CN219625637U - Test tool - Google Patents

Test tool Download PDF

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Publication number
CN219625637U
CN219625637U CN202223425826.1U CN202223425826U CN219625637U CN 219625637 U CN219625637 U CN 219625637U CN 202223425826 U CN202223425826 U CN 202223425826U CN 219625637 U CN219625637 U CN 219625637U
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China
Prior art keywords
module
heat exchange
space
probe
mounting
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Active
Application number
CN202223425826.1U
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Chinese (zh)
Inventor
龚守钧
陈国政
赖治寰
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Dongguan Zhongzhan Semiconductor Technology Co ltd
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Dongguan Zhongzhan Semiconductor Technology Co ltd
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Priority to CN202223425826.1U priority Critical patent/CN219625637U/en
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Abstract

The utility model provides a testing tool, which comprises a base, a mounting module, a probe module and a pressure module, wherein the mounting module is arranged on the base, an accommodating space is formed in the mounting module, the probe module is positioned on the mounting module and extends into the accommodating space and contacts a test piece to be tested which is placed in the accommodating space, a first heat exchange space communicated with the accommodating space is formed in the mounting module, the first heat exchange space surrounds the probe module, the pressure module is used for being close to or far away from the mounting module, and when the pressure module is close to the mounting module, the pressure module abuts against the test piece to be tested so that the test piece to be tested contacts the probe module; according to the utility model, the first heat exchange space communicated with the accommodating space is arranged between the mounting module and the base, heat emitted by the test piece to be tested is conducted with the first heat exchange space through the probe module, and the heat of the first heat exchange space is conducted to the outside of the test tool through air convection.

Description

Test tool
Technical Field
The utility model relates to the technical field of chip testing, in particular to a testing tool.
Background
After the chip is manufactured, various data performances are required to be tested, such as current, voltage, frequency and the like, in order to detect the output stability of the chip, the chip is required to be tested under the conditions of rated power and full-load power, and the current chip is developed towards the high-power high-current direction.
At present, the heat dissipation modes mainly comprise air cooling, liquid cooling and the like, only one part of the chip can be directly dissipated, the chip can be coated in the test jig when the conventional test jig is used, the conventional air cooling or indirect heat dissipation effect is poor, and the heat source is not easily discharged when the chip heats, so that the test result is not in line with expectations.
Disclosure of Invention
The main object of the present utility model is to overcome the above drawbacks and disadvantages of the prior art and to provide a testing tool.
The utility model provides a testing tool, includes base, installation module, probe module and pressure module, the installation module is installed on the base, be equipped with accommodation space on the installation module, the probe module is located on the installation module and extend to in the accommodation space and contact and place in the test piece that awaits measuring in the accommodation space, be equipped with the intercommunication on the installation module accommodation space's first heat exchange space, first heat exchange space encircles the probe module, the pressure module is used for being close to or keep away from the installation module, when the pressure module is close to the installation module, the pressure module supports the test piece that awaits measuring, so that the test piece that awaits measuring contacts the probe module.
According to the utility model, the first heat exchange space communicated with the accommodating space is arranged between the mounting module and the base, heat emitted by the test piece to be tested is conducted with the first heat exchange space through the probe module, and the heat of the first heat exchange space is conducted to the outside of the test tool through air convection.
In one embodiment, the first heat exchanging space is provided on the mounting module, the first heat exchanging space includes an air inlet extending to the base and an air outlet provided on the mounting module and adjacent to the probe module. Outside cold air is blown into the first heat exchange space through the air inlet, so that heat conducted out of the test piece to be tested through the probe module and the mounting module is conducted out of the air outlet in an air convection mode.
In an implementation manner of one embodiment, the mounting module includes a base, a mounting table and a lower plate, wherein the mounting table and the lower plate are arranged on the base, a heat exchange groove is concavely formed in the surface of the base, a containing hole is formed in the lower plate, at least one probe module is arranged on the mounting table, the probe module extends to the containing space through the containing hole and abuts against the test piece to be tested, and the mounting table and the lower plate enclose the heat exchange groove into a first heat exchange space. The test piece to be tested is arranged in the accommodating space and seals the accommodating hole, the first heat exchange space is separated from the accommodating space through the lower plate, and the emitted heat of the test piece to be tested is conducted to the first heat exchange space through the probe module to dissipate heat.
In an implementation manner of one embodiment, a heat sink is disposed on the probe module disposed on the mounting table, the heat sink is accommodated in the accommodating hole, a gap between the heat sink and the mounting table forms a second heat exchange space, the second heat exchange space is communicated with the first heat exchange space, and the heat sink is provided with the test piece to be tested. The second heat exchange space can increase the contact area between the radiating fins and the air, so that the heat emitted by the chip can be conducted into the air through the radiating fins quickly, and then the heat is conducted out through air convection.
In one embodiment, the probe module includes a plurality of probes, at least one heat sink is disposed on the probe module, each of the heat sinks is used for connecting a plurality of probes belonging to the same probe module, and the heat sink rapidly conducts heat emitted by the chip into air.
In one embodiment, the probe is provided with a copper sleeve, and the probe is telescopically movable relative to the copper sleeve.
In one embodiment, the copper sleeve is provided with a plurality of heat dissipation holes, and the heat dissipation holes are communicated with the second heat exchange space.
In an implementation manner of one embodiment, the mounting module further includes an upper plate and a limiting plate with a limiting hole, the limiting plate is installed in the upper plate, the upper plate is installed on the lower plate, the limiting plate and the lower plate enclose into the accommodating space, and when the pressure module is propped against the test piece to be tested, the pressure module is propped against the limiting plate.
In an implementation manner of one embodiment, the air inlet is formed at a bottom of the heat exchange groove, an air outlet groove communicated with the heat exchange groove is formed at one end of the heat exchange groove, and the lower plate is arranged on the base and surrounds the air outlet groove to form the air outlet.
In one embodiment, two of the probe modules are mounted at the bottom of the heat exchange tank, and the first heat exchange space surrounds the probe modules.
In one embodiment, a plurality of the probe modules are provided, at least one of the probe modules is mounted on the mounting table, and the second heat exchanging space surrounds the probe module. The probe module is added on the mounting table, and heat can be quickly conducted into the second heat exchange space through the probe to dissipate heat.
The testing tool has the beneficial effects that: through set up the first heat exchange space that communicates accommodating space on installation module to set up the second heat exchange space at installation module's mount table, second heat exchange space and first heat exchange space intercommunication, the heat that awaits measuring test piece gives off carries out heat conduction through probe module and first heat exchange space and second heat exchange space, with the heat conduction of first heat exchange space outside the test tool through the air convection.
Drawings
FIG. 1 is a schematic diagram of a test tool according to the present utility model;
FIG. 2 is a schematic diagram illustrating the assembly of a portion of the structure of the testing tool of FIG. 1;
FIG. 3 is a schematic exploded view of the test tool of FIG. 1;
FIG. 4 is a cross-sectional view of a first embodiment of the test tool of the present utility model;
FIG. 5 is a schematic view of a portion of the assembly of the test tool of FIG. 1;
FIG. 6 is a schematic view of the probe structure of the test tool of FIG. 1;
FIG. 7 is a cross-sectional view of a second embodiment of the test tool of the present utility model.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
The utility model provides a testing tool, which comprises a base, a mounting module, a probe module and a pressure module, wherein the mounting module is arranged on the base, an accommodating space is formed in the mounting module, the probe module is positioned on the mounting module and extends into the accommodating space and contacts a test piece to be tested which is placed in the accommodating space, a first heat exchange space communicated with the accommodating space is formed in the mounting module, the first heat exchange space surrounds the probe module, the pressure module is used for being close to or far away from the mounting module, and when the pressure module is close to the mounting module, the pressure module abuts against the test piece to be tested so that the test piece to be tested contacts the probe module
According to the utility model, the first heat exchange space communicated with the accommodating space is arranged on the mounting module, heat emitted by the test piece to be tested is conducted with the first heat exchange space through the probe module, and the heat of the first heat exchange space is conducted to the outside of the test tool through air convection.
Example 1
Referring to fig. 1, 2, 3 and 4, the present utility model provides a testing tool 100, which includes a base 1, a mounting module 2, a probe module 3 and a pressure module 4, wherein the mounting module 2 is mounted on the base 1, a receiving space 5 is provided on the mounting module 2, the probe module 3 is located on the mounting module 2 and extends into the receiving space 5 to contact a test piece 200 to be tested placed in the receiving space 5, the pressure module 4 mainly acts to provide pressure and contact the test piece 200 to be tested, the test piece to be tested is mainly a chip, pins of the test piece 200 to be tested are arranged downward, the pressure module 4 can approach or separate from the mounting module 2, and when the pressure module 4 approaches the mounting module 2, the pressure module 4 contacts the test piece to be tested so that the test piece to be tested and pins thereof contact the probe module 3. The probe module 3 is abutted against the test piece 200 to be tested to test current, voltage, frequency and the like.
More specifically, referring to fig. 4 and 5, a first heat exchanging space 6 communicating with the receiving space 5 is provided between the mounting module 2 and the base 1, the first heat exchanging space 6 surrounding the probe module 3. In this embodiment, the first heat exchange space 6 is disposed on the mounting module 2, or the first heat exchange space 6 may be disposed on the base 1, or the mounting module 2 and the base 1 may be enclosed together, where the first heat exchange space 6 includes an air inlet 61 and an air outlet 62, the air inlet 61 extends to the base 1 and extends out of the base 1, and the air outlet 62 is disposed on the mounting module 2 and near the probe module 3 by inputting gases with different temperatures at an extension port of the base 1.
More specifically, referring to fig. 2, 3 and 4, the mounting module 2 includes a base 21, a mounting table 22 mounted on the base 21, and a lower plate 23, the lower plate 23 has a receiving hole 231, the mounting table 22 is received in the receiving hole 231, at least one probe module 3 is disposed on the mounting table 22, and the first heat exchanging space 6 is disposed on the base 21 and surrounds the mounting table 22 and the probe module 3.
The installation module 2 further comprises an upper plate 24 and a limiting plate 25 with limiting holes, wherein the limiting plate 25 is arranged in the upper plate 24, and further, in the embodiment, the limiting plate 25 is composed of four limiting blocks 251, the four limiting blocks 251 are enclosed to form the limiting holes, and the size adjustment of the limiting holes can be realized by finely adjusting the installation positions of the limiting blocks 251. The upper plate 24 is mounted on the lower plate 23, the mounting table 22, the limiting plate 25 and the lower plate 23 enclose the accommodating space 5, and when the pressure module 4 abuts against the test piece 200 to be tested, the pressure module 4 abuts against the limiting plate 25.
More specifically, referring to fig. 3 to 5, the surface of the base 21 is concavely provided with a heat exchange groove 211, the bottom surface of the heat exchange groove 211 is provided with a mounting hole 212, a mounting block below the mounting table 22 is mounted in the mounting hole 212, and the mounting table 22 and the lower plate 23 enclose the heat exchange groove 211 into the first heat exchange space 6. The test piece 200 to be tested is installed in the accommodating space 5 and seals the accommodating hole 231, the first heat exchange space 6 is separated from the accommodating space 5 by the lower plate 23, and the heat emitted by the test piece 200 to be tested is conducted to the first heat exchange space 6 through the probe module 3 for heat dissipation.
More specifically, referring to fig. 3 and 5, the air inlet 61 is formed at the bottom of the heat exchange groove 211, an air outlet 213 is formed at one end of the heat exchange groove 211 and is in communication with the heat exchange groove 211, and the lower plate 23 is mounted on the base 21 and surrounds the air outlet 213 to form the air outlet 62.
More specifically, please refer to fig. 4 and 6, wherein two probe modules 3 are installed at the bottom of the heat exchange groove 211, the first heat exchange space 6 surrounds the two probe modules 3, the two probe modules 3 are close to the air outlet 62, and the two probe modules 3 are used for abutting against pins of the test piece 200 to be tested. The two probe modules 3 each comprise a plurality of probes 31, the probes 31 are sleeved with sleeves 32 and can move up and down in a telescopic manner along the sleeves 32, in order to ensure that the probes 31 have elastic contact force when the test piece 200 to be tested is abutted, springs (not shown) are arranged between the probes 31 and the sleeves 32, the sleeves 32 are arranged at the bottoms of the heat exchange grooves 211, the probes 31 penetrate through the lower plate 23 and extend out of the surface of the lower plate 23, the first heat exchange space 6 surrounds the probes 31 of the two probe modules 3 or the middle part of the sleeves 32, and the probes 31 of the probe modules 3 are abutted against pins of the test piece 200 to be tested.
Example two
Referring to fig. 3 and 7, the present utility model provides a testing tool having a structure substantially the same as that of the first embodiment, in which a heat sink 7 is disposed on a probe module 3 mounted on a mounting table 22, a gap between the heat sink 7 and the mounting table 22 forms a second heat exchanging space 221, the second heat exchanging space 221 is communicated with the first heat exchanging space 6, and a test piece 200 to be tested is disposed on the heat sink 7. In this embodiment, the mounting table 22 is installed in the accommodating hole 231, two ends of the heat sink 7 are attached to the mounting table 22, the mounting table 22 is provided with a groove and a probe mounting hole 222, and the groove of the mounting table 22 and the heat sink 7 are enclosed into a second heat exchange space 221 with two open ends. It is also possible to provide grooves and mounting blocks 22 on the heat sink 7 to form a second heat exchanging space 221. The number of the heat sinks 7 is at least one, and a plurality of heat sinks 7 may be provided, and the probe 31 passes through the heat sinks 7 to abut against the test piece 200 to be tested. The pins of the test piece 200 to be tested are in contact with the radiating fins 7 to increase the radiating area, the test piece 200 to be tested is mainly a chip, the pins are sheet-shaped, the shape of the radiating fins 7 corresponds to the shape of the pins of the chip, one or more radiating fins 7 correspond to one pin, and a plurality of probes 31 correspond to one radiating fin.
According to the utility model, the first heat exchange space 6 communicated with the accommodating space is arranged on the mounting module 2, the second heat exchange space 221 is arranged on the mounting table 22 of the mounting module 2, the second heat exchange space 221 is communicated with the first heat exchange space 6, heat emitted by the test piece 200 to be tested is conducted with the first heat exchange space 6 and the second heat exchange space 221 through the probe module 3 and the mounting table 22, and the heat of the first heat exchange space 6 is conducted to the outside of the test tool 100 through air convection.
Example III
Referring to fig. 3 and 6, the present utility model provides a testing tool, which has a structure substantially the same as that of the second embodiment, except that a plurality of heat dissipation holes are formed on the sleeve 32, and the heat dissipation holes are communicated with the second heat exchange space 221. In this embodiment, the probe module 3 is mounted on the mounting table 22, the probe module 3 includes a plurality of probes 31, a sleeve 32 is sleeved on the probes 31 and can move up and down along the sleeve 32, the sleeve 32 is mounted in a probe mounting hole 222 of the mounting table 22, the second heat exchange space 221 surrounds the probes 31 or the middle part of the sleeve 32 of the probe module 3, and a heat conduction path exists between the heat dissipation hole and the second heat exchange space 221.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a test tool, its characterized in that includes base, installation module, probe module and pressure module, the installation module is installed on the base, be equipped with accommodation space on the installation module, the probe module is located on the installation module and extend to in the accommodation space and contact the test piece that awaits measuring of arranging in the accommodation space, be equipped with the intercommunication on the installation module the first heat exchange space of accommodation space, first heat exchange space encircles the probe module, the pressure module is used for being close to or keep away from the installation module, when the pressure module is close to the installation module, the pressure module supports the test piece that awaits measuring, so that the test piece that awaits measuring contacts the probe module.
2. The test tool of claim 1, wherein: the first heat exchange space comprises an air inlet and an air outlet, the air inlet extends to the base, and the air outlet is arranged on the mounting module and is close to the probe module.
3. The test tool of claim 2, wherein: the mounting module comprises a base, a mounting table and a lower plate, wherein the mounting table and the lower plate are arranged on the base, a heat exchange groove is concavely formed in the surface of the base, a containing hole is formed in the lower plate, at least one probe module is arranged on the mounting table, the probe module extends to the containing space through the containing hole and is abutted to the test piece to be tested, and the heat exchange groove is surrounded by the mounting table and the lower plate to form a first heat exchange space.
4. A test tool according to claim 3, wherein: the bottom surface of the heat exchange groove is provided with a mounting hole, and the mounting table is arranged in the mounting hole.
5. A test tool according to claim 3, wherein: the probe module arranged on the mounting table is provided with a radiating fin, the radiating fin is accommodated in the accommodating hole, a second heat exchange space is formed between the radiating fin and the mounting table, the second heat exchange space is communicated with the first heat exchange space, and the radiating fin is provided with the test piece to be tested.
6. The test tool of claim 5, wherein: the probe module comprises a plurality of probes, at least one radiating fin is arranged on the probe module, and each radiating fin is used for connecting the plurality of probes belonging to the same probe module.
7. The test tool of claim 6, wherein: the probe is provided with a copper sleeve, and the probe can move in a telescopic manner relative to the copper sleeve.
8. The test tool of claim 7, wherein: and the copper sleeve is provided with a plurality of radiating holes, and the radiating holes are communicated with the second heat exchange space.
9. A test tool according to claim 3, wherein: the mounting module further comprises an upper plate and a limiting plate with limiting holes, wherein the limiting plate is arranged in the upper plate, the upper plate is arranged on the lower plate, the limiting plate and the lower plate enclose into the accommodating space, and when the pressure module abuts against the test piece to be tested, the pressure module abuts against the limiting plate.
10. A test tool according to claim 3, wherein: the air inlet is formed in the bottom of the heat exchange groove, the air outlet groove communicated with the heat exchange groove is formed in one end of the heat exchange groove, and the lower plate is arranged on the base and surrounds the air outlet groove to form the air outlet.
CN202223425826.1U 2022-12-19 2022-12-19 Test tool Active CN219625637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223425826.1U CN219625637U (en) 2022-12-19 2022-12-19 Test tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223425826.1U CN219625637U (en) 2022-12-19 2022-12-19 Test tool

Publications (1)

Publication Number Publication Date
CN219625637U true CN219625637U (en) 2023-09-01

Family

ID=87771789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223425826.1U Active CN219625637U (en) 2022-12-19 2022-12-19 Test tool

Country Status (1)

Country Link
CN (1) CN219625637U (en)

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