CN212983046U - Spraying temperature control device for preparing superconducting material based on MOVCD technology - Google Patents
Spraying temperature control device for preparing superconducting material based on MOVCD technology Download PDFInfo
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- CN212983046U CN212983046U CN202021947801.6U CN202021947801U CN212983046U CN 212983046 U CN212983046 U CN 212983046U CN 202021947801 U CN202021947801 U CN 202021947801U CN 212983046 U CN212983046 U CN 212983046U
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Abstract
The utility model discloses a temperature regulating device sprays based on MOVCD technique preparation superconducting material, it relates to MOVCD technical field. Its technical scheme main points including spray the board and with the cooling plate that sprays the contact of board bottom wall, all be provided with cooling tube in spraying board and the cooling plate. The utility model discloses increased on the basis of cooling plate and sprayed the cooling structure of board self, thereby both combine to improve accuse temperature precision, reduce the influence of spraying board temperature fluctuation to the film.
Description
Technical Field
The utility model relates to a MOVCD technical field, more specifically say, it relates to a temperature regulating device sprays based on MOVCD technique preparation superconducting material.
Background
In the process of film growth, the MOCVD (Metal-organic Chemical Vapor Deposition) technique, i.e., Metal-organic Chemical Vapor Deposition, is often used, and has the advantages of large epitaxial area, strong repeatability, accurate component control, high Deposition rate, large growth scale and the like, and is widely applied to the fields of semiconductors, superconducting materials and the like.
The MOCVD equipment has strict requirements on a film growth environment, the film growth quality is related to a plurality of factors, and in order to ensure the film growth quality, on one hand, the components and the flow rate of the reaction source gas reaching the surface of the substrate are required to be as uniform as possible, so that the reaction source gas is required to be uniformly sprayed to the surface of the substrate; on the other hand, the pre-reaction of the precursor gases should be suppressed so that the precursor gases are chemically reacted on the surface of the substrate.
When a rare earth barium copper oxide (abbreviated as REBCO, wherein RE is a rare earth element such as Y, Gd, Sm, etc.) film is deposited by the MOCVD technique, a metal organic source is vaporized by an evaporator, passes through a source tube, reaches a diffusion plate, is diffused by the diffusion plate, and then directly sprays the metal organic source onto a base band through a spray plate, thereby forming a film on the surface of the base band. The shower plate temperature is a key parameter, which affects the quality of the film. The gaseous phase metal organic source with the low temperature of the spraying plate can be condensed on the spraying plate, the temperature of the spraying plate is too high, the gaseous phase metal organic source can react on the spraying plate in advance, the spraying holes are easy to block, and the reaction source gas can not be uniformly sprayed to the surface of the substrate, so that the quality of the film is influenced.
Chinese patent publication No. CN105274498A discloses a gas shower head, a method for manufacturing the same, and a thin film growth reactor, wherein the gas shower head includes a gas distribution diffusion plate and a water cooling plate, and a coolant pipeline is disposed in the water cooling plate.
However, the gas distribution diffusion plate can slightly deform after being heated, so that the contact effect of the gas distribution diffusion plate and the water cooling plate is influenced, the cooling effect of the water cooling plate on the gas distribution diffusion plate is further influenced, and the temperature control precision is influenced.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a temperature regulating device sprays based on MOVCD technique preparation superconducting material, it has increased the cooling structure based on spraying board self on the basis of cooling plate, thereby both combine to improve accuse temperature precision, reduce the influence of spraying board temperature fluctuation to the film.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a temperature regulating device sprays based on MOVCD technique preparation superconducting material, including spray the board and with the cooling plate that sprays the board bottom wall contact, all be provided with cooling tube in spray board and the cooling plate.
Furthermore, the cooling pipeline in the spray plate is an air cooling pipeline or a liquid cooling pipeline.
Furthermore, the cooling pipeline in the cooling plate is an air cooling pipeline or a liquid cooling pipeline.
Furthermore, the cooling pipeline in the spraying plate is an air cooling pipeline, and the cooling pipeline in the cooling plate is a liquid cooling pipeline.
Furthermore, the cooling pipeline in the spraying plate is a liquid cooling pipeline, and the cooling pipeline in the cooling plate is an air cooling pipeline.
Furthermore, a plurality of cooling pipelines are arranged in the cooling plate, and at least two cooling pipelines with opposite medium flowing directions are arranged in the plurality of cooling pipelines.
Furthermore, a plurality of cooling pipelines are arranged in the spraying plate, and at least two cooling pipelines with opposite medium flowing directions are arranged in the plurality of cooling pipelines.
Further, the cooling pipeline in the spray plate is close to the bottom wall of the spray pipe.
Furthermore, an open slot is arranged in the middle of the spraying plate, and a plurality of spraying holes are formed in the bottom wall in the open slot; and a cooling pipeline in the spraying plate is close to the inner side wall of the open slot.
Furthermore, an open slot is arranged in the middle of the spraying plate, and a plurality of spraying holes are formed in the bottom wall in the open slot; the cooling duct in the shower plate can surround the open groove.
To sum up, the utility model discloses following beneficial effect has:
1. cooling pipelines are arranged in the spray plate and the cooling plate, so that the rough control of water cooling can be realized through the cooling plate, the fine control of gas cooling can be realized through the spray plate, the temperature control precision can be improved by combining the spray plate and the cooling plate, the precise temperature control can be realized, and the influence of the temperature fluctuation of the spray plate on the film can be reduced;
2. the bidirectional design of the medium flowing direction of the cooling pipeline can improve the uniformity of heat exchange, thereby enabling the temperature to be more stable.
Drawings
FIG. 1 is a schematic structural diagram of a spraying temperature control device for preparing a superconducting material based on MOVCD technology in an embodiment;
FIG. 2 is a schematic structural view of a cooling plate in the embodiment;
fig. 3 is a schematic structural view of the shower plate in the embodiment.
In the figure: 1. a source tube; 2. a diffusion plate; 3. a spray plate; 31. an open slot; 32. a first air cooling duct; 322. a first air-cooled outlet; 33. a second air cooling duct; 331. a second air-cooled inlet; 4. a cooling plate; 41. an opening; 42. a first liquid cooling conduit; 421. a first liquid cooling inlet; 422. a first liquid cooling outlet; 43. a second liquid cooling conduit; 431. a second liquid cooling inlet; 432. a second liquid cooling outlet; 5. heating plates; 6. and (4) a base band.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Example (b):
a spray control device based on MOVCD technology for preparing superconducting materials, refer to fig. 1 to 3, comprising a spray plate 3 and a cooling plate 4, wherein the cooling plate 4 is positioned below the spray plate 3 and is contacted with the bottom wall of the spray plate 3; an open slot 31 is arranged in the middle of the spray plate 3, a plurality of spray holes are uniformly distributed on the inner bottom wall of the open slot 31, and an opening 41 matched with the open slot 31 is arranged in the middle of the cooling plate 4.
Referring to fig. 1, when preparing REBCO superconducting thin film, a diffusion plate 2 is disposed on the top wall of a spray plate 3, a source tube 1 is disposed on the diffusion plate 2, a heating plate 5 is disposed below a cooling plate 4, and a base band 6 is disposed on the heating plate 5; after being vaporized by an evaporator, the metal organic source enters a cavity through a source tube 1, firstly passes through a diffusion plate 2 after entering the cavity, is diffused by the diffusion plate 2, then is sprayed onto a base band 6 through a spraying plate 3, and reacts on the base band 6 to generate a REBCO superconducting film; the growth temperature of the REBCO superconducting film is relatively high, various heat losses exist in the process of heating the base band 6, the heating plate 5 needs to be heated to be close to 1000 ℃ to be capable of maintaining the temperature required by the film growth, and the temperature of the spraying plate 3 only needs to be controlled to be 300 ℃.
Referring to fig. 1 to 3, in order to control the temperature of the shower plate 3, cooling pipes are provided in both the shower plate 3 and the cooling plate 4 in the present embodiment; cooling pipelines can be divided into air cooling pipelines and liquid cooling pipelines according to different cooling media; the cooling pipeline in the spray plate 3 can be an air cooling pipeline or a liquid cooling pipeline, the cooling pipeline in the cooling plate 4 can be an air cooling pipeline or a liquid cooling pipeline, and meanwhile, a gas-liquid combination, a gas-gas combination, a liquid-liquid combination or a liquid-gas combination can be formed between the spray plate 3 and the cooling plate 4; in this embodiment, an air cooling pipeline is arranged in the spray plate 3, a liquid cooling pipeline is arranged in the cooling plate 4, and the liquid cooling medium is water.
Referring to fig. 1 and 2, the cooling plate 4 is connected with a water chiller through a pipeline, and cools the spray plate 3 through water circulation; in this embodiment, two cooling pipelines are arranged in the cooling plate 4, namely a first liquid cooling pipeline 42 and a second liquid cooling pipeline 43; the side wall of the cooling plate 4 is provided with a first liquid cooling inlet 421 and a first liquid cooling outlet 422 which are communicated with the first liquid cooling pipeline 42, and a second liquid cooling inlet 431 and a second liquid cooling outlet 432 which are communicated with the second liquid cooling pipeline 43; the first liquid cooling inlet 421, the first liquid cooling outlet 422, the second liquid cooling inlet 431 and the second liquid cooling outlet 432 are all located on the same side wall of the cooling plate 4.
Referring to fig. 2, in the present embodiment, the first liquid-cooling pipeline 42 and the second liquid-cooling pipeline 43 are respectively connected with a flow meter, so that the flow rate of the cooling water can be independently controlled; the first liquid cooling pipeline 42 and the second liquid cooling pipeline 43 are both U-shaped, and the medium flowing directions of the first liquid cooling pipeline 42 and the second liquid cooling pipeline 43 are opposite in this embodiment; the medium flowing directions of the two pipelines are opposite, so that the uniformity of heat exchange can be improved in the circulating process, and the temperature is more stable.
Referring to fig. 3, in the present embodiment, two cooling pipes, namely a first air-cooling pipe 32 and a second air-cooling pipe 33, are disposed in the shower plate 3; the side wall of the spray plate 3 is provided with a first air-cooling inlet and a first air-cooling outlet 322 which are communicated with the first air-cooling pipeline 32, and a second air-cooling inlet 331 and a second air-cooling outlet which are communicated with the second air-cooling pipeline 33; the first air-cooled outlet 322 and the second air-cooled inlet 331 are located on the same sidewall of the spray plate 3, and the first air-cooled inlet and the second air-cooled outlet are located on the same sidewall of the spray plate 3, and two sides are disposed oppositely.
Referring to fig. 3, in the present embodiment, the medium flowing directions of the first air-cooling pipeline 32 and the second air-cooling pipeline 33 are opposite, so that the uniformity of heat exchange can be improved in the circulation process, and the temperature is more stable; the first gas-cooled pipeline 32 and the second gas-cooled pipeline 33 are respectively connected with a gas flowmeter, so that the gas flow can be controlled independently; the first and second air-cooled ducts 32, 33 cooperate to surround the open slot 31 to cool the entire shower area.
Referring to fig. 1 and 3, the first air-cooling duct 32 and the second air-cooling duct 33 are both close to the bottom wall of the shower plate 3, the thickness of the shower plate 3 in this embodiment is 15mm, the diameter of the air-cooling duct is 8mm, the distance from the axis of the air-cooling duct to the bottom wall of the shower plate 3 is 6mm, and the distance from the top wall of the shower plate 3 is 9 mm; the air-cooled pipeline is not in the middle of the spray plate 3, but is close to the bottom wall of the spray plate 3, the purpose is to approach the spray holes, the air-cooled cooling effect is improved, meanwhile, the air-cooled pipeline is close to the bottom wall of the spray plate 3 and can be closer to the cooling plate 4, the condition that the contact with the horizontal plate 4 is not good due to slight deformation of the spray plate 3 after being heated is improved, and therefore, the water-cooled cooling is facilitated; meanwhile, the air cooling pipeline is close to the inner side wall of the open slot 31, the distance between the axis of the air cooling pipeline and the inner side wall of the open slot 31 is 6mm in the embodiment, and the purpose is to approach the spray holes to improve the air cooling effect.
The working principle is as follows:
the utility model can control water flow rate through the flowmeter independently through cooling plate 4 water cooling circulation cooling, carries out coarse adjustment, and simultaneously combines spray plate 3 self gas cooling, can be controlled independently through the gas flowmeter, carries out fine adjustment; even if slight deformation appears in spray plate 3, cause and the cooling plate 4 contact when not good, also can be through increase gas flow by a wide margin, reduce water flow, carry out accurate accuse temperature to reduce the influence of 3 temperature fluctuations of spray plate to the film.
Claims (10)
1. A spray temperature control device based on MOVCD technology preparation superconducting material, its characterized in that: the spraying plate and the cooling plate contacted with the bottom wall of the spraying plate are both internally provided with cooling pipelines.
2. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: and the cooling pipeline in the spray plate is an air cooling pipeline or a liquid cooling pipeline.
3. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: and the cooling pipeline in the cooling plate is an air cooling pipeline or a liquid cooling pipeline.
4. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: the cooling pipeline in the spraying plate is an air cooling pipeline, and the cooling pipeline in the cooling plate is a liquid cooling pipeline.
5. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: the cooling pipeline in the spraying plate is a liquid cooling pipeline, and the cooling pipeline in the cooling plate is an air cooling pipeline.
6. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: the cooling plate is internally provided with a plurality of cooling pipelines, and the plurality of cooling pipelines at least comprise two cooling pipelines with opposite medium flowing directions.
7. The spraying temperature control device for preparing superconducting materials based on MOVCD technology of claim 1, wherein: the spraying plate is internally provided with a plurality of cooling pipelines, and the cooling pipelines at least comprise two cooling pipelines with opposite medium flowing directions.
8. The spraying temperature control device for preparing superconducting materials based on MOVCD technology according to any one of claims 1-7, wherein: and the cooling pipeline in the spray plate is close to the bottom wall of the spray plate.
9. The spraying temperature control device for preparing superconducting materials based on MOVCD technology according to any one of claims 1-7, wherein: an open slot is formed in the middle of the spraying plate, and a plurality of spraying holes are formed in the bottom wall of the open slot; and a cooling pipeline in the spraying plate is close to the inner side wall of the open slot.
10. The spraying temperature control device for preparing superconducting materials based on MOVCD technology according to any one of claims 1-7, wherein: an open slot is formed in the middle of the spraying plate, and a plurality of spraying holes are formed in the bottom wall of the open slot; the cooling duct in the shower plate can surround the open groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021947801.6U CN212983046U (en) | 2020-09-08 | 2020-09-08 | Spraying temperature control device for preparing superconducting material based on MOVCD technology |
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| CN202021947801.6U CN212983046U (en) | 2020-09-08 | 2020-09-08 | Spraying temperature control device for preparing superconducting material based on MOVCD technology |
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| CN212983046U true CN212983046U (en) | 2021-04-16 |
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| CN202021947801.6U Active CN212983046U (en) | 2020-09-08 | 2020-09-08 | Spraying temperature control device for preparing superconducting material based on MOVCD technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115341197A (en) * | 2022-09-15 | 2022-11-15 | 东部超导科技（苏州）有限公司 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
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2020
- 2020-09-08 CN CN202021947801.6U patent/CN212983046U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115341197A (en) * | 2022-09-15 | 2022-11-15 | 东部超导科技（苏州）有限公司 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
| CN115341197B (en) * | 2022-09-15 | 2023-08-11 | 东部超导科技（苏州）有限公司 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
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