CN219552481U - Switching module and detection device - Google Patents

Abstract

The utility model relates to a switching module and a detection device, comprising a first switching plate and convex points; the first adapter plate is provided with a conductive wire which is used for being electrically connected with the detection module; the salient points are arranged on the first adapter plate and electrically connected with the conductive wires, and the salient points are used for electrically abutting against detection points of products to be detected. In the utility model, the bump is used for replacing the probe in the prior art, and the length of the bump is far smaller than that of the prior probe, so the arrangement of the utility model can enable a signal transmission link to be shorter, and compared with the probe scheme in the prior art, the arrangement of the utility model can be applied to signal testing with higher frequency. When the high-frequency signal is transferred through the transfer module, the loss and the interference on the high-frequency signal can be effectively reduced, and the transmission effect on the high-frequency signal is further improved.

Description

Switching module and detection device

Technical Field

The utility model belongs to the technical field of circuit board testing, and particularly relates to a switching module and a detection device.

Background

With the development progress of the age, the speed of information transmission is faster from 2G to current 5G, and the high-speed and high-frequency transmission of signals is also becoming a requirement of people for electronic products, and in the production process of the electronic products, high-speed and high-frequency testing is required for the semiconductor and rear-end products.

When testing, the corresponding switching device is usually required to be electrically connected with the product to be tested and the detection module, at present, the switching device usually comprises a probe and an adapter plate, one end of the probe is in electrical interference with the adapter plate, the other end of the probe is in electrical interference with a detection point of the product to be tested, the adapter plate can be electrically connected with the detection module through a cable and the like, and when the probe is in electrical interference with the detection point of the product to be tested and the adapter plate is in electrical connection with the detection module, the electrical connection between the detection module and the detection point of the product to be tested can be realized.

When the switching device is adopted, the signal transmission link is a detection point-probe-switching board-cable-detection module of a product to be detected.

However, the frequency of a signal is inversely proportional to the wavelength, when the frequency of the signal is high, the wavelength is short, and when the wavelength of the signal is less than or equal to the length of a transmission link of the signal, the signal is reflected during transmission, and the reflected signal is superimposed with the original signal, thereby causing loss and interference.

The existing transfer module uses probes, and the longer probes enable the signal transmission link of the transfer module to be longer, so that the transfer module has poorer transmission effect on high-frequency signals, and the detection module is not beneficial to detecting the high-frequency signals.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: aiming at the problem that the signal transmission link of the switching module is long in the prior art, which leads to poor transmission effect on high-frequency signals, the switching module and the detection device are provided.

In order to solve the above problems, in one aspect, an embodiment of the present utility model provides a switching module, including a first switching board and a bump; the first adapter plate is provided with a conductive wire which is used for being electrically connected with the detection module; the salient points are arranged on the first adapter plate and electrically connected with the conductive wires, and the salient points are used for electrically abutting against detection points of products to be detected.

Optionally, the switching module further comprises a base and a guide plate; the guide plate is connected to the base, and a guide hole is formed in the guide plate; the guide holes penetrate through the guide plate along the arrangement direction of the guide plate and the base; the guide holes are used for limiting the placement position of the product to be tested on the base; the first adapter plate is connected to the base, and the protruding points are opposite to the guide holes so as to electrically collide with detection points of the product to be detected placed in the guide holes.

Optionally, a concave structure is arranged on the surface of the base, which is close to the guide plate, and the concave structure is opposite to the guide hole; the first adapter plate is provided with a first area and a second area which are connected with each other, the first area is connected to the surface of the base close to the guide plate, and the second area is opposite to the concave structure and is arranged at intervals with the bottom surface of the concave structure; the salient points are arranged in the second area; the second area has elasticity, and when the salient points are pressed, the second area can generate elastic deformation so as to be close to the bottom surface of the concave structure.

Optionally, the switching module further includes an elastic element, where the elastic element is disposed between the second area and the bottom surface of the concave structure; when the second area is close to the bottom surface of the concave structure, the elastic piece can be forced to elastically deform.

Optionally, the base comprises a support plate, a bottom plate and a probe; the first transfer plate and the guide plate are both connected with the support plate, and the first transfer plate is positioned between the support plate and the guide plate; the bottom plate is connected to one side of the supporting plate, which is away from the guide plate; the supporting plate is provided with a first pinhole; the probe is connected with the bottom plate and penetrates through the first pin hole so as to be simultaneously and electrically abutted against the detection point of the product to be detected placed in the guide hole.

Optionally, the bottom plate comprises a mounting plate, a second adapter plate and a protection plate; the mounting plate is connected with the supporting plate, and a second pinhole is arranged on the mounting plate; the second adapter plate is connected to one side of the mounting plate, which is away from the supporting plate, and the probe penetrates through the second pinhole so as to be electrically connected with the second adapter plate; the protection board is connected with the mounting plate and is positioned on one side of the second adapter plate, which is away from the mounting plate.

Optionally, the guide plate is provided with a wire passing hole, and the wire passing hole penetrates through the guide plate along the arrangement direction of the guide plate and the base; the switching module further comprises a cable, one end of the cable is electrically connected with the conductive wire on the first switching plate, and the other end of the cable penetrates out of the guide plate from the wire passing hole.

Optionally, the bump and the conductive line are in an integrated structure.

Optionally, at least one area of the first adapter plate is an elastic area, and the bump is arranged in the elastic area, so that the elastic area can be elastically deformed when the bump is stressed.

In order to solve the above problems, another aspect of the present utility model provides a detection device, including a detection module and any one of the above adapting modules.

In the switching module and the detection device provided by the embodiment of the utility model, the bump can be in electrical contact with the detection point of the product to be detected, so that the detection point of the product to be detected is electrically connected with the first switching plate, and meanwhile, the first switching plate can be electrically connected with the detection module, so that the electrical connection between the detection point of the product to be detected and the detection module can be realized. In this embodiment, the bump replaces the probe in the prior art, and since the length of the bump is far smaller than that of the existing probe, the signal transmission link can be made shorter by the arrangement of this embodiment, so compared with the probe scheme in the prior art, the arrangement of this embodiment can be applied to signal testing with higher frequency. When the high-frequency signal is transferred through the transfer module, the loss and the interference to the high-frequency signal can be effectively reduced, and the transmission effect to the high-frequency signal is further improved.

Drawings

FIG. 1 is a schematic diagram of an adapter module according to an embodiment of the present utility model cooperating with a product to be tested;

FIG. 2 is a schematic structural diagram of a switching module according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a switch module according to an embodiment of the present utility model;

fig. 4 is a top view of a first adapter plate of an adapter module according to an embodiment of the present utility model.

Reference numerals in the specification are as follows:

100. a switching module;

1. a first adapter plate; 11. a first region; 12. a second region;

2. a bump;

3. a base; 31. a concave structure; 32. a support plate; 33. a bottom plate; 34. a probe; 35. a mounting plate; 36. a protective plate;

4. a guide plate; 41. a guide hole; 42. a wire through hole;

5. a cable;

200. a product to be tested; 201. and detecting a point.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

As shown in fig. 1 to 3, in an embodiment, the inspection device includes an inspection module and a switching module 100, the switching module 100 is electrically connected to the inspection module, and the switching module 100 is used for electrically contacting with the inspection point 201 of the product 200 to be inspected, so that the inspection module is electrically connected to the inspection point 201 of the product 200 to be inspected, and the inspection module can inspect the product to be inspected.

As shown in fig. 1, 2 and 4, in one embodiment, the adapter module 100 includes a first adapter plate 1 and a bump 2, and a conductive wire is disposed on the first adapter plate 1 and is used for electrically connecting with the detection module; the bump 2 is disposed on the connection board and electrically connected to the conductive wire, and the bump 2 is used for electrically abutting against the detection point 201 of the product 200 to be tested. When the conductive wire is electrically connected with the detection module, and the bump 2 is electrically abutted against the detection point 201 of the product 200 to be detected, the detection module can be electrically connected with the detection point 201 of the product 200 to be detected.

In this embodiment, the bump 2 replaces the probe in the prior art, and since the length of the bump 2 is much smaller than that of the probe in the prior art, the signal transmission link can be made shorter by the arrangement of this embodiment, so the arrangement of this embodiment can be applied to signal testing at a higher frequency than the probe scheme in the prior art. When the high-frequency signal is transferred through the transfer module 100 of the embodiment, the loss and interference to the high-frequency signal can be effectively reduced, and the transmission effect to the high-frequency signal is further improved. Wherein the length h of the bump 2 is 0.2mm-0.3mm, and the length of the probe is usually 2.4mm-5mm.

It should be understood that in a practical scenario, there are usually a plurality of detection points 201 of the product under test 200, and in this case, there are also a plurality of bumps 2, where the number of bumps 2 may be the same as the number of detection points 201 on one product under test 200, and in this case, one detection point 201 may collide with one bump 2. Of course, the number of the bumps 2 may be smaller or larger than the number of the detection points 201 on one product 200 to be tested. In addition, the "plurality" means two or more, and the meaning of "plurality" in each embodiment is the same, and the description thereof will be omitted.

The length of the bump 2 refers to the length of the bump 2 protruding from the first adapter plate 1, where the surface (defined as a supporting surface 1 a) of the first adapter plate 1 on which the bump 2 is disposed is a plane, and in a scenario, assuming that the supporting surface 1a is parallel to the horizontal plane and the bump 2 protrudes above the supporting surface 1a, the length h of the bump 2 is the height between the uppermost end of the bump 2 and the supporting surface 1 a.

In one embodiment, the bump 2 is made of metal, such as copper, aluminum, etc.

In one embodiment, the bump 2 and the conductive wire are integrally formed, so that contact points in the signal transmission link can be reduced, and thus impedance matching continuity can be better, and the signal transmission device can be suitable for signal transmission with higher frequency. When the bump 2 and the conductive wire are designed separately, a contact point is formed between the bump 2 and the conductive wire, and the contact point can be omitted when the bump 2 and the conductive wire are in an integrated structure. In addition, impedance matching is mainly matching between the characteristic impedance (also called characteristic impedance) of the transmission link and the load impedance.

In an embodiment, the bump 2 may be machined first, and then the bump 2 is bonded on the first adapter plate 1, or the bump 2 may be disposed on the first adapter plate 1 using a MEMS process. Alternatively, the bump 2 may be directly pressed out of the conductive wire by molding the conductive wire or the like on the first adapter plate 1. Alternatively, the bump 2 may be formed on the conductive line by electrochemical deposition. The bump 2 and the conductive wire can be integrated in several ways.

In one embodiment, at least one area of the first adapter plate 1 is an elastic area, and the bump 2 is disposed in the elastic area, so that the elastic area can be elastically deformed when the bump 2 is stressed. In the use process, when the detection point 201 of the product to be detected 200 is abutted against the bump 2, the product to be detected 200 can apply pressure to the bump 2, so that the elastic region can generate elastic deformation, and the bump 2 can be in contact with the detection point 201 of the product to be detected 200 more tightly through the reaction force of the elastic region, thereby guaranteeing the signal transmission effect.

As shown in fig. 2 and 3, in an embodiment, the adapter module 100 further includes a base 3 and a guide plate 4; the guide plate 4 is connected to the base 3, and the guide plate 4 is provided with a guide hole 41; along the arrangement direction of the guide plate 4 and the base 3, the guide holes 41 penetrate the guide plate 4; the guide holes 41 are used for limiting the placement position of the product 200 to be tested on the base 3; the first adapter plate 1 is connected to the base 3, and the bump 2 is opposite to the guiding hole 41, so as to electrically collide with the detecting point 201 of the product 200 to be detected placed in the guiding hole 41.

In use, the product 200 to be measured is placed in the guide hole 41, and the placement position of the product 200 to be measured can be defined by the side wall of the guide hole 41. Meanwhile, when the first adapter plate 1 is assembled, the connection position of the first adapter plate 1 on the base 3 is suitable, and when the product 200 to be tested is placed in the guide hole 41, the detection point 201 of the product 200 to be tested can be abutted against the bump 2 on the first adapter plate 1.

In an embodiment, the width and/or length of the guiding hole 41 gradually decreases along the direction from the guiding plate 4 to the base 3, i.e. the inner surface of the guiding hole 41 has an inclined arrangement, so that the opening of the guiding hole 41 on the side facing away from the base 3 is larger than the opening of the guiding hole 41 on the side close to the base 3, thereby facilitating the placement of the product 200 to be measured in the guiding hole 41.

In an embodiment, the guide plate 4 is positioned on the base 3 by a pin, and the guide plate 4 may be connected to the base 3 by a bolt or the like. The first adapter plate 1 may be connected to the base 3 by a bolt or the like.

As shown in fig. 2 and 4, in one embodiment, the surface of the base 3 near the guide plate 4 is provided with a concave structure 31, and the concave structure 31 is opposite to the guide hole 41; the first adapter plate 1 is provided with a first area 11 and a second area 12 which are connected with each other, the first area 11 is connected to the surface of the base 3 close to the guide plate 4, and the second area 12 is opposite to the concave structure 31 and is arranged at intervals from the bottom surface of the concave structure 31; the bump 2 is arranged in the second region 12; the second region 12 has elasticity, and when the bump 2 is pressed, the second region 12 can elastically deform to approach the bottom surface of the concave structure 31. The second region 12 is the elastic region.

In addition, in one embodiment, the entire first adapter plate 1 has elasticity. For example, the first adapter plate 1 may include an insulating plate and a metal plate, wherein the metal plate is disposed on the insulating plate, and the insulating plate and the metal plate each have elasticity, and at the same time, the metal plate may be cut by laser cutting or the like to form different conductive lines. The material of the metal plate may be copper, and the material of the insulating plate may be PI (polyimide) or the like. However, it should be noted that the implementation form of the first adapter plate 1 includes, but is not limited to, the above arrangement, and it may also be a corresponding flexible plate in the prior art.

As shown in fig. 4, in an embodiment, the first area 11 is a frame structure, and the second area 12 is a plate structure, where the second area 12 is connected to the first area 11, and the second area 12 is located in the frame structure of the first area 11. The second regions 12 are provided in plural, and the second regions 12 are provided at intervals, and one or more bumps 2 are provided in one of the second regions 12. In this case, a plurality of concave structures 31 may be provided, and one second region 12 may be opposite to one concave structure 31.

In one embodiment, the adapter module 100 further includes an elastic member disposed between the second region 12 and the bottom surface of the concave structure 31; when the second region 12 is close to the bottom surface of the concave structure 31, the elastic member can be forced to elastically deform. That is, when the product 200 to be tested applies pressure to the bump 2, the first adapter plate 1 can be forced to the elastic member to elastically deform when bending and deforming to the bottom surface side of the concave structure 31, so that the reaction force of the first adapter plate 1 to the bump 2 can be improved, and the bump 2 can be more tightly abutted against the detection point 201 of the product 200 to be tested.

As shown in fig. 2 and 3, in one embodiment, the base 3 includes a support plate 32, a bottom plate 33, and probes 34; the first adapter plate 1 and the guide plate 4 are connected with the support plate 32, and the first adapter plate 1 is positioned between the support plate 32 and the guide plate 4; the bottom plate 33 is connected to the side of the support plate 32 facing away from the guide plate 4; the supporting plate 32 is provided with a first pinhole, and the probe 34 is connected to the bottom plate 33 and passes through the first pinhole so as to simultaneously electrically collide with the bump 2 at the detection point 201 of the product 200 to be tested placed in the guide hole 41.

In this embodiment, the transfer module 100 includes the bump 2 and the probe 34, where the bump 2 is used to collide with the detection point 201 for transmitting the high-frequency signal, and the probe 34 is used to collide with the monitoring point for transmitting the low-frequency signal, and the first transfer board 1 and the bump 2 have higher cost in production, so that the detection effect of the detection module can be ensured through this direction, and the production cost of the transfer module 100 can be reduced. In addition, the maximum height of the bump 2 with respect to the support plate 32 and the maximum height of the probe 34 with respect to the support plate 32 may be the same after assembly. In addition, the probes 34 and the first pin holes are each provided in plurality, wherein one probe 34 can pass through the support plate 32 from one first pin hole.

In an actual use scenario, the support plate 32 is located above the bottom plate 33, the guide plate 4 is located above the support plate 32, the first needle hole penetrates the support plate 32 from top to bottom, and the probe 34 penetrates the first needle hole from bottom to top. In addition, the concave structure 31 is actually provided on the surface of the support plate 32 near the guide plate 4. Both the first region 11 of the first adapter plate 1 and the guide plate 4 may be connected to the support plate 32 by means of bolts.

As shown in fig. 2 and 3, in one embodiment, the base plate 33 includes a mounting plate 35, a second adapter plate, and a protective plate 36; the mounting plate 35 is connected with the support plate 32, and a second pinhole is arranged on the mounting plate 35; the second adapter plate is connected to one side of the mounting plate 35, which is away from the support plate 32, and the probe 34 passes through the second pinhole so as to be electrically connected with the second adapter plate; the protection plate 36 is connected to the mounting plate 35 and is located on the side of the second adapter plate facing away from the mounting plate 35. That is, the mounting plate 35 is located below the support plate 32, the second adapter plate is located below the mounting plate 35, the protection plate 36 is located below the second adapter plate, and the second pinhole penetrates the mounting plate 35 from top to bottom. The second adapter plate may be a PCB or the like, and is configured to lead out signals of the probe 34, and when in use, the second adapter plate is electrically connected with the detection module.

The probe 34 may be a double ended probe 34 of the prior art; one end of the probe 34 passes through the support plate 32 from the first pinhole to collide with the detection point 201 of the product 200 to be tested, and the other end of the probe 34 passes through the mounting plate 35 from the second pinhole to collide with the conductive line on the second interposer to realize electrical connection. Meanwhile, the upper and lower ends of the middle portion of the probe 34 may be respectively abutted against the support plate 32 and the mounting plate 35, thereby fixing the probe 34 between the support plate 32 and the mounting plate 35. Of course, in some embodiments, the probe 34 may be embedded in the first pinhole, and the two may be interference fit; alternatively, the probe 34 may be embedded in the second pin hole, and the two may be interference fit.

In addition, the protection plate 36 may be used to protect the second adapter plate and the probe 34, so as to effectively avoid collision of the second adapter plate and the probe 34 by foreign objects.

In one embodiment, mounting plate 35 may be positioned on support plate 32 by pins and coupled to support plate 32 by bolts. In addition, the second adapter plate and the protection plate 36 may be both connected to the mounting plate 35 by bolts.

As shown in fig. 2, in an embodiment, the guide plate 4 is provided with a wire through hole 42, and the wire through hole 42 penetrates the guide plate 4 along the arrangement direction of the guide plate 4 and the base 3; the switching module 100 further comprises a cable 5, one end of the cable 5 is electrically connected with the conductive wire on the first switching plate 1, and the other end of the cable 5 penetrates out of the guide plate 4 from the wire through hole 42. When in use, the other end of the cable 5 is electrically connected with the detection module, so that signals can be transmitted from the convex points 2, the conductive wires of the first adapter plate 1 and the cable 5 to the detection module. In addition, the cable 5 may be a coaxial cable.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (10)

1. The switching module is characterized by comprising a first switching plate and a convex point;

the first adapter plate is provided with a conductive wire which is used for being electrically connected with the detection module;

the salient points are arranged on the first adapter plate and electrically connected with the conductive wires, and the salient points are used for electrically abutting against detection points of the product to be detected.

2. The patching module of claim 1, wherein the patching module further comprises a base and a guide plate;

the guide plate is connected to the base, and a guide hole is formed in the guide plate;

the guide holes penetrate through the guide plate along the arrangement direction of the guide plate and the base; the guide holes are used for limiting the placement position of the product to be tested on the base;

the first adapter plate is connected to the base, and the protruding points are opposite to the guide holes so as to electrically collide with detection points of the product to be detected placed in the guide holes.

3. The transfer module according to claim 2, wherein the surface of the base, which is close to the guide plate, is provided with a concave structure, and the concave structure is opposite to the guide hole;

the first adapter plate is provided with a first area and a second area which are connected with each other, the first area is connected to the surface of the base close to the guide plate, and the second area is opposite to the concave structure and is arranged at intervals with the bottom surface of the concave structure;

the salient points are arranged in the second area;

the second area has elasticity, and when the salient points are pressed, the second area can generate elastic deformation so as to be close to the bottom surface of the concave structure.

4. The patching module of claim 3, further comprising an elastic member disposed between the second region and a bottom surface of the recessed structure;

when the second area is close to the bottom surface of the concave structure, the elastic piece can be forced to elastically deform.

5. The patching module of claim 2, wherein said base includes a support plate, a base plate, and probes;

the first transfer plate and the guide plate are both connected with the support plate, and the first transfer plate is positioned between the support plate and the guide plate;

the bottom plate is connected to one side of the supporting plate, which is away from the guide plate;

the supporting plate is provided with a first pinhole,

the probe is connected with the bottom plate and penetrates through the first pin hole so as to be simultaneously and electrically abutted against the detection point of the product to be detected placed in the guide hole.

6. The adapter module of claim 5, wherein the base plate comprises a mounting plate, a second adapter plate, and a protective plate;

the mounting plate is connected with the supporting plate, and a second pinhole is arranged on the mounting plate;

the second adapter plate is connected to one side of the mounting plate, which is away from the supporting plate, and the probe penetrates through the second pinhole so as to be electrically connected with the second adapter plate;

the protection board is connected with the mounting plate and is positioned on one side of the second adapter plate, which is away from the mounting plate.

7. The transfer module according to claim 2, wherein the guide plate is provided with a wire passing hole, and the wire passing hole penetrates through the guide plate along the arrangement direction of the guide plate and the base;

the switching module further comprises a cable, one end of the cable is electrically connected with the conductive wire on the first switching plate, and the other end of the cable penetrates out of the guide plate from the wire passing hole.

8. The patching module of claim 1, wherein said bumps are integrally formed with said conductive lines.

9. The adapter module of claim 1, wherein at least one area of the first adapter plate is an elastic area, and the bump is disposed in the elastic area, so that the elastic area can be elastically deformed when the bump is stressed.

10. A test device comprising a test module and a switch module according to any one of claims 1-9.