CN219553581U - Semiconductor wafer recognition and sorting equipment - Google Patents

Semiconductor wafer recognition and sorting equipment Download PDF

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Publication number
CN219553581U
CN219553581U CN202320346209.8U CN202320346209U CN219553581U CN 219553581 U CN219553581 U CN 219553581U CN 202320346209 U CN202320346209 U CN 202320346209U CN 219553581 U CN219553581 U CN 219553581U
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semiconductor wafer
frame
sorting
sorting device
utility
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吴为珍
孙涛涛
吴拓
孙昌才
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Wuhu Yiying Dingyu Automation Equipment Co ltd
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Wuhu Yiying Dingyu Automation Equipment Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model relates to the technical field of semiconductor wafers, in particular to semiconductor wafer identification and sorting equipment, which comprises a machine body, wherein a feeding frame for clamping grooves of wafers is arranged at the top of the machine body, a plurality of clamping groove frames are arranged at the top of the machine body, empty clamping grooves are formed in the inner walls of the clamping groove frames, and a sorting assembly for sorting the clamping grooves of the wafers is arranged at the top of the machine body. The utility model greatly saves the labor intensity of manpower, improves the measuring operation efficiency, and completes the original transportation and measurement.

Description

一款半导体晶圆识别排序设备A semiconductor wafer identification and sorting equipment

技术领域technical field

本实用新型涉及半导体晶圆技术领域,具体为一款半导体晶圆识别排序设备。The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer identification and sorting device.

背景技术Background technique

晶圆是指硅半导体集成电路制作所用的硅晶片,由于其形状为圆形,故称为晶圆;在硅晶片上可加工制作成各种电路元件结构,而成为有特定电性功能之IC产品。Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. product.

根据申请号为CN202122034600.8的专利文献所提供的一种半导体晶圆检测用智能分拣装置,包括底板,所述底板顶部的右侧固定连接有驱动框,所述驱动框内腔的底部固定连接有第一电机,所述第一电机的输出端固定连接有竖杆,所述竖杆左侧的顶部固定连接有横板,所述横板的表面固定连接有第二电动伸缩杆。本实用新型通过底板、第一电动伸缩杆、顶盘、传动框、驱动框、第一电机、竖杆、横板、卡框、限位杆、第二电动伸缩杆、卡爪、第三电动伸缩杆、竖板、传动带、输出辊和第二电机,可使装置达到使用效果好的功能,解决了现有市场上的半导体晶圆检测用分拣装置不具备使用效果好的功能,直接夹取易产生碎裂的现象,不利于使用者操作使用的问题。According to the patent document with application number CN202122034600.8, an intelligent sorting device for semiconductor wafer detection is provided, which includes a bottom plate, a driving frame is fixedly connected to the right side of the top of the bottom plate, and the bottom of the inner cavity of the driving frame is fixed A first motor is connected, the output end of the first motor is fixedly connected with a vertical rod, the top of the left side of the vertical rod is fixedly connected with a horizontal plate, and the surface of the horizontal plate is fixedly connected with a second electric telescopic rod. The utility model uses the bottom plate, the first electric telescopic rod, the top plate, the transmission frame, the driving frame, the first motor, the vertical rod, the horizontal plate, the card frame, the limit rod, the second electric telescopic rod, the claws, the third electric motor The telescopic rod, the vertical plate, the transmission belt, the output roller and the second motor can make the device achieve the function of good use effect, which solves the problem that the sorting device for semiconductor wafer detection in the existing market does not have the function of good use effect and directly clamps the The phenomenon of fragmentation is easy to occur, which is not conducive to the problem of user's operation and use.

上述专利中的半导体晶圆检测用智能分拣装置,解决了现有市场上的半导体晶圆检测用分拣装置不具备使用效果好的功能,直接夹取易产生碎裂的现象,不利于使用者操作使用的问题。目前根据卡塞上的条形码信息和晶圆上的镭刻码重新排序作业都是由人工完成,人工作业费时费力,效率低并且容易出错。The intelligent sorting device for semiconductor wafer detection in the above patent solves the problem that the sorting device for semiconductor wafer detection in the existing market does not have the function of good use effect, and the phenomenon that it is easy to be broken when directly clamped is not conducive to use. The problem of operation and use by the operator. At present, the reordering operations based on the barcode information on the jam and the radium engraved code on the wafer are all done manually, which is time-consuming, labor-intensive, inefficient and error-prone.

实用新型内容Utility model content

本实用新型的目的在于提供一款半导体晶圆识别排序设备,以解决上述背景技术中提出的问题。The purpose of this utility model is to provide a semiconductor wafer identification and sorting device to solve the problems raised in the above-mentioned background technology.

为实现上述目的,本实用新型提供如下技术方案:In order to achieve the above object, the utility model provides the following technical solutions:

一款半导体晶圆识别排序设备,包括机体,所述机体顶部设置有用于对晶圆卡槽的上料架,所述机体顶部设置有多个卡槽架,多个所述卡槽架内壁均设置有空卡槽,所述机体顶部设置有对晶圆卡槽进行排序的排序组件。A device for identifying and sorting semiconductor wafers, including a body, the top of the body is provided with a loading rack for wafer slotting, and the top of the body is provided with a plurality of slotting racks, and the inner walls of the plurality of slotting racks are Empty card slots are provided, and a sorting component for sorting the wafer card slots is arranged on the top of the body.

作为本实用新型优选的方案,所述排序组件包括有设置在机体顶部的安装架,所述安装架外壁设置有抓取块,所述机体顶部设置有底座,所述底座顶部设置有移裁架,所述机体顶部设置有下料架,所述机体顶部设置有机械臂。As a preferred solution of the utility model, the sorting assembly includes a mounting frame arranged on the top of the body, the outer wall of the mounting frame is provided with a grabbing block, the top of the body is provided with a base, and the top of the base is provided with a cutting frame , the top of the body is provided with a blanking frame, and the top of the body is provided with a mechanical arm.

作为本实用新型优选的方案,所述上料架和下料架均通过螺栓与机体顶部连接。As a preferred solution of the utility model, both the loading rack and the unloading rack are connected to the top of the machine body through bolts.

作为本实用新型优选的方案,多个所述卡槽架均通过螺栓与机体顶部连接,所述空卡槽均通过卡扣与卡槽架内壁连接。As a preferred solution of the present invention, the plurality of draw-in slot frames are all connected to the top of the machine body through bolts, and the empty draw-in slots are all connected to the inner wall of the draw-in slot frame through buckles.

作为本实用新型优选的方案,所述安装架通过螺栓与机体顶部连接,所述抓取块通过滑轨与安装架外壁滑动连接。As a preferred solution of the present invention, the installation frame is connected to the top of the machine body through bolts, and the grasping block is slidably connected to the outer wall of the installation frame through slide rails.

作为本实用新型优选的方案,所述底座通过螺栓与机体顶部连接,所述移裁架通过导轨与底座外壁滑动连接。As a preferred solution of the present invention, the base is connected to the top of the machine body through bolts, and the cutting frame is slidingly connected to the outer wall of the base through guide rails.

作为本实用新型优选的方案,所述机体顶部设置有Beffe仓。As a preferred solution of the utility model, a Beffe bin is arranged on the top of the body.

与现有技术相比,本实用新型的有益效果是:针对背景技术中提出的问题,本申请采用了排序组件,通过自动对卡塞上的条形码信息和晶圆上的镭刻码进行重新排序,大大的节省人工劳动强度、提高测量作业效率,使原本搬运、量测一体化完成。Compared with the prior art, the beneficial effect of the utility model is: for the problems raised in the background technology, the application adopts a sorting component to automatically reorder the barcode information on the jam and the radium engraved code on the wafer , which greatly saves labor intensity, improves the efficiency of measurement work, and completes the integration of original handling and measurement.

附图说明Description of drawings

图1为本实用新型整体结构立体图;Fig. 1 is a three-dimensional view of the overall structure of the utility model;

图2为本实用新型正视图;Fig. 2 is a front view of the utility model;

图3为本实用新型侧视图;Fig. 3 is a side view of the utility model;

图4为本实用新型俯视图。Fig. 4 is a top view of the utility model.

图中:1、机体;2、上料架;3、卡槽架;301、空卡槽;4、安装架;401、抓取块;5、底座;6、移裁架;7、下料架;8、机械臂;9、Beffe仓。In the figure: 1. Machine body; 2. Feeding frame; 3. Card slot frame; 301. Empty card slot; 4. Installation frame; 401. Grab block; 5. Base; rack; 8. Mechanical arm; 9. Beffe warehouse.

具体实施方式Detailed ways

下面将结合本实用新型实施例,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例,基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the present invention The embodiments in the utility model, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts, all belong to the scope of protection of the utility model.

为了便于理解本实用新型,下面将参照相关附图对本实用新型进行更全面的描述。给出了本实用新型的若干实施例。但是,本实用新型可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对本实用新型的公开内容更加透彻全面。In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Several embodiments of the utility model are given. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

需要说明的是,当元件被称为“固设于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。It should be noted that when an element is referred to as being “fixed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

除非另有定义,本文所使用的所有的技术和科学术语与属于本实用新型的技术领域的技术人员通常理解的含义相同。本文中在本实用新型的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本实用新型。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used in the description of the utility model herein is only for the purpose of describing specific embodiments, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

请参阅图1-4,本实用新型提供一种技术方案:一款半导体晶圆识别排序设备,包括机体1,所述机体1顶部设置有用于对晶圆卡槽的上料架2,所述机体1顶部设置有多个卡槽架3,用于安装空卡槽301,多个所述卡槽架3内壁均设置有空卡槽301,所述机体1顶部设置有对晶圆卡槽进行排序的排序组件。Please refer to Figures 1-4, the utility model provides a technical solution: a semiconductor wafer identification and sorting equipment, including a body 1, the top of the body 1 is provided with a loading rack 2 for wafer slotting, the The top of the body 1 is provided with a plurality of card slot frames 3 for installing empty card slots 301. The inner walls of the multiple card slot frames 3 are all provided with empty card slots 301, and the top of the body 1 is provided with a wafer card slot. The sort component for sorting.

目前根据卡塞上的条形码信息和晶圆上的镭刻码重新排序作业都是由人工完成,人工作业费时费力,效率低并且容易出错。At present, the reordering operations based on the barcode information on the jam and the radium engraved code on the wafer are all done manually, which is time-consuming, labor-intensive, inefficient and error-prone.

本实施例中所有电气元件均通过常规控制器进行控制。All electrical components in this embodiment are controlled by conventional controllers.

实施例,请参照图1-4,所述排序组件包括有设置在机体1顶部的安装架4,所述安装架4外壁设置有抓取块401,用于抓取并移动晶圆卡槽,所述机体1顶部设置有底座5,所述底座5顶部设置有移裁架6,所述机体1顶部设置有下料架7,所述机体1顶部设置有机械臂8,所述上料架2和下料架7均通过螺栓与机体1顶部连接,多个所述卡槽架3均通过螺栓与机体1顶部连接,所述空卡槽301均通过卡扣与卡槽架3内壁连接,所述安装架4通过螺栓与机体1顶部连接,所述抓取块401通过滑轨与安装架4外壁滑动连接,所述底座5通过螺栓与机体1顶部连接,所述移裁架6通过导轨与底座5外壁滑动连接。在使用时首先人员将晶圆卡塞放置于上料架2,人员再卡槽架3的三号位放置一个空卡槽301,抓取块401配合安装架4将来料的卡塞搬运到寻边器上,寻边器对卡塞里的晶圆自动寻边,完成寻边后,移裁架6将卡塞搬运到卡槽架3二号位上,该位置对卡塞上的条形码进行扫码,同时该位置的相机识别晶圆上镭刻号,然后机械臂8根据镭刻号将晶圆取放到根据条形码排序的卡塞位置内,放满之后,移裁架6将该排上的卡塞同时移动一格位置,料满的那个空卡槽301放入到下料架7上并输送到设备末端,然后等待员工取走,如此往复。For the embodiment, please refer to Figures 1-4, the sorting assembly includes a mounting frame 4 arranged on the top of the machine body 1, and the outer wall of the mounting frame 4 is provided with a grabbing block 401 for grabbing and moving the wafer slot, The top of the body 1 is provided with a base 5, the top of the base 5 is provided with a cutting frame 6, the top of the body 1 is provided with a blanking frame 7, the top of the body 1 is provided with a mechanical arm 8, and the loading frame 2 and the blanking frame 7 are connected to the top of the body 1 by bolts, and the plurality of slot frames 3 are connected to the top of the body 1 by bolts, and the empty slots 301 are connected to the inner wall of the slot frame 3 by buckles. The mounting frame 4 is connected to the top of the body 1 through bolts, the grasping block 401 is slidably connected to the outer wall of the mounting frame 4 through slide rails, the base 5 is connected to the top of the body 1 through bolts, and the cutting frame 6 is connected to the top of the body 1 through guide rails. It is slidably connected with the outer wall of the base 5. When in use, the personnel first place the wafer jam on the loading rack 2, and then place an empty card slot 301 on the third position of the slot rack 3, and the grabbing block 401 cooperates with the installation frame 4 to transport the jammed material to the seeker. On the edge detector, the edge finder automatically detects the edge of the wafer in the card. After the edge detection is completed, the moving frame 6 transports the card to the second position of the card slot rack 3, and this position performs the barcode on the card. Scan the code, and at the same time, the camera at this position recognizes the engraved number on the wafer, and then the robotic arm 8 takes the wafer into the jam position sorted according to the barcode according to the engraved number. The jam on the top moves one grid position at the same time, and the empty card slot 301 that is full is placed on the unloading rack 7 and transported to the end of the equipment, and then waits for the employee to take it away, and so on and forth.

实施例,请参照图1,所述机体1顶部设置有Beffe仓9。For an embodiment, please refer to FIG. 1 , a Beffe bin 9 is arranged on the top of the body 1 .

本实用新型工作流程:在使用时首先人员将晶圆卡塞放置于上料架2,人员再卡槽架3的三号位放置一个空卡槽301,抓取块401配合安装架4将来料的卡塞搬运到寻边器上,寻边器对卡塞里的晶圆自动寻边,完成寻边后,移裁架6将卡塞搬运到卡槽架3二号位上,该位置对卡塞上的条形码进行扫码,同时该位置的相机识别晶圆上镭刻号,然后机械臂8根据镭刻号将晶圆取放到根据条形码排序的卡塞位置内,放满之后,移裁架6将该排上的卡塞同时移动一格位置,料满的那个空卡槽301放入到下料架7上并输送到设备末端,然后等待员工取走,如此往复。本实用新型大大的节省人工劳动强度、提高测量作业效率,使原本搬运、量测一体化完成。The working process of the utility model: when in use, the personnel first place the wafer jam on the loading rack 2, and then place an empty card slot 301 on the third position of the slot rack 3, and the grasping block 401 cooperates with the installation frame 4 to feed the material. The jam is transported to the edge finder, and the edge finder automatically finds the edge of the wafer in the card. After the edge finding is completed, the moving and cutting frame 6 transports the jam to the second position of the card slot rack 3. The barcode on the jam is scanned, and the camera at this position recognizes the engraved number on the wafer, and then the robotic arm 8 takes the wafer according to the engraved number and puts the wafer in the jam position sorted by the barcode. After it is full, move The cutting frame 6 moves the jams on the row by one position at the same time, and the empty card slot 301 that is full is put into the unloading rack 7 and transported to the end of the equipment, and then waits for the employee to take it away, and so on. The utility model greatly saves labor intensity, improves measurement operation efficiency, and integrates original handling and measurement.

尽管已经示出和描述了本实用新型的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本实用新型的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (7)

1.一款半导体晶圆识别排序设备,包括机体(1),其特征在于:所述机体(1)顶部设置有用于对晶圆卡槽的上料架(2),所述机体(1)顶部设置有多个卡槽架(3),多个所述卡槽架(3)内壁均设置有空卡槽(301),所述机体(1)顶部设置有对晶圆卡槽进行排序的排序组件。1. A semiconductor wafer identification and sorting device, including a body (1), characterized in that: the top of the body (1) is provided with a loading rack (2) for wafer slotting, and the body (1) The top is provided with a plurality of card slot racks (3), and the inner walls of the plurality of card slot racks (3) are provided with empty card slots (301), and the top of the body (1) is provided with a device for sorting the wafer card slots Sort components. 2.根据权利要求1所述的一款半导体晶圆识别排序设备,其特征在于:所述排序组件包括有设置在机体(1)顶部的安装架(4),所述安装架(4)外壁设置有抓取块(401),所述机体(1)顶部设置有底座(5),所述底座(5)顶部设置有移裁架(6),所述机体(1)顶部设置有下料架(7),所述机体(1)顶部设置有机械臂(8)。2. A semiconductor wafer identification and sorting device according to claim 1, characterized in that: the sorting component includes a mounting frame (4) arranged on the top of the body (1), and the outer wall of the mounting frame (4) A grabbing block (401) is provided, a base (5) is provided on the top of the body (1), a cutting frame (6) is provided on the top of the base (5), and a blanking frame (6) is provided on the top of the body (1) frame (7), and a mechanical arm (8) is arranged on the top of the body (1). 3.根据权利要求2所述的一款半导体晶圆识别排序设备,其特征在于:所述上料架(2)和下料架(7)均通过螺栓与机体(1)顶部连接。3. A semiconductor wafer identification and sorting device according to claim 2, characterized in that: both the loading rack (2) and the unloading rack (7) are connected to the top of the machine body (1) by bolts. 4.根据权利要求2所述的一款半导体晶圆识别排序设备,其特征在于:多个所述卡槽架(3)均通过螺栓与机体(1)顶部连接,所述空卡槽(301)均通过卡扣与卡槽架(3)内壁连接。4. A semiconductor wafer identification and sorting device according to claim 2, characterized in that: a plurality of the slot holders (3) are connected to the top of the body (1) by bolts, and the empty slots (301 ) are connected to the inner wall of the card slot frame (3) through buckles. 5.根据权利要求2所述的一款半导体晶圆识别排序设备,其特征在于:所述安装架(4)通过螺栓与机体(1)顶部连接,所述抓取块(401)通过滑轨与安装架(4)外壁滑动连接。5. A semiconductor wafer identification and sorting device according to claim 2, characterized in that: the installation frame (4) is connected to the top of the body (1) through bolts, and the grabbing block (401) is connected through slide rails It is slidingly connected with the outer wall of the mounting frame (4). 6.根据权利要求2所述的一款半导体晶圆识别排序设备,其特征在于:所述底座(5)通过螺栓与机体(1)顶部连接,所述移裁架(6)通过导轨与底座(5)外壁滑动连接。6. A semiconductor wafer identification and sorting device according to claim 2, characterized in that: the base (5) is connected to the top of the body (1) through bolts, and the cutting frame (6) is connected to the base through guide rails (5) Outer wall sliding connection. 7.根据权利要求1所述的一款半导体晶圆识别排序设备,其特征在于:所述机体(1)顶部设置有Beffe仓(9)。7. A semiconductor wafer identification and sorting device according to claim 1, characterized in that: a Beffe bin (9) is arranged on the top of the body (1).
CN202320346209.8U 2023-03-01 2023-03-01 Semiconductor wafer recognition and sorting equipment Expired - Fee Related CN219553581U (en)

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