CN219122104U

CN219122104U - Wafer test carrier

Info

Publication number: CN219122104U
Application number: CN202222667574.7U
Authority: CN
Inventors: 刘睿
Original assignee: Innoscience Zhuhai Technology Co Ltd
Current assignee: Innoscience Zhuhai Technology Co Ltd
Priority date: 2022-10-10
Filing date: 2022-10-10
Publication date: 2023-06-02
Anticipated expiration: 2032-10-10

Abstract

The utility model discloses a wafer test carrier, which comprises a clamping assembly and a supporting assembly; the clamping assembly comprises at least two clamping arms, first ends of the clamping arms are connected to the center block, at least one clamping arm is hinged with the center block and can rotate relative to the center block, each clamping arm is provided with a stop block, and the distance between the stop block and the center block is adjustable; the supporting component is arranged below the clamping component and hinged to the center block. The wafer test carrier can avoid the surface contact of the wafer, thereby avoiding polluting the surface of the wafer, improving the accuracy of wafer detection and avoiding damaging the wafer.

Description

Wafer test carrier

Technical Field

The present utility model relates to the field of semiconductor device manufacturing, and more particularly, to a wafer test carrier for use in testing a wafer.

Background

With the development of electronic technology, semiconductor devices are increasingly used. In the manufacturing process of semiconductor devices, operations involving analysis of the surface of a wafer and the like are often required, for example, ICP-MS test is required to analyze metal impurities on the surface of the wafer, and the surface morphology of the wafer is observed by a metallographic microscope.

Typically, the wafer is placed in a cassette, and when testing is desired, the wafer is removed from the cassette and placed on a testing device, such as a table of the testing device. After the wafer is tested, the wafer needs to be taken down from the testing device and then put back into the wafer box. However, since there is no special wafer pick-and-place device, a vacuum suction pen or tweezers are generally required to perform the wafer pick-and-place operation. As shown in fig. 1, when testing a wafer 11, the wafer is taken out by using a vacuum chuck 13. The vacuum suction pen 13 includes a suction head 14 and a pen holder 15, and when the wafer 11 is taken and placed, the suction head 14 needs to be attached to the surface of the wafer, and the wafer 11 is sucked and placed on the workbench 12, for example, on a microscope stage, through the vacuum suction pen 13.

However, since the vacuum pen 13 needs to be in direct contact with the surface of the wafer 11, the surface of the wafer 11 is easily polluted, and when the wafer 11 is analyzed later, the analysis result is disturbed, and the analysis result is inaccurate. Therefore, in the case of analyzing the surface of the wafer 11, the wafer 11 is not preferably taken and placed by using the vacuum pen 13. On the other hand, after the wafer 11 is taken out by using the vacuum suction pen 13, the wafer 11 needs to be placed on the workbench 12 of the testing device, and the workbench 12 is also in contact with the surface of the wafer 11, so that the process of placing the wafer 11 on the workbench 12 can also pollute the surface of the wafer 11, and if the back surface of the wafer is detected, the accuracy of detection is easily affected because pollutants are introduced after the back surface of the wafer 11 is in contact with the workbench 12.

Further, since the wafer 11 is required to be placed on the table 12 by the vacuum suction pen 13, an operation of placing the wafer 11 is required to be performed, and once the operation is careless, the wafer 11 is easily dropped, and the wafer 11 is damaged or even broken. It can be seen that the conventional testing process of the wafer 11 has problems of easily introducing contaminants and easily causing damage to the wafer 11.

Disclosure of Invention

The utility model aims to provide a wafer test carrier which can avoid polluting the surface of a wafer and is not easy to damage the wafer.

In order to achieve the above-mentioned object, the wafer test carrier provided by the present utility model includes a clamping assembly and a supporting assembly; the clamping assembly comprises at least two clamping arms, first ends of the clamping arms are connected to the center block, at least one clamping arm is hinged with the center block and can rotate relative to the center block, each clamping arm is provided with a stop block, and the distance between the stop block and the center block is adjustable; the supporting component is arranged below the clamping component and hinged to the center block.

According to the technical scheme, the wafer can be clamped by using the clamping arms, for example, after the clamping arms are unfolded, the edge of the wafer is clamped by the stop block instead of the surface of the wafer by adjusting the stop block at a proper position, so that the pollution to the surface of the wafer caused by the contact of the vacuum pen and the surface of the wafer is avoided, and the accuracy of analyzing the surface of the wafer is improved.

On the other hand, since the wafer test carrier is provided with the supporting component, the wafer carrier can be directly placed on the workbench, for example, the supporting component is placed on the workbench, the wafer is directly supported by the wafer test carrier and the test operation is completed, and the wafer is not required to be placed on the workbench from the wafer carrier, so that the operation of placing the wafer on the workbench is not needed, and the risk of wafer damage caused by dropping of the wafer is reduced.

Moreover, as the distance between the stop block and the center block is adjustable, the position of the stop block can be adjusted according to the different sizes of wafers to be tested, so that the wafer test carrier can adapt to wafers with different sizes, and has good compatibility.

In a preferred embodiment, one of the plurality of clamping arms is a fixed clamping arm and the center block is fixed to a first end of the fixed clamping arm.

Therefore, the fixed clamping arm cannot rotate relative to the fixed block, the clamping assembly is simple in structure, the center block and the fixed clamping arm are integrally formed, and the assembly difficulty and the assembly cost of the clamping assembly are reduced.

In a preferred embodiment, at least one of the plurality of clamping arms is a movable clamping arm, a first end of the movable clamping arm being hinged to the central block.

Therefore, the movable clamping arm can rotate relative to the center block, so that the movable clamping arm can rotate between the unfolding state and the storage state, and the wafer test carrier can be conveniently stored.

The further scheme is that at least one clamping arm is a telescopic clamping arm, the telescopic clamping arm is provided with a fixing part and a sliding part which can slide in a telescopic manner relative to the fixing part, and the stop block is positioned at one end of the sliding part far away from the center block.

Therefore, the sliding part can drive the stop block to move, so that the position of the stop block is adjusted.

The fixed part is provided with a first chute, the sliding part slides in the first chute, the first chute is provided with at least one first positioning hole, and a first positioning piece of the sliding part is connected with the first positioning hole.

Therefore, after the length of the sliding part is adjusted, the sliding part is fixed at a specific position of the fixing part through the matching of the first locating piece and the first locating hole, so that the falling of the wafer caused by the stretching of the sliding part in the wafer clamping and wafer testing processes is avoided.

In a further scheme, the first positioning holes are threaded holes, and the first positioning pieces are screws. Because the cooperation of screw and screw hole is very stable, firm, can effectively avoid the unexpected flexible condition of sliding part to take place.

In a further aspect, the fixing portion is provided with at least one scale mark, and each scale mark corresponds to one first positioning hole.

It can be seen that when the sliding distance of the sliding portion is adjusted, it is possible to determine which first positioning hole the first positioning member is fixed to, based on the readable mark.

Still further, the scheme is that one clamping arm is fixed clamping arm of length, and fixed clamping arm of length is provided with the second spout, and the regulation slider can slide in the second spout, and the backstop piece sets up on the regulation slider.

Therefore, the stop block is driven to slide through the adjusting slide block, the position of the stop block can be adjusted, and the requirements of wafer testing with different sizes are met.

In a further scheme, the second chute is provided with at least one second positioning hole, and a second positioning piece of the adjusting slide block is connected with the second positioning hole.

In a further proposal, one side of the stop block, which is close to the center block, is provided with an inclined plane. Preferably, the edge of the wafer may abut against the bevel. Like this, through the supporting role of this inclined plane, the lower surface of wafer can not contact with the centre gripping arm to avoid the centre gripping arm to lead to the fact the pollution to the surface of wafer, when testing the back of wafer, can ensure can not introduce the pollutant, improve the accuracy of detection.

Alternatively, the supporting component comprises a supporting rod, a first end of the supporting rod is hinged to the center block, and a second end of the supporting rod is provided with a supporting claw component.

Therefore, the supporting rod can rotate relative to the center block, and when the supporting rod needs to be unfolded, the supporting rod only needs to be rotated for a certain angle, so that the operation is very simple. And through rotating the bracing piece, can reduce the volume of wafer test carrier when accomodating, the space that the wafer test carrier occupy is very little.

In a further aspect, the support jaw assembly includes at least three support arms, each of the support arms being pivotally coupled to the second end of the support bar, each of the support arms being rotatable relative to the support bar in a first direction.

It can be seen that the plurality of support arms can be unfolded to form more than three support points so that the wafer test carrier is firmly supported on the table.

Alternatively, the number of the support arms is three, the three support arms are sequentially arranged along the second direction, and the two end support arms can rotate along the second direction relative to the support rod along the second direction.

It can be seen that the two end support arms can be rotated in two different ways so that the support jaw assembly is supported more quickly and securely on the table.

In a further scheme, the end wall of the first end of the supporting rod is provided with an arc surface close to the edge of the center block, and a right angle surface is provided with an edge far away from the center block.

Like this, when the bracing piece needs to rotate, the design of cambered surface can ensure that the bracing piece can smooth and easy rotation, and the right angle face of the edge of keeping away from the center piece can restrict the rotation of bracing piece to spacing the bracing piece.

Drawings

Fig. 1 is a schematic diagram of a wafer chuck and a wafer.

Fig. 2 is a configuration diagram of a housed state of the embodiment of the present utility model.

Fig. 3 is a structural diagram of an operating state of an embodiment of the present utility model.

Fig. 4 is a structural exploded view of the housed state of the embodiment of the present utility model.

Fig. 5 is an exploded view of the movable clamp arm of an embodiment of the present utility model.

Fig. 6 is an exploded view of the structure of the fixed clamp arm of the embodiment of the present utility model.

Fig. 7 is an enlarged view of a portion of the structure of the clamping arm and wafer according to an embodiment of the utility model.

Fig. 8 is an exploded view of the structure of the support assembly according to the embodiment of the present utility model.

Fig. 9 is a partial exploded view of a support assembly and a clamping assembly according to an embodiment of the present utility model.

The utility model is further described below with reference to the drawings and examples.

Detailed Description

The wafer test carrier is used for clamping the wafer, and the surface of the wafer can be detected by the test device under the condition that the wafer is placed on the wafer test carrier. The wafer test carrier only clamps the edge of the wafer, but does not contact the surface of the wafer, so that the surface of the wafer is prevented from being polluted, the wafer is not required to be taken down and placed on a workbench of a test device in the wafer test process, and the wafer damage caused by taking and placing the wafer can be avoided.

Referring to fig. 2 and 3, the configuration diagrams of the storage state and the operating state of the present embodiment are shown respectively. The present embodiment includes a clamping assembly 20 and a support assembly 50, wherein the clamping assembly 20 is used to clamp a wafer, and the support assembly 50 is disposed below the clamping assembly 20 to support the clamping assembly 20, and preferably, the support assembly 50 can be placed on a table, such as a microscope stage.

Referring to fig. 4, the clamping assembly 20 includes a center block 21 and three clamping arms, each of which includes a fixed clamping arm 40 and two movable clamping arms 30, and referring to fig. 5 and 6, the center block 21 is fixedly connected to the fixed clamping arm 40, preferably, the center block 21 is integrally formed with the fixed clamping arm 40, and the center block 21 is disposed at one end of the fixed clamping arm 40. The center block 21 has a circular shape, on which three hinge shafts 22 are provided, each hinge shaft 22 being a cylinder extending upward from the upper surface of the center block 21.

Referring to fig. 5, the movable clamp arm 30 is a telescopic clamp arm including a fixed portion 31 and a sliding portion 35, wherein one end of the fixed portion 31 is provided with a through hole 32, and a hinge shaft 22 is passed through the through hole 32 such that the fixed portion 31 can be rotated with respect to the hinge shaft 22 such that the movable clamp arm 30 is rotated with respect to the center block 21. In this way, the movable clamp arm 30 is hinged to the central block 21. When the wafer test carrier is in operation, the two movable clamping arms 30 can be rotated to the unfolded position, as shown in fig. 3, so that the three clamping arms are arranged in a Y shape and respectively abut against the edge of the wafer. Preferably, a damping block may be provided in the circumferential direction of the hinge shaft 22 to prevent the movable clamp arm 30 from freely rotating with respect to the hinge shaft 22, and the movable clamp arm 30 does not rotate with respect to the hinge shaft 22 in the absence of a force applied by a tester. Thus, when the wafer is clamped by the wafer test carrier, the movable clamping arm 30 cannot accidentally rotate under the condition of clamping the wafer, so that the wafer is not dropped outside the movable clamping arm, and the wafer is prevented from being damaged.

The sliding portion 35 of the movable clamp arm 30 can slide in a telescopic manner with respect to the fixed portion 31, the fixed portion 31 is provided with a first slide groove 33, and the sliding portion 35 can slide in the first slide groove 33, thereby realizing the extension and shortening of the movable clamp arm 30. A stop block 37 is provided at an end of the slide 35 remote from the center block 21, the stop block 37 being in contact with the edge of the wafer, each wafer being held by the stop blocks 37 of the three holding arms. Since the slide portion 35 can slide in a telescopic manner, the distance between the stopper 37 and the center block 21 is adjustable.

In the present embodiment, in order to avoid contact between the lower surface of the wafer and the upper surface of the slide portion 35 or the fixed portion 31, the surface of the stopper 37 near the center block 21 is provided as a slope. Referring to fig. 7, the stopper 37 is provided with a slope 38 at an end surface near the sliding portion 35, and the slope 38 is provided obliquely from bottom to top as viewed from a direction near the center block 21 to a direction far from the center block 21, so that after the wafer 80 is clamped by using three clamping arms, the lower surface of the wafer 80 can be supported by the slope 38 without being in direct contact with the sliding portion 35, so that a gap is formed between the wafer 80 and the sliding portion 35, and contamination of the lower surface of the wafer 80 due to contact of the clamping arms with the lower surface of the wafer 80 can be avoided.

The movable clamping arm 30 is configured to be telescopic in this embodiment, mainly to accommodate wafers 80 of different sizes. For better clamping wafers 80 of different sizes, a plurality of first positioning holes (not visible in the drawings) are provided in the fixing portion 31, and preferably, the plurality of first positioning holes are provided in the first chute 33. Further, the sliding portion 35 is provided with a first positioning member 39, and preferably, the first positioning member 39 is a screw, and the first positioning hole is a screw hole, so that the position of the sliding portion 35 with respect to the fixed portion 31 is kept fixed by the engagement of the screw with the screw hole. In the present embodiment, the first positioning piece 39 is provided at an end of the sliding portion 35 near the center block 21, and a through hole 36 is provided at an end of the sliding portion 35, and the first positioning piece 39 may pass through the through hole 36 and be engaged with the first positioning hole.

Of course, other implementations of the first positioning member and the first positioning hole are also possible, for example, the first positioning hole is a blind hole, and the first positioning member is a pin shaft.

The plurality of first positioning holes correspond to the wafers with the sizes respectively, and in order to facilitate the testers to know the sizes of the wafers corresponding to the first positioning holes, a plurality of scale marks 34 are arranged on the fixing portion 31, and each scale mark 34 corresponds to one first positioning hole. The scale mark 34 may be a scribe line or written with text corresponding to the wafer size at the location corresponding to the first positioning hole. For example, the number of scale marks 34 is three, corresponding to four inch, six inch, eight inch wafers, respectively.

Referring to fig. 6, a cover plate 25 is provided above the center block 21, the cover plate 25 is circular, and the area of the cover plate 25 is equal to the area of the center block 21. Three circular through holes 26 are provided in the cover plate 25, and each hinge shaft 22 can pass through one through hole 26. Also, the through hole 32 of each movable clamp arm 30 passes through the hinge shaft 22, and thus the cover plate 25 covers over the movable clamp arms 30. By covering the cover plate 25 on the center block 21, it is possible to prevent foreign matters such as dust from falling between the cover plate 25 and the center shaft 21, and to prevent the foreign matters from affecting the rotation of the movable clamp arm 30.

Referring to fig. 6, the fixed clamping arm 40 is a length-fixed clamping arm, a second sliding groove 41 is provided on the fixed clamping arm 40, and an adjusting slider 45 is further provided on the fixed clamping arm 40, where the adjusting slider 45 can slide in the second sliding groove 41. The adjusting slider 45 includes a sliding seat 46, a stopper 48 is provided on the sliding seat 46, a slope 49 is also provided on a side of the stopper 48 close to the center block 21, and the slope 48 is inclined upward from bottom to top as viewed from a direction close to the center block 21 to a direction away from the center block 21, so that a lower surface of the wafer 80 does not contact with an upper surface of the fixed clamping arm 40.

In addition, a second positioning member 47 is further disposed on the sliding seat 46, and a plurality of second positioning holes (not visible in the drawing) are disposed in the second sliding groove 41, each of the second positioning holes corresponding to one wafer size. In order to facilitate the tester to know the wafer size corresponding to each second positioning hole, a plurality of scale marks 42 are disposed on the fixed clamping arm 40, and each scale mark 42 corresponds to one second positioning hole. The scale mark 42 may be a scribe line or written with text corresponding to the wafer size at the location corresponding to the second positioning hole.

The fixed clamping arms 40 are fixedly connected with the center block 21, and cannot rotate relative to the center block 21, and in the storage state, as shown in fig. 2, the two movable clamping arms 30 and the fixed clamping arms 40 are respectively located on two sides of the center block 21, so that the wafer test carrier is small in storage volume and convenient to store and carry.

Referring to fig. 8 and 9, the support assembly 50 is disposed below the clamping assembly 20, and preferably, the support assembly 50 is rotatable relative to the center block 21. The support assembly 50 includes a support rod 51, as can be seen in fig. 8, the support rod 51 has a flat elongated shape, and referring to fig. 9, a first end of the support rod 51 is an end near the center block 21, and a rotation shaft 55 is disposed at the first end, and the rotation shaft 55 may pass through a through hole 54 of the support rod 51. A boss is provided at the lower surface of the center block 21, and a through hole 28 is provided at the middle of the boss, and a rotation shaft 55 passes through the through hole 28 so that the support rod 51 can rotate with respect to the center block 21.

In the storage state, the support assembly 50 is attached to the fixed clamping arm 40, when the support assembly 50 is unfolded, the support rod 51 needs to be rotated downwards by 90 degrees, and in order to facilitate the rotation of the support rod 51, the edge of the first end of the support rod 51, which is close to the center block 21, is provided with the cambered surface 52, and the edge, which is far from the center block 21, is provided with the right-angle surface 53. Thus, the arc surface 52 can ensure smooth rotation of the support rod 52, the right-angle surface 53 has a limiting effect on rotation of the support rod 51, and when the support rod 51 rotates 90 degrees, the right-angle surface 53 is abutted against the lower surface of the center block 21 to limit the support rod 51 to continue rotating, so that the support rod 51 and the center block 21 keep a vertical position, and the clamping assembly 20 is stably supported above the support assembly 50.

The second end of the support rod 51 is an end remote from the center block 21, and a support claw assembly 60 is provided at the second end, and referring to fig. 8, the support claw assembly 60 includes three support arms which are sequentially arranged in a second direction, wherein the second direction is a width direction of the support rod 51. And, each of the three support arms is rotatable with respect to the support rod 51 in a first direction, which is a thickness direction of the support rod 51.

In the second direction, one support arm 61 is located in the middle of the three support arms, and the other two support arms 70 are located at both ends of the support arm 61, respectively, and thus the two support arms 70 are end support arms, respectively. The support arm 61 can rotate only in the first direction with respect to the support rod 51, and therefore, a rotation shaft 57 is provided at the second end of the support rod 51, and the axis of the rotation shaft 57 extends in the second direction. The upper end of the support arm 61 is provided with a through hole 62, and the rotation shaft 57 may pass through the through hole 62 so that the support arm 61 rotates with respect to the support rod 51.

Each support arm 70 includes a hinge block 71 and a body portion 74, and the upper end of the hinge block 71 is provided with a through hole 72, and the rotation shaft 57 may pass through the through hole 72, so that the hinge block 71 may be rotated in a first direction with respect to the support rod 51. In addition, the hinge block 71 is provided at a lower end thereof with a through hole 73, the main body 74 is provided at an upper end thereof with a rotation shaft 75, and an axis of the rotation shaft 75 extends in a first direction such that the main body 74 can rotate in a second direction with respect to the hinge block 71, that is, the main body 74 can rotate in the second direction with respect to the support rod 51.

When the wafer test carrier needs to be placed on the workbench, the supporting claw assembly 60 is unfolded, that is, the supporting arm 61 is rotated along the first direction, the supporting arm 70 is driven to rotate along the first direction, and the main body 74 is driven to rotate along the second direction, so that the lower ends of the three supporting arms 70 are not in the same straight line, and the wafer test carrier can be reliably placed on the workbench.

When the wafer testing carrier is used for testing the wafer, the wafer testing carrier cannot contact the lower surface of the wafer, so that the pollution to the lower surface of the wafer is avoided, and the accuracy of testing the surface of the wafer is ensured. In addition, because the wafer test carrier can directly clamp the wafer and is placed on the workbench, the wafer is not required to be directly placed on the workbench, and wafer damage caused by accidental falling of the wafer in the operation process of placing the wafer on the workbench is avoided.

Of course, the above-mentioned scheme is only a preferred embodiment of the present utility model, and may be changed in practice, for example, the size of the wafer test carrier may be larger or smaller, so as to adapt to the wafer test requirements of other different sizes; alternatively, the hinge connection mode of the movable clamping arm and the center block can be realized by adopting other structures; alternatively, the structure of the support jaw assembly may be modified with reference to the structure of the camera tripod, none of which affect the practice of the present utility model, and should be included within the scope of the present utility model.

Claims

1. The wafer test carrier is characterized by comprising:

a clamping assembly and a support assembly;

the clamping assembly comprises at least two clamping arms, first ends of a plurality of clamping arms are connected to a center block, at least one clamping arm is hinged with the center block and can rotate relative to the center block, each clamping arm is provided with a stop block, and the distance between each stop block and the center block is adjustable;

the support assembly is arranged below the clamping assembly and is hinged to the center block.

2. The wafer test carrier of claim 1, wherein:

one of the plurality of clamping arms is a fixed clamping arm, and the center block is fixed at a first end of the fixed clamping arm.

3. The wafer test carrier of claim 2, wherein:

at least one of the plurality of clamping arms is a movable clamping arm, and a first end of the movable clamping arm is hinged with the center block.

4. A wafer test carrier according to any one of claims 1 to 3, wherein:

at least one clamping arm is a telescopic clamping arm, the telescopic clamping arm is provided with a fixing part and a sliding part which can slide in a telescopic manner relative to the fixing part, and the stop block is positioned at one end of the sliding part far away from the center block.

5. The wafer test carrier of claim 4, wherein:

6. The wafer test carrier of claim 5, wherein:

the first locating hole is a threaded hole, and the first locating piece is a screw.

7. The wafer test carrier of claim 5, wherein:

the fixing part is provided with at least one scale mark, and each scale mark corresponds to one first positioning hole.

8. A wafer test carrier according to any one of claims 1 to 3, wherein:

at least one clamping arm is a fixed-length clamping arm, the fixed-length clamping arm is provided with a second chute, an adjusting slide block can slide in the second chute, and a stop block is arranged on the adjusting slide block.

9. The wafer test carrier of claim 8, wherein:

the second chute is provided with at least one second positioning hole, and the second positioning piece of the adjusting slide block is connected with the second positioning hole.

10. A wafer test carrier according to any one of claims 1 to 3, wherein:

and an inclined plane is arranged on one side of the stop block, which is close to the center block.

11. A wafer test carrier according to any one of claims 1 to 3, wherein:

the support assembly comprises a support rod, a first end of the support rod is hinged to the center block, and a second end of the support rod is provided with a support claw assembly.

12. The wafer test carrier of claim 11, wherein:

the support claw assembly comprises at least three support arms, each support arm is hinged to the second end of the support rod, and each support arm can rotate in a first direction relative to the support rod.

13. The wafer test carrier of claim 12, wherein:

the number of the supporting arms is three, the three supporting arms are sequentially arranged along the second direction, and the two end supporting arms can rotate along the second direction relative to the supporting rods along the second direction.

14. The wafer test carrier of claim 11, wherein:

the end wall of the first end of the supporting rod is provided with an arc surface close to the edge of the center block, and a right angle surface is provided with an edge far away from the center block.