CN219626621U

CN219626621U - Wafer cleaning auxiliary device

Info

Publication number: CN219626621U
Application number: CN202320075294.9U
Authority: CN
Inventors: 闫青芝; 连坤; 王金翠; 胡卉; 胡文
Original assignee: Jinan Jingzheng Electronics Co Ltd
Current assignee: Jinan Jingzheng Electronics Co Ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-09-01
Anticipated expiration: 2033-01-09

Abstract

The utility model provides a wafer cleaning auxiliary device, which comprises: the bearing assembly comprises an objective table, wherein the objective table is provided with an object placing space for placing a wafer; the positioning assembly is arranged on the object stage and comprises limiting pieces dispersed around the object placing space, the limiting pieces are abutted with the wafer, the wafer and the object stage are kept relatively static.

Description

Wafer cleaning auxiliary device

Technical Field

The utility model relates to the technical field of semiconductor element preparation, in particular to a wafer cleaning auxiliary device.

Background

The wafer is a common base material in the semiconductor field, and in the manufacturing process of integrated circuits, the wafer is cleaned by adopting a chemical or physical method to remove pollutants and oxides on the surface of the wafer, so that the surface of the wafer meets the process of the cleanliness requirement.

The wafer cleaning method in the prior art comprises the following steps: the wafer is transferred to the wiping table by using tweezers, and one end of the wafer is abutted against the tweezers for wiping during wiping. Because an external force is applied to the wafer during wiping, the tweezers slide relatively with the wafer, and the tweezers scratch the surface of the wafer.

Disclosure of Invention

The utility model provides an auxiliary device for cleaning a wafer, which is used for solving the technical problem that the surface of the wafer is damaged when a wafer is fixed by tweezers.

The utility model provides a wafer cleaning auxiliary device, which comprises:

the bearing assembly comprises an objective table, wherein the objective table is provided with an object placing space for placing a wafer;

the positioning component is arranged on the object stage and comprises positioning pieces dispersed around the object placing space, and the positioning pieces are abutted with the wafer to keep the wafer and the object stage relatively static.

In one possible implementation, the placement space is adapted to the wafer shape, and the positioning elements are distributed around the edge of the placement space.

In one possible implementation, the positioning member includes at least three translation limiting members spaced around the object accommodating space, and the at least three translation limiting members are used for abutting against the circular arc portion of the wafer.

In one possible implementation, the center of the storage space is located within a range formed by connecting lines of the plurality of translation limiting members.

In one possible implementation, the positioning member includes at least one rotation limiter for abutting against the trimmed portion of the wafer.

In one possible implementation manner, the number of the translation limiting pieces is four, the number of the rotation limiting pieces is two, the translation limiting pieces and the rotation limiting pieces are distributed along the edge of the storage space, and the two rotation limiting pieces are located between the translation limiting pieces; the distance between the rotation limiting piece and the center of the storage space is smaller than the distance between the translation limiting piece and the center of the storage space.

In one possible implementation, a through-opening is provided through the stage; the through hole is positioned in the range of the storage space, the range of the through hole is smaller than the storage space, and a hollowed-out net is arranged in the through hole.

In a possible implementation manner, the bearing assembly further comprises a handle, the handle is connected with the object stage and perpendicular to the object stage, and the connection position of the handle and the object stage is located outside the object placing space.

In one possible implementation, the stage is further provided with a relief opening, and the relief opening is located at an edge of the stage on a side opposite to the handle.

In one possible implementation, the apparatus further comprises a cleaning tank adapted for integral entry of the stage.

According to the auxiliary device for cleaning the wafer, provided by the utility model, the object placing space provided by the object stage provides a fixed position for positioning the wafer, and the limiting pieces around the object placing space can fix the wafer in the object placing space, so that the wafer and the object stage are kept static, the wafer and the object stage are integrated in the cleaning process, the position of the wafer is prevented from being fixed by using tweezers, the condition that the tweezers scratch the surface of the wafer in the cleaning process can be effectively reduced, and the wafer is effectively protected.

Drawings

FIG. 1 is a schematic view of the overall structure of a wafer cleaning auxiliary device;

FIG. 2 is a schematic view of a structure of a carrier assembly and a positioning assembly;

FIG. 3 is a schematic diagram of a wafer structure;

FIG. 4 is a schematic view of another construction of the carrier assembly and positioning assembly;

fig. 5 is a schematic view of another overall structure of the wafer cleaning auxiliary device.

Reference numerals illustrate:

100. a carrier assembly; 200. a positioning assembly; 300. a cleaning tank; 400. a wafer;

101. an objective table; 102. a storage space; 103. a handle;

101a, a yielding port; 101b, a through hole; 101c, a hollowed-out net;

201. a positioning piece; 201a, translational limiter; 201b, a rotation limiting piece;

401. a circular arc portion; 402. and (5) trimming.

Detailed Description

In order that those skilled in the art will better understand the technical solutions of the present utility model, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

In the existing wafer cleaning process, the wafer is firstly transferred to the wiping table by using tweezers, and one end of the wafer is abutted against the tweezers for wiping during wiping. Because an external force is applied to the wafer during wiping, the tweezers slide relatively with the wafer, and the tweezers scratch the surface of the wafer. Therefore, the technical problem that the wafer surface is damaged due to the fixation of the wafer by tweezers in the wafer cleaning process needs to be solved.

Example 1

Fig. 1 is a schematic overall structure of a wafer cleaning auxiliary device, fig. 2 is a schematic structural diagram of a carrier assembly 100 and a positioning assembly 200, and fig. 3 is a schematic structural diagram of a wafer 400. As shown in fig. 1 to 3, the present embodiment provides a wafer cleaning auxiliary device, which includes a carrier assembly 100 and a positioning assembly 200.

The carrier assembly 100 is used for placing a wafer 400, and comprises a stage 101, wherein the stage 101 is provided with a placing space 102 for placing the wafer 400.

The positioning assembly 200 is used for fixing the position of the wafer 400, the positioning assembly 200 is disposed on the stage 101, and includes positioning members 201 dispersed around the object placing space 102, where the positioning members 201 abut against the wafer 400, and keep the wafer 400 and the stage 101 relatively stationary.

According to the auxiliary device for cleaning the wafer, provided by the utility model, the object placing space 102 provided by the object stage 101 provides a fixed position for positioning the wafer, and the limiting pieces around the object placing space 102 can fix the wafer 400 in the object placing space 102, so that the wafer 400 and the object stage 101 are kept stationary, and are integrated in the cleaning process, the position of the wafer 400 is prevented from being fixed by using tweezers, thereby effectively reducing the occurrence of scratching the surface of the wafer by the tweezers in the cleaning process, and effectively protecting the wafer 400.

The wafer 400 is shaped as shown in fig. 3, and the wafer 400 is a circular sheet as a whole, and includes a circular arc portion 401 and a trimming edge 402, where the trimming edge 402 is used as a positioning edge to determine the direction of the crystal axis of the wafer 400.

As shown in fig. 1 and 2, the object placing space 102 on the object stage 101 is adapted to the shape of the wafer 400, and the center of the object placing space 102 coincides with the center of the circular arc portion 401 of the wafer 400. The positioning members 201 are distributed around the edge of the storage space 102, so that the positioning members 201 can abut against the edge of the wafer 400 to position the wafer 400 in the storage space 102.

As shown in fig. 1 and 2, in some examples, the positioning assembly 200 may include at least three translation limiters 201a, the translation limiters 201a abutting the rounded portion 401 of the wafer 400.

The translation limiter 201a is configured to limit the overall position of the wafer 400 in the storage space 102, so as to prevent the wafer 400 from sliding relative to the stage 101.

To better define the wafer 400, the center of the placement space 102 is located within the range formed by the connection lines of the plurality of translation stoppers 201 a. Because the center of the storage space 102 coincides with the center of the circular arc portion 401 of the wafer 400, the center of the wafer 400 is also within the range formed by the connecting lines of the plurality of translation limiters 201 a. At this time, the length of the connecting line between any two translation stoppers 201a is smaller than the diameter of the circular arc portion 401 of the wafer 400, that is, smaller than the maximum contour of the wafer 400. Thus, the wafer 400 cannot be translated out from between the translation limiter 201a in any direction, so that at least three translation limiters 201a can limit the wafer 400 in the storage space 102.

As shown in fig. 1 and 2, the positioning member 201 may further include at least one rotation limiting member 201b, where the rotation limiting member 201b abuts against the trimming edge 402 of the wafer 400, so as to prevent the wafer 400 from rotating in the storage space 102.

Although the wafer 400 cannot translate in the storage space 102 under the limitation of the translation limiter 201a, the wafer 400 can rotate in the storage space 102 again because the wafer 400 has self-symmetry and the edge is mostly the circular arc portion 401. Since the wafer 400 is provided with the trimming edge 402, the rotation stopper 201b abutting against the trimming edge 402 can prevent the wafer 400 from rotating.

Preferably, as shown in fig. 2, four translation limiting members 201a are provided, two rotation limiting members 201b are provided, and the distance between the rotation limiting members 201b and the center of the storage space 102 is smaller than the distance between the translation limiting members 201a and the center of the storage space 102.

Four translation limiting members 201a and two rotation limiting members 201b are distributed on the objective table 101, the layout of the positioning member 201 can be divided into a structure with one side being compact and the other side being sparse, when the wafer 400 is placed on the objective table 101, the wafer 400 can enter the object placing space 102 from the sparse side, the trimming edge 402 of the wafer 400 is firstly abutted with the rotation limiting members 201b, the direction of the wafer 400 is determined, then the wafer 400 is in a fine adjustment position, and finally the wafer 400 is fixed in the object placing space 102.

As shown in fig. 2, the positioning members 201 are all cylinders protruding from the upper surface of the stage 101, and the top edges of the cylinders are chamfered to prevent the surface of the wafer 400 from being scratched when the wafer 400 is placed.

In order to facilitate the overall transportation of the carrier assembly 100 and the wafer 400, the carrier assembly 100 further includes a handle 103 as shown in fig. 1 and 2, where the handle 103 is connected to the stage 101 and perpendicular to the stage 101, and the connection position is located outside the storage space 102.

Illustratively, the handle 103 may be a long cylinder with a bottom outside the rotation limiter 201b, and the carrier assembly 100 and the wafer 400 may be moved integrally by the handle 103 for cleaning.

As shown in fig. 2, the stage 101 is further provided with a relief opening 101a, and the relief opening 101a is located at an edge of the stage 101 on a side opposite to the handle 103.

A relief port 101a is provided in the stage 101 to provide a space into which the tips of tweezers enter during the process of gripping the wafer 400 with the tweezers and placing it in the placement space 102. After the wafer 400 is placed in the placement space 102, the released tweezers tips can be removed from the yielding port 101a, so that the wafer 400 cannot slide relative to the surface of the wafer 400, and the surface of the wafer 400 is further protected.

As shown in fig. 1, a cleaning tank 300 is further included, and the cleaning tank 300 is adapted for the entire entry of the stage 101. Cleaning solution can be placed in the cleaning tank 300, and the upper end is provided with a large opening, so that the cleaning machine head can be conveniently aligned to the wafer 400. Ultrasonic cleaning may also be performed within the cleaning tank 300.

Example 2

FIG. 4 is a schematic view of another configuration of the carrier assembly 100 and the positioning assembly 200; fig. 5 is a schematic view of another overall structure of the wafer cleaning auxiliary device. Referring to fig. 4 and 5, the present embodiment provides another wafer cleaning auxiliary device, which is different from the wafer cleaning auxiliary device in embodiment 1 in that: as shown in fig. 4, a through hole 101b is formed through the stage 101.

Specifically, the through hole 101b is located in a circular hole in the center of the storage space 102, the range of the through hole 101b is smaller than that of the storage space 102, and a hollowed-out net 101c is disposed in the through hole 101b. The through-hole 101b is provided to effectively reduce the weight of the stage 101 and to allow the wafer 400 placed on the stage 101 to have an area of contact with the outside on both sides. The hollowed-out net 101c can maintain the flatness of the surface of the stage 101. As shown in fig. 5, when the stage 101 is placed in the cleaning tank 300 together with the wafer 400 to ultrasonically clean the wafer 400, the cleaning liquid in the cleaning tank 300 can quickly submerge the wafer 400 through the through-hole 101b, thereby improving cleaning efficiency.

When the wafer 400 is required to be removed after the cleaning is completed, due to the existence of the through hole 101b, the air pressures at the two sides of the wafer 400 are balanced, an adsorption effect can not be generated with the surface of the objective table 101, and a large moment can be prevented from being applied to one side of the wafer 400 due to overcoming the negative pressure adsorption force when the wafer 400 is removed, so that the structure of the wafer 400 is protected.

Referring to fig. 4 and 5, the difference between the yield port 101a in the present embodiment and the embodiment 1 is that the yield port 101a in the present embodiment is a cambered surface notch cut along a cutting line of the stage 101, which can further reduce the material consumption of the stage 101, reduce the weight of the stage 101, and increase the grippable range of the tweezers.

It is to be understood that, based on the several embodiments provided in the present utility model, those skilled in the art may combine, split, reorganize, etc. the embodiments of the present utility model to obtain other embodiments, which all do not exceed the protection scope of the present utility model.

The foregoing detailed description of the utility model has been presented for purposes of illustration and description, and it should be understood that the foregoing is by way of illustration and description only, and is not intended to limit the scope of the utility model.

Claims

1. The wafer cleaning auxiliary device is characterized by comprising:

a carrier assembly (100) comprising a stage (101), the stage (101) having a storage space (102) for a wafer (400);

the positioning assembly (200) is arranged on the object stage (101) and comprises positioning pieces (201) dispersed around the object placing space (102), the positioning pieces (201) are abutted with the wafer (400), and the wafer (400) and the object stage (101) are kept relatively static;

a through hole (101 b) is formed through the objective table (101); the through hole (101 b) is located in the range of the storage space (102), the range of the through hole (101 b) is smaller than that of the storage space (102), and a hollowed-out net (101 c) is arranged in the through hole.

2. The auxiliary device for cleaning a wafer according to claim 1, wherein the storage space (102) is adapted to the shape of the wafer (400), and the positioning members (201) are distributed around the edge of the storage space (102).

3. The wafer cleaning auxiliary device according to claim 1, wherein the positioning member (201) comprises at least three translational limiting members (201 a) spaced around the object accommodating space (102), and the at least three translational limiting members (201 a) are configured to abut against the circular arc portion (401) of the wafer (400).

4. A wafer cleaning auxiliary device according to claim 3, wherein the center of the storage space (102) is located within a range formed by connecting a plurality of the translation stoppers (201 a).

5. A wafer cleaning aid according to claim 3, wherein the positioning member (201) comprises at least one rotation limiter (201 b), the rotation limiter (201 b) being adapted to abut against a cut edge (402) portion of the wafer (400).

6. The wafer cleaning auxiliary device according to claim 5, wherein four translation limiters (201 a) are provided, two rotation limiters (201 b) are provided, the translation limiters (201 a) and the rotation limiters (201 b) are distributed along the edge of the storage space (102), and the two rotation limiters (201 b) are located between the translation limiters (201 a); the distance between the rotation limiting piece (201 b) and the center of the storage space (102) is smaller than the distance between the translation limiting piece (201 a) and the center of the storage space (102).

7. The wafer cleaning auxiliary device according to any one of claims 1 to 6, wherein the carrier assembly (100) further comprises a handle (103), the handle (103) is connected to the stage (101) and is perpendicular to the stage (101), and a connection position of the handle (103) to the stage (101) is located outside the storage space (102).

8. The wafer cleaning auxiliary device according to claim 7, wherein a relief opening (101 a) is further provided in the stage (101), and the relief opening (101 a) is located at an edge of the stage (101) on a side opposite to the handle (103).

9. The wafer cleaning assistance device according to any one of claims 1-6 and 8, further comprising a cleaning tank (300), said cleaning tank (300) being adapted for integral access of said stage (101).