JP2012112717A - Test method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize quality of switching operation of product types in an electrical test of a semiconductor device.SOLUTION: In electrical test devices such as a self-weight dropping type handler or the like having a thermostatic bath 20, the test method of a semiconductor device comprises: a step of arranging a DIP 30 at a positioning part 20b at the inside of the thermostatic bath 20; and a step of attaching the DIP 30 to a socket 2 arranged at the inside of the thermostatic bath 20 and performing an electrical test of the DIP 30 at the inside of the thermostatic bath 20. When the DIP 30 is attached to the socket 2, position adjustment of the socket 2 at the inside of the thermostatic bath 20 is performed by a position adjustment mechanism of the socket 2, provided at the outside of the thermostatic bath 20 to attach the DIP 30 to the socket 2.

Description

  The present invention relates to a test technique for a semiconductor device, and more particularly to a technique that is effective when applied to shortening the time required for changing the test performed by mounting a semiconductor device in a socket.

  In a multi-product compatible IC (Integrated Circuit) handler, there has been disclosed a technique for eliminating the exchange of a conveyance path located in a thermostat (for example, Patent Document 1).

  In addition, a technology is disclosed that enables quick and easy setup change corresponding to a change in IC type in a stocker apparatus that can handle a wide variety of products (for example, Patent Document 2).

  In addition, in a probe socket for IC package inspection, a technique is disclosed in which the center position of the IC package becomes the center position of the socket body even if the number of terminals of the IC package is different (for example, Patent Document 3). ).

JP-A-6-82516 JP 61-161468 A JP 2004-93506 A

  In an electrical test that guarantees the performance of an electronic component such as a semiconductor device in which a semiconductor integrated circuit or the like is incorporated, the test terminal electrically connected to the electrical test device is pressed against the lead terminal of the electronic component to A predetermined electrical property test is performed by making contact.

  In this electrical characteristic test, when the shape / size or the number of terminals of an electronic part to be tested is changed due to production fluctuation, the switching part of the test equipment is changed according to the product to be produced.

  In order to reduce the number of switching operations when switching the type of electronic component, etc., the production items are classified according to the width of the main body of the electronic component, etc. It is common to take measures such as reduction.

  Here, the structure and operation of the test section of the natural fall type handler apparatus examined by the present inventors will be described. FIG. 16 is a schematic configuration diagram illustrating a test unit of a natural drop handler device of a comparative example. The test unit has a mechanism for forming a temperature atmosphere corresponding to the target test environment temperature.

  As shown in FIG. 16, a constant temperature bath 20 in which an electrical test of the electronic component 1 such as a semiconductor device is performed is installed in the test unit, and the lead terminal 1 a of the electronic component 1 is contacted in the constant temperature bath 20. A socket 2 having a test terminal is disposed. Also, the socket 2 is electrically connected to an adapter socket 3 having an electrical terminal that is detachably and electrically in contact with the socket 2 and a slave board 4 to which the electrical terminal of the adapter socket 3 is electrically connected. It is provided outside the thermostat 20 in the state.

  Note that an interface housing 5 serving as a tester head is disposed adjacent to the thermostatic chamber 20, and the daughter board 4 is fixed to the surface of the interface housing 5 on the thermostatic chamber side. On the other hand, the child substrate 6 is fixed to the surface of the interface casing 5 on the side of the electrical test apparatus (tester) which is the surface opposite to the thermostatic chamber side. Therefore, the sub-board 4 and the sub-board 6 are electrically connected by the wiring 21, and the sub-board 6 is further connected to a plurality of electrical terminals 6 a for electrical connection with an electrical test apparatus (tester) (not shown). Is attached.

  Here, the interface housing 5 has a heat insulating function such as filling the inside with a heat insulating material 7 so that heat from the natural drop handler is not applied to the electric test apparatus during the temperature environment test.

  Further, inside the constant temperature bath 20, a transport rail 8 that guides the electronic component 1, a chute rail 12 that sandwiches the electronic component 1 between the transport rail 8, a stopper 9 that positions the electronic component 1, and the like. Is arranged. The stopper 9 is fastened to a cylinder 10 disposed outside the thermostatic bath, and can be freely advanced and retracted.

  Further, outside the thermostatic chamber, a cutting cylinder 17 for feeding the electronic components 1 to the socket 2 one by one, and a contact cylinder connected to the conveying rail 8 and pressing the conveying rail 8 in the direction of the socket 2. 11 etc. are arranged.

  Next, the operation of the test unit (test unit) will be described.

  First, the plurality of electronic components 1 guided by the transfer rail 8 are individually cut out by the cutting cylinder 17 and when the stopper 9 protrudes, the electronic component 1 falls to the inspection position by its own weight (other than gravity such as air friction). It is transported by a fall due to its own weight in the presence of external force).

  Next, as shown in the comparative example of FIG. 17, the electronic component 1 is sandwiched between the conveyance rail 8 and the chute rail 12, and the direction of the socket 2 (H) by the pressing plate 11 a connected to the contact cylinder 11. The lead terminal 1a (see FIG. 16) of the electronic component 1 is brought into contact with the test terminal of the socket 2. At this time, the electronic component 1 is attached to the socket 2.

  In this state, an electrical characteristic test (electrical test) is performed. Thereafter, when the electrical characteristic test of the electronic component 1 is completed, the contact cylinder 11 is retracted, and the electronic component 1 is detached from the socket 2 by the elastic force of the spring 13 in FIG. Return to position. Furthermore, when the stopper 9 moves backward, the electronic component 1 is sent downward (outside the thermostatic chamber 20) from the test section by its own weight drop.

  Here, standardization of the width of the main body of the electronic component 1 and the pitch between the lead terminals 1a is being promoted by JEITA (Electronic Information Technology Industry Association) and the like, and the electronic component 1 is within the standardized law. The outline of is determined.

  For example, as shown in the comparative examples of FIG. 18 and FIG. 19, in the electronic component 1 such as DIP (Dual in-line package, semiconductor device), the distance (L1 and L2) from the mold end surface 1b to the first terminal 1aa. Is defined as a lead pitch P dimension (L1 = P) shown in FIG. 18 for a standard product or a half (L2 = P / 2) of a lead pitch P dimension shown in FIG. 19 for a shrink product.

  At this time, in an electric test apparatus connected to a free fall (self-weight drop) type handler or the like having a test section as shown in FIG. 16, positioning is performed on the mold end surface 1b of the electronic component 1, so that the above-described JEITA When testing both standard products and shrink products that comply with standards, etc., it is necessary to prepare and select switching parts corresponding to each type and perform the test.

  Thus, as a result of investigation by the present inventor, the following problems were found.

  When the product type is switched in the electrical test of the electronic component, in the natural drop type handler device, a switching operation of the switching component (for example, a transport rail or a chute rail) occurs in the test section. For example, in the case of a low-temperature test in which the test environment temperature is 0 ° C. or less, for example, in order to prevent condensation, the device temperature is once raised above the air dew point and the switching operation is performed. It takes time to reach temperature and stabilize. This time is, for example, about 4 hours, and the test cannot be executed during this time, so that the operating rate of the apparatus is lowered. Especially for automotive parts, the test environment temperature is getting higher / lower due to the stricter customer specifications in recent years. For this reason, the temperature difference between the test environment temperature and the external temperature increases, and the temperature gradient increases, so the amount of heat that escapes from the test part of the device increases, and the time to reach the test environment temperature has increased. The occupancy rate is decreasing.

  In addition, because switching parts are removed and assembled, the switching time is easily affected by the skill level of the operator, the quality of the type switching work is not stable, and the test environment cannot be managed accurately. There are also challenges.

  Furthermore, when there is a problem in the assembly of the switching component, there is a problem that the electronic component transportation trouble occurs, thereby causing the quality degradation of the electronic component such as bending the lead terminal of the electronic component.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of stabilizing the work quality of the product type switching operation in the electrical test of the semiconductor device.

  Another object of the present invention is to provide a technique capable of stably maintaining a test environment in an electrical test of a semiconductor device.

  Another object of the present invention is to provide a technique capable of stabilizing the quality of a semiconductor device.

  Another object of the present invention is to provide a technique capable of shortening the work time at the time of product type switching in an electrical test of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  A test method for a semiconductor device according to a representative embodiment includes: (a) a step of placing the semiconductor device in a positioning portion inside the thermostat; and (b) a socket in which the semiconductor device is placed inside the thermostat. And performing an electrical test of the semiconductor device inside the thermostat, and in the step (b), the socket position adjusting mechanism provided outside the thermostat in the step (b) The position of the socket inside the thermostat is adjusted, and the semiconductor device is mounted in the socket.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  It is possible to stabilize the quality of the product switching operation in the electrical test of the semiconductor device.

  A test environment can be stably maintained in an electrical test of a semiconductor device.

  The quality of the semiconductor device can be stabilized.

  It is possible to shorten the work time when switching the product type in the electrical test of the semiconductor device.

1 is a configuration block diagram showing an example of a configuration of a test system used in a test of a semiconductor device according to a first embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing an example of a structure of a thermostatic chamber and a tester head in the test system shown in FIG. It is a fragmentary sectional view which shows the structure partly cut | disconnected along the AA line shown in FIG. FIG. 3 is a partial cross-sectional view showing an example of a structure when the semiconductor device is mounted on a socket in the structure shown in FIG. 2. It is a side view which shows an example of the movement state of the socket at the time of the kind change of the semiconductor device of Embodiment 1 of this invention. It is a side view which shows an example of the movement state of the socket at the time of the test content switching of the semiconductor device of Embodiment 1 of this invention. It is a fragmentary sectional view which partially cuts off and shows an example of the structure of a thermostat and a tester head when the division | segmentation type conveyance rail is employ | adopted in Embodiment 2 of this invention. FIG. 8 is a partial cross-sectional view showing an example of a cross-sectional structure in the test section having the structure shown in FIG. It is a fragmentary sectional view which shows an example of the basic structure of the split-type conveyance rail shown in FIG. It is a fragmentary sectional view which shows an example of the basic structure of the split-type conveyance rail shown in FIG. It is a top view which shows an example of the structure of the cam mechanism which operates the division | segmentation type conveyance rail shown in FIG. It is a fragmentary sectional view showing an example of the basic structure of the division type conveyance rail of the 1st modification. It is a fragmentary sectional view showing an example of the basic structure of the division type conveyance rail of the 1st modification. It is a fragmentary sectional view showing an example of the basic structure of the division type conveyance rail of the 2nd modification. It is a fragmentary sectional view showing an example of the basic structure of the division type conveyance rail of the 2nd modification. It is a fragmentary sectional view which cuts and shows the structure of the thermostat of a comparative example, and a tester head partially. FIG. 17 is a partial cross-sectional view illustrating a structure of the structure illustrated in FIG. 16 when the semiconductor device is mounted on a socket. It is a side view which shows the structure of the semiconductor device of a comparative example. It is a side view which shows the structure of the semiconductor device of a comparative example.

  In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

  Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps) are not necessarily indispensable unless otherwise specified and clearly considered essential in principle. Needless to say.

  Further, in the following embodiments, regarding constituent elements and the like, when “consisting of A”, “consisting of A”, “having A”, and “including A” are specifically indicated that only those elements are included. It goes without saying that other elements are not excluded except in the case of such cases. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment 1)
FIG. 1 is a block diagram showing an example of the configuration of a test system used for testing a semiconductor device according to the first embodiment of the present invention. FIG. 2 shows an example of the structure of a thermostatic chamber and a tester head in the test system shown in FIG. FIG. 3 is a partial cross-sectional view showing a partially cut structure taken along the line AA shown in FIG. 2, and FIG. 4 is a view of the structure shown in FIG. It is a fragmentary sectional view which shows an example of the structure at the time of mounting | wearing.

  5 is a side view showing an example of the movement state of the socket at the time of switching the product type of the semiconductor device according to the first embodiment of the present invention. FIG. 6 is a diagram at the time of switching the test contents of the semiconductor device according to the first embodiment of the present invention. It is a side view which shows an example of the movement state of a socket.

  The semiconductor device of the first embodiment is mounted on a socket after assembly is completed and an electrical test is performed using a tester. In the first embodiment, an example of the semiconductor device is shown in FIG. DIP (Dual in-line package) 30 is taken up and explained.

  The DIP 30 includes a main body portion 30c in which a semiconductor chip 37 is embedded, and lead terminals 30a that are a plurality of external terminals exposed from the main body portion 30c. The plurality of lead terminals 30a are opposed to the main body portion 30c. Exposed on each side. The main body 30c is formed, for example, in a rectangular shape in plan view, and a plurality of lead terminals 30a are exposed on two opposing longitudinal sides of the main body 30c. At this time, the plurality of lead terminals 30a are arranged at the same pitch on two opposing sides.

  The main body 30c is made of a sealing resin such as a thermosetting epoxy resin, for example.

  Next, the configuration of the test system including the tester 14 shown in FIG. 1 for performing the electrical test of the DIP 30 and the flow of the electrical test will be described.

  FIG. 1 shows an example of a test system including a natural fall type (self-weight fall type) handler according to the first embodiment, and the configuration thereof will be described. In addition, the said dead weight fall (natural fall) said here is the fall by the dead weight in the condition where external forces other than gravity, such as friction of air, exist. The test system shown in FIG. 1 includes a thermostat 20 having a test unit (test unit, measurement unit) 20a in which the test of the DIP 30 shown in FIG. 5 is performed, a tester head 15 disposed adjacent to the thermostat 20, A tester 14 that is electrically connected to the tester head 15 and transmits a test electrical signal to the tester head 15 is provided.

  Furthermore, a low-temperature / high-temperature air generator 16 that supplies low-temperature / high-temperature air 29 (see FIG. 2) to the thermostat 20 and a transport rail 8 that is a guide member that guides the transport of the DIP 30 into and out of the thermostat 20 Is provided.

  In this test system, a plurality of DIPs 30 are set in the transport rail 8 in a state of being packed in the shipping tube 18, and are slid by the dead weight on the transport rail 8 having an inclination to maintain the target test environment temperature. It is sent to the test unit 20a in the thermostat 20 that has been made.

  Then, after the DIP 30 is positioned by the test unit 20a in the thermostatic bath 20, an electrical test is performed.

  After the test, the DIP 30 is classified according to the test result and stored in the shipping tube 18 disposed below the transport rail 8.

  Next, the test part 20a in the thermostat 20 and the tester head 15 will be described with reference to FIGS.

  In addition, the test part 20a in the thermostat 20 is equipped with the structure which forms the temperature atmosphere corresponding to the target test environment temperature.

  In the thermostat 20 shown in FIGS. 2 and 3, a socket 2 having a test terminal 2 a for contacting the lead terminal 30 a of the DIP 30 shown in FIG. 5 is arranged. Further, the socket 2 is connected to an adapter socket 3 having an electrical terminal (not shown) that is detachably and electrically in contact with the socket 2, and further, a child to which the electrical terminal of the adapter socket 3 is electrically connected. A board 4 is provided, and the adapter socket 3 and the sub board 4 are provided outside the thermostatic bath 20 in a state of being electrically connected to the socket 2.

  The adapter socket 3 is disposed at an opening portion of the wall portion 19 that partitions the handler (constant temperature bath 20) side and the tester side, and the side opposite to the constant temperature bath side of the wall portion 19 is the tester head side. An interface housing 5 is disposed on the head side. That is, the constant temperature bath 20 is disposed on one side of the wall portion 19, and the interface housing 5 is disposed adjacent to the constant temperature bath 20 on the other side.

  Further, slide plates 22a and 22b provided in a slidable manner are provided on the side surface 5a on the thermostat side of the interface housing 5 in a state separated from the side surface 5a. A substrate 4 is attached. On the other hand, the child substrate 6 is fixed to the side surface 5b on the tester 14 (see FIG. 1) side, which is the surface opposite to the constant temperature bath side of the interface housing 5.

  The child board 4 and the child board 6 are electrically connected by a plurality of wirings 21, and the child board 6 is provided with a plurality of electrical terminals 6 a for electrical connection with the tester 14. Yes.

  Further, the interface housing 5 has a heat insulating function such as filling the heat insulating material 7 therein so that heat from the natural drop handler is not applied to the tester 14 during the temperature environment test.

  On the other hand, in the constant temperature bath 20, a conveyance rail 8 that is a guide member for guiding the DIP 30, a chute rail 12 that is a similar guide member that sandwiches the DIP 30 between the conveyance rail 8, and a positioning unit 20 b A stopper 9 and the like for positioning the DIP 30 are arranged. The stopper 9 is fastened to a cylinder 10 disposed outside the thermostatic bath, and can be freely advanced and retracted.

  Further, outside the thermostatic chamber, it is connected to the cutting cylinder 17 for feeding the DIP 30 to the socket 2 one by one, or the conveying rail 8, and the conveying rail 8 is directed to the socket 2 through the pressing plate 11a. A contact cylinder 11 or the like to be pressed is disposed.

  Here, in the natural drop handler according to the first embodiment, the socket 2 arranged in the thermostat 20 is minutely moved from the outside of the thermostat 20 along the sliding direction (drop direction) B of the DIP 30 shown in FIG. It has a position adjustment mechanism that can be moved.

  The position adjusting mechanism is an internal engagement portion covered with the interface housing 5 and is exposed to the cam portion 23a, which is a rotating body, and the shaft portion 23b of the cam portion 23a. It has the switching lever 23 which is an external engaging part to engage, and the slide plate 22a engaged with the cam part 23a. The cam portion 23a is a disk-shaped rotating body, is joined to the shaft portion 23b in an eccentric state with respect to the rotation center of the shaft portion 23b, and engages with the guide groove 22c of the slidable slide plate 22a. is doing. A switching lever 23 rotatably provided outside the interface housing 5 is coupled to the shaft portion 23b.

  Accordingly, when the switching lever 23 is rotated as shown in FIG. 2, the shaft portion 23b is rotated and the cam portion 23a is also rotated eccentrically, and the slide plate 22a engaged with the cam portion 23a is decentered of the cam portion 23a. It moves in the B direction (sliding direction of DIP30) according to the amount. That is, a cam mechanism that can move the socket 2 by a small amount by cam driving by the cam portion 23a is provided.

  The slide plates 22a and 22b, the sub board 4, the adapter socket 3 and the socket 2 are structured so as to be movable together in the B direction. At this time, as shown in FIG. 22a and 22b are individually supported by the wall portion 19 via a linear guide 24 so as to be linearly movable.

  Thereby, in the natural drop type handler of the first embodiment, the switching lever 23 is driven (rotated) from the outside of the constant temperature bath 20 to be arranged in the slide plates 22a and 22b, the adapter socket 3, and the constant temperature bath 20. The socket 2 thus made can be linearly moved with a small amount and high accuracy along the sliding direction B of the DIP 30.

  Next, a test method for the semiconductor device according to the first embodiment will be described.

  First, as shown in FIGS. 2 and 3, the DIP 30 is guided by the transfer rail 8 and disposed in the positioning portion 20 b inside the thermostat 20. Specifically, a plurality of DIPs 30 guided by the transport rail 8 are individually cut out by the cutting cylinder 17 and when the stopper 9 is in a protruding state, the DIP 30 is dropped by its own weight (also called natural fall) to the inspection position of the positioning portion 20b. Transport (place at inspection position).

  Therefore, when the DIP 30 is set on the transport rail 8, the terminal rows of the plurality of opposing lead terminals 30a are arranged on the transport rail 8 so as to be along the drop direction (the B direction in FIG. 2). The self-weight fall can be performed along the rail 8 for conveyance.

  Thereafter, the DIP 30 is attached to the socket 2 disposed inside the thermostat 20. Here, as shown in FIG. 4, the DIP 30 is pressed in the direction of the socket 2 (C direction) by the pressing plate 11 a connected to the contact cylinder 11 with the conveyance rail 8 and the chute rail 12 sandwiched. The lead terminal 30 a of the DIP 30 shown in FIG. 5 is brought into contact with the test terminal 2 a of the socket 2. At this time, the DIP 30 is attached to the socket 2.

  At that time, the position of the socket 2 inside the thermostat 20 is adjusted by the position adjusting mechanism of the socket 2 provided outside the thermostat 20 as necessary, and the DIP 30 is mounted on the socket 2. The position adjusting mechanism includes a cam mechanism, and adjusts the position of the socket 2 by driving the cam mechanism. Specifically, the switching lever 23 is rotated by a predetermined amount, and the shaft portion 23b and the cam portion 23a connected to the switching lever 23 are rotated by a predetermined amount. By rotation of the cam portion 23a, the slide plates 22a and 22b fixed to the linear guide 24 and the slave board 4, and the adapter socket 3 and the socket 2 are linearly moved by a predetermined pitch, thereby the position of the lead terminal 30a of the DIP 30 The DIP 30 is attached to the socket 2 after matching the position of the test terminal 2 a of the socket 2.

  After the mounting, an electrical characteristic test (electrical test) of the DIP 30 is performed inside the thermostat 20.

  During the test, the electrical test is performed by transmitting an electrical signal from the tester 14 provided outside the thermostat 20 shown in FIG. 1 to the DIP 30 through the slave board 4 and the slave board 6 of the tester head 15.

  Thereafter, when the electrical characteristic test of the DIP 30 is completed, the contact cylinder 11 is retracted, the DIP 30 is detached from the socket 2 by the elastic force of the spring 13, and the transport rail 8 returns to the original sliding position of the positioning portion 20b. . Furthermore, when the stopper 9 is retracted, the DIP 30 is sent downward (outside the thermostatic chamber 20) from the test section by its own weight drop.

  Next, the positive pressure inside and outside the thermostat 20 and the interface housing 5 will be described.

  As shown in FIG. 2, the constant temperature bath 20 includes a fluid pipe joint 25a for taking in dry air 27 (dry air) having a low dew point from the outside, and a low temperature / high temperature air generator 16 shown in FIG. A fluid pipe joint 25b connected to the exhaust pipe 26 is provided, and an exhaust port 26 is formed.

  Further, a suction port 5c is provided at a position corresponding to the exhaust port 26 of the thermostatic chamber 20 in the interface housing 5, and the exhaust port 26 of the thermostatic chamber 20 and the interface are provided on both sides of the through hole 19a of the wall portion 19. A suction port 5c of the housing 5 is disposed. Further, the interface housing 5 is also formed with an exhaust port 5d.

  Therefore, the dry air 27, which is the fluid taken into the constant temperature bath 20 from the fluid pipe joint 25a, is filled into the constant temperature bath 20, while the low temperature / high temperature air 29 taken from the fluid pipe joint 25b is used as the exhaust port. 26, through the through hole 19a and the suction port 5c, enter the inside of the interface housing 5, and are further discharged to the outside through the exhaust port 5d.

  That is, dry air 27 is supplied to the inside of the constant temperature bath 20 to be in a positive pressure state, and the dew point is lower than the outside.

  Further, in the vicinity of the switching lever 23 which is an external engagement portion provided outside the interface housing 5, the switching lever 23 and the surrounding interface housing 5 are filled with dry air 27 which is a fluid having a low dew point. Nozzle 38 is provided. That is, dry air 27 is also supplied to the switching lever 23 and the surrounding interface housing 5 to form a positive pressure state, and the dew point is low.

  Next, an operation (work) at the time of product type switching in the semiconductor device test method of the first embodiment will be described.

  FIG. 5 shows two types of DIP 30. DIP 30 (D) has 24 pins (12 pins on one side), and DIP 30 (E) has 22 pins (11 pins on one side). Although the lead-to-lead pitch is the same, the distance from the mold end face 30b to the first terminal 30aa is different, and the lead terminals 30a are arranged in an arrangement that is shifted by a half of the lead-to-lead pitch. Yes. Note that the socket 2 includes a number of test terminals 2 a corresponding to the larger number of lead terminals 30 a (DIP 30 (D)).

  In this situation, when the switching lever 23 shown in FIG. 2 is rotated by a predetermined amount, the cam portion 23a in which the displacement amount is set so that the slide plates 22a and 22b are slid by a half of the pitch between the lead terminals becomes the slide plate. It rotates in a guide groove 22c formed in 22a. As a result, the slide plates 22a and 22b move by ½ pitch respectively, and the adapter socket 3 and the socket 2 fixed on the child board 4 fastened to each of the slide plates 22a and 22b also have the same displacement amount, that is, Only the ½ pitch (F amount from the reference position 28 in FIG. 5) moves in the test apparatus.

  By performing such an operation, the distance from the mold end surface 30b of the DIP 30 to the first terminal 30aa, which is positioned by the stopper 9, is different from that of the standard pitch product / shrink product without replacing the switching parts of the electrical test apparatus. Can be tested with the same switching component.

  FIG. 6 shows a mounting switching method when the test matrix is changed by shifting the position of the test terminal 2 a of the socket 2 by one pin relative to the DIP 30. The mounting position of the socket 2 is shifted. For example, in the example shown in FIG. 6, the test terminal 2a of the first pin of the socket 2 is brought into contact with the first terminal 30aa of the first pin of the DIP 30 in a normal test, whereas the socket is changed by changing the test matrix. By shifting the position of 2 by G amount from the reference position 28, the test terminal 2a of the 2nd pin of the socket 2 is brought into contact with the first terminal 30aa of the 1st pin of the DIP 30.

  Here, in FIG. 2, parts such as a guide mechanism, a position indexing part, and a pressing spring to the cam portion 23a are omitted.

  Further, in the product switching operation, the case of manual position switching using a cam mechanism has been described. However, automatic switching can be performed by connecting a motor or the like to the eccentric shaft.

  Further, a cam, a link, a feed screw, a winding transmission, and the like may be used for a multi-position indexing mechanism.

  According to the test method of the semiconductor device of the first embodiment, the position of the socket 2 arranged inside the thermostat 20 can be freely adjusted from the outside of the thermostat 20, so that the type of semiconductor device At the time of switching, there is no need to remove or assemble switching parts with respect to an electrical test apparatus (also referred to simply as a test apparatus) such as a self-falling handler, so that the quality of the product switching operation can be stabilized.

  Furthermore, since the product switching operation is facilitated, the quality of the test environment can be made less susceptible to the influence of operator skill.

  In addition, since the quality of the test environment is not affected by the superiority or inferiority of the skill of the worker, the quality of the DIP 30 (semiconductor device) can be stabilized.

  In addition, since there is no need to remove / assemble the switching parts from the test apparatus when switching the product type, the time for switching the product type can be shortened.

  In addition, since one type of component can be used for a plurality of products, the number of switching components to be prepared can be reduced. Thereby, the manufacturing cost of DIP30 can be reduced.

  Also, dry air 27 (for example, −70 ° C.), which is a fluid having a low dew point, is supplied to mechanical parts such as the switching lever 23 and the interface housing 5 provided in the test apparatus, and the switching lever 23 and the interface housing 5 are supplied. By adhering the surrounding area with a fluid having a low dew point, adhesion / penetration wetting does not occur, so that it is possible to prevent the occurrence of electrical leakage and short circuit due to condensation.

  Further, by adopting a device configuration in which dry air 27, which is a fluid having a low dew point, is taken into the constant temperature bath 20 through the fluid pipe joint 25a and is removed from the exhaust port 5d of the test interface unit, the constant temperature bath 20 to the test interface The inside can be kept at a positive pressure from the surrounding environment. Thereby, since the inflow of the surrounding external air into the thermostat 20-test interface part is lose | eliminated, generation | occurrence | production of the dew condensation which causes an apparatus failure can be suppressed. In addition, since no foreign matter or the like enters, it is possible to prevent the reliability of the electrical test from being lowered.

  In addition, the following problems may occur when the parts are switched in accordance with the switching of the semiconductor device type.

  When changing the product type in a test equipment such as a self-falling handler, switching between the semiconductor device A and the semiconductor device B is not simply performed, but actual tests such as a DC test, a standby current test, and a hold test are performed. For test items that do not reveal anomalies unless performed in a high / low temperature environment, the test must be performed after an appropriate test temperature environment is created.

  The first problem is, for example, at low temperatures (below 0 ° C), in order to prevent condensation, the temperature of the device is once raised above the air dew point, switching is performed, and then the target low temperature test temperature is reached. The temperature stabilization waiting time is required.

  Furthermore, as a second problem, the test environment temperature of automotive parts and the like has become higher / lower due to stricter customer specifications in recent years. Therefore, the temperature difference between the test environment temperature and the external temperature is widened, and the amount of heat escaping from the test part of the device increases due to a large temperature gradient, so that the time to reach the test environment temperature is extended, and the operation of the device is increased. The rate is gradually decreasing.

  However, according to the test method of the semiconductor device of the first embodiment, even if the type of the semiconductor device is switched, the test device is replaced without adjusting the position of the socket 2 from the outside and opening the thermostat 20. be able to. Therefore, especially in the temperature environment test, the work can be performed while maintaining the same environmental temperature as that during production.

  Therefore, there is no need for a temperature waiting time until the target test environment temperature is reached or a time until the temperature stabilizes. In electrical testing of semiconductor devices, the test environment can be stably maintained even when product types are switched, and tests after switching can be performed quickly without the need for temperature waiting time or temperature stabilization time. .

(Embodiment 2)
FIG. 7 is a partial cross-sectional view showing an example of the structure of the constant temperature bath and the tester head when the split type transport rail is adopted in the second embodiment of the present invention, and FIG. 8 is a test of the structure shown in FIG. FIG. 9 is a partial sectional view showing an example of the basic structure of the split-type transport rail shown in FIG. 7, and FIG. 10 is a split-type transport rail shown in FIG. It is a fragmentary sectional view showing an example of the basic structure. 11 is a plan view showing an example of the structure of a cam mechanism for operating the split type transport rail shown in FIG. 7, and FIG. 12 is a partial sectional view showing an example of the basic structure of the split type transport rail of the first modification. FIG. 13 is a partial cross-sectional view showing an example of the basic structure of the split-type transport rail of the first modification, FIG. 14 is a partial cross-sectional view showing an example of the basic structure of the split-type transport rail of the second modification, and FIG. It is a fragmentary sectional view which shows an example of the basic structure of the split-type conveyance rail of 2 modifications.

  In the second embodiment, corresponding means in an electrical test apparatus such as a natural (self-weight) drop-type handler when the size (width) of the package body is changed in accordance with the switching of the type of semiconductor device, that is, the width of the package body. A technique for aligning the semiconductor device in the direction (direction intersecting the sliding (falling) direction) and the socket 2 will be described.

  As described in the first embodiment, the standardization of the width of the package body of a semiconductor device is being promoted by JEITA (Electronic Information Technology Industries Association) and the like for package types having the same package thickness. Limited (for example, 300 mil, 350 mil, 400 mil, etc.).

  Therefore, in the test apparatus such as the natural drop handler according to the second embodiment, as shown in FIG. 7 and FIG. 8, the transport system and sockets of the semiconductor device are variable and divided.

  First, as shown in FIG. 7, the guide member for guiding the sliding of the DIP 30 in the transport system of the DIP 30 is a split-type transport rail 8b. The split-type transport rail 8b is divided into left and right near the center of the width direction of the main body 30c (package main body) of the DIP 30, and two split-type transport rails 8b arranged to face each other. Thus, the left and right sides of each DIP 30 are guided. That is, the groove portions 8c having shapes corresponding to the opposing lead terminal 30a groups of the DIP 30 are formed in the divided transport rails 8b on the left and right sides.

  Next, the variable operation of the split type transport rail 8b will be described with reference to FIGS. 7, 9 and 11. FIG. An example of the operation means of the split type transport rail 8b accompanying the change in the width direction of the package body is a plate-like cam 32 having a plurality of index positions with different distances from the center of rotation as shown in FIG. When the plate-like cam 32 of FIG. 11 is used, it can be made to correspond to four types of widths of width A, width B, width C, and width D.

  In the structure shown in FIG. 7, first, when the handle member 31 is rotated, the plate cam 32 connected to the handle member 31 is also rotated. A positioning pin 33 that engages with the plate-like cam 32 is embedded in each of the divided transport rails 8b. At that time, the positioning pin 33 is in contact with the outer periphery of the plate-like cam 32 by a spring member (not shown) and can move in the horizontal direction along the outer shape of the plate-like cam 32 as the plate-like cam 32 rotates. It has become.

  Subsequently, the rotation of the handle member 31 is stopped at a position where the desired rail width is obtained, and the two split transfer rails 8b are positioned by the ball plunger 34 at that position.

  Here, the structure shown in FIG. 9 is a case where the plate-like cam 32 is mounted on a rotatable disk 35, and the ball plunger 34 is mounted on the disk 35 and rotates the handle member 31. Then, the disk 35 and the plate-like cam 32 are configured to rotate. As described above, the two positioning pins 33 can be moved in four sizes (widths) A, B, C, and D shown in FIG. The two divided transport rails 8b can be set to any one of four types of width A, width B, width C, and width D.

  As described above, the divisional transfer rail 8b in which the DIP 30 is slid and arranged on the positioning portion 20b (see FIG. 2) of the thermostatic chamber 20 has a plurality of types (four types in this case) of the main body portion 30c of the DIP 30 (width is here) The movable structure corresponding to the size (width) of the main body portion 30c of the DIP 30 of the divided transport rail 8b is driven by the cam drive by the plate-like cam 32 of the cam mechanism. Done.

  As other means other than the cam drive for moving the divided transport rail 8b, a method of continuously changing the width using a feed screw, a method of determining two positions at the forward / reverse end of the cylinder, etc. Needless to say, it is possible to use a regular mechanism.

  Further, the socket 2 has a split structure as in the case of the split transfer rail 8b of the transfer system, so that the semiconductor device can be mounted on the socket 2 in accordance with the change in the width of the package body.

  A method of attaching the DIP 30 to the split socket 2b will be described with reference to FIGS.

  First, as shown in FIG. 8, the transfer rail 8 that presses the DIP 30 when mounted on the split socket 2b has a plurality of types (widths) of the package body (main body portion 30c) of the semiconductor device on the pressing surface. A plurality of recesses 8a corresponding to the above are formed. The plurality of recesses 8a are formed by steps 8d formed on the pressing surface.

  By providing the step 8d according to the width of the package body, it is possible to guide the pulling in the width direction of the DIP 30 in the positioning portion 20b (see FIG. 2) of the thermostatic bath 20, and the stop position of the transport rail 8 Can be adjusted by the adjusting screw 36.

  The split socket 2b is connected to a split adapter socket 3a fixed to the split slave board 4a. As shown in FIG. 10, the mounting of the DIP 30 to the split type socket 2b includes a split type chute rail 12a that is a guide member of the DIP 30 and that is divided according to the size in the width direction, and a recess 8a. The lead terminal 30a of the DIP 30 sandwiched between the transport rails 8 is connected to the test terminal 2a of the split socket 2b that is divided and arranged in accordance with the position of the lead terminal group according to the size in the width direction. .

  At this time, the split socket 2b can be moved by, for example, the above-described cam mechanism or the above-described feed screw method, cylinder method, or the like.

  As described above, according to the semiconductor device test method using the test apparatus such as the natural drop handler of the second embodiment, the semiconductor device transport system and sockets are divided so as to correspond to the width direction of the package body. By adopting a structure and a variable type, it is possible to realize correspondence to a wider variety of semiconductor devices with the same component.

  Moreover, since the adjustment can be performed from the outside without opening the thermostatic chamber 20, the same effect as that described in the first embodiment can be obtained.

  The other effects obtained by the semiconductor device test method using the test apparatus such as the natural fall handler according to the second embodiment are the same as the effects of the first embodiment, and therefore, redundant description thereof is omitted. To do.

  Next, a modification of the second embodiment will be described.

  The first modification shown in FIGS. 12 and 13 is a case where the semiconductor device is an SOP (Small Outline Package) 40 or a TSOP (Thin Small Outline Package) in which the lead terminal 40a which is an external terminal forms a gull wing shape. Further, the second modification shown in FIGS. 14 and 15 is a case where the lead terminal 50a which is an external terminal of the SOJ (Small Outline J-leaded Package) 50 having a J shape.

  Also in the case of these SOP40 and SOJ50, the above-mentioned DIP30 shown in FIGS. 7 to 11 can be made by changing the transport system and sockets of the semiconductor device as a split structure and changing the package system according to the change in the width direction of the package body. The same effect can be obtained.

  In the test of the semiconductor device using the natural drop type handler of the second embodiment, such as DIP30, SOP40 and TSOP, or SOJ50, a plurality of lead terminals 30a, which are external terminals from two opposite sides of the package body, All of the semiconductor devices of the type in which 40a and 50a protrude can be handled by the same method.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments of the invention. However, the present invention is not limited to the embodiments of the invention, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

  For example, the technique described in the first embodiment (the technique for aligning the DIP 30 and the socket 2 in the DIP sliding direction from outside the thermostatic bath) and the technique described in the second embodiment (the DIP 30 and the socket 2 in the DIP width direction). May be a single technique, or may be a technique in which the first and second embodiments are combined.

  In the first and second embodiments, the case where the positioning is performed by moving the socket 2 from the outside of the thermostatic chamber in the alignment of the semiconductor device and the socket 2 is described. In the positioning unit 20b in the thermostatic bath, The position of the stopper 9 may be variable, and the semiconductor device may be moved to align the semiconductor device and the socket 2.

  The present invention is suitable for a test method of an electronic device that is performed by being attached to a socket.

DESCRIPTION OF SYMBOLS 1 Electronic component 1a Lead terminal 1aa 1st terminal 1b Mold end surface 2 Socket 2a Test terminal 2b Split-type socket 3 Adapter socket 3a Split-type adapter socket 4 Sub-board 4a Split-type sub-board 5 Interface housing 5a, 5b Side surface 5c Inlet 5d Exhaust port 6 Sub-board 6a Electrical terminal 7 Heat insulation 8 Transport rail (guide member)
8a Concave part 8b Dividing rail (guide member)
8c Groove 8d Step 9 Stopper 10 Cylinder 11 Contact cylinder 11a Press plate 12 Chute rail (guide member)
12a Split chute rail (guide member)
13 Spring 14 Tester 15 Tester Head 16 Low Temperature / High Temperature Air Generator 17 Cutting Cylinder 18 Shipping Tube 19 Wall 19a Through Hole 20 Constant Temperature Bath 20a Test Unit (Measurement Unit, Test Unit)
20b Positioning portion 21 Wiring 22a Slide plate 22b Slide plate 22c Guide groove 23 Switching lever (external engagement portion, position adjustment mechanism)
23a Cam part (internal engagement part, position adjustment mechanism)
23b Shaft portion (internal engagement portion, position adjustment mechanism)
24 Linear guide 25a, 25b Fluid pipe joint 26 Exhaust port 27 Dry air 28 Reference position 29 Low temperature / high temperature air 30 DIP (semiconductor device)
30a Lead terminal (external terminal)
30aa 1st terminal (external terminal)
30b Mold end face 30c Main body 31 Handle member 32 Plate cam 33 Positioning pin 34 Ball plunger 35 Disc 36 Adjustment screw 37 Semiconductor chip 38 Nozzle 40 SOP (semiconductor device)
40a Lead terminal (external terminal)
50 SOJ (semiconductor device)
50a Lead terminal (external terminal)

Claims (15)

(A) arranging the semiconductor device in a positioning part inside the thermostat;
(B) attaching the semiconductor device to a socket disposed inside the thermostat and conducting an electrical test of the semiconductor device inside the thermostat;
Have
In the step (b), the position of the socket inside the thermostat is adjusted by the socket position adjusting mechanism provided outside the thermostat, and the semiconductor device is mounted in the socket. A method for testing a semiconductor device. The method for testing a semiconductor device according to claim 1,
The position adjustment mechanism includes an internal engagement portion covered by a housing disposed adjacent to the thermostat, and an external engagement portion exposed to the outside of the housing and engaged with the internal engagement portion. A method for testing a semiconductor device, comprising: The method for testing a semiconductor device according to claim 2,
A test method for a semiconductor device, wherein the inside of the thermostatic chamber is maintained at a positive pressure. The method for testing a semiconductor device according to claim 3,
A test method for a semiconductor device, wherein the external engagement portion is maintained at a positive pressure. The semiconductor device test method according to claim 4,
A test method for a semiconductor device, wherein the inside of the thermostatic chamber and the external engagement portion are maintained at a positive pressure by supplying dry air. The test method for a semiconductor device according to claim 5,
The semiconductor device testing method, wherein the position adjustment mechanism includes a cam mechanism, and the position of the socket is adjusted by driving the cam mechanism. The method for testing a semiconductor device according to claim 1,
The guide member and the socket for disposing the semiconductor device in the positioning portion of the thermostat have a split structure that is movable in accordance with a plurality of types of sizes of the main body of the semiconductor device. A method for testing a semiconductor device. The test method of a semiconductor device according to claim 7,
The method of testing a semiconductor device, wherein the guide member and the socket are movable according to the size of the main body of the semiconductor device by a cam drive of a cam mechanism. The method for testing a semiconductor device according to claim 1,
The semiconductor device test, wherein the guide member for disposing the semiconductor device in the positioning portion of the thermostatic chamber has a plurality of recesses corresponding to a plurality of types of sizes of the main body of the semiconductor device. Method. The method for testing a semiconductor device according to claim 1,
A method for testing a semiconductor device, comprising: adjusting the position of the socket in a direction along a sliding direction of the semiconductor device. The method for testing a semiconductor device according to claim 1,
A method for testing a semiconductor device, comprising: adjusting the position of the socket in a direction intersecting a sliding direction of the semiconductor device. The method for testing a semiconductor device according to claim 1,
In the step (a), the semiconductor device is dropped by its own weight and placed in the positioning portion. The test method of a semiconductor device according to claim 12,
The semiconductor device has a main body in which a semiconductor chip is embedded and a plurality of external terminals exposed from the main body.
The plurality of external terminals are exposed on two opposite sides of the main body,
A method of testing a semiconductor device, wherein the semiconductor device is dropped in such a manner that a terminal row of the plurality of external terminals is arranged in a direction along a dropping direction when the weight falls. The method for testing a semiconductor device according to claim 13,
A test method for a semiconductor device, wherein the body portion of the semiconductor device is made of a sealing resin. The method for testing a semiconductor device according to claim 1,
When the electrical test of the semiconductor device is performed in the step (b), an electrical signal is transmitted to the semiconductor device from a tester provided outside the thermostat, and the electrical test is performed. A method for testing a semiconductor device.

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