CN219553602U - Automatic arrangement equipment of a section wafer - Google Patents
Automatic arrangement equipment of a section wafer Download PDFInfo
- Publication number
- CN219553602U CN219553602U CN202320911172.9U CN202320911172U CN219553602U CN 219553602 U CN219553602 U CN 219553602U CN 202320911172 U CN202320911172 U CN 202320911172U CN 219553602 U CN219553602 U CN 219553602U
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- wafer
- telescopic cylinder
- linear guide
- connecting rod
- baffle
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Intermediate Stations On Conveyors (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
The utility model relates to the technical field of automatic wafer arrangement, in particular to automatic wafer arrangement equipment which comprises an equipment main body, wherein a partition plate is arranged in the equipment main body, an upper window and a lower window are sequentially arranged in the partition plate from top to bottom, a conveyor belt is arranged on one side of the partition plate, which is close to the inside of the equipment main body, a connecting rod is arranged at the top end of the conveyor belt, a second telescopic cylinder is arranged in the top end of the connecting rod, a miniature telescopic cylinder is arranged at the execution end of the second telescopic cylinder, a retaining plate is connected at the execution end of the miniature telescopic cylinder, and a moving groove is arranged at the connection part of the miniature telescopic cylinder and the connecting rod.
Description
Technical Field
The utility model relates to the technical field of automatic wafer arrangement, in particular to automatic wafer arrangement equipment.
Background
The chip is processed by a wafer, and the semiconductor material with very thin thickness, very high precision and very good consistency of the chip is used as a base material. The wafer can classify products by thickness in the processing process, the thickness is the same, the frequency is the same, and different customers can be met by products with different frequencies, so that the products can be accurately classified according to frequency segments before shipment, and the requirements of different customers are met.
Through retrieval, chinese patent number CN114713510a discloses an automatic wafer classifying device, which comprises a base, a first placing component, a second placing component, a wafer transporting component and a wafer detecting component, wherein the first placing component, the second placing component and the wafer transporting component are all fixedly arranged on the base, the wafer transporting component is arranged between the first placing component and the second placing component, the wafer detecting component is arranged on the first placing component, and the wafer transporting component and the wafer detecting component are electrically connected with a microcontroller; the first subassembly of placing is used for placing the wafer before the detection, and the second is placed the subassembly and is used for placing the wafer after the detection, and the frequency that the wafer detection subassembly was used for detecting the wafer, and the wafer transportation subassembly is used for transporting the wafer, and the wafer transportation subassembly is carried the wafer on the second and is placed the subassembly and detect on the wafer detection subassembly, carries the wafer after the detection and stores the basket that corresponds in the second place the subassembly, and rethread microcontroller makes the classification equipment realize automaticly.
Above-mentioned patent product can effectually guarantee that the wafer is in the horizontality and carries in the course of working, but among the prior art, and the categorised collator volume of wafer is great, carries out fixed mounting through artificial transport when the installation, uses the claw of snatching to snatch and place the wafer when classifying the wafer in above-mentioned patent product, if snatch the claw and break down then can make the wafer drop, and classify through the claw of snatching and make the inside operation of device comparatively loaded down with trivial details, the inefficiency.
Disclosure of Invention
The utility model aims to provide wafer automatic arrangement equipment for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides an automatic arrangement equipment of wafer, includes the equipment main part, be equipped with the baffle in the equipment main part, the baffle is equipped with window and lower window from top to bottom in proper order, the baffle is close to the inside one side of equipment main part is equipped with the conveyer belt, the conveyer belt is close to one side of baffle is equipped with placement machine and constructs, placement machine constructs including connecting rod, the flexible jar of second, miniature flexible jar, butt plate and movable groove, the conveyer belt top is close to baffle department is equipped with the connecting rod, the connecting rod is the door shape setting, the inside flexible jar of second that is equipped with in connecting rod top, the execution end of the flexible jar of second is equipped with miniature flexible jar, the execution end connection of miniature flexible jar is equipped with butt plate, miniature flexible jar with the connecting rod junction is equipped with movable groove.
In a preferred embodiment of the present utility model, the second telescopic cylinder is disposed horizontally to the conveyor belt, and the second telescopic cylinder is disposed vertically to the micro telescopic cylinder.
As a preferable scheme of the utility model, an empty blocking plug is arranged in the upper window and positioned at the top end of the partition board, and an air cylinder is arranged at the bottom end of the empty blocking plug.
As a preferable scheme of the utility model, the lower window is provided with a wafer clamping plug, the bottom end of the wafer clamping plug is provided with a first telescopic cylinder, and the bottom end of the first telescopic cylinder is connected with an extraction device.
As a preferable scheme of the utility model, the extracting device comprises a first linear guide rail, a second linear guide rail, a clamping base, an electric control telescopic rod, a cross rod, an electromagnetic chuck and a motor, wherein the bottom end of the wafer clamping plug is connected with the first linear guide rail, one end of the first linear guide rail, which is far away from the wafer clamping plug, is provided with the second linear guide rail, the top end of the second linear guide rail is provided with the clamping base, the top end of the clamping base is provided with the electric control telescopic rod, the executing end of the electric control telescopic rod is provided with the motor, the joint of the electric control telescopic rod and the motor is provided with the cross rod, and one end of the cross rod, which is far away from the electric control telescopic rod, is provided with the electromagnetic chuck.
As a preferable scheme of the utility model, the motor is fixedly connected with the cross rod, and the cross rod is movably connected with the electric control telescopic rod.
Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the conveying assembly is adopted, the conveying belt is additionally arranged between the empty clamping plug and the wafer clamping plug, the abutting plate abuts against the wafer through the telescopic cylinder in the connecting rod, the wafer is moved to the empty clamping plug position under the action of the telescopic cylinder, the wafer is inserted into the empty clamping plug under the pushing of the abutting plate by inertia, and the classified wafer can be quickly and efficiently loaded into the clamping plug when the wafer is tidied.
Drawings
FIG. 1 is a perspective view of the overall structure of the present utility model;
FIG. 2 is a perspective view of the internal structure of the present utility model;
FIG. 3 is a perspective view of the placement mechanism of the present utility model;
FIG. 4 is a cross-sectional view of the placement mechanism of the present utility model.
In the figure: 1. an apparatus main body; 101. a partition plate; 102. an upper window; 103. a lower window; 2. an empty blocking plug; 201. a cylinder; 3. wafer jam; 301. a first telescopic cylinder; 4. an extraction device; 401. a first linear guide rail; 402. a second linear guide rail; 403. clamping a base; 404. an electric control telescopic rod; 405. a cross bar; 406. an electromagnetic chuck; 407. a motor; 5. a conveyor belt; 6. a placement mechanism; 601. a connecting rod; 602. a second telescopic cylinder; 603. a miniature telescopic cylinder; 604. a retaining plate; 605. and a moving groove.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides an automatic arrangement equipment of wafer, includes equipment main part 1, be equipped with baffle 101 in the equipment main part 1, baffle 101 is equipped with window 102 and lower window 103 from top to bottom in proper order, baffle 101 is close to inside one side of equipment main part 1 is equipped with conveyer belt 5, conveyer belt 5 is close to one side of baffle 101 is equipped with places mechanism 6, place mechanism 6 includes connecting rod 601, the flexible jar 602 of second, miniature flexible jar 603, butt plate 604 and movable groove 605, the conveyer belt 5 top is close to baffle 101 department is equipped with connecting rod 601, connecting rod 601 is the door shape setting, the inside second flexible jar 602 that is equipped with in connecting rod 601 top, the execution end of the flexible jar 602 of second is equipped with miniature flexible jar 603, the execution end connection of miniature flexible jar 603 is equipped with butt plate 604, miniature flexible jar 603 with the connecting rod 601 junction is equipped with movable groove 605, second flexible jar 602 with conveyer belt 5 is the level setting, second flexible jar 602 is perpendicular setting with miniature jar 603.
In this embodiment, when sorting wafers with different thicknesses, after the electromagnetic chuck 406 places the wafers on the conveyor belt 5, the conveyor belt 5 moves the wafers towards the position of the empty chuck 2, when the wafers move to the position of the connecting rod 601, the image sensor arranged in the connecting rod 601 captures the images of the wafers and sends the images to the controller through the electric signals, the controller receives the processed electric signals to the second telescopic cylinder 602 and the micro telescopic cylinder 603, the micro telescopic cylinder 603 drives the resisting plate 604 downwards to abut against the wafers, the second telescopic cylinder 602 starts to stretch towards the position of the empty chuck 2, the resisting plate 604 moves towards the position of the empty chuck 2, the micro telescopic cylinder 603 retracts, the wafers move towards the clamping grooves of the empty chuck 2 under the inertia effect, and the wafers are quickly inserted into the middle of the empty chuck 2.
Referring to fig. 1-2, an empty clamping plug 2 is disposed in the upper window 102 and located at the top end of the partition 101, an air cylinder 201 is disposed at the bottom end of the empty clamping plug 2, a wafer clamping plug 3 is disposed at the lower window 103, a first telescopic cylinder 301 is disposed at the bottom end of the wafer clamping plug 3, an extraction device 4 is connected to the bottom end of the first telescopic cylinder 301, the extraction device 4 includes a first linear guide 401, a second linear guide 402, a clamping base 403, an electric control telescopic rod 404, a cross rod 405, an electromagnetic chuck 406 and a motor 407, a first linear guide 401 is disposed at the bottom end connection of the bottom end of the wafer clamping plug 3, a second linear guide 402 is disposed at one end of the first linear guide 401, a clamping base 403 is disposed at the top end of the second linear guide 402, an electric control telescopic rod 404 is disposed at the top end of the clamping base 403, a cross rod 405 is disposed at the connection of the electric control telescopic rod 404 and the motor 407, and the cross rod 405 is disposed at one end far from the electric control telescopic rod 406, and the electric control telescopic rod 405 is movably connected to the cross rod 405.
In this embodiment, when sorting wafers with different thicknesses, the wafers to be sorted are placed in the wafer chuck 3 and put on the first linear guide 401 of the lower window 103, the wafer chuck 3 is connected with the first linear guide 401 through clamping, the first linear guide 401 moves the wafer chuck 3 inwards, when moving to the other end of the first linear guide 401, the controller sends an electrical signal to the second linear guide 402 and the electrical control telescopic rod 404, the second linear guide 402 moves the clamping base 403 to the position of the wafer chuck 3, the electrical control telescopic rod 404 drives the cross rod 405, that is, the electromagnetic chuck 406 is close to the wafer in the wafer chuck 3 to absorb and extract the wafer, the cross rod 405 is driven to move to the top end of the conveyor belt 5 through the rotation of the motor 407 under the movement of the second linear guide 402, and the electromagnetic chuck 406 puts down the wafer.
The bottom of the electromagnetic chuck 406 is provided with a negative pressure hole, an air duct is arranged in the electromagnetic chuck 406, a solenoid valve in the prior art is arranged on the air duct and controlled by a microcontroller, when the electromagnetic chuck 406 grabs a wafer, the solenoid valve opens an air source to suck air, the wafer is fixed on the electromagnetic chuck 406 through the negative pressure hole, and when the electromagnetic chuck 406 moves to the position of the conveyor belt 5, the negative pressure does not exist in the negative pressure hole, so that the purpose of loosening the wafer is achieved.
The cylinder 201 moves the empty jam 2 downward so that it can be aligned with the empty slot when inserted after wafer alignment.
The working flow of the utility model is as follows: the model of the controller is as follows: "6ES7214-1BG40-0XB0".
When classifying wafers with different thicknesses, the wafers to be classified are placed in the wafer clamping plugs 3 and placed on the first linear guide rail 401 of the lower window 103, the wafer clamping plugs 3 are connected with the first linear guide rail 401 through clamping, the first linear guide rail 401 moves the wafer clamping plugs 3 inwards, when the wafer clamping plugs are moved to the other end of the first linear guide rail 401, the controller sends electric signals to the second linear guide rail 402 and the electric control telescopic rod 404, the second linear guide rail 402 moves the clamping base 403 to the position of the wafer clamping plugs 3, the electric control telescopic rod 404 drives the cross rod 405, namely the electromagnetic chuck 406, to be close to the wafers in the wafer clamping plugs 3 to absorb and extract the wafers, the microcontroller in the prior art enables classification equipment to realize automation, the cross rod 405 is driven to move to the position of the conveyor belt 5 corresponding to the empty clamping plugs 2 classified by the wafers under the movement of the second linear guide rail 402, the electric control rod is driven by the rotation of the motor 407 to move the cross rod 405 to the top end of the conveyor belt 5, and the electromagnetic chuck 406 puts down the wafers.
The bottom of the electromagnetic chuck 406 is provided with a negative pressure hole, an air duct is arranged in the electromagnetic chuck 406, a solenoid valve in the prior art is arranged on the air duct and controlled by a microcontroller, when the electromagnetic chuck 406 grabs a wafer, the solenoid valve opens an air source to suck air, the wafer is fixed on the electromagnetic chuck 406 through the negative pressure hole, and when the electromagnetic chuck 406 moves to the position of the conveyor belt 5, the negative pressure does not exist in the negative pressure hole, so that the purpose of loosening the wafer is achieved.
The first telescopic cylinder 301 pushes the wafer inside the wafer chuck 3 upwards, so that the subsequent electromagnetic chuck 4 can absorb and extract the wafer conveniently.
After the electromagnetic chuck 406 places the wafer on the conveyor belt 5, the conveyor belt 5 moves the wafer towards the position of the empty clamping plug 2, when the wafer moves to the position of the connecting rod 601, the image sensor arranged in the connecting rod 601 captures the image of the wafer and sends the image to the controller through an electric signal, the controller receives the processed electric signal and sends the processed electric signal to the second telescopic cylinder 602 and the micro telescopic cylinder 603, the micro telescopic cylinder 603 drives the retaining plate 604 downwards to abut against the wafer, the second telescopic cylinder 602 starts to stretch towards the position of the empty clamping plug 2, the retaining plate 604 is enabled to abut against the wafer to move towards the position of the empty clamping plug 2, the micro telescopic cylinder 603 retracts, the wafer moves towards the clamping groove of the empty clamping plug 2 under the inertia effect, and the wafer is quickly inserted into the middle of the empty clamping plug 2.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Automatic arrangement equipment of a wafer, including equipment main part (1), its characterized in that: be equipped with baffle (101) in equipment main part (1), baffle (101) are equipped with window (102) and lower window (103) from top to bottom in proper order, baffle (101) are close to inside one side of equipment main part (1) is equipped with conveyer belt (5), conveyer belt (5) are close to one side of baffle (101) is equipped with placement machine constructs (6), placement machine constructs (6) including connecting rod (601), second telescopic cylinder (602), miniature telescopic cylinder (603), butt plate (604) and movable groove (605), conveyer belt (5) top is close to baffle (101) department is equipped with connecting rod (601), connecting rod (601) are the door shape setting, connecting rod (601) top inside is equipped with second telescopic cylinder (602), the execution end of second telescopic cylinder (602) is equipped with miniature telescopic cylinder (603), the execution end connection of miniature telescopic cylinder (603) is equipped with butt plate (604), miniature telescopic cylinder (603) with connecting rod (601) junction is equipped with movable groove (605).
2. A wafer finishing apparatus according to claim 1, wherein: the second telescopic cylinder (602) and the conveyor belt (5) are horizontally arranged, and the second telescopic cylinder (602) and the miniature telescopic cylinder (603) are vertically arranged.
3. A wafer finishing apparatus according to claim 1, wherein: an empty blocking plug (2) is arranged in the upper window (102) and positioned at the top end of the partition board (101), and an air cylinder (201) is arranged at the bottom end of the empty blocking plug (2).
4. A wafer finishing apparatus according to claim 1, wherein: the lower window (103) is provided with a wafer clamping plug (3), a first telescopic cylinder (301) is arranged at the bottom end of the wafer clamping plug (3), and an extraction device (4) is connected with the bottom end of the first telescopic cylinder (301).
5. A wafer finishing apparatus according to claim 4, wherein: the extraction element (4) include first linear guide (401), second linear guide (402), press from both sides base (403), automatically controlled telescopic link (404), horizontal pole (405), electromagnet (406) and motor (407), wafer card stopper (3) bottom connection is equipped with first linear guide (401), first linear guide (401) are kept away from the one end of wafer card stopper (3) is equipped with second linear guide (402), second linear guide (402) top is equipped with and presss from both sides and get base (403), it is equipped with automatically controlled telescopic link (404) to press from both sides base (403) top, the execution end of automatically controlled telescopic link (404) is equipped with motor (407), automatically controlled telescopic link (404) with motor (407) junction is equipped with horizontal pole (405), horizontal pole (405) are kept away from the one end of automatically controlled telescopic link (404) is equipped with electromagnet (406).
6. A wafer finishing apparatus according to claim 5, wherein: the motor (407) is fixedly connected with the cross rod (405), and the cross rod (405) is movably connected with the electric control telescopic rod (404).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320911172.9U CN219553602U (en) | 2023-04-19 | 2023-04-19 | Automatic arrangement equipment of a section wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320911172.9U CN219553602U (en) | 2023-04-19 | 2023-04-19 | Automatic arrangement equipment of a section wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219553602U true CN219553602U (en) | 2023-08-18 |
Family
ID=87737303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320911172.9U Active CN219553602U (en) | 2023-04-19 | 2023-04-19 | Automatic arrangement equipment of a section wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219553602U (en) |
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2023
- 2023-04-19 CN CN202320911172.9U patent/CN219553602U/en active Active
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