CN219577355U - PCB board with heat conduction structure - Google Patents

Abstract

The utility model discloses a PCB with a heat conduction structure, which comprises a substrate, wherein two groups of symmetrical thread barrels are fixedly connected to the upper surface of the substrate, a plate body is commonly placed at the top ends of the two groups of thread barrels, two groups of symmetrical through holes are formed in the bottom surface of the plate body, threaded bolts are connected to the inner wall of each thread barrel in a threaded manner, the top ends of the threaded bolts penetrate through the through holes and extend to the upper side of the plate body, and the symmetrical heat conduction barrels are fixedly inlaid at the bottom surface of the plate body. According to the utility model, the heat conducting tube is matched with the heat conducting rod, so that the inconvenient phenomenon of workers during replacement of the heat conducting mechanism of the traditional device is avoided, the plate body can be positioned and installed through the matching of the threaded bolt and the threaded tube, the phenomenon that the plate body is easy to fall off due to insufficient stability is avoided, and the heat generated by the device can be effectively dissipated through the heat dissipation holes, so that the problem of unsatisfactory heat dissipation effect is avoided.

Description

PCB board with heat conduction structure

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a PCB with a heat conduction structure.

Background

The name of PCB is printed circuit board, also called printed circuit board, which is an important electronic component, is a support for electronic components, is a carrier for the electronic components to be electrically connected with each other, and is called printed circuit board because it is made by adopting electronic printing technology.

The utility model patent with the publication number of CN207692149U discloses a multilayer PCB board with a heat conduction structure, which comprises a heat conduction graphite substrate, wherein one surface of the heat conduction graphite substrate is sequentially provided with a first insulating heat conduction layer and a first circuit layer, and the other surface of the heat conduction graphite substrate is sequentially provided with a second insulating heat conduction layer, a second circuit layer, a third insulating heat conduction layer and a third circuit layer.

Disclosure of Invention

The utility model aims to provide a PCB with a heat conduction structure, so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a PCB board with heat conduction structure, includes the base plate, the upper surface fixedly connected with two sets of symmetrical screw thread section of thick bamboo of base plate, two sets of the plate body has been placed jointly to the top of screw thread section of thick bamboo, two sets of symmetrical through-holes have been seted up to the bottom surface of plate body, every the equal threaded connection of inner wall of screw thread section of thick bamboo has the screw thread bolt, every the top of screw thread bolt all runs through the through-hole and extends to the top of plate body, the fixed symmetrical heat-conducting tube that inlays in bottom surface of plate body, the inside of plate body is fixed to inlay has two sets of symmetrical absorber plates, every set of the one end that the absorber plate is close to each other all is connected with the surface fixed of heat-conducting tube, symmetrical louvre has been seted up to the bottom surface of base plate, every the equal threaded connection of inner wall of heat-conducting tube has the heat-conducting rod, every the bottom of heat-conducting rod all extends to the inside of louvre, the surface fixedly connected with protection ring of heat-conducting rod.

In a further embodiment, symmetrical fingerboards are arranged above the board body, and the bottom end of each fingerboard is fixedly connected with the top end of the threaded bolt.

In a further embodiment, symmetrical anti-slip pads are arranged above the base plate, and one side surfaces of the two anti-slip pads, which are close to each other, are fixedly connected with the left end and the right end of the plate body respectively.

In a further embodiment, the inner top wall of each heat conducting tube is fixedly connected with a limiting plate, and the bottom surface of each limiting plate is contacted with the top end of the heat conducting rod.

In a further embodiment, the upper surface of the substrate and the bottom surface of the plate body are fixedly connected with protection pads, and two protection pads are contacted with one side surface close to each other.

In a further embodiment, a dust screen is disposed inside each heat dissipation hole, and an outer surface of each dust screen is fixedly connected with an inner wall of each heat dissipation hole.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the heat conducting tube is matched with the heat conducting rod, so that the inconvenient phenomenon of workers during replacement of the heat conducting mechanism of the traditional device is avoided, the plate body can be positioned and installed through the matching of the threaded bolt and the threaded tube, the phenomenon that the plate body is easy to fall off due to insufficient stability is avoided, and the heat generated by the device can be effectively dissipated through the heat dissipation holes, so that the problem of unsatisfactory heat dissipation effect is avoided.

Drawings

Fig. 1 is a schematic perspective view of a plate body according to the present utility model.

Figure 2 is a front cross-sectional view of a plate body in accordance with the present utility model.

Fig. 3 is a bottom view of the plate body of the present utility model.

Fig. 4 is an enlarged schematic view of the structure a in fig. 2 according to the present utility model.

In the figure: 1. a substrate; 2. a plate body; 3. a protective pad; 4. a thread cylinder; 5. a heat conduction tube; 6. a protective pad; 7. a fingerboard; 8. a limiting plate; 9. a heat absorbing plate; 10. a through hole; 11. a threaded bolt; 12. a heat radiation hole; 13. a dust screen; 14. a heat conduction rod; 15. and a guard ring.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, in the present utility model, a PCB board with a heat conducting structure includes a substrate 1, two groups of symmetrical screw barrels 4 are fixedly connected to an upper surface of the substrate 1, a board body 2 is commonly placed at top ends of the two groups of screw barrels 4, two groups of symmetrical through holes 10 are provided on a bottom surface of the board body 2, screw bolts 11 are screwed on inner walls of the screw barrels 4, top ends of the screw bolts 11 penetrate through the through holes 10 and extend to an upper portion of the board body 2, symmetrical heat conducting barrels 5 are fixedly inlaid on the bottom surface of the board body 2, two groups of symmetrical heat absorbing plates 9 are fixedly inlaid in the board body 2, one end of each group of heat absorbing plates 9 close to each other is fixedly connected with an outer surface of the heat conducting barrel 5, symmetrical heat dissipation holes 12 are provided on the bottom surface of the substrate 1, heat conducting rods 14 are screwed on inner walls of each heat conducting barrel 5, bottom ends of each heat conducting rod 14 extend to an inner portion of the heat dissipation holes 12, and a protection ring 15 is fixedly connected to an outer surface of the heat conducting rod 14.

The top of plate body 2 is equipped with symmetrical fingerboard 7, the bottom of every fingerboard 7 all with the top fixed connection of threaded bolt 11, can make the rotation of threaded bolt 11 more convenient, avoid the workman to appear there is not phenomenon of hand down when rotating it, the top of base plate 1 is equipped with symmetrical slipmat 6, a side that two slipmats 6 are close to each other respectively with the left and right sides both ends fixed connection of plate body 2, can make the device take more steadily, avoid the workman to appear the phenomenon that the hand was slipped down when taking it, the equal fixedly connected with limiting plate 8 of interior roof of every heat-conducting cylinder 5, the bottom surface of every limiting plate 8 all contacts with the top of heat-conducting rod 14, can carry out spacing protection to the installation of heat-conducting rod 14, avoid heat-conducting rod 14 to appear damaging phenomenon because of the installation is out of position easily.

The equal fixedly connected with protection pad 3 of the upper surface of base plate 1 and the bottom surface of plate body 2, a side that two protection pads 3 are close to each other contacts, can support the protection to plate body 2, has improved the sturdiness of plate body 2, and the inside of every louvre 12 all is equipped with dust screen 13, and the surface of every dust screen 13 all with the inner wall fixed connection of louvre 12 can carry out dustproof processing to the device, avoids external dust to get into and appears accumulational phenomenon at plate body 2 surface.

The working principle of the utility model is as follows:

when the anti-slip device is used, the plate body 2 is placed at a designated position by the anti-slip pad 6, the anti-slip pad 3 is used for positioning and protecting the plate body, then the heat conducting rod 14 is inserted into the heat conducting cylinder 5 and rotated, so that the heat conducting rod 14 is installed, the threaded bolt 11 is inserted into the threaded cylinder 4 by the fingerboard 7, the plate body 2 is positioned and installed by the cooperation of the threaded bolt 11 and the threaded cylinder 4, finally heat is dissipated by the heat dissipating holes 12, and the dust prevention is carried out on the plate body by the dust preventing net 13, so that the aim of replacing the installation mode of the heat conducting mechanism of the traditional device is fulfilled, and the inconvenience of workers in replacing the heat conducting mechanism is avoided.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (6)

1. A PCB board with heat conduction structure, its characterized in that: including base plate (1), the upper surface fixedly connected with two sets of symmetrical screw thread section of thick bamboo (4) of base plate (1), two sets of plate body (2) have been placed jointly to the top of screw thread section of thick bamboo (4), two sets of symmetrical through-hole (10) have been seted up to the bottom surface of plate body (2), every equal threaded connection of inner wall of screw thread section of thick bamboo (4) has screw thread bolt (11), every the top of screw thread bolt (11) all runs through-hole (10) and extends to the top of plate body (2), the bottom surface of plate body (2) is fixed to be inlayed have symmetrical heat conduction section of thick bamboo (5), the inside fixed heat absorption board (9) of inlaying of plate body (2), every set of the one end that heat absorption board (9) are close to each other all with the surface fixed connection of heat conduction section of thick bamboo (5), the bottom surface of base plate (1) has seted up symmetrical louvre (12), every equal threaded connection of inner wall of heat conduction section of thick bamboo (5) has pole (14), every the bottom of heat conduction pole (14) all extends to heat conduction ring (14) inside heat dissipation ring (15).

2. The PCB with thermally conductive structure of claim 1, wherein: the upper part of the plate body (2) is provided with symmetrical fingerboards (7), and the bottom end of each fingerboard (7) is fixedly connected with the top end of the threaded bolt (11).

3. The PCB with thermally conductive structure of claim 1, wherein: the upper part of the base plate (1) is provided with symmetrical anti-slip pads (6), and one side surface of each anti-slip pad (6) which is close to each other is fixedly connected with the left end and the right end of the plate body (2) respectively.

4. The PCB with thermally conductive structure of claim 1, wherein: the inner top wall of each heat conduction cylinder (5) is fixedly connected with a limiting plate (8), and the bottom surface of each limiting plate (8) is contacted with the top end of a heat conduction rod (14).

5. The PCB with thermally conductive structure of claim 1, wherein: the upper surface of base plate (1) and the bottom surface of plate body (2) are all fixedly connected with protection pad (3), and two protection pad (3) are close to each other one side and contact.

6. The PCB with thermally conductive structure of claim 1, wherein: and a dustproof net (13) is arranged in each radiating hole (12), and the outer surface of each dustproof net (13) is fixedly connected with the inner wall of each radiating hole (12).