CN219552461U

CN219552461U - Transfer mechanism for chip test

Info

Publication number: CN219552461U
Application number: CN202223550332.6U
Authority: CN
Inventors: 王涛
Original assignee: Shanghai Semiconductor Technology Co ltd
Current assignee: Shanghai Semiconductor Technology Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-08-18
Anticipated expiration: 2032-12-29

Abstract

The utility model provides a transfer mechanism for chip testing, comprising: the feeding platform is used for conveying the chip material boxes for placing chips and comprises a feeding groove, a conveying channel and a first pushing component arranged in the X-axis direction, wherein the first pushing component pushes the chip material boxes from one end of the conveying channel to the other end along the X-axis direction; the transfer mechanism is arranged at the discharge end of the conveying channel; the lifting mechanism is used for controlling the transfer mechanism to move in the Z-axis direction; according to the chip multi-direction transfer device, the feeding platform, the transfer mechanism and the lifting mechanism are arranged, so that the chip material box with the chips can be transferred in the X, Y, Z axial direction, the chips can be transferred in multiple directions, and the requirement on the chips in multiple directions in the chip test process is met.

Description

Transfer mechanism for chip test

Technical Field

The utility model relates to the technical field of chip manufacturing, in particular to a transfer mechanism for chip testing.

Background

The semiconductor industry is most upstream of an IC design company and a silicon wafer manufacturing company, the IC design company designs a circuit diagram according to the requirements of customers, and the silicon wafer manufacturing company manufactures a silicon wafer by using polysilicon as a raw material. The main task of the midstream IC manufacturing company is to implant the circuit diagram designed by the IC design company onto the wafer manufactured by the silicon wafer manufacturing company. The finished wafer is sent to a downstream IC packaging factory for packaging and testing.

The position of the chip is required to be transferred in the test process, the existing chip transfer mechanism has a single transfer path, and the chip can be transferred only in a single direction, so that the actual working requirement cannot be met.

Therefore, there is a need to design a transfer mechanism for chip testing to solve the above-described problems.

Disclosure of Invention

The utility model provides a transfer mechanism for chip testing, which is used for solving the technical problems related to the background technology.

In order to solve the problems, the utility model provides the following technical scheme: a transfer mechanism for chip testing, comprising:

the feeding platform is used for conveying the chip material box for placing the chips and comprises a feeding groove, a conveying channel and a first pushing component arranged in the X-axis direction, wherein the first pushing component comprises an air cylinder and a pushing plate arranged at the output end of the air cylinder, and the first pushing component pushes the chip material box from one end of the conveying channel to the other end along the X-axis direction;

the transfer mechanism is arranged at the discharge end of the conveying channel and comprises a guide chute arranged in the Y-axis direction and a second pushing component capable of pushing the chip material box to move in the guide chute;

the lifting mechanism comprises a lifting track arranged in the Z-axis direction, and a moving part is arranged on the lifting track and is connected with the transferring mechanism and used for controlling the transferring mechanism to move in the Z-axis direction.

Further, the back of push pedal is equipped with spacing part, spacing part includes gag lever post and stopper, the gag lever post with push pedal fixed connection, the stopper sets up on conveying channel.

Further, the second pushing component comprises a limit rail on the Y axis, and an L-shaped moving part is arranged on the limit rail.

Further, the moving part is driven by a ball screw structure.

Further, the lifting mechanism is provided with a counting sensor for measuring the number of chip cartridges transferred.

Furthermore, the inlet of the feeding trough and the inlet of the guide trough are provided with chamfer structures.

Compared with the prior art, the utility model has at least the following beneficial effects:

according to the chip multi-direction transfer device, the feeding platform, the transfer mechanism and the lifting mechanism are arranged, so that the chip material box with the chips can be transferred in the X, Y, Z axial direction, the chips can be transferred in multiple directions, and the requirement on the chips in multiple directions in the chip test process is met.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic overall structure of an embodiment of the present utility model;

FIG. 2 is a top view of FIG. 1;

fig. 3 is an enlarged view at a in fig. 1.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model. It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the utility model. The connection relationships shown in the drawings are for convenience of clarity of description only and are not limiting on the manner of connection.

It is noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component, or intervening components may also be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. It should also be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless otherwise specifically defined and limited; either mechanically or electrically, or by communication between two components. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

It should be further noted that, in the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The utility model discloses a transfer mechanism for chip test, and aims to provide a mechanism capable of transferring chips in multiple directions in the chip test process.

Referring to fig. 1 and 2, a transfer mechanism for chip testing includes:

the feeding platform 100 is used for conveying the chip material box 400 for placing chips and comprises a feeding groove 101, a conveying channel 102 and a first pushing component arranged in the X-axis direction, wherein the first pushing component comprises an air cylinder 1031 and a push plate 1032 arranged at the output end of the air cylinder 1031, and the first pushing component pushes the chip material box 400 from one end of the conveying channel to the other end along the X-axis direction;

a transfer mechanism 200, which is arranged at the discharge end of the conveying channel 102 and comprises a guide chute 201 arranged in the Y-axis direction and a second pushing component 202 capable of pushing the chip material box 400 to move in the guide chute;

the lifting mechanism 300 includes a lifting rail 301 provided in the Z-axis direction, and a moving portion 302 is provided on the lifting rail 301, and the moving portion 302 is connected to the transfer mechanism 200 to control the transfer mechanism 200 to move in the Z-axis direction.

With continued reference to fig. 1, a limiting component is disposed on the back of the push plate 1032, the limiting component includes a limiting rod 1041 and a limiting block 1042, the limiting rod 1041 is fixedly connected with the push plate 1032, the limiting block 1042 is disposed on the conveying channel, and the setting of the limiting component ensures that the push plate can be pushed out in a parallel state.

With continued reference to fig. 1, the second pushing member 202 includes a limiting rail 2021 on the Y axis, and an L-shaped moving portion 2022 is disposed on the limiting rail 2021, where the moving portion contacts the chip cartridge to push the chip cartridge along the Y axis.

In this embodiment, the moving portion is driven by a ball screw structure.

As shown in fig. 1, the lifting mechanism 300 is provided with a counting sensor 303 for measuring the number of the transferred cartridges 400, and the counting sensor senses when the transferring mechanism is lifted, and the counting is increased once.

As shown in fig. 3, chamfer structures 500 are disposed at the inlets of the feeding trough 101 and the guiding trough 201.

The utility model has simple principle and reasonable design, can conveniently control the chip material box to be conveyed to the required direction, and effectively solves the technical problems in the prior art.

In the description and claims of the present utility model, the words "comprise/comprising" and the words "have/include" and variations thereof are used to specify the presence of stated features, values, steps, or components, but do not preclude the presence or addition of one or more other features, values, steps, components, or groups thereof.

Some features of the utility model, which are, for clarity of illustration, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, some features of the utility model, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination in different embodiments.

The foregoing description of the preferred embodiment of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. A transfer mechanism for chip testing, comprising:

2. The transfer mechanism for chip testing according to claim 1, wherein the back of the push plate is provided with a limiting component, the limiting component comprises a limiting rod and a limiting block, the limiting rod is fixedly connected with the push plate, and the limiting block is arranged on the conveying channel.

3. The transfer mechanism for chip testing according to claim 1, wherein the second pushing member comprises a limit rail on the Y-axis, and an L-shaped moving portion is provided on the limit rail.

4. A transfer mechanism for chip testing according to claim 3, wherein said moving part is driven by a ball screw structure.

5. The transfer mechanism for chip testing according to claim 1, wherein the lifting mechanism is provided with a counting sensor for measuring the number of chip cartridges transferred.

6. The transfer mechanism for chip testing according to any one of claims 1 to 5, wherein chamfer structures are provided at the inlets of the feed chute and the guide chute.