CN218938639U

CN218938639U - Microscope objective table for wafer

Info

Publication number: CN218938639U
Application number: CN202223399469.6U
Authority: CN
Inventors: 杨云帆; 杜联柱
Original assignee: Zhejiang Huayuan Micro Electronics Technology Co ltd
Current assignee: Zhejiang Huayuan Micro Electronics Technology Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-04-28
Anticipated expiration: 2032-12-19

Abstract

The microscope objective table for the wafer comprises a table body, wherein the table body comprises an object carrying area, the object carrying area is arranged on the table body and used for placing the wafer, and an exhaust groove is arranged in the object carrying area; the first fixing part is arranged at one side of the carrying area and used for fixing the reference edge of the wafer, and the first fixing part is arranged along the width direction of the carrying area; and the second fixing parts are arranged on one side of the carrying area, which is far away from the first fixing parts, and are used for fixing the arc-shaped edges of the wafer, wherein at least two fixing parts are symmetrically distributed. The wafer is placed in a fixed direction by arranging the first fixing part and the second fixing part, and can be fixed in the carrying area to prevent the wafer from sliding.

Description

Microscope objective table for wafer

Technical Field

The utility model relates to the technical field of semiconductor processing equipment, in particular to a microscope objective table for a wafer.

Background

There are two kinds of existing stages on the market, one is a metal stage with a complex structure, and the X, Y or Z axis of the stage can be independently moved by means of a knob or the like; another is a stage with only a single plane, such as a piece of glass, that functions very singly, i.e. is able to carry objects onto itself. The two are in common that the operator can be prevented from directly contacting the wafer by hands, so that the influence of scratches and the like on the surface of the wafer is avoided. The metal object stage with a complex structure has larger volume and slightly expensive price; the simple planar stage lacks a fixture on which the wafer slides or even drops easily. The common defects of the two are: in the use of the wafer, the wafer is inconvenient to place and take, for example, the plane is too flat, if the air in the wafer and the objective table is emptied, the wafer can be adsorbed on the objective table, the wafer can not be taken directly from the objective table, the wafer can be moved to the edge of the objective table to be taken or clamped by force, the surface and the back of the wafer are easily scratched in the process, and even the wafer can fall off when sliding.

Disclosure of Invention

The utility model aims to provide a microscope stage for a wafer, which solves the problems in the prior art.

The technical scheme of the utility model is as follows: a microscope stage for a wafer includes a stage body including

The carrying area is arranged on the platform body and used for placing the wafer, and an exhaust groove is formed in the carrying area;

the first fixing part is arranged at one side of the carrying area and used for fixing the reference edge of the wafer, and the first fixing part is arranged along the width direction of the carrying area;

and the second fixing parts are arranged on one side of the carrying area, which is far away from the first fixing parts, and are used for fixing the arc-shaped edges of the wafer, wherein at least two fixing parts are symmetrically distributed.

Further, the first fixing portion includes a first inclined plane, and the reference edge moves toward the carrying area along the inclined plane.

Further, the second fixing part comprises a second inclined plane, and the arc-shaped edge moves towards the object carrying area along the inclined plane.

Further, the first fixing part comprises a third inclined plane, the second fixing part comprises a fourth inclined plane, the reference edge is the third inclined plane, and meanwhile, the arc edge moves to the carrying area along the fourth inclined plane.

Further, a first handle and a second handle are respectively arranged on two sides of the table body, the first handle is located on one side of the fixing portion, and the second handle is located on one side of the fixing portion.

Further, the first handle is higher than the second handle.

Further, the width of the carrying area is smaller than the diameter of the wafer.

The utility model has the beneficial effects that:

compared with the prior art, the wafer is placed in a fixed direction by arranging the first fixing part and the second fixing part, and can be fixed in the carrying area to prevent the wafer from sliding; through arranging exhaust grooves at intervals in the carrying area, air circulation is increased, and excessive lamination of the wafer and the carrying area is avoided; through setting the width of carrying the thing district to be less than the diameter of wafer for the edge of wafer can be held easily by the operator with hand or tweezers, just can take or clamp the wafer to the edge for other objective tables then need, the practicality is strong.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a second embodiment of the present utility model;

FIG. 3 is a schematic diagram of a third embodiment of the present utility model;

Detailed Description

The utility model is further illustrated by way of example with reference to the accompanying drawings.

The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.

In one embodiment, as shown in FIG. 1, a microscope stage for a wafer comprises a stage body 1, and further comprises

The carrying area 2 is arranged on the platform body 1 and is used for placing the wafers 3, wherein the carrying area 2 is provided with exhaust grooves 201 at intervals, and preferably, the number of the exhaust grooves 201 in the embodiment is six;

the first fixing portion 4 is disposed on one side of the carrying area 2 and is used for fixing the reference edge 301 of the wafer 3, wherein the first fixing portion 4 is disposed along the width direction of the carrying area 2, and preferably, the extension length of the first fixing portion 4 in the embodiment is consistent with the width of the carrying area 2;

the second fixing parts 5 are arranged on one side, far away from the first fixing parts 4, of the carrying area 2 and are used for fixing the arc-shaped edges 302 of the wafer 3, wherein at least two second fixing parts 5 are symmetrically distributed, and preferably, symmetrical shafts of the two second fixing parts 5 penetrate through the center of the first fixing parts 4, and the arc-shaped edges 302 are tangent to one side of the second fixing parts 5; according to the utility model, the wafer 3 is placed in a fixed direction by arranging the first fixing part 4 and the second fixing part 5, and the wafer 3 can be fixed in the carrying area 2 to prevent the wafer 3 from sliding; by arranging the air exhaust grooves 201 at intervals in the carrying area 2, air circulation is increased, and excessive lamination of the wafer 3 and the carrying area 2 is avoided.

In an alternative embodiment of the present utility model, the first fixing portion 4 includes a first inclined surface 401, the reference edge 301 moves along the first inclined surface 401 toward the carrying area 2, and preferably, the first fixing portion 4 in this embodiment has a triangular cross section, so as to prevent the fragile wafer 3 from being hit or caught by the edge of the first fixing portion 4 during the taking process, thereby causing fragments, and preferably, the second fixing portion 5 in this embodiment has a rectangular cross section.

In an alternative embodiment of the present utility model, the two sides of the table body 1 are respectively provided with the first handle 6 and the second handle 7, the first handle 6 is located at one side of the first fixing portion 4, the second handle 7 is located at one side of the second fixing portion 5, the first handle 6 is higher than the second handle 7, some procedures need to mark the wafer 3 with a pen when checking the wafer 3, and the first handle 6 is designed to be larger so as to facilitate the adjustment of the position and direction of the table body 1 by one hand; the second handle 7 does not interfere with the marking operation of the wafer 3 when the pen is held by the right hand, and the first handle 6 and the second handle 7 can be simultaneously pinched by the two hands to operate when the table body 1 needs to be moved by the two hands.

In an alternative embodiment of the present utility model, the width of the carrying area 2 is smaller than the diameter of the wafer 3, so that the operator can easily pinch the edge of the wafer 3 by hand or tweezers, and the wafer needs to be moved to the edge to be taken or clamped relative to other object stages, so that the practicality is high; preferably, in this embodiment, taking a wafer diameter of 100mm as an example, the width of the carrying area 2 is set to 95mm.

In a second embodiment, as shown in FIG. 2, a microscope stage for a wafer comprises a stage body 1, and further comprises

In an alternative embodiment of the present utility model, the second fixing portion 5 includes a second inclined surface 501, and the arcuate edge 302 moves along the second inclined surface 501 toward the carrying area 2, preferably, the second fixing portion 5 in this embodiment has a triangular cross section, so as to prevent the fragile wafer 3 from being hit or caught by the edge of the second fixing portion 5 during the taking process, and thus causing fragments, preferably, the first fixing portion 4 in this embodiment has a rectangular cross section.

In a third embodiment, as shown in FIG. 3, a microscope stage for a wafer comprises a stage body 1, and further comprises

In an alternative embodiment of the present utility model, the first fixing portion 4 includes a third inclined surface 402, the second fixing portion 5 includes a fourth inclined surface 502, the reference edge 301 moves along the third inclined surface 402, and the arc edge 302 moves toward the carrying area 2 along the fourth inclined surface 502, and preferably, the sections of the first fixing portion 4 and the second fixing portion 5 in this embodiment are triangular, so that the fragile wafer 3 is prevented from being hit or jammed by the edges of the first fixing portion 4 and the second fixing portion 5 during the picking process, and thus fragments are caused.

Claims

1. A microscope stage for wafers, comprising a stage body (1), characterized in that: the wafer loading device further comprises a carrying area (2), wherein the carrying area (2) is arranged on the table body (1) and is used for placing the wafer (3), and exhaust grooves (201) are formed in the carrying area (2) at intervals;

the first fixing part (4) is arranged on one side of the carrying area (2) and used for fixing the reference edge (301) of the wafer (3), wherein the first fixing part (4) is arranged along the width direction of the carrying area (2);

and the second fixing part (5) is arranged on one side of the carrying area (2) away from the first fixing part (4) and is used for fixing the arc-shaped edge (302) of the wafer (3), wherein at least two second fixing parts (5) are symmetrically distributed.

2. A microscope stage for a wafer according to claim 1, wherein: the first fixing part (4) comprises a first inclined surface (401), and the reference edge (301) moves towards the carrying area (2) along the first inclined surface (401).

3. A microscope stage for a wafer according to claim 1, wherein: the second fixing part (5) comprises a second inclined plane (501), and the arc-shaped edge (302) moves towards the carrying area (2) along the second inclined plane (501).

4. A microscope stage for a wafer according to claim 1, wherein: the first fixing part (4) comprises a third inclined surface (402), the second fixing part (5) comprises a fourth inclined surface (502), the reference edge (301) is along the third inclined surface (402), and meanwhile, the arc-shaped edge (302) moves towards the carrying area (2) along the fourth inclined surface (502).

5. A microscope stage for a wafer according to claim 1, wherein: the two sides of the table body (1) are respectively provided with a first handle (6) and a second handle (7), the first handle (6) is positioned on one side of the first fixing part (4), and the second handle (7) is positioned on one side of the second fixing part (5).

6. A microscope stage for a wafer according to claim 5, wherein: the first handle (6) is higher than the second handle (7).

7. A microscope stage for a wafer according to claim 1, wherein: the width of the carrying area (2) is smaller than the diameter of the wafer (3).