CN219670630U - Evaporation device and evaporation system - Google Patents
Evaporation device and evaporation system Download PDFInfo
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- CN219670630U CN219670630U CN202320181945.2U CN202320181945U CN219670630U CN 219670630 U CN219670630 U CN 219670630U CN 202320181945 U CN202320181945 U CN 202320181945U CN 219670630 U CN219670630 U CN 219670630U
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- 230000008020 evaporation Effects 0.000 title claims abstract description 183
- 238000001704 evaporation Methods 0.000 title claims abstract description 183
- 239000000463 material Substances 0.000 claims abstract description 95
- 238000001514 detection method Methods 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000007740 vapor deposition Methods 0.000 claims description 77
- 238000010438 heat treatment Methods 0.000 claims description 46
- 230000004044 response Effects 0.000 claims description 18
- 238000003380 quartz crystal microbalance Methods 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 7
- 238000005019 vapor deposition process Methods 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 239000002346 layers by function Substances 0.000 description 1
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- 230000009467 reduction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The embodiment of the utility model discloses an evaporation device and an evaporation system. The evaporation device of one embodiment comprises an evaporation chamber, the evaporation chamber comprises a first evaporation chamber for placing a substrate to be evaporated and a second evaporation chamber arranged outside the first evaporation chamber, and the evaporation device comprises: an evaporation source disposed in the second evaporation chamber, comprising: the evaporation device comprises an evaporation crucible and a plurality of nozzles positioned on the evaporation crucible, wherein each nozzle emits evaporation material to form a material evaporation area; the bearing plate is arranged on one side of the nozzle far away from the evaporation crucible, and a preset distance is reserved between the bearing plate and the nozzle; the detection unit is arranged on one side surface of the bearing plate, close to the evaporation source, and is used for sensing the material evaporation state of the material evaporation area so as to generate nozzle working information corresponding to the material evaporation area, and the shielding piece is used for responding to an input control instruction to shield or not shield the detection unit.
Description
Technical Field
The utility model relates to the technical field of display. And more particularly, to a vapor deposition apparatus and a vapor deposition system.
Background
The formation of an OLED device on a substrate generally employs an evaporation process, which refers to heating an evaporation material under a certain vacuum condition to melt (or sublimate) the evaporation material into vapor composed of atoms, molecules or groups of atoms, and then condensing the vapor on the surface of the substrate to form a film, thereby forming a functional layer of the OLED device.
The evaporation process can be divided into a point source crucible and a line source crucible according to the type of evaporation source. For the line source evaporation, after the material is heated, the material is sprayed out of a Nozzle opening of a crucible, a film layer is formed after deposition on a substrate, the uniformity of the thickness of the film layer mainly depends on the material speed sprayed out of each Nozzle opening, and the uniformity deterioration of the film thickness is a main cause for causing the optical defect and the yield reduction of an OLED device, so that the uniformity of the evaporation film layer is particularly important to monitor in real time in the production process.
Disclosure of Invention
The utility model aims to provide an evaporation device and an evaporation system, which are used for solving at least one of the problems existing in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the first aspect of the utility model provides an evaporation device, which comprises an evaporation chamber, wherein the evaporation chamber comprises a first evaporation chamber for placing a substrate to be evaporated and a second evaporation chamber positioned outside the first evaporation chamber,
the vapor deposition device includes:
an evaporation source disposed in the second evaporation chamber, comprising: the evaporation device comprises an evaporation crucible and a plurality of nozzles positioned on the evaporation crucible, wherein each nozzle emits evaporation material to form a material evaporation area;
the bearing plate is arranged on one side of the nozzle far away from the evaporation crucible, and a preset distance is reserved between the bearing plate and the nozzle;
the detection unit is arranged on one side surface of the bearing plate, which is close to the evaporation source, and is used for sensing the material evaporation state of the material evaporation area so as to generate nozzle working information corresponding to the material evaporation area, and
and the shielding piece is arranged on the same side of the bearing plate as the detection unit and is used for shielding or not shielding the detection unit in response to an input control instruction.
In an alternative embodiment, the evaporation source further comprises a shell with an inner cavity, the evaporation crucible and the nozzle are arranged in the inner cavity, and an opening corresponding to the nozzle is arranged on the top wall of one side of the shell, close to the nozzle.
In an alternative embodiment, the opening is an adjustable opening, and in response to an adjustment command input to the adjustable opening, an opening area of the opening is changed, so that an area of the material evaporation area is changed.
In an alternative embodiment, the bearing plate comprises a first plate body and a second plate body, wherein the first plate body and the second plate body have preset included angles to form an evaporation shielding area covering the material evaporation area,
the evaporation shielding area covers the material evaporation area corresponding to the opening area of the adjustable opening when the opening area is maximum.
In an alternative embodiment, when the shielding member shields the detection unit in response to the control instruction, the shielded detection unit does not sense the material evaporation state of the material evaporation region;
when the shielding piece responds to the control instruction and does not shield the detection unit, the nozzle positioned in the second vapor deposition chamber emits vapor deposition material to the detection unit which is not shielded, and the detection unit senses the material vapor deposition state of the material vapor deposition area formed by the nozzle so as to generate nozzle working information corresponding to the material vapor deposition area.
In an alternative embodiment, the detection unit comprises a plurality of quartz crystal microbalance sensors arranged along a first direction, each quartz crystal microbalance sensor corresponding to at least one evaporation zone for material,
the first direction is parallel to an arrangement direction of the nozzles.
In an alternative embodiment, the shutter comprises a rotatable shaft and a rotatable cover coupled to the rotatable shaft,
the rotational axis extends in the first direction,
the rotating cover has a cavity that rotates about the rotational axis in response to the control command such that the cavity of the rotating cover houses all of the quartz crystal microbalance sensor.
In an alternative embodiment, the shielding piece comprises a sliding rail arranged on one side surface of the bearing plate close to the evaporation source and a sliding cover positioned on the sliding rail,
the slide rail extends in the first direction,
the sliding cover is provided with a cavity, and the sliding cover moves on the sliding rail in response to the control instruction, so that the cavity of the sliding cover accommodates all the quartz crystal microbalance sensors.
A second aspect of the present utility model provides an evaporation system comprising:
the vapor deposition device according to the first aspect of the present utility model, a displacement device connected to the vapor deposition source, and a controller,
the controller is used for outputting a displacement instruction for controlling the displacement device so that the displacement device drives the evaporation device to move in the first evaporation chamber and the second evaporation chamber;
the controller is also used for outputting a control instruction to the shielding piece, and acquiring the nozzle working information generated by the detection unit when the shielding piece does not shield the detection unit.
In an alternative embodiment, the vapor deposition system further includes:
a heating device for heating the evaporation crucible,
the controller is also used for judging the working states of the nozzles of different material evaporation areas according to the working information of the nozzles, generating a heating instruction to the heating device,
the heating device adjusts the heating temperature of the evaporation crucible according to the heating instruction.
The beneficial effects of the utility model are as follows:
according to the evaporation device provided by the embodiment of the utility model, the detection unit arranged on the bearing plate is utilized to detect the evaporation source positioned in the second evaporation chamber when the detection unit is not shielded by the shielding piece, and the detection can be performed before the evaporation process of the substrate, or can be performed when the evaporation process of the substrate is performed, namely, the film thickness and uniformity of the evaporation material can be rapidly judged on line in real time, the risk and position of blocking holes are rapidly judged, and the productivity and the evaporation material utilization rate are improved while the product quality in the production process is ensured.
Drawings
The following describes the embodiments of the present utility model in further detail with reference to the drawings.
Fig. 1 is a schematic view showing a structure of a shutter of an evaporation apparatus according to an embodiment of the present utility model in a non-shielding state;
fig. 2 is a schematic view showing a structure of a shutter of an evaporation apparatus according to an embodiment of the present utility model in a blocking state;
fig. 3 shows a schematic cross-sectional view of an evaporation device according to an embodiment of the present utility model;
fig. 4 is a schematic structural view of an evaporation system according to another embodiment of the present utility model.
Detailed Description
In order to more clearly illustrate the present utility model, the present utility model will be further described with reference to examples and drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this utility model is not limited to the details given herein.
In the current production process of the actual evaporation process, the following problems exist in the monitoring mode of the thickness and uniformity of the evaporated film: (1) the real-time monitoring cannot be performed; the current method for measuring the film thickness and uniformity is to evaporate the material onto a detection substrate (Key Glass) with a specific measurement point, and then measure the film thickness and uniformity by an ellipsometer.
(2) The risk capacity of the prejudging quality is poor; with the lengthening of the production time, uneven consumption of materials in the evaporation crucible, material splashing or blockage of a Nozzle (Nozzle) can cause uniformity deterioration of an evaporation film layer, key Glass must be newly input according to the current film thickness monitoring mode, and a film thickness verification result is waited for and judged in a downtime state, so that in general, the result can be output only in one or more hours, and the production process is influenced.
(3) The material blocking hole is found slower; the accumulation and blockage of the material on the inner wall of the nozzles (nozzles) in the production process are common production anomalies, which cause abrupt change of the uniformity of the film thickness, but because the growth condition of the material cannot be observed on the inner wall of the nozzles, and when the material is observed to be accumulated on the nozzles, a lot of abnormal products can be produced, and if the abnormal products are found to be out of time, immeasurable loss can be caused to the production.
Accordingly, as shown in fig. 1, 2 and 3, the present utility model proposes a vapor deposition apparatus 1 comprising a vapor deposition chamber including a first vapor deposition chamber 1A in which a substrate 2 to be vapor deposited is placed and a second vapor deposition chamber 1B located outside the first vapor deposition chamber 1A,
the vapor deposition device 1 includes:
the vapor deposition source 10 provided in the second vapor deposition chamber 1B includes: a vapor deposition crucible 11 and a plurality of nozzles 12 located on the vapor deposition crucible 11;
the bearing plate 20 is arranged on one side of the nozzle 12 far away from the evaporation crucible 11, the bearing plate 20 and the nozzle 12 have a preset distance, and the evaporation material emitted by each nozzle 12 forms a material evaporation area on the bearing plate 20;
a detecting unit 30 disposed on a side surface of the carrier plate 20 near the vapor deposition source 10, the detecting unit 30 being configured to sense a material vapor deposition state of the material vapor deposition area to generate nozzle operation information corresponding to the material vapor deposition area, and
and a shielding member 40 disposed at the same side of the carrier plate 20 as the detection unit 30, for shielding or not shielding the detection unit 30 in response to an input control command.
The vapor deposition device of the embodiment utilizes the detection unit 30 arranged on the bearing plate 20 to detect the vapor deposition source 10 positioned in the second vapor deposition chamber 1B when the detection unit is not shielded by the shielding member 40, and the detection can be performed before the vapor deposition process of the substrate 2 to be vapor deposited, or can be performed when the vapor deposition process of the substrate 2 to be vapor deposited is performed, that is, the film thickness and uniformity of the vapor deposition material can be rapidly determined on line in real time, the risk and position of hole blockage can be rapidly judged, and the product quality in the production process can be ensured while the productivity and the utilization rate of the vapor deposition material can be improved.
In an alternative embodiment, when the shielding member 40 shields the detecting unit 30 in response to the control command, the shielded detecting unit 30 does not sense the material vapor deposition state of the material vapor deposition region;
as shown in fig. 1, when it is not necessary to verify the uniformity of the film thickness of the materials sprayed from different nozzles, the shielding member 40 is controlled to be closed, that is, the shielding member 40 shields the detecting unit 30, at this time, the vapor deposition material sprayed from the Nozzle 12 is not deposited on the detecting unit 30, but is deposited on the shielding member 40, and the detecting unit 30 does not detect at this time, so that the service life of the detecting unit 30 in the production period is prolonged.
It should be noted that, the detecting unit 30 shown in fig. 1 is a schematic perspective view, that is, after the detecting unit 30 is blocked by the blocking member 40, it is not visible, and the covering relationship between the detecting unit 30 and the blocking member 40 in the blocked state is shown in a perspective view in this embodiment.
In another alternative embodiment, when the shielding member 40 does not shield the detecting unit 30 in response to the control command, the nozzle 12 located in the second vapor deposition chamber 1B emits vapor deposition material to the detecting unit 30 which is not shielded, and the detecting unit 30 senses a material vapor deposition state of the material vapor deposition region formed by the nozzle 12 to generate nozzle operation information corresponding to the material vapor deposition region.
In this embodiment, as shown in fig. 2, when it is necessary to verify the uniformity of the film thickness of the material sprayed from different nozzles, the shielding member 40 is in an open state in response to a control command, shielding of the detection unit 30 is canceled, when the evaporation crucible 11 is located in the second evaporation chamber 1B provided with the detection unit 30, the Nozzle 12 emits the evaporation material, part of the evaporation material in the formed material evaporation area is evaporated onto the detection unit 30, and the detection unit 30 can obtain the Nozzle operation information of the Nozzle 12 corresponding to the material evaporation area detected by the detection unit 30 according to the material evaporation state, for example, the evaporation thickness, of the evaporation material formed on the surface.
In a specific example, the detection of the nozzle 12 by the detection unit 30 of the present embodiment may be performed before the vapor deposition process of the substrate 2 to be vapor deposited, or may be performed when the vapor deposition process of the substrate 2 to be vapor deposited is performed.
For example, as shown in fig. 3, before the initial processing, the vapor deposition source 10 is located in the second vapor deposition chamber 1B as an initial position, and at this time, the shielding member 40 may be controlled to cancel the shielding of the detection unit 30 and open the nozzles 12, so as to implement the test of the operation state of each nozzle 12 of the vapor deposition source 10 before the initial processing, and ensure the product quality during the production process.
In another embodiment, as shown in fig. 3, in the processing technology, the evaporation source 10 is moved from the second evaporation chamber 1B to the first evaporation chamber 1A, and the evaporation is performed on the substrate 2 to be evaporated in the first evaporation chamber 1A, after the evaporation source 10 completes one round of evaporation, that is, when the evaporation is performed from the left side to the right side of the substrate 2 to be evaporated and from the right side to the left side of the substrate 2 to be evaporated, the evaporation of the substrate 2 to be evaporated is completed once, at this time, the detection of the Nozzle 12 in the processing technology by the movement of the evaporation source 10 from the first evaporation chamber 1A to the second evaporation chamber 1B can be controlled, that is, the shielding member 40 is controlled to cancel the shielding of the detection unit 30, and the detection unit 30 directly detects the material evaporation state of the evaporation material formed on the surface thereof, so that the problem that the material is empty and the processing failure of the substrate 2 to be evaporated due to non-timely monitoring in the processing technology can be avoided.
In an alternative embodiment, as shown in fig. 3, the evaporation source 10 further includes a housing 13 having an inner cavity, the evaporation crucible 11 and the nozzle 12 are disposed in the inner cavity, and an opening 121 corresponding to the nozzle 12 is disposed on a top wall of the housing 13 near a side of the nozzle 12.
In this embodiment, considering that, in the vapor deposition process, when the vapor deposition source 10 is located in the second vapor deposition chamber 1B, there may be a case where the vapor deposition material formed in the material vapor deposition area of the carrier plate 20 falls onto the vapor deposition source 10, the present embodiment protects the vapor deposition source 10 by the housing 13, ensures the normal operation of the nozzle 12 by the opening 121, and prevents the vapor deposition material from falling off on the basis of realizing the normal operation of the vapor deposition process.
In an alternative embodiment, the opening 121 shown in fig. 3 is an adjustable opening, and the opening area of the opening 121 is changed in response to an adjustment command input to the adjustable opening, so that the area of the material evaporation zone is changed. In this embodiment, by adjusting the opening area of the opening, the area of the material evaporation area of the nozzle 12 formed on the carrier plate 20 can be adjusted in the first evaporation chamber 1A, and the area of the material evaporation area of the nozzle 12 formed on the substrate 2 to be evaporated can be adjusted in the second evaporation chamber 1B, so as to realize the substrate evaporation with different design requirements.
In an alternative embodiment, as shown in fig. 3, the carrier plate 20 includes a first plate body 21 and a second plate body 22, where the first plate body 21 and the second plate body 22 have a preset included angle to form an evaporation shielding area covering the material evaporation area, and the evaporation shielding area covers the material evaporation area corresponding to when the opening area of the adjustable opening is the largest. Through this setting, utilize first plate body 21 and second plate body 22 to block the evaporation coating path of the evaporation coating material of nozzle 12 outgoing, avoid evaporation coating material to pollute second evaporation coating cavity 1B, avoid evaporation coating material to pollute first evaporation coating cavity 1A and avoid evaporation coating material to pollute waiting in the first evaporation coating cavity 1A and evaporate coating substrate 2, guarantee product quality.
As shown in fig. 3, the detecting unit 30 of the present embodiment is disposed on the second plate 22, and in another example, the detecting unit 30 may also be disposed on the first plate 21, which is not described herein.
In an alternative embodiment, as shown in fig. 1 and 2, the detecting unit 30 includes a plurality of quartz crystal microbalance sensors arranged along a first direction, each corresponding to at least one of the material vapor deposition areas, the first direction being parallel to the arrangement direction of the nozzles 12.
In this embodiment, a plurality of quartz crystal microbalance sensors are provided, and the arrangement direction is parallel to the arrangement direction of the nozzles 12, so as to realize the determination of the nozzle working states of all the nozzles 12.
As shown in fig. 1 and 2, the quartz crystal microbalance sensor corresponds to the nozzles 12 one by one, that is, one quartz crystal microbalance sensor senses the material evaporation area formed by one nozzle 12, but in consideration of cost, one quartz crystal microbalance sensor may not be set to correspond one by one, that is, one quartz crystal microbalance sensor corresponds to a plurality of nozzles 12, so that the process manufacturing cost is reduced on the basis of realizing the monitoring of all the nozzles 12.
In an alternative embodiment, the shutter 40 includes a rotational shaft extending in the first direction and a rotational cover coupled to the rotational shaft, the rotational cover having a cavity that rotates about the rotational shaft in response to the control command such that the cavity of the rotational cover receives all of the quartz crystal microbalance sensor.
In this embodiment, the shielding member 40 is of a flip design, i.e., the shielding of the detection unit 30 is achieved or the shielding of the detection unit 30 is canceled by controlling the rotation angle of the rotary cover about the rotary shaft.
In another alternative embodiment, the shielding member 40 includes a sliding rail provided on a side surface of the carrier plate 20 near the evaporation source 10 and a sliding cover provided on the sliding rail,
the slide rail extends in the first direction,
the sliding cover is provided with a cavity, and the sliding cover moves on the sliding rail in response to the control instruction, so that the cavity of the sliding cover accommodates all the quartz crystal microbalance sensors.
In this embodiment, the shielding member 40 is of a sliding design, that is, the sliding cover is controlled to move on a sliding rail provided on the carrying plate 20, so as to shield the detection unit 30 or cancel shielding of the detection unit 30.
The structural design of the shielding member 40 is selected by those skilled in the art according to practical applications, and the shielding member 40 is used as a design criterion for shielding the detection unit 30 in response to a control instruction or for canceling shielding of the detection unit 30, which will not be described herein.
In this embodiment, the shielding member 40 and the detecting unit 30 are detachably designed, so that they can be separated from the carrier plate 20, thereby cleaning the evaporation material formed on the carrier plate 20 and the rotary cover, and facilitating replacement of the quartz crystal microbalance sensor.
Another embodiment of the present utility model provides an evaporation system, as shown in fig. 4, including:
the vapor deposition device 1 according to the above embodiment of the present utility model, a displacement device (not shown) connected to the vapor deposition source 10, and a controller 3,
the controller 3 is configured to output a displacement command for controlling the displacement device, so that the displacement device drives the evaporation device 1 to move in the first evaporation chamber 1A and the second evaporation chamber 1B;
the controller 3 is further configured to output a control command to the shielding member 40, and acquire nozzle operation information generated by the detection unit 30 when the shielding member 40 does not shield the detection unit 30.
As shown in fig. 3, in the vapor deposition process of the substrate 2 to be vapor deposited, the initial position of the vapor deposition device 1 is located in the second vapor deposition chamber 1B, the controller 3 outputs a displacement command, and the displacement device can move in the horizontal direction shown in fig. 3 to drive the vapor deposition device 1 to move between the first vapor deposition chamber 1A and the second vapor deposition chamber 1B. When the controller 3 controls the displacement device to move to the second vapor deposition chamber 1B, a control instruction is further output, so that the shielding member 40 shields or cancels shielding of the detection unit 30, the detection unit 30 generates nozzle operation information corresponding to the material vapor deposition area according to vapor deposition material formed on the surface of the detection unit, and the controller 3 acquires the nozzle operation information generated by the detection unit 30 and judges the operation states of the nozzles at different positions based on the nozzle operation information.
Therefore, this embodiment accomplishes the evaporation rate control, feedback and regulation and control to different positions nozzles through at second evaporation chamber 1B, can discover in real time and fast and whether have unusually, judge stifled hole risk and position fast, this system can avoid because evaporation homogeneity is poor influences product quality, can avoid again because the problem that the untimely material that leads to empty burning of discovery nozzles stifled hole or unusually and base plate extravagant appears, ensure in the production process product quality, can reduce cost and improve evaporation material utilization and increase the productivity, ensure to improve productivity and evaporation material utilization when product quality in the production process.
Further, in an alternative embodiment, as shown in fig. 4, the evaporation system further includes:
a heating device 4 for heating the evaporation crucible 11,
the controller 3 is further configured to determine the operating states of the nozzles 12 in different material evaporation areas according to the nozzle operating information, generate a heating command to the heating device 4,
the heating device 4 adjusts the heating temperature of the vapor deposition crucible 11 according to the heating command.
Based on the foregoing description, after the controller 3 obtains the nozzle operation information, it is able to determine the operation states of the nozzles 12 in different material evaporation areas, for example, the operation state in one of the different material evaporation areas is determined to be abnormal, for example, the evaporation rate of the nozzle 12 in the abnormal position is lower than the evaporation rate of the nozzle 12 in the other normal position, in which case, the controller 3 generates a heating instruction to the heating device 4 according to the determined operation state, so that the heating device 4 heats the abnormal position, and the evaporation rate in the abnormal position is adjusted to be consistent with the evaporation rate in the normal position by increasing the temperature in the abnormal position to accelerate the evaporation rate of the nozzle 12.
In an alternative embodiment, as shown in fig. 4, the heating device 4 includes a first heating wire 41, where the first heating wire corresponds to all the nozzles 12, that is, the evaporation rate of all the nozzles 12 can be controlled after the first heating wire is heated up in response to a heating command.
Further, the heating device 4 further comprises a plurality of second heating wires 42, each corresponding to one or more nozzles 12, all of the second heating wires corresponding to all of the nozzles 12, and the first heating wires being farther from the nozzles 12 than the second heating wires.
As shown in fig. 4, the number of the second heating wires is three, and the second heating wires 42a, the second heating wires 42b, the second heating wires 42c, and the second heating wires 42d are sequentially included, where the second heating wires at different positions correspond to one or more nozzles 12, for example, the second heating wires 42a correspond to 3 nozzles 12, the second heating wires 42c correspond to 2 nozzles 12, but all of the second heating wires 42a to 42c can heat all of the nozzles 12, so as to realize heating at different positions.
Therefore, the evaporation system of this embodiment can regulate and control the heating device of different positions in real time and adjust the material ejection rate and the homogeneity of crucible different positions to prejudge possible quality risk in advance, realize carrying out real-time monitoring and adjustment to the homogeneity of the evaporation coating film thickness of base plate, improve productivity and evaporation coating material utilization ratio when guaranteeing the product quality in the production process.
It should be noted that, the principle and workflow of the control method provided in this embodiment are similar to those of the display module set described above, and the related parts can be referred to the above description, which is not repeated here.
It is further noted that in the description of the present utility model, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the foregoing examples of the present utility model are provided merely for clearly illustrating the present utility model and are not intended to limit the embodiments of the present utility model, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present utility model as defined by the appended claims.
Claims (9)
1. An evaporation device comprises an evaporation chamber, and is characterized in that the evaporation chamber comprises a first evaporation chamber for placing a substrate to be evaporated and a second evaporation chamber positioned outside the first evaporation chamber,
the vapor deposition device includes:
an evaporation source disposed in the second evaporation chamber, comprising: a vapor deposition crucible and a plurality of nozzles positioned on the vapor deposition crucible;
the bearing plate is arranged on one side of the nozzle far away from the evaporation crucible, the bearing plate and the nozzle have a preset distance, and the evaporation material emitted by each nozzle forms a material evaporation area on the bearing plate;
the detection unit is arranged on one side surface of the bearing plate, which is close to the evaporation source, and is used for sensing the material evaporation state of the material evaporation area so as to generate nozzle working information corresponding to the material evaporation area, and
and the shielding piece is arranged on the same side of the bearing plate as the detection unit and is used for shielding or not shielding the detection unit in response to an input control instruction.
2. The vapor deposition apparatus according to claim 1, wherein the vapor deposition source further comprises a housing having an inner cavity, the vapor deposition crucible and the nozzle are disposed in the inner cavity, and an opening corresponding to the nozzle is provided in a top wall of the housing on a side close to the nozzle.
3. The vapor deposition device according to claim 2, wherein,
the opening is an adjustable opening, and the opening area of the opening is changed in response to an adjustment instruction input to the adjustable opening, so that the area of the material evaporation zone is changed.
4. The vapor deposition device according to claim 3, wherein the carrier plate comprises a first plate body and a second plate body, the first plate body and the second plate body have a preset included angle to form a vapor deposition shielding area covering the material vapor deposition area,
the evaporation shielding area covers the material evaporation area corresponding to the opening area of the adjustable opening when the opening area is maximum.
5. The vapor deposition apparatus according to claim 1, wherein,
the detection unit comprises a plurality of quartz crystal microbalance sensors which are arranged along a first direction, each quartz crystal microbalance sensor corresponds to at least one material evaporation area,
the first direction is parallel to an arrangement direction of the nozzles.
6. The vapor deposition device according to claim 5, wherein,
the shielding piece comprises a rotating shaft and a rotating cover connected with the rotating shaft,
the rotational axis extends in the first direction,
the rotating cover has a cavity that rotates about the rotational axis in response to the control command such that the cavity of the rotating cover houses all of the quartz crystal microbalance sensor.
7. The vapor deposition device according to claim 5, wherein the shielding member comprises a slide rail provided on a side surface of the carrier plate near the vapor deposition source and a slide cover provided on the slide rail,
the slide rail extends in the first direction,
the sliding cover is provided with a cavity, and the sliding cover moves on the sliding rail in response to the control instruction, so that the cavity of the sliding cover accommodates all the quartz crystal microbalance sensors.
8. An evaporation system, the evaporation system comprising:
the vapor deposition device according to any one of claims 1 to 7, a displacement device connected to the vapor deposition source, and a controller,
the controller is used for outputting a displacement instruction for controlling the displacement device so that the displacement device drives the evaporation device to move in the first evaporation chamber and the second evaporation chamber;
the controller is also used for outputting a control instruction to the shielding piece, and acquiring the nozzle working information generated by the detection unit when the shielding piece does not shield the detection unit.
9. The vapor deposition system of claim 8, further comprising:
a heating device for heating the evaporation crucible,
the controller is also used for judging the working states of the nozzles of different material evaporation areas according to the working information of the nozzles, generating a heating instruction to the heating device,
the heating device adjusts the heating temperature of the evaporation crucible according to the heating instruction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320181945.2U CN219670630U (en) | 2023-01-19 | 2023-01-19 | Evaporation device and evaporation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320181945.2U CN219670630U (en) | 2023-01-19 | 2023-01-19 | Evaporation device and evaporation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219670630U true CN219670630U (en) | 2023-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202320181945.2U Active CN219670630U (en) | 2023-01-19 | 2023-01-19 | Evaporation device and evaporation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219670630U (en) |
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2023
- 2023-01-19 CN CN202320181945.2U patent/CN219670630U/en active Active
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