CN219671989U - Moisture-heat resistant floor heating composite substrate - Google Patents
Moisture-heat resistant floor heating composite substrate Download PDFInfo
- Publication number
- CN219671989U CN219671989U CN202223149956.7U CN202223149956U CN219671989U CN 219671989 U CN219671989 U CN 219671989U CN 202223149956 U CN202223149956 U CN 202223149956U CN 219671989 U CN219671989 U CN 219671989U
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- China
- Prior art keywords
- layer
- panel
- board
- composite substrate
- thickness
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- 239000002131 composite material Substances 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 title claims description 18
- 239000010410 layer Substances 0.000 claims abstract description 65
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- 239000011094 fiberboard Substances 0.000 claims abstract description 9
- 229920001342 Bakelite® Polymers 0.000 claims abstract description 8
- 239000004637 bakelite Substances 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 239000000835 fiber Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 23
- 229920002689 polyvinyl acetate Polymers 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- 239000004566 building material Substances 0.000 abstract description 2
- 239000002023 wood Substances 0.000 description 3
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Floor Finish (AREA)
Abstract
The utility model belongs to the technical field of building materials, relates to a floor substrate, and particularly relates to a wet-heat resistant floor composite substrate, which comprises an upper panel with the thickness of 2-5 mm and a lower panel with the thickness of 2-5 mm, wherein a functional board layer with the thickness of 1-3 mm is arranged between the two panels, a glue layer (A) is arranged between the upper panel and the functional board layer, and a glue layer (B) is arranged between the functional board layer and the lower panel. The upper/lower layer panel is a fiber board, the functional board layer is an bakelite board or a glass fiber board, and the thickness of the adhesive layer (A) and the adhesive layer (B) is PVAc with 0.2-1.2 mm. The utility model introduces the functional board which is heat-resistant, moisture-resistant and has better dimensional stability, and forms the composite board with the fiber board, thereby effectively improving the heat-resistant, moisture-resistant and dimensional stability of the floor base material, and having low cost and easy popularization.
Description
Technical Field
The utility model belongs to the technical field of building materials, relates to a floor base material, and particularly relates to a wet-heat-resistant floor heating composite base material.
Background
With the improvement of living standard, the floor is widely applied to building decoration by people, and the floor is divided into a plurality of types according to different purposes, and the floor is one of the floor. Families for installing floor heating are more and more, but the traditional wooden floor is easy to warp and deform due to temperature difference, and cannot meet the current requirements of people on floor heating. As an important base material in the composition of the wood floor, the thermal deformation of the wood floor base material is an inherent defect, and the heat resistance and moisture resistance dimensional stability is improved only by modifying the wood, so that the difficulty is high; the common floor base material can not adapt to the use environment with large ground heating temperature difference and high humidity, and often has the quality problems of warp deformation and the like.
In view of the above, the single fiber board is compounded with other functional boards, so that the technical problem that the physical properties of the floor heating floor base material are not ideal is hopeful to be solved.
Disclosure of Invention
Aiming at the existing problems of large temperature and humidity change and easy deformation of plates in a floor heating environment, the utility model discloses a wet-heat resistant floor heating composite substrate.
The technical scheme of the utility model is as follows:
the utility model provides a wet heat resistant floor composite substrate warms up, includes upper panel and lower floor's panel, is equipped with the function sheet layer between two-layer panel, is equipped with glue film A between upper panel and the function sheet layer, is equipped with glue film B between function sheet layer and lower floor's panel.
Further, the upper panel has a thickness of 2 to 5mm, preferably 4mm, and is a fiberboard.
Further, the thickness of the functional board layer is 1-3 mm, preferably 2mm, and the functional board layer is a bakelite board or a glass fiber board.
Further, the lower panel has a thickness of 2 to 5mm, preferably 4mm, and is a fiberboard.
Further, the thicknesses of the adhesive layer A and the adhesive layer B are 0.1-0.3 mm, preferably 0.2mm, and are PVAc.
Advantageous effects
The utility model introduces the functional board and the fiber board which are heat-resistant, moisture-resistant and good in dimensional stability to form the composite board, can effectively improve the heat resistance, moisture-resistant and dimensional stability of the floor base material, has low cost and is easy to popularize.
Drawings
Fig. 1 is a schematic structural diagram of a composite substrate of a wet heat resistant floor heating floor, wherein the composite substrate comprises a top panel, a functional board layer, a bottom panel, a glue layer A, a glue layer 5 and a glue layer B.
Detailed Description
The present utility model will be described in detail with reference to the following examples, so that those skilled in the art can better understand the present utility model, but the present utility model is not limited to the following examples.
Example 1
The utility model provides a wet heat resistant floor composite substrate warms up, is 4mm fibreboard including upper panel 1 and lower floor panel 3 and is 4mm fibreboard, is equipped with 2 mm's function sheet layer 2 between two-layer panel, specifically is the bakelite board, is equipped with 0.2mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.2mm thick glue film B between function sheet layer 2 and lower floor panel 3. The different layers were bonded using PVAc.
Example 2
The utility model provides a wet heat resistant floor composite substrate warms up, is 4mm fibreboard including upper panel 1 and lower floor panel 3 and is 4mm fibreboard, is equipped with 2 mm's function sheet layer 2 between two-layer panel, specifically is glass fiber board, is equipped with 0.2mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.2mm thick glue film B between function sheet layer 2 and lower floor panel 3. The different layers were bonded using PVAc.
The finished substrate test data are shown in Table 1
TABLE 1
Example 3
The utility model provides a wet heat resistant floor composite substrate warms up, is 2mm fibreboard and lower floor's panel 3 is 5mm fibreboard including upper panel 1, is equipped with 3 mm's function sheet layer 2 between two-layer panel, specifically is the bakelite board, is equipped with 0.1mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.3mm thick glue film B between function sheet layer 2 and lower floor's panel 3. The different layers were bonded using PVAc.
Example 4
The utility model provides a wet heat resistant floor composite substrate warms up, is 5mm fibreboard and lower floor's panel 3 is 2mm fibreboard including upper panel 1, is equipped with 2 mm's function sheet layer 2 between two-layer panel, specifically is the bakelite board, is equipped with 0.3mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.2mm thick glue film B between function sheet layer 2 and lower floor's panel 3. The different layers were bonded using PVAc.
Example 5
The utility model provides a wet heat resistant floor composite substrate warms up, is 5mm fibreboard including upper panel 1 and lower floor panel 3 and is 5mm fibreboard, is equipped with 3 mm's function sheet layer 2 between two-layer panel, specifically is the bakelite board, is equipped with 0.3mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.3mm thick glue film B between function sheet layer 2 and lower floor panel 3. The different layers were bonded using PVAc.
Example 6
The utility model provides a wet heat resistant floor composite substrate warms up, is 2mm fibreboard and lower floor's panel 3 is 5mm fibreboard including upper panel 1, is equipped with 3 mm's function sheet layer 2 between two-layer panel, specifically is glass fiber board, is equipped with 0.2mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.3mm thick glue film B between function sheet layer 2 and lower floor's panel 3. The different layers were bonded using PVAc.
Example 7
The utility model provides a wet heat resistant floor composite substrate warms up, is 5mm fibreboard and lower floor's panel 3 is 2mm fibreboard including upper panel 1, is equipped with 2 mm's function sheet layer 2 between two-layer panel, specifically is glass fiber board, is equipped with 0.3mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.1mm thick glue film B between function sheet layer 2 and lower floor's panel 3. The different layers were bonded using PVAc.
Example 8
The utility model provides a wet heat resistant floor composite substrate warms up, is 5mm fibreboard including upper panel 1 and lower floor panel 3 and is 5mm fibreboard, is equipped with 3 mm's function sheet layer 2 between two-layer panel, specifically is glass fiber board, is equipped with 0.3mm thick glue film A between upper panel 1 and function sheet layer 2, is equipped with 0.3mm thick glue film B between function sheet layer 2 and lower floor panel 3. The different layers were bonded using PVAc.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (8)
1. The utility model provides a wet heat resistant floor heating floor composite substrate, includes upper panel (1) and lower floor's panel (3), its characterized in that: a functional board layer (2) is arranged between the two layers of panels, the functional board layer (2) is a bakelite board or a glass fiber board with the thickness of 1-3 mm, an adhesive layer A (4) is arranged between the upper layer of panels (1) and the functional board layer (2), and an adhesive layer B (5) is arranged between the functional board layer (2) and the lower layer of panels (3).
2. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the upper panel (1) is a fiber plate with the thickness of 2-5 mm.
3. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the upper panel (1) is a fiberboard with a thickness of 4 mm.
4. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the functional board layer (2) is a bakelite board or a glass fiber board with the thickness of 2mm.
5. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the lower panel (3) is a fiberboard with a thickness of 2-5 mm.
6. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the lower panel (3) is a fiberboard with a thickness of 4 mm.
7. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the thickness of the adhesive layer A (4) and the adhesive layer B (5) is 0.1-0.3 mm.
8. The heat and humidity resistant floor heating composite substrate of claim 1, wherein: the thickness of the adhesive layer A (4) and the adhesive layer B (5) is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223149956.7U CN219671989U (en) | 2022-11-24 | 2022-11-24 | Moisture-heat resistant floor heating composite substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223149956.7U CN219671989U (en) | 2022-11-24 | 2022-11-24 | Moisture-heat resistant floor heating composite substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219671989U true CN219671989U (en) | 2023-09-12 |
Family
ID=87896949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223149956.7U Active CN219671989U (en) | 2022-11-24 | 2022-11-24 | Moisture-heat resistant floor heating composite substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219671989U (en) |
-
2022
- 2022-11-24 CN CN202223149956.7U patent/CN219671989U/en active Active
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| GR01 | Patent grant |