CN215728609U

CN215728609U - Multifunctional wafer test probe system

Info

Publication number: CN215728609U
Application number: CN202121091990.6U
Authority: CN
Inventors: 高伦; 李宏业
Original assignee: Hebei Light Electronic Technology Co ltd
Current assignee: Hebei Light Electronic Technology Co ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2022-02-01
Anticipated expiration: 2031-05-20

Abstract

The utility model discloses a multifunctional wafer test probe system, which relates to the technical field of wafer test probes and comprises a probe card, wherein a test circuit board is arranged in the probe card, a plurality of upper probes are arranged on the test circuit board, sleeves are fixedly arranged on the upper probes, lower probes are inserted into the sleeves, and the lower probes are fixed on the upper probes through spiral elastic sheets; still including the equipartition box, the sleeve all runs through the setting on the equipartition box, and the sleeve is located to be equipped with the air intake on the inside section of thick bamboo of equipartition box, and the sleeve is located to be equipped with a plurality of exhaust vents on the one end circumference of probe down, and exhaust vent and air intake are linked together through the clearance between probe and the sleeve down. The utility model can avoid the damage of the wafer caused by the test, and the probe has the functions of heat dissipation and soft contact test on the wafer test point while having the test function, thereby providing the functionality of the wafer test probe.

Description

Multifunctional wafer test probe system

Technical Field

The utility model belongs to the technical field of wafer test probes, and particularly relates to a multifunctional wafer test probe system.

Background

In the manufacturing process of the integrated circuit, it is often necessary to perform an electrical performance test on the wafer to determine whether the integrated circuit is good, and finally, the integrated circuit is packaged. In the prior art, a wafer is usually electrically tested by using a wafer test card with a plurality of probes, so that the probes on the wafer test card apply test signals to the integrated circuits to determine whether the optical performance is good. In addition, when the probe is in contact test with the wafer, hard contact is generally adopted, a good buffer component is lacked, the existing probe only has the function of wafer test, and the function is single. Therefore, a multifunctional wafer test probe system is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defect that a wafer test lacks necessary heat dissipation and buffering functions in the prior art, and provides a multifunctional wafer test probe system.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the multifunctional wafer test probe system comprises a probe card, wherein a test circuit board is arranged in the probe card, a plurality of upper probes are arranged on the test circuit board at positions corresponding to chip wafers, a sleeve is fixedly arranged at one end, away from the probe card, of each upper probe, a lower probe is inserted into one end, away from the upper probes, of each sleeve, and the lower probes are fixed on the upper probes through spiral elastic sheets;

still include the equipartition box, one side of equipartition box is equipped with the air supply port, the sleeve all runs through the setting on the equipartition box, the sleeve is located and is equipped with the air intake on the inside bobbin section of equipartition box, the sleeve is located and is equipped with a plurality of exhaust vents on the one end circumference of probe down, and exhaust vent and air intake are linked together through the clearance between probe and the sleeve down.

Furthermore, a testing cylinder for driving the probe card to move up and down is fixedly arranged at the top of the probe card.

Furthermore, the upper probe, the spiral spring and the lower probe are of an integrated structure.

Further, the sleeve and the position that the equipartition box links to each other all are equipped with the sealing washer.

Furthermore, one side that the sleeve is located equipartition box upper portion is equipped with the stopper, and one side that is located equipartition box lower part is equipped with solid fixed ring, gu fixed ring links to each other with the sleeve with the threaded mode.

The multifunctional wafer test probe system provided by the utility model has the beneficial effects that:

(1) the wafer test probe is provided with the heat dissipation unit, namely, heat dissipation gas is supplied from the outside and distributed on each probe through the uniform distribution box, and then the probe conveys the heat dissipation gas source to the wafer, so that heat generated in the wafer test process can be dissipated accurately, the anxiety of the heat generated in the wafer test on the damage of the wafer is eliminated, the probe has the test function, and meanwhile, the wafer test probe also has the function of dissipating heat of the wafer test point, and further the functionality of the wafer test probe is provided.

(2) The probe adopts a double-probe structure of the upper probe and the lower probe, and the upper probe and the lower probe are connected into an integral structure through the spiral elastic sheet, so that on one hand, when the lower probe contacts a wafer, soft contact can be realized under the action of the spiral elastic sheet, namely buffer contact, and damage to the wafer caused by hard contact of the probe and the wafer is avoided, and on the other hand, the upper probe, the spiral elastic sheet and the lower probe which are in the integral structure are favorable for transmission of test signals, can improve the test accuracy, and enable the probe to have the test function and the soft contact function of a wafer test point, thereby providing the functionality of the wafer test probe.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a schematic view of the internal structure of the present invention;

labeled as: the probe card comprises a probe card 1, a test circuit board 2, an upper probe 3, a sleeve 4, an even distribution box 5, a spiral elastic sheet 6, a lower probe 7, an air outlet hole 8, an air inlet 9, a sealing ring 10, a limiting block 11, a fixing ring 12, an air source port 13 and a test air cylinder 14.

Detailed Description

The utility model will be further illustrated with reference to the following specific examples. These examples are intended to illustrate the utility model and are not intended to limit the scope of the utility model. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided" and "connected" are to be interpreted broadly, e.g. as a fixed connection, a detachable connection or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The structural features of the present invention will now be described in detail with reference to the accompanying drawings.

Referring to fig. 1-3, a multifunctional wafer test probe system includes a probe card 1, a test cylinder 14 for driving the probe card 1 to move up and down is fixedly disposed at the top of the probe card 1, a test circuit board 2 is disposed in the probe card 1, a plurality of upper probes 3 are disposed on the test circuit board 2 at positions corresponding to chip dies, the upper probes 3 are electrically connected to the test circuit board 2, the test circuit board 2 sends test signals to the upper probes 3, sleeves 4 are fixedly disposed at ends of the upper probes 3 far away from the probe card 1, lower probes 7 are inserted at ends of the sleeves 4 far away from the upper probes 3, the lower probes 7 can move up and down freely in the sleeves 4, the lower probes 7 are fixed on the upper probes 3 through spiral elastic pieces 6, the spiral elastic pieces 6 have good elasticity, the spiral spring 6 can provide an elastic support for the lower probe 7 after the lower probe 7 receives pressure. The upper probe 3, the spiral elastic sheet 6 and the lower probe 7 are of an integrated structure, and the design of the integrated structure is adopted, so that the upper probe 3 has good buffering capacity and good signal conduction capacity.

Still including equipartition box 5, one side of equipartition box 5 is equipped with air supply port 13, air supply port 13 is used for external air pump, the air pump provides the air supply for whole equipartition box 5, sleeve 4 all runs through the setting on equipartition box 5, the position that sleeve 4 and equipartition box 5 link to each other all is equipped with sealing washer 10, one side that sleeve 4 is located equipartition box 5 upper portion is equipped with stopper 11, one side that is located equipartition box 5 lower part is equipped with solid fixed ring 12, gu fixed ring 12 links to each other with the threaded mode with sleeve 4. The sleeve 4 is equipped with air intake 9 on being located the inside bobbin section of equipartition box 5, and the sleeve 4 is located and is equipped with a plurality of exhaust vents 8 on the one end circumference of probe 7 down, and exhaust vent 8 is linked together through the clearance between probe 7 and the sleeve 4 down with air intake 9, and the air supply accessible equipartition of supply is to every sleeve 4 in, then transmits to exhaust vent 8, and the air supply can be even through exhaust vent 8 blows and beats on the wafer test point.

The multifunctional wafer test probe system of the utility model can accurately dissipate the heat generated in the wafer test process by arranging the heat dissipation unit on the wafer test probe, namely, the heat dissipation gas supplied from the outside is distributed on each probe through the uniform distribution box and then the probe conveys the heat dissipation gas to the wafer, thereby eliminating the anxiety of the heat generated in the wafer test on the damage of the wafer, and on the other hand, the probe adopts a double-probe structure of an upper probe and a lower probe, and the upper probe and the lower probe are connected into an integrated structure through a spiral elastic sheet, so that when the lower probe contacts the wafer, the soft contact can be realized under the action of the spiral elastic sheet, namely, the buffer contact is realized, the damage caused by the hard contact of the probe and the wafer is avoided, the upper probe, the spiral elastic sheet and the lower probe in the integrated structure are beneficial to the transmission of test signals, the test accuracy can be improved, and the probe has the test function, the wafer test probe also has the functions of heat dissipation and soft contact test of the wafer test point, and provides the functionality of the wafer test probe.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A multifunctional wafer test probe system comprises a probe card (1), wherein a test circuit board (2) is arranged in the probe card (1), and a plurality of upper probes (3) are arranged on the test circuit board (2) at positions corresponding to chip wafers, and is characterized in that one ends, far away from the probe card (1), of the upper probes (3) are fixedly provided with sleeves (4), one ends, far away from the upper probes (3), of the sleeves (4) are inserted with lower probes (7), and the lower probes (7) are fixed on the upper probes (3) through spiral elastic sheets (6);

still include equipartition box (5), one side of equipartition box (5) is equipped with air supply port (13), sleeve (4) all run through the setting on equipartition box (5), sleeve (4) are located and are equipped with air intake (9) on the inside section of thick bamboo of equipartition box (5), sleeve (4) are located and are equipped with a plurality of exhaust vents (8) on the one end circumference of probe (7) down, and exhaust vent (8) are linked together through the clearance between probe (7) and sleeve (4) down with air intake (9).

2. The multifunctional wafer test probe system as claimed in claim 1, wherein a test cylinder (14) for driving the probe card (1) to move up and down is fixed on the top of the probe card (1).

3. The multifunctional wafer test probe system of claim 1, wherein the upper probe (3), the spiral spring (6) and the lower probe (7) are an integrated structure.

4. The multifunctional wafer test probe system as claimed in claim 1, wherein the sleeve (4) is provided with a sealing ring (10) at the position where it is connected with the uniform distribution box (5).

5. The multifunctional wafer test probe system of claim 1, wherein a limiting block (11) is disposed on one side of the sleeve (4) located at the upper portion of the uniform distribution box (5), and a fixing ring (12) is disposed on one side located at the lower portion of the uniform distribution box (5), wherein the fixing ring (12) is connected with the sleeve (4) in a threaded manner.