in the electric push rod 31 is connected with the box 5 through a connecting rod 32, a rod groove matched with the connecting rod 32 is disposed on the driving box 3, the connecting rod 32 is fixedly connected with the piston rod in the electric push rod 31, and the connecting rod 32 is fixedly connected with the box 5. The connecting rod 32 is driven to move along the horizontal direction through the piston rod in the electric push rod 31, the connecting rod 32 drives the box body 5 to move, the box body 5 drives the mounting block 4 to move, and the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to move, so that the horizontal clamping distance between the two first clamping plates 7 and the second clamping plate 8 is adjusted according to the length of a silicon wafer.
In this embodiment, the guiding portion includes a first slider 51 fixed at the bottom of the box 5, and the substrate 2 is provided with a first chute matched with the first slider 51, two sides of the first slider 51 are fixedly provided with first bumps, and the inner wall of the first chute is provided with a first bar-shaped groove matched with the first bumps. By providing the first slider 51 and the first bump, the case 5 is prevented from being offset during movement.
In this embodiment, the base 1 is connected with the substrate 2 through the transmission shaft 21, a third power source for driving the transmission shaft 21 to rotate is fixedly installed in the base 1, the third power source is a first motor 22, a power output shaft of the first motor 22 is coaxially fixed with the transmission shaft 21, the transmission shaft 21 is fixedly connected with the substrate 2, a cylindrical groove for the transmission shaft 21 to pass through is formed in the base 1, a limiting ring is fixedly installed on the transmission shaft 21, and a limiting groove matched with the limiting ring is formed in the base 1. The transmission shaft 21 is driven to rotate by the first motor 22, the transmission shaft 21 drives the base plate 2 to rotate, the base plate 2 drives the box body 5 to rotate, the box body 5 drives the mounting block 4 to rotate, and the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to rotate, so that the angle adjustment is carried out on the silicon wafer.
In this embodiment, the box body 5 far away from the first sliding groove is fixedly connected with the base plate 2, the driving box 3 is fixedly connected with the base plate 2, the first clamping plate 7 is fixedly connected with the mounting block 4, the second sliding block 81 is fixedly mounted on the second clamping plate 8, the mounting block 4 is provided with a second sliding groove matched with the second sliding block 81, the second sliding block 81 is fixedly mounted with a second protruding block, and the inner wall of the second sliding groove is provided with a second bar-shaped groove matched with the second protruding block.
In this embodiment, a switch is fixedly mounted on the base 1, and a closed loop is formed between the switch and the first motor 22, the second motor 53, the motor 61 and the electric push rod 31, and the first motor 22, the second motor 53, the motor 61 and the electric push rod 31 are controlled to be started and closed by the switch control loop.
Working principle: by placing the silicon chip on the first clamping plate 7, opening the switch of the electric push rod 31, the piston rod in the electric push rod 31 drives the connecting rod 32 to move along the horizontal direction, the connecting rod 32 drives the box 5 to move, the box 5 drives the mounting block 4 to move, the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to move, thereby adjusting the horizontal clamping distance between the two first clamping plates 7 and the second clamping plate 8 according to the length of the silicon chip, when the silicon chip is moved to a proper position, closing the switch of the electric push rod 31, opening the switch of the motor 61, the motor 61 drives the screw rod 62 to rotate, the screw rod 62 drives the connecting block 63 to move along the vertical direction, the connecting block 63 drives the connecting rod 64 to move, the connecting rod 64 drives the second clamping plate 8 to move, thereby adjusting the clamping distance between the first clamping plate 7 and the second clamping plate 8 according to the thickness of the silicon chip, clamping force on the silicon chip can be adjusted according to the requirement, when the silicon wafer is clamped, the switch of the motor 61 is turned off, a worker processes the silicon wafer, when the angle adjustment is required to be performed on the silicon wafer, the switch of the first motor 22 is turned on, the first motor 22 drives the transmission shaft 21 to rotate, the transmission shaft 21 drives the base plate 2 to rotate, the base plate 2 drives the box 5 to rotate, the box 5 drives the mounting block 4 to rotate, the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to rotate, thereby performing the angle adjustment on the silicon wafer, when the angle adjustment is completed, the switch of the first motor 22 is turned off, when the turnover processing surface is required to be performed on the silicon wafer, the switch of the second motor 53 is turned on, the second motor 53 drives the rotating shaft 54 to rotate, the rotating shaft 54 drives the connecting column 55 to rotate, the connecting column 55 drives the mounting block 4 to rotate, the mounting block 4 drives the first clamping plate 7 and the second clamping plate 8 to rotate, thereby realizing the turnover of the silicon wafer on the first clamping plate 7 and the second clamping plate 8, and simultaneously replacing the processing surface of the silicon wafer, then closing the switch of the second motor 53, repeating the operation after the processing of the processing surface of the silicon wafer is finished, taking down the processed silicon wafer, and closing all the switches.
Through setting up pivot 54, drive pivot 54 through second motor 53 and rotate, the pivot 54 drives spliced pole 55 and rotates, and spliced pole 55 drives installation piece 4 and rotate, and installation piece 4 drives first splint 7 and second splint 8 and rotate to the realization is to the upset of the silicon chip that is cliied through first splint 7 and second splint 8, carries out the turn-over to the machined surface of silicon chip, thereby reduces the time of changing the silicon chip machined surface, has improved the machining efficiency of silicon chip.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a dynamics adjustable silicon chip fixture, includes base (1) and base plate (2), be equipped with drive box (3) and box (5) on base plate (2), and base plate (2) are located on base (1), its characterized in that still includes:
the clamping part comprises a first clamping plate (7) and a second clamping plate (8) which are used for clamping the silicon wafer, and a turnover part used for driving the clamping part to rotate is arranged in the box body (5);
the first driving part is arranged in the driving box (3) and used for driving the box body (5) to move along the horizontal direction, and a guiding part is arranged between the box body (5) and the substrate (2) and used for guiding the box body (5).
2. The adjustable force silicon wafer clamping mechanism of claim 1, wherein: the turnover part comprises a rotating shaft (54) arranged in the box body (5), a first power source used for driving the rotating shaft (54) to rotate is arranged in the box body (5), a connecting column (55) is arranged at one end of the rotating shaft (54), a mounting block (4) is arranged on the connecting column (55), and a second driving part used for driving the second clamping plate (8) to move along the vertical direction is arranged on the mounting block (4).
3. The adjustable force silicon wafer clamping mechanism of claim 2, wherein: the mounting block (4) is provided with a case (6), the driving part II comprises a screw rod (62) arranged in the case (6), a second power source used for driving the screw rod (62) to rotate is arranged in the case (6), the screw rod (62) is provided with a connecting block (63), and the connecting block (63) is connected with a second clamping plate (8) through a connecting rod (64).
4. The adjustable force silicon wafer clamping mechanism of claim 1, wherein: the first driving part comprises an electric push rod (31) arranged in the driving box (3), a piston rod in the electric push rod (31) is connected with the box body (5) through a connecting rod (32), and a rod groove matched with the connecting rod (32) is formed in the driving box (3).
5. The adjustable force silicon wafer clamping mechanism of claim 4, wherein: the guide part comprises a first sliding block (51) fixed at the bottom of the box body (5), a first sliding groove matched with the first sliding block (51) is formed in the base plate (2), first protruding blocks are arranged on two sides of the first sliding block (51), and first strip-shaped grooves matched with the first protruding blocks are formed in the inner wall of the first sliding groove.
6. The adjustable force silicon wafer clamping mechanism of claim 5, wherein: the base (1) is connected with the base plate (2) through a transmission shaft (21), a third power source for driving the transmission shaft (21) to rotate is arranged in the base (1), a limiting ring is arranged on the transmission shaft (21), and a limiting groove matched with the limiting ring is formed in the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321562676.0U CN220382074U (en) | 2023-06-19 | 2023-06-19 | Dynamics adjustable silicon chip fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321562676.0U CN220382074U (en) | 2023-06-19 | 2023-06-19 | Dynamics adjustable silicon chip fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220382074U true CN220382074U (en) | 2024-01-23 |
Family
ID=89564917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321562676.0U Active CN220382074U (en) | 2023-06-19 | 2023-06-19 | Dynamics adjustable silicon chip fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220382074U (en) |
-
2023
- 2023-06-19 CN CN202321562676.0U patent/CN220382074U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |