CN219573335U - Vacuum type pressure sensor - Google Patents
Vacuum type pressure sensor Download PDFInfo
- Publication number
- CN219573335U CN219573335U CN202320720175.4U CN202320720175U CN219573335U CN 219573335 U CN219573335 U CN 219573335U CN 202320720175 U CN202320720175 U CN 202320720175U CN 219573335 U CN219573335 U CN 219573335U
- Authority
- CN
- China
- Prior art keywords
- vacuum
- chip
- diaphragm
- pressure sensor
- induction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a vacuum type pressure sensor, which comprises a substrate, a vacuum shell and an induction chip, wherein the induction chip is fixedly connected to the substrate, the vacuum shell covers the induction chip from the outside, a vacuum cavity is arranged in the vacuum shell, the induction chip comprises a cylinder type fixed seat and an induction diaphragm, the top of the cylinder type fixed seat is provided with the induction diaphragm in a sealing way, the bottom of the cylinder type fixed seat is connected with the surface of the substrate in a sealing way, the enclosed space between the induction chip and the substrate is a test cavity, one surface of the induction chip faces the vacuum cavity, the other surface of the induction chip faces the test cavity, a medium through hole is formed in the substrate at the bottom of the test cavity and is coaxial with the induction diaphragm, the medium to be tested is filled into the test cavity through the medium through hole to deform the induction diaphragm, and the induction diaphragm converts deformation into an electric signal to be output; the utility model can isolate all external environmental factors possibly causing induction failure, and improve the sensitivity and stability of the sensor.
Description
Technical Field
The utility model belongs to the technical field of pressure sensors, and particularly relates to a vacuum type pressure sensor.
Background
The pressure sensor is the most widely used one, and the traditional pressure sensor is mainly a mechanical structure type device, and the deformation of an elastic element is used for indicating the pressure, but the structure is large in size and heavy in weight and can not provide electrical output. With the development of semiconductor technology, semiconductor pressure sensors have been developed, which are characterized by small volume, light weight, high accuracy and good temperature characteristics. Particularly, with the development of MEMS technology, semiconductor sensors are being developed toward miniaturization, and the semiconductor sensors have low power consumption and high reliability. However, the sensing unit of the existing sensor is easily interfered by various kinds of interference in the working environment, such as electromagnetic interference, interference of particles in air and the like, and the interference can influence the sensitivity of the sensing unit, so that the sensing stability is reduced, and the performance of the product can not meet the use requirement.
Disclosure of Invention
Aiming at the problems and the technical requirements, the utility model provides a vacuum type pressure sensor which can isolate all external environmental factors possibly causing induction failure and improve the sensitivity and the stability of the sensor.
The technical scheme of the utility model is as follows: the utility model provides a vacuum type pressure sensor, includes base plate, vacuum housing and response chip, response chip fixed connection is on the base plate, and vacuum housing covers the response chip from the outside, is the vacuum chamber in the vacuum housing, the response chip includes barrel type rigid coupling seat and response diaphragm, and barrel type rigid coupling seat top is sealed to be equipped with the response diaphragm, barrel type rigid coupling seat bottom and base plate surface sealing connection, and the space that response chip and base plate enclose is the test chamber, and response chip one side is faced the vacuum chamber, and the another side is faced the test chamber, the medium through-hole has been seted up on the base plate of test chamber bottom, and medium through-hole and response diaphragm coaxial setting, the medium that awaits measuring fills the test chamber through the medium through-hole and makes the response diaphragm produce deformation, and the response diaphragm is the electric signal output with the deformation volume conversion.
Further, the vacuum degree in the vacuum shell is < -90KPa.
In the scheme, the vacuum degree lower than-90 KPa is arranged in the vacuum shell, one side of the sensing diaphragm used for sensing the pressure of the medium is adsorbed by the vacuum cavity, the other side of the sensing diaphragm contacts the test cavity, and when the sensing diaphragm is detected, the pressure of the medium is sensed on one side of the test cavity, and the other side of the sensing diaphragm is in a vacuum environment, so that the interference of all environmental factors can be avoided, the sensing diaphragm is only subjected to the pressure from the medium in the test cavity in the test process, and the test effect is more sensitive.
Furthermore, the sensing chip is a silicon piezoresistance MEMS chip, 4 strain resistors are etched on the sensing diaphragm, and the 4 strain resistors are connected in a Wheatstone bridge mode.
When the medium is filled into the test cavity, the sensing diaphragm deforms under the pressure of the medium, the deformation is larger as the pressure is larger, the resistance value of the strain resistor on the sensing diaphragm changes under the action of the pressure, the balance of 4 strain resistors connected in a Wheatstone bridge mode is broken, and when a certain voltage or current is input into the input end of the bridge, the correspondingly changed signal voltage or signal current can be obtained at the output end of the bridge, namely, the deformation is converted into an electric signal.
Further, the substrate is a copper-clad plate or a circuit board.
Further, the sensing chip is connected with the substrate through a wire, the wire is a gold wire or an aluminum wire, and the wire transmits an electric signal on the sensing diaphragm to the substrate.
Furthermore, the vacuum shell and the substrate are connected in a sealing way by glue or solder paste.
Furthermore, the bottom of the cylinder-shaped fixedly connected seat is bonded with the base plate by glue.
Furthermore, the vacuum shell is made of metal, and the edges and corners of the vacuum shell are round curves.
Compared with the prior art, the utility model has the beneficial effects that: the vacuum type pressure sensor can test common engine oil, refrigerants, atmosphere and other liquid or gas media, has wide application range, and during the test, as the vacuum cavity in the vacuum shell directly acts on the sensing diaphragm, the side of the sensing diaphragm isolates all external environmental factors possibly causing product failure in an initial state, so that the deformation of the sensing diaphragm is only influenced by the pressure of the medium in the testing cavity, the deformation is in direct proportion to the pressure, and the testing stability and sensitivity of the product are greatly improved; in addition, adopt metal material preparation vacuum casing, not only intensity is higher, can also shield electromagnetic wave, provides electromagnetic interference protection, and is better to the chip protection effect.
Drawings
FIG. 1 is a cross-sectional view of a vacuum pressure sensor of the present utility model;
marked in the figure as: the device comprises a vacuum shell 1, a vacuum cavity 11, an induction chip 2, a cylindrical fixing seat 21, an induction diaphragm 22, a substrate 3, a test cavity 31, a medium through hole 32 and a wire 4.
Description of the embodiments
The utility model is further described below with reference to the drawings and examples.
As shown in fig. 1, the vacuum type pressure sensor comprises a substrate 3, a vacuum shell 1 and an induction chip 2, wherein the induction chip 2 is fixedly connected to the substrate 3, the vacuum shell 1 covers the induction chip 2 from the outside, and a vacuum cavity 11 is arranged in the vacuum shell 1; the vacuum shell 1 is made of metal, the edges and corners of the vacuum shell 1 are round curves, and the vacuum degree in the vacuum shell 1 is less than-90 KPa. The vacuum shell 1 is made of metal materials, so that the intensity is higher, electromagnetic waves can be shielded, electromagnetic interference protection is provided, the protection effect on the induction chip 2 is better, the vacuum degree is set within-90 KPa, the effect of isolating interference can be achieved, and the negative pressure value of the vacuum shell cannot damage the induction chip 2.
The sensing chip 2 comprises a barrel-type fixing seat 21 and a sensing diaphragm 22, the top of the barrel-type fixing seat 21 is provided with the sensing diaphragm 22 in a sealing way, the bottom of the barrel-type fixing seat 21 is connected with the surface of the base plate 3 in a sealing way, a space enclosed by the sensing chip 2 and the base plate 3 is a testing cavity 31, one side of the sensing chip 2 faces the vacuum cavity 11, and the other side faces the testing cavity 31; the sensing chip 2 is a silicon piezoresistive MEMS chip, 4 strain resistors are etched on the sensing diaphragm 22, and the 4 strain resistors are connected in a wheatstone bridge mode.
One side of the sensing diaphragm 22 for sensing the pressure of the medium is adsorbed by the vacuum cavity 11, the other side is contacted with the test cavity 31, and when in detection, the pressure of the medium is sensed on one side of the test cavity 31, and the other side is in a vacuum environment, so that the interference of all environmental factors can be avoided, the sensing diaphragm 22 is only subjected to the pressure from the medium in the test cavity 31 in the test process, and the test effect is more sensitive.
A medium through hole 32 is formed in the substrate 3 at the bottom of the test cavity 31, the medium through hole 32 and the sensing diaphragm 22 are coaxially arranged, the medium to be tested is filled into the test cavity 31 through the medium through hole 32 to deform the sensing diaphragm 22, and the sensing diaphragm 22 converts deformation into an electric signal to be output. When the medium is filled in the test cavity 31, the sensing diaphragm 22 deforms under the pressure of the medium, and the resistance of the strain resistors on the sensing diaphragm 22 changes under the action of the pressure, so that the balance of the 4 strain resistors connected in a Wheatstone bridge mode is broken, and when a certain voltage or current is input to the input end of the bridge, the correspondingly changed signal voltage or signal current can be obtained at the output end of the bridge, namely, the deformation is converted into an electric signal.
The induction chip 2 is connected with the substrate 3 through a lead 4, the lead 4 is a gold wire or an aluminum wire, the lead 4 transmits an electric signal on the induction membrane 22 to the substrate 3, the substrate 3 is a copper-clad plate or a circuit board, and the vacuum shell 1 is connected with the substrate 3 in a sealing way by adopting glue or solder paste; glue is adopted to bond the bottom of the barrel-shaped fixing seat 21 and the base plate 3, and glue or solder paste can be used for sealing connection, so that air and liquid cannot enter the cavity, and the sealing is kept.
When the induction chip 2 is packaged, the following process flow is adopted for packaging, and the method comprises the following four steps:
step1: core-coating glue on the surface of the substrate, bonding the induction chip at the glue position, and keeping the glue overflow by 100%;
step2: binding-adopting a wire to interconnect and conduct the induction chip and the substrate;
step3: sticking shell, namely coating glue or solder paste on the surface of a substrate, and bonding a vacuum shell at the glue position;
step4: vacuum curing-placing the product after the shell is pasted in a vacuum furnace, vacuumizing and then heating for curing.
While the utility model has been described with respect to several preferred embodiments, the scope of the utility model is not limited thereto, and any changes and substitutions that would be apparent to one skilled in the art within the scope of the utility model are intended to be included within the scope of the utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.
Claims (8)
1. A vacuum pressure sensor, characterized by: including base plate, vacuum housing and response chip, response chip fixed connection is on the base plate, and the vacuum housing covers the response chip from the outside, is the vacuum chamber in the vacuum housing, the response chip includes barrel type rigid coupling seat and response diaphragm, and barrel type rigid coupling seat top is sealed to be equipped with the response diaphragm, and barrel type rigid coupling seat bottom and base plate surface sealing connection, and the space that response chip and base plate enclose is the test chamber, and response chip one side is faced the vacuum chamber, and the another side is faced the test chamber, set up the medium through-hole on the base plate of test chamber bottom, medium through-hole and the coaxial setting of response diaphragm, and the medium that awaits measuring fills into the test chamber through the medium through-hole and makes the response diaphragm produce deformation, and the response diaphragm is the signal of telecommunication output with the deformation volume conversion.
2. A vacuum pressure sensor as claimed in claim 1, wherein: the vacuum degree in the vacuum shell is < -90KPa.
3. A vacuum pressure sensor as claimed in claim 1, wherein: the sensing chip is a silicon piezoresistance MEMS chip, 4 strain resistors are etched on the sensing diaphragm, and the 4 strain resistors are connected in a Wheatstone bridge mode.
4. A vacuum pressure sensor as claimed in claim 1, wherein: the substrate is a copper-clad plate or a circuit board.
5. A vacuum pressure sensor as claimed in claim 1, wherein: the induction chip is connected with the substrate through a wire, the wire is a gold wire or an aluminum wire, and the wire transmits an electric signal on the induction diaphragm to the substrate.
6. A vacuum pressure sensor as claimed in claim 1, wherein: the vacuum shell and the base plate are connected in a sealing way by glue or solder paste.
7. A vacuum pressure sensor as claimed in claim 1, wherein: the bottom of the cylinder type fixedly connected seat is bonded with the base plate by glue.
8. A vacuum pressure sensor as claimed in claim 1, wherein: the vacuum shell is made of metal, and the edges and corners of the vacuum shell are round curves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320720175.4U CN219573335U (en) | 2023-04-04 | 2023-04-04 | Vacuum type pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320720175.4U CN219573335U (en) | 2023-04-04 | 2023-04-04 | Vacuum type pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219573335U true CN219573335U (en) | 2023-08-22 |
Family
ID=87658383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320720175.4U Active CN219573335U (en) | 2023-04-04 | 2023-04-04 | Vacuum type pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219573335U (en) |
-
2023
- 2023-04-04 CN CN202320720175.4U patent/CN219573335U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103257007B (en) | Pressure sensor dielectric medium isolation packaging structure and packaging method of same | |
| CN205785644U (en) | MEMS minute-pressure pressure transducer | |
| CN111638002A (en) | MEMS pressure sensor oil-filled core and packaging method thereof | |
| CN206670840U (en) | A kind of small-sized silicon piezoresistance type gas pressure sensor structure | |
| CN202442825U (en) | Dielectric isolation encapsulating structure of pressure sensor | |
| CN101532889A (en) | Force sensor | |
| CN109534282B (en) | Production process of dielectric isolation type pressure sensor based on flip chip | |
| CN112763129A (en) | Absolute pressure contact type MEMS capacitance film vacuum gauge | |
| CN109100080A (en) | Quick response diaphragm pressure sensor and its manufacturing method | |
| CN207636232U (en) | A kind of strain-type differential pressure pickup | |
| CN200989838Y (en) | Pressure sensor | |
| CN114739571A (en) | Packaging device of MEMS pressure sensor | |
| CN219573335U (en) | Vacuum type pressure sensor | |
| CN2839604Y (en) | Conjunctive sensor device for monitoring temperature and pressure | |
| CN210089909U (en) | Medium isolation type pressure sensor | |
| CN112197854A (en) | High-performance piezoelectric vibration sensor | |
| CN110132462B (en) | Pressure sensor packaging structure and packaging method thereof | |
| CN1696627A (en) | High temperature pressure sensor workable in high range, high over loading | |
| CN114216519B (en) | Temperature and pressure integrated sensor packaging structure | |
| CN207894549U (en) | A kind of pressure sensor | |
| CN204881935U (en) | Capacitanc pressure sensing device | |
| CN210827408U (en) | Pressure sensitive element and pore water pressure meter | |
| CN210136010U (en) | Sensing device of underwater shock wave sensor | |
| CN201772965U (en) | Soi engine oil pressure sensor | |
| CN208984269U (en) | Based on upside-down mounting welding core media isolation type pressure sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |