CN201626139U - Composite plate - Google Patents
Composite plate Download PDFInfo
- Publication number
- CN201626139U CN201626139U CN2010201654096U CN201020165409U CN201626139U CN 201626139 U CN201626139 U CN 201626139U CN 2010201654096 U CN2010201654096 U CN 2010201654096U CN 201020165409 U CN201020165409 U CN 201020165409U CN 201626139 U CN201626139 U CN 201626139U
- Authority
- CN
- China
- Prior art keywords
- plate
- material plate
- composite plate
- solid
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
- Veneer Processing And Manufacture Of Plywood (AREA)
Abstract
The utility model discloses a composite plate, which includes a solid wood panel and a high-density base material plate, wherein the solid wood plate and the high-density base material plate are connected through connecting surfaces in a waveform adhesion way, the thickness of the solid wood panel is 0.2cm to 0.4cm, and the thickness of the high density base material plate is 1.0cm to 1.2cm. Under the conditions of high temperature and low temperature, the surface of the composite plate can not have crack performance due to the stable fiber structure of the panel; and furthermore, the composite plate can fully realize the automation and reduce the cost by 30 percent, and social and economic benefits are remarkable.
Description
Technical field
The utility model relates to a kind of composite plate, especially adopts the composite plate of solid wood and the combination of high density backing material plate.
Background technology
The application of composite plate is very general, and its structure has a backing material plate at least, this plate substrate top with glue through colding pressing or hot pressing is compounded with one deck surface layer veneer; Its manufacture craft mainly includes 1, gluing between solid-wood panels and base material; 2, hot pressing; 3, processing.This technical maturity, cost is lower, and bonding quality is stable, satisfies suitability for industrialized production.But, had a strong impact on the service life of composite plate owing to the contraction and the surface checking of solid wood composite board various degrees under different environments for use made from above-mentioned manufacturing process.This be because, backing material plate be heated or make moist back distortion, panel directly influences its life-span also along with distortion.
Summary of the invention
The purpose of this utility model is to provide a kind of novel composite plate of long service life, this composite plate includes solid-wood panels and high density backing material plate, solid-wood panels and high density backing material plate joint face are that waveform is bonding, the thickness of solid-wood panels is 0.2-0.4cm, and the thickness of high density backing material plate is 1.0-1.2cm.
This composite plate makes solid-wood panels and high density backing material plate good bond by under high temperature, condition of high voltage, adopts the waveform connected mode again, increases adhesive surface, and solid-wood panels and high density backing material plate form firm integral body.Under high temperature and low humidity condition, the Stability Analysis of Structures of panel fiber, so the surface crack performance can not occur.The utility model can be realized automation fully, and it is nearly 30% to reduce cost, characteristics such as economic benefit and social benefit are comparatively remarkable.
Description of drawings
Fig. 1 is a profile of the present utility model
1, solid-wood panels 2, high density backing material plate
The specific embodiment
In conjunction with the accompanying drawings the utility model is described in further detail.
As can be seen from Figure 1, a kind of composite plate includes solid-wood panels 1 and high density backing material plate 2, and solid-wood panels 1 and high density backing material plate 2 joint faces are that waveform is bonding, and the thickness of solid-wood panels 1 is 0.2-0.4cm, and the thickness of high density backing material plate 2 is 1.0-1.2cm.
Claims (1)
1. a composite plate includes solid-wood panels and high density backing material plate, it is characterized in that: solid-wood panels and high density backing material plate joint face are that waveform is bonding, and the thickness of solid-wood panels is 0.2-0.4cm, and the thickness of high density backing material plate is 1.0-1.2cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201654096U CN201626139U (en) | 2010-04-02 | 2010-04-02 | Composite plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201654096U CN201626139U (en) | 2010-04-02 | 2010-04-02 | Composite plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201626139U true CN201626139U (en) | 2010-11-10 |
Family
ID=43057525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201654096U Expired - Fee Related CN201626139U (en) | 2010-04-02 | 2010-04-02 | Composite plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201626139U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804713A (en) * | 2010-04-02 | 2010-08-18 | 吴永志 | Composite board with new structure |
-
2010
- 2010-04-02 CN CN2010201654096U patent/CN201626139U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804713A (en) * | 2010-04-02 | 2010-08-18 | 吴永志 | Composite board with new structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101110 Termination date: 20110402 |