CN219568053U - Air inlet device for semiconductor equipment and semiconductor equipment - Google Patents
Air inlet device for semiconductor equipment and semiconductor equipment Download PDFInfo
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- CN219568053U CN219568053U CN202320700062.8U CN202320700062U CN219568053U CN 219568053 U CN219568053 U CN 219568053U CN 202320700062 U CN202320700062 U CN 202320700062U CN 219568053 U CN219568053 U CN 219568053U
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- liquid source
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Abstract
The utility model discloses an air inlet device for semiconductor equipment and the semiconductor equipment, and relates to the technical field of semiconductor equipment. The air inlet device comprises an air inlet pipeline and an air inlet block, wherein two opposite ends of the air inlet pipeline are respectively connected with a liquid source system and the air inlet block, the air inlet pipeline comprises a pipeline body and a plurality of connecting lugs, the connecting lugs are arranged at intervals along the periphery of the pipeline body, an air inlet is formed in the air inlet block, the pipeline body is correspondingly arranged with the air inlet, and the connecting lugs are fixedly connected with the air inlet block. The air inlet device and the semiconductor device can solve the problem that the liquid source is easy to generate condensation phenomenon in the prior art, and can avoid influencing the sealing performance between the air inlet pipeline and the air inlet block of the liquid source.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to an air inlet device for semiconductor equipment and the semiconductor equipment.
Background
A semiconductor device, such as a plasma enhanced chemical vapor deposition (PECVD, plasma Enhanced Chemical Vapor Deposition) device, generates plasma by ionizing a desired gas source using a strong electric field or a magnetic field, and can deposit a desired thin film on a substrate because the plasma is chemically active and easily reacts. After the process of depositing the thin film is completed, the PECVD device can generate cleaning gas by heating and vaporizing the required liquid source by utilizing the heating device, and the cleaning gas is introduced into the reaction chamber, so that the aim of cleaning the reaction chamber can be fulfilled because the cleaning gas can react with byproducts in the reaction chamber.
At present, two air inlet pipelines are generally arranged on an air inlet block of the reaction chamber, wherein one air inlet pipeline is used for introducing plasma generated by a gas source into the reaction chamber, and the other air inlet pipeline is used for introducing clean gas generated by a liquid source into the reaction chamber. In order to increase the service life of the rubber ring of the remote plasma System (RPS, remotePlasmas System), a low-temperature cooling liquid needs to be introduced into the cooling device of the RPS, which can reduce the temperature of the air inlet block, reduce the temperature of the heating device at the air inlet block, and further cause the phenomenon that the liquid source is easily condensed.
In order to solve the problem, in the prior art, a heat insulation pad is generally added between an air inlet pipeline of a liquid source and an air inlet block, so that contact thermal resistance is increased through the heat insulation pad, heat transfer is reduced, and further, the influence on the temperature of a heating device is avoided. However, this approach adds a new sealing surface, which tends to affect the sealing performance between the inlet pipe and the inlet block of the liquid source.
Disclosure of Invention
The utility model aims to provide an air inlet device for semiconductor equipment and the semiconductor equipment, which can solve the problem that a liquid source is easy to generate condensation phenomenon in the prior art, and can avoid influencing the sealing performance between an air inlet pipeline and an air inlet block of the liquid source.
Embodiments of the present utility model are implemented as follows:
in one aspect of the embodiment of the utility model, an air inlet device for a semiconductor device is provided, which comprises an air inlet pipeline and an air inlet block, wherein two opposite ends of the air inlet pipeline are respectively connected with a liquid source system and the air inlet block, the air inlet pipeline comprises a pipeline body and a plurality of connecting lugs, the connecting lugs are arranged at intervals along the periphery of the pipeline body, an air inlet is arranged on the air inlet block, the pipeline body is correspondingly arranged with the air inlet, and the connecting lugs are fixedly connected with the air inlet block. This an air inlet unit for semiconductor device can solve the problem that the liquid source takes place the condensation phenomenon easily among the prior art, can also avoid influencing the sealing performance between air inlet pipe and the air inlet piece of liquid source simultaneously.
Optionally, a plurality of the connection lugs are uniformly distributed along the periphery of the pipe body.
Optionally, the air inlet device further comprises a heat insulation block, wherein a notch is formed in one side, close to the air inlet block, of the connecting lug, and the heat insulation block is arranged at the notch of the connecting lug.
Optionally, the thermal-insulated piece includes two contact surfaces that set up relatively and connect two the lateral wall face of contact surface, one the contact surface with the engaging lug laminating contact, another the contact surface with the piece laminating contact that admits air, part the lateral wall face with engaging lug laminating contact, part the lateral wall face deviates from the engaging lug lays.
Optionally, the material of the heat insulation block is polytetrafluoroethylene or ceramic.
Optionally, the air inlet device further comprises a fastener, wherein a connecting hole is formed in the connecting lug, a mounting hole is formed in the air inlet block, and the fastener sequentially penetrates through the connecting hole and the mounting hole, so that the connecting lug is fixedly connected with the air inlet block.
Optionally, the number of the fasteners is multiple, and the fasteners and the connecting lugs are arranged in a one-to-one correspondence.
Optionally, the air inlet device further comprises a sealing ring, wherein an accommodating groove is formed in the air inlet block, the accommodating groove is formed along the outer periphery of the air inlet, and the sealing ring is accommodated in the accommodating groove.
Optionally, the orthographic projection of the sealing ring on the air inlet block is positioned in the orthographic projection range of the pipeline body on the air inlet block.
In another aspect of the embodiments of the present utility model, a semiconductor device is provided, including an RPS, a liquid source system, and an air intake device for a semiconductor device as described above, where the RPS and the liquid source system are respectively connected to an air intake block of the air intake device. This an air inlet unit for semiconductor device can solve the problem that the liquid source takes place the condensation phenomenon easily among the prior art, can also avoid influencing the sealing performance between air inlet pipe and the air inlet piece of liquid source simultaneously.
The beneficial effects of the embodiment of the utility model include:
the air inlet device comprises an air inlet pipeline and an air inlet block, wherein the two opposite ends of the air inlet pipeline are respectively connected with a liquid source system and the air inlet block, the air inlet block is connected with the reaction chamber, so that a liquid source can be introduced into the air inlet block through the air inlet pipeline, and clean gas is generated by heating and vaporizing under the action of the heating device, can be introduced into the reaction chamber through the air inlet block and reacts with byproducts in the reaction chamber, and the aim of cleaning the reaction chamber is fulfilled. Specifically, the air inlet pipeline comprises a pipeline body and a plurality of connecting lugs, the plurality of connecting lugs are arranged along the periphery of the pipeline body at intervals, an air inlet is formed in the air inlet block, so that a liquid source can be introduced into the air inlet block through the air inlet, the pipeline body and the air inlet are correspondingly arranged, and the connecting lugs are fixedly connected with the air inlet block so as to enable the pipeline body and the air inlet block to be fixedly connected through the connecting lugs. Because the plurality of connecting lugs are arranged at intervals along the periphery of the pipeline body, the air inlet device provided by the utility model can ensure that the air inlet pipeline is fixedly connected with the air inlet block, and can reduce the contact area between the air inlet pipeline and the air inlet block, thereby increasing the contact thermal resistance and further reducing the heat loss of the air inlet block. In addition, compared with the technical scheme that the heat insulation pad is additionally arranged between the air inlet pipeline and the air inlet block in the prior art, the air inlet device provided by the utility model is not additionally provided with new parts (namely the heat insulation pad), so that a new sealing surface (namely the sealing surfaces between the two opposite sides of the heat insulation pad and the air inlet pipeline and the air inlet block) is not additionally arranged, and the influence on the sealing performance between the air inlet pipeline and the air inlet block can be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a structure of a semiconductor device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a second embodiment of the present utility model;
fig. 3 is an exploded schematic view of an air intake device for a semiconductor device according to an embodiment of the present utility model.
Icon: 100-an air intake device; 110-an air inlet pipeline; 111-a pipe body; 112-connecting lugs; 1121-notch; 1122-connecting holes; 120-air inlet block; 121-an air inlet; 122-mounting holes; 123-a receiving groove; 130-insulating blocks; 131-contact surface; 132-sidewall surfaces; 140-a sealing ring; 200-cooling device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be connected between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 to 3 in combination, an embodiment of the present utility model provides a semiconductor device, which includes an RPS, a liquid source system, and an air inlet device 100 (abbreviated as air inlet device 100) for the semiconductor device, wherein the RPS and the liquid source system are respectively connected with an air inlet block 120 of the air inlet device 100, so as to respectively introduce a plasma generated by a gas source and a cleaning gas generated by a liquid source into a reaction chamber through the air inlet device 100. The air inlet device 100 for the semiconductor device can solve the problem that the condensation phenomenon of the liquid source is easy to occur in the prior art, and can avoid influencing the sealing performance between the air inlet pipeline 110 and the air inlet block 120 of the liquid source.
Illustratively, the semiconductor apparatus further includes a heating device (not shown in the figure) and a cooling device 200, so that the liquid source is heated by the heating device to vaporize the liquid source to generate a cleaning gas, and the RPS is cooled by the cooling device 200, so as to improve the service life of the rubber ring of the RPS. Regarding the specific structures of the other devices included in the semiconductor apparatus and the heating device, the cooling device 200, and the other devices, those skilled in the art should be able to make reasonable selections and designs according to practical situations with reference to the prior art, and no specific limitation is made herein.
As shown in fig. 1 to 3, the air inlet device 100 includes an air inlet pipe 110 and an air inlet block 120, opposite ends of the air inlet pipe 110 are respectively connected with a liquid source system and the air inlet block 120, the air inlet pipe 110 includes a pipe body 111 and a plurality of connecting lugs 112, the plurality of connecting lugs 112 are arranged along the periphery of the pipe body 111 at intervals, an air inlet 121 is arranged on the air inlet block 120, the pipe body 111 is correspondingly arranged with the air inlet 121, and the connecting lugs 112 are fixedly connected with the air inlet block 120.
It should be noted that, as shown in fig. 1 to 3, the air inlet device 100 includes an air inlet pipe 110 and an air inlet block 120, opposite ends of the air inlet pipe 110 are respectively connected with a liquid source system and the air inlet block 120, the air inlet block 120 is connected with a reaction chamber, so that a liquid source can be introduced into the air inlet block 120 through the air inlet pipe 110 and heated and vaporized under the action of a heating device to generate a cleaning gas, and the cleaning gas can be introduced into the reaction chamber through the air inlet block 120 and react with byproducts in the reaction chamber, thereby achieving the purpose of cleaning the reaction chamber.
Specifically, as shown in fig. 1 to 3, the air inlet pipe 110 includes a pipe body 111 and a plurality of connection lugs 112, an air inlet 121 is disposed on the air inlet block 120, and the pipe body 111 and the air inlet 121 are disposed correspondingly, so that a liquid source can be introduced into the air inlet block 120 through the air inlet 121, and the connection lugs 112 are fixedly connected with the air inlet block 120, so that the pipe body 111 and the air inlet block 120 are fixedly connected through the connection lugs 112. Because the plurality of connecting lugs 112 are arranged at intervals along the periphery of the pipe body 111, the air inlet device 100 provided by the utility model can ensure that the air inlet pipe 110 and the air inlet block 120 are fixedly connected, and can reduce the contact area between the air inlet pipe 110 and the air inlet block 120, thereby increasing the contact thermal resistance and further reducing the heat loss of the air inlet block 120.
In addition, compared with the prior art in which the heat insulation pad is added between the air inlet pipe 110 and the air inlet block 120, the air inlet device 100 provided by the utility model does not add new components (i.e. the heat insulation pad), so that a new sealing surface (i.e. the sealing surfaces between the two opposite sides of the heat insulation pad and the air inlet pipe 110 and the air inlet block 120) is not added, and the sealing performance between the air inlet pipe 110 and the air inlet block 120 can be prevented from being influenced.
As shown in fig. 1 to 3, in the present embodiment, the plurality of connection lugs 112 are uniformly arranged along the outer circumference of the duct body 111 to improve the stability and reliability of the connection between the air intake duct 110 and the air intake block 120. For example, in the present embodiment, the air intake block 120 has a rectangular structure, the number of the connecting lugs 112 is four, and the four connecting lugs 112 are respectively distributed at four vertexes of the air intake block 120 correspondingly.
Regarding the actual number of the connection lugs 112, those skilled in the art should be able to make reasonable choices and designs according to the actual circumstances, without specific limitation. It should be noted that the number of the connection lugs 112 is not too large, so as to avoid the contact area between the air inlet pipe 110 and the air inlet block 120 to be too large, thereby increasing the heat loss of the air inlet block 120; the number of the connection lugs 112 is not too small to avoid affecting the stability and reliability of the connection between the air intake duct 110 and the air intake block 120.
As shown in fig. 2 and 3, in the present embodiment, the air intake device 100 further includes a heat insulation block 130, a notch 1121 is disposed on a side of the connection lug 112 near the air intake block 120, and the heat insulation block 130 is disposed at the notch 1121 of the connection lug 112. Optionally, the material of the insulating block 130 is polytetrafluoroethylene or ceramic, etc.
Specifically, as shown in fig. 3, the heat insulation block 130 includes two contact surfaces 131 disposed opposite to each other and a side wall surface 132 connecting the two contact surfaces 131, wherein one contact surface 131 is in contact with the connecting lug 112, the other contact surface 131 is in contact with the air intake block 120, a portion of the side wall surface 132 is in contact with the connecting lug 112, and a portion of the side wall surface 132 is away from the connecting lug 112, so as to increase the contact thermal resistance through the heat insulation block 130, thereby reducing heat transfer and avoiding affecting the temperature of the heating device. Also, since a portion of the sidewall surface 132 of the insulation block 130 is disposed away from the connection lugs 112, the insulation block 130 is substantially located at the atmosphere end, and thus a new sealing surface (i.e., similar to the sealing surface between the opposite sides of the insulation pad and the intake duct 110 and the intake block 120 in the related art) is not added, it is also possible to avoid affecting the sealing performance between the intake duct 110 and the intake block 120.
As shown in fig. 2 and 3, in this embodiment, the air intake device 100 further includes a fastener (not shown in the drawings), the connecting lug 112 is provided with a connecting hole 1122, the air intake block 120 is provided with a mounting hole 122, and the fastener sequentially penetrates through the connecting hole 1122 and the mounting hole 122, so that the connecting lug 112 is fixedly connected with the air intake block 120. Optionally, the number of the fasteners is plural, and the plural fasteners are disposed in one-to-one correspondence with the plural connection lugs 112. Illustratively, in the present embodiment, the number of fasteners is four to correspond one-to-one with the four connecting lugs 112.
As shown in fig. 3, in the present embodiment, the air inlet device 100 further includes a sealing ring 140, the air inlet block 120 is provided with a receiving groove 123, the receiving groove 123 is disposed along the outer periphery of the air inlet 121, and the sealing ring 140 is received in the receiving groove 123 to improve the sealing performance between the air inlet pipe 110 and the air inlet block 120, so as to avoid leakage of the liquid source through the gap between the air inlet pipe 110 and the air inlet block 120. The front projection of the sealing ring 140 on the air inlet block 120 should be located within the front projection range of the pipe body 111 on the air inlet block 120, so as to avoid interference between the sealing ring 140 and the connecting lug 112, thereby avoiding affecting the sealing performance between the air inlet pipe 110 and the air inlet block 120.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Claims (10)
1. An air inlet device (100) for semiconductor equipment is characterized by comprising an air inlet pipeline (110) and an air inlet block (120), wherein two opposite ends of the air inlet pipeline (110) are respectively connected with a liquid source system and the air inlet block (120), the air inlet pipeline (110) comprises a pipeline body (111) and a plurality of connecting lugs (112), the connecting lugs (112) are arranged at intervals along the periphery of the pipeline body (111), an air inlet (121) is formed in the air inlet block (120), the pipeline body (111) and the air inlet (121) are correspondingly arranged, and the connecting lugs (112) are fixedly connected with the air inlet block (120).
2. The air intake device (100) for a semiconductor apparatus according to claim 1, wherein a plurality of the connection lugs (112) are uniformly arranged along the outer periphery of the duct body (111).
3. The air inlet device (100) for a semiconductor apparatus according to claim 1, further comprising a heat insulating block (130), wherein a notch (1121) is provided at a side of the connection lug (112) close to the air inlet block (120), and the heat insulating block (130) is provided at the notch (1121) of the connection lug (112).
4. An air inlet device (100) for a semiconductor apparatus according to claim 3, characterized in that the heat insulating block (130) comprises two contact surfaces (131) arranged opposite each other and a side wall surface (132) connecting the two contact surfaces (131), one contact surface (131) being in abutting contact with the connecting lug (112), the other contact surface (131) being in abutting contact with the air inlet block (120), a part of the side wall surface (132) being in abutting contact with the connecting lug (112), a part of the side wall surface (132) being arranged away from the connecting lug (112).
5. An air inlet device (100) for a semiconductor apparatus according to claim 3, characterized in that the material of the heat insulating block (130) is polytetrafluoroethylene or ceramic.
6. The air inlet device (100) for a semiconductor apparatus according to claim 1, further comprising a fastener, wherein a connecting hole (1122) is provided on the connecting lug (112), a mounting hole (122) is provided on the air inlet block (120), and the fastener sequentially penetrates through the connecting hole (1122) and the mounting hole (122) so that the connecting lug (112) is fixedly connected with the air inlet block (120).
7. The air intake device (100) for a semiconductor apparatus according to claim 6, wherein the number of the fasteners is plural, and plural of the fasteners are provided in one-to-one correspondence with plural of the connection lugs (112).
8. The air inlet device (100) for a semiconductor apparatus according to claim 1, further comprising a sealing ring (140), wherein a receiving groove (123) is provided on the air inlet block (120), the receiving groove (123) is provided along the outer periphery of the air inlet (121), and the sealing ring (140) is accommodated in the receiving groove (123).
9. The air inlet device (100) for a semiconductor apparatus according to claim 8, wherein an orthographic projection of the seal ring (140) on the air inlet block (120) is located within an orthographic projection range of the pipe body (111) on the air inlet block (120).
10. A semiconductor device characterized by comprising an RPS, a liquid source system and an air intake (100) for a semiconductor device according to any one of claims 1-9, said RPS and said liquid source system being connected to an air intake block (120) of said air intake (100), respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320700062.8U CN219568053U (en) | 2023-03-31 | 2023-03-31 | Air inlet device for semiconductor equipment and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320700062.8U CN219568053U (en) | 2023-03-31 | 2023-03-31 | Air inlet device for semiconductor equipment and semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219568053U true CN219568053U (en) | 2023-08-22 |
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ID=87660780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320700062.8U Active CN219568053U (en) | 2023-03-31 | 2023-03-31 | Air inlet device for semiconductor equipment and semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219568053U (en) |
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- 2023-03-31 CN CN202320700062.8U patent/CN219568053U/en active Active
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