CN219536697U - Common-cavity temperature equalizing plate - Google Patents

Abstract

The utility model belongs to the technical field of heat dissipation temperature equalization plates, and particularly discloses a common cavity temperature equalization plate, wherein an upper cover and a lower cover of the common cavity temperature equalization plate are respectively buckled on two end surfaces of a middle cover, a first cavity is formed in the upper cover and the middle cover, a first capillary structure is arranged in the first cavity, a second cavity is formed in the lower cover and the middle cover, a second capillary structure is arranged in the second cavity, the second cavity is communicated with the first cavity, a steam cavity is formed by the second cavity and the first cavity together, a heat transfer working medium is arranged in the steam cavity, and the heat transfer working medium can diffuse and circulate in the first cavity and the second cavity. The common-cavity temperature-equalizing plate reduces material stacking of the soaking plate, reduces contact thermal resistance in a heat conduction process, reduces welding procedures, simplifies manufacturing procedures, has larger volume of a steam cavity, reduces diffusion resistance, is favorable for accelerating a heat dissipation process, and has good heat conduction capability.

Description

Common-cavity temperature equalizing plate

Technical Field

The utility model relates to the technical field of heat dissipation temperature equalization plates, in particular to a common-cavity temperature equalization plate.

Background

Along with the rapid development of electronic technology, electronic products are increasingly widely applied in life of people, and requirements of people on small-size electronic products are also higher, so that the electronic products are expected to be smaller, lighter, thinner, attractive and portable. However, for electronic products with smaller volume, the internal structure is relatively compact, and the accumulated heat is obvious, so that the electronic products need to be rapidly cooled. In order to realize efficient heat dissipation, a technical scheme of overlapping two temperature equalization plates appears, but the structure is generally large in thickness, the manufacturing process is complicated, and the heat dissipation device cannot be applied to some electronic products with small volumes.

Therefore, a common chamber temperature uniformity plate is needed to solve the above problems.

Disclosure of Invention

The utility model aims to provide a common-cavity temperature-equalizing plate which simplifies the manufacturing process, does not need repeated welding, liquid injection and vacuum degassing, has a large volume of a vapor cavity, small evaporation and diffusion resistance of a heat transfer working medium, strong heat conduction capability and good heat dissipation effect.

To achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a common-cavity temperature-equalizing plate, which comprises:

a middle cover;

the upper cover is buckled with the middle cover and is connected with the middle cover in a sealing way, a first cavity is formed in the upper cover, and a first capillary structure is arranged in the first cavity;

the lower cover is buckled with the middle cover and is in sealing connection, a second cavity is formed in the lower cover, a second capillary structure is arranged in the second cavity, the second cavity is communicated with the first cavity to form a steam cavity, and a heat transfer working medium is arranged in the steam cavity.

Optionally, the inboard terminal surface of upper cover is equipped with the first support column of a plurality of intervals settings, the terminal butt of first support column in first capillary structure.

Optionally, the first capillary structure includes first copper mesh, first copper mesh presss from both sides to be established first support column with between the well lid, first copper mesh both sides are equipped with and dodge the vacancy, dodge vacancy department and form auxiliary air flue.

Optionally, at least one vent hole is formed in the middle cover, and the vent hole communicates the first chamber with the second chamber.

Optionally, the vent holes are arranged in one of a circle, square, rectangle or triangle.

Optionally, the second capillary structure includes a long groove and a short groove etched on the middle cover, the short groove is arranged at two ends of the middle cover along the length direction of the middle cover and forms an evaporation area or a condensation area, the long groove is arranged in the middle of the middle cover along the length direction of the middle cover, and the vent hole is arranged in the evaporation area and/or the condensation area.

Optionally, the second capillary structure includes a second copper mesh, and the second copper mesh is sandwiched between the lower cover and the middle cover and respectively abuts against the lower cover and the middle cover.

Optionally, the inboard terminal surface of lower cover is equipped with the second support column of a plurality of intervals settings, the terminal butt of second support column in the second copper mesh.

Optionally, a plurality of bridge support columns are arranged in a partial area of the inner side end surface of the lower cover, the partial area is arranged corresponding to the opening position of the vent hole, and the tail ends of the bridge support columns are abutted to the second copper net.

Optionally, the common-cavity temperature equalizing plate comprises a liquid injection port, and the liquid injection port is communicated with the first cavity or the second cavity.

The beneficial effects of the utility model are as follows:

the utility model provides a common-cavity temperature equalizing plate which comprises a middle cover, an upper cover and a lower cover, wherein the upper cover and the lower cover are respectively buckled on two end faces of the middle cover and are in sealing connection with the middle cover. The inside of upper cover and well lid forms first cavity, is equipped with first capillary structure in the first cavity, and the inside of lower cover and well lid forms the second cavity, is equipped with second capillary structure in the second cavity, and second cavity and first cavity intercommunication, second cavity and first cavity form the steam chamber jointly, have heat transfer working medium in the steam chamber, and heat transfer working medium can diffuse circulation in first cavity and second cavity. The common-cavity temperature-equalizing plate reduces material stacking of the soaking plate, reduces contact thermal resistance in a heat conduction process, reduces welding procedures, simultaneously has larger volume of a steam cavity and smaller diffusion resistance due to the communication of the first cavity and the second cavity, is beneficial to accelerating a heat dissipation process, has good heat conduction capability, and has the advantages that the two cavities are communicated, so that the operation is only needed once during liquid injection and air extraction, and the manufacturing procedure is simplified.

Drawings

FIG. 1 is a schematic cross-sectional view of a common chamber temperature uniformity plate according to a first embodiment of the present utility model;

FIG. 2 is a top view of a top cover and a first copper mesh provided in a first embodiment of the utility model;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is a top view of a first copper mesh provided in a first embodiment of the utility model;

FIG. 5 is a top view of a middle cap provided in a first embodiment of the present utility model;

fig. 6 is a top view of a second copper mesh provided in a first embodiment of the utility model;

FIG. 7 is a top view of a lower cover provided in a first embodiment of the utility model;

FIG. 8 is a partial enlarged view at B in FIG. 7;

FIG. 9 is an enlarged view of a portion of FIG. 7 at C;

fig. 10 is a top view of a lower cover and a second copper mesh provided in a second embodiment of the present utility model;

FIG. 11 is a top view of a second copper mesh provided in a second embodiment of the utility model;

FIG. 12 is a schematic cross-sectional view of a common-chamber temperature-equalizing plate according to a third embodiment of the present utility model;

FIG. 13 is a top view of a middle cover provided in a third embodiment of the present utility model;

fig. 14 is a partial enlarged view at D in fig. 13.

In the figure:

100. a middle cover; 110. a groove; 110a, long grooves; 110b, short grooves; 120. an upper liquid injection port end; 130. a vent hole;

200. an upper cover; 201. a first airway; 202. an auxiliary airway; 210. a first support column; 210a, a first column; 210b, a second column; 220. a first copper mesh; 221. avoidance of gaps; 230. an upper sealing edge;

300. a lower cover; 301. a second airway; 310. a second copper mesh; 320. a second support column; 330. bridge support columns; 340. a lower sealing edge; 350. a liquid filling port end;

400. and (3) welding seams.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Example 1

As shown in fig. 1, the present embodiment provides a common-cavity temperature-equalizing plate, which includes a middle cover 100, an upper cover 200 and a lower cover 300, wherein the upper cover 200 and the lower cover 300 are respectively buckled on two end surfaces of the middle cover 100, the upper cover 200 is in sealing connection with the middle cover 100, and the lower cover 300 is in sealing connection with the middle cover 100. The upper cover 200 and the middle cover 100 are rectangular structures, a first cavity is formed in the upper cover 200 and the middle cover 100, a first capillary structure is arranged in the first cavity, a cavity without the first capillary structure is a first air channel 201, a second cavity is formed in the lower cover 300 and the middle cover 100, a second capillary structure is arranged in the second cavity, a cavity without the second capillary structure is a second air channel 301, the second cavity is communicated with the first cavity, namely the first air channel 201 is communicated with the second air channel 301, a steam cavity is formed in the second cavity and the first cavity together, a heat transfer working medium is arranged in the steam cavity, and the heat transfer working medium can diffuse and circulate in the first air channel 201 and the second air channel 301. By way of example, saturated water may be selected for the heat transfer medium.

When the heat dissipation device is used, the lower cover 300 is connected with an electronic product needing heat dissipation, the heat of the electronic product is dissipated to the lower cover 300 along the thickness direction of the common-cavity temperature-equalizing plate, the heat transfer working medium in the second cavity is heated and converted into gas phase working medium, part of the gas phase working medium is spread to the second capillary structure through the second air passage 301, the heat is transferred to the middle cover 100, the first air passage 201 is communicated with the second air passage, so that the other part of the gas phase working medium can be directly spread to the first air passage 201 to exchange heat with the heat transfer working medium in the first cavity, of course, the heat of the middle cover 100 can be transferred to the heat transfer working medium in the first cavity, the heat transfer working medium in the first cavity is evaporated into the gas phase working medium to be continuously spread to the first capillary structure through the first air passage 201, the first heat transfer working medium is condensed into the liquid phase after encountering the first capillary structure, the heat is transferred to the upper cover 200, the heat dissipation in the thickness direction is finished, compared with the traditional double-layer stacked temperature-equalizing plate, the common-cavity temperature-equalizing plate is reduced, the material stack of the common-cavity temperature-equalizing plate is reduced, the heat dissipation device is well, the heat dissipation process is reduced, the heat dissipation process is conducted with the heat dissipation process is carried out, and the heat dissipation process is easy to be conducted with the heat conduction process, and the heat dissipation process is easy, and the heat is easy to be conducted and due to the heat to be connected with the heat transfer process.

In addition, in the embodiment, along the length direction of the common-cavity temperature-equalizing plate, one end is an evaporation area, the other end is a condensation area, the heat transfer working media in the first cavity and the second cavity are subjected to state conversion simultaneously, the heat of the heat source is gradually transferred to the farthest end in the plane direction, the heat flow density of the heat source and the evaporation thermal resistance in the plane direction are relatively reduced, the heat transfer quantity in the two-dimensional plane direction is effectively increased, the whole thickness is thinner, the internal space of an electronic product can be effectively utilized, and therefore the current requirement for the ultrathin and rapid heat-conducting temperature-equalizing plate is met.

Of course, in some embodiments, the upper cover 200 may be connected to an electronic product requiring heat dissipation, and the upper cover 200 and the lower cover 300 may both be used as heat sources.

As an alternative, in this embodiment, the upper cover 200, the middle cover 100 and the lower cover 300 are made of metal materials, and the upper cover 200 and the middle cover 100, the middle cover 100 and the lower cover 300 may be sealed by brazing, vacuum diffusion welding or laser welding to form a closed cavity, and the upper cover 200 and the middle cover 100, and the middle cover 100 and the lower cover 300 all form a weld 400. Preferably, the upper cover 200, the middle cover 100 and the lower cover 300 may be made of high-performance alloy copper or stainless steel. After the upper cover 200, the middle cover 100 and the lower cover 300 are molded, the thickness thereof is greater than or equal to 0.03mm, preferably 0.05mm to 1.0mm. Further, the first chamber and the second chamber have different heights in design, and the heights of the first chamber and the second chamber are each greater than 0.06mm, preferably greater than 0.15mm.

Further, referring to fig. 2, 3 and 4, in this embodiment, the inner end surface of the upper cover 200 is provided with a plurality of first support columns 210 disposed at intervals, and the ends of the first support columns 210 are abutted against the first capillary structure. Illustratively, in this embodiment, the first support columns 210 are configured as cylinders, and the diameter ranges from 0.3mm to 2mm, and each first support column 210 is arranged in a transverse and longitudinal array, and the distance between two adjacent first support columns 210 ranges from 0.3mm to 3mm. Of course, in other embodiments, the first support column 210 may be configured as a triangular prism, a quadrangular prism, a pentagonal prism, a hexagonal prism, or the like, which is not limited in this embodiment.

The first capillary structure comprises a first copper mesh 220, the first copper mesh 220 is clamped between a first support column 210 and the middle cover 100, avoidance gaps 221 are formed in two sides of the first copper mesh 220, and an auxiliary air channel 202 is formed at the avoidance gaps 221. Specifically, the shape of the first copper mesh 220 is also rectangular, and the axis of the first copper mesh 220 coincides with the axis of the upper cover 200, but the width of the first copper mesh 220 is smaller than that of the upper cover 200, and gaps are left on two sides of the first copper mesh 220, namely, the above-mentioned avoidance gaps 221, and by setting the avoidance gaps 221, an auxiliary air passage 202 for the heat transfer working medium converted into a gas phase to circulate is formed on two sides of the first copper mesh 220, so that the heat transfer working medium is facilitated to rapidly spread into the first capillary structure (namely the first copper mesh 220 here), the resistance of the gas phase to circulate is reduced, and heat exchange is accelerated. Illustratively, the first copper mesh 220 has a specification of 100 mesh to 400 mesh and a thickness of 0.03mm to 0.22mm, and the auxiliary air passage 202 has a width of 0.5mm to 10mm. Of course, in some embodiments, the first capillary structure may be replaced by other capillary structures having the same effect, for example, copper powder, foam copper or fiber copper wire, etc., which will not be described in detail herein.

In order to better support the middle cap 100 and the first capillary structure, the first support column 210 in the present embodiment includes a first column 210a and a second column 210b, wherein the end of the first column 210a abuts against the first capillary structure (here, the first copper mesh 220), the first column 210a can provide support for the first capillary structure, the second column 210b abuts against both sides of the middle cap 100 in the width direction, and the second column 210b can provide support for the middle cap 100. It should be noted that, the first column 210a and the second column 210b only differ in that the heights of the first column 210a and the second column 210b are different, the height of the first column 210a is smaller than the height of the second column 210b, and the remaining dimensions are equal.

Referring to fig. 5, the middle cap 100 is provided with at least one vent hole 130, and the vent hole 130 communicates the first chamber with the second chamber. An evaporation area and a condensation area are respectively formed along the two ends of the length direction of the common-cavity temperature-equalizing plate, and the vent 130 is arranged in the evaporation area or the condensation area. Specifically, the vent hole 130 may be provided in one of a circle, a square, a rectangle, or a triangle. Illustratively, the present embodiment is described taking the case where two vent holes 130 are provided in the middle cap 100, one vent hole 130 is provided in a circular shape, and the other vent hole 130 is provided in a rectangular shape. Of course, in other embodiments, the ventilation holes 130 may be provided in other numbers or in any other shape, and may be specifically provided according to needs, which is not limited in this embodiment. In addition, the size of the vent 130 may be specifically adjusted according to the volume of the steam chamber, the shape characteristics of the vent, and the size of the middle cover.

Referring to fig. 1 and 6-9, the second capillary structure in the second chamber includes a second copper mesh 310, where the second copper mesh 310 is sandwiched between the lower cover 300 and the middle cover 100 and abuts against the lower cover 300 and the middle cover 100, respectively. The second copper net 310 and the lower cover 300 have the same shape and are rectangular, the size of the second copper net is slightly smaller than that of the lower cover 300, a plurality of second support columns 320 are arranged at intervals on the inner side end face of the lower cover 300, and the tail ends of the second support columns 320 are abutted against the second copper net 310 so as to provide a supporting effect on the second copper net 310, so that the second copper net is not easy to deform. Illustratively, the second support columns 320 in this embodiment are also configured as cylinders, whose diameters range from 0.3mm to 2mm, and each second support column 320 is arranged in a transverse and longitudinal array, and the distance between two adjacent second support columns 320 ranges from 0.3mm to 3mm. Of course, in other embodiments, the second support column 320 may be configured as a triangular prism, a quadrangular prism, a pentagonal prism, a hexagonal prism, or the like, which is not limited in this embodiment. The second copper mesh 310 is also set to 100 to 400 mesh and has a thickness of 0.03 to 0.22mm. Of course, in some embodiments, the second copper mesh 310 may be replaced by other capillary structures with the same effect, for example, copper powder, foam copper or fiber copper wires, etc., which will not be described in detail herein.

More preferably, a plurality of bridge support columns 330 are disposed in a partial area of the inner side end surface of the lower cover 300, the partial area is disposed corresponding to the opening position of the vent 130, and the ends of the bridge support columns 330 are abutted against the second copper mesh 310. The width and height of the bridge support columns 330 are the same as the diameter of the second support columns 320, and the length of the bridge support columns 330 may be specifically set according to the opening size of the ventilation holes 130. By providing the bridge support columns 330 in the partial areas corresponding to the ventilation holes 130, a good support can be provided for the second copper mesh 310, and the second copper mesh 310 can support the middle cover 100, so that the open hole positions are prevented from being concavely deformed. Of course, in some embodiments, tower-shaped support columns may be disposed in a partial area of the inner side end surface of the lower cover 300, the partial area is disposed corresponding to the opening position of the ventilation holes 130, the tail ends of the tower-shaped support columns are abutted against the second copper net 310, and the tower-shaped support columns replace the bridge support columns 330 to provide support for the second copper net 310 and the middle cover 100.

Further, the common-cavity temperature-equalizing plate in the embodiment further comprises a liquid injection port, wherein the liquid injection port is communicated with the first cavity or the second cavity and is used for injecting heat transfer working media into the steam cavity, and the common-cavity temperature-equalizing plate is used as a degassing port and is used for vacuumizing the steam cavity. After the liquid injection and vacuum pumping are completed, the liquid injection port can be sealed by adopting a welding process such as resistance welding, ultrasonic welding or laser welding. And the filling amount of the heat transfer working medium is 90% -100% of the sum of the capillary water contents of the first capillary structure and the second capillary structure, so that the phenomenon of liquid leakage is avoided. In addition, the vacuum degree in the steam chamber needs to be less than or equal to 150Pa.

As an alternative, in this embodiment, the lower sealing edge 340 is formed around the lower cover 300, one side of the lower sealing edge 340 extends outwards to form the lower liquid injection port end 350, the upper liquid injection port end 120 is disposed at a corresponding position on the middle cover 100, and after the lower sealing edge 340 of the lower cover 300 is buckled with the middle cover 100, the upper liquid injection port end 120 and the lower liquid injection port end 350 are jointly surrounded to form the liquid injection port.

Of course, in other embodiments, the upper sealing edge 230 may be formed around the upper cover 200, the lower filling port end 350 may be formed by extending one side of the upper sealing edge 230 outwards, the upper filling port end 120 may be disposed at a corresponding position on the middle cover 100, and the upper filling port end 120 and the lower filling port end 350 may be formed by surrounding together after the upper sealing edge 230 of the upper cover 200 is buckled with the middle cover 100.

Example two

The present embodiment provides a common-chamber temperature-equalizing plate, referring to fig. 10 and 11, which is different from the common-chamber temperature-equalizing plate in the implementation one in that: in this embodiment, the shape of the lower cover 300 and the second copper mesh 310 is similar to a T-shape, so that some parts in the electronic product can be avoided, and the area of the lower cover 300 is smaller than that of the upper cover 200, so that the heat dissipation area of the upper cover 200 is relatively enlarged, and the quick heat dissipation of the upper cover 200 is facilitated.

Of course, in this embodiment, the lower cover 300 is also provided with a second support column 320 and a bridge support column 330, the bridge support column 330 is disposed in a partial area corresponding to the vent 130, the ends of the second support column 320 and the bridge support column 330 are both abutted to the second copper mesh 310, the width and the height of the bridge support column 330 are the same as the diameter of the second support column 320, and the length of the bridge support column 330 can be specifically set according to the size of the opening of the vent 130. Through set up bridge support column 330 on lower cover 300, can provide good support to second copper net 310, and then second copper net 310 can support well lid 100, guarantees that its trompil position is difficult for taking place to warp, is favorable to improving the mechanical strength of whole common chamber samming board, increase of service life.

The rest of the structures in this embodiment are the same as those in the first embodiment, and will not be described here again.

Example III

The present embodiment provides a common-chamber temperature-equalizing plate, referring to fig. 12, 13 and 14, which is different from the common-chamber temperature-equalizing plate in the implementation one in that: the second capillary structure in this embodiment is a composite capillary, and includes a second copper mesh 310 and a groove 110 etched on the middle cover 100, wherein a capillary water channel is formed in the groove 110, and the capillary water absorbing capacity is improved. Illustratively, the capillary channel formed by the grooves 110 is a rectangular flow channel having a width greater than 0.03mm and a depth greater than 0.005mm, and the length can be adjusted as desired to achieve a target capillary force. Alternatively, the grooves 110 include long grooves 110a and short grooves 110b, the short grooves 110b being disposed at both ends of the middle cap 100 in the length direction thereof and forming an evaporation zone or a condensation zone, the long grooves 110a being disposed in the middle of the middle cap 100 in the length direction thereof, and the vent holes 130 being disposed in the evaporation zone and/or the condensation zone.

In the following description, two through holes are set on the middle cover 100 as an example, one through hole is set in the evaporation area and the condensation area of the middle cover 100 (i.e. the positions of the short grooves 110b on the two ends of the middle cover 100 along the length direction of the middle cover), one through hole is set to be circular, the other through hole is set to be rectangular, the first cavity and the second cavity can be communicated through the two through holes, the heat transfer working medium in the first cavity and the heat transfer working medium in the second cavity can share and circulate mutually, the volume of the steam cavity is increased, the space through which the heat transfer working medium can circulate is increased when the heat transfer working medium evaporates to be gas phase, the circulation resistance of the heat transfer working medium of the gas phase is reduced, and the heat exchange process is accelerated. In addition, the first cavity is communicated with the second cavity, so that only one liquid injection port is arranged on the common cavity temperature equalizing plate.

The other structures in this embodiment are the same as those in the first embodiment, and will not be described here again.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. A common-chamber temperature equalization plate, comprising:

a middle cover (100);

the upper cover (200) is buckled with the middle cover (100) and is connected in a sealing way, a first cavity is formed in the upper cover, and a first capillary structure is arranged in the first cavity;

the lower cover (300), lower cover (300) with well lid (100) lock and sealing connection, and inside formation second cavity, be equipped with the second capillary structure in the second cavity, the second cavity with first cavity intercommunication forms the steam chamber, the steam intracavity has the heat transfer working medium.

2. The common-chamber temperature equalization plate according to claim 1, wherein a plurality of first support columns (210) are arranged at intervals on the inner side end surface of the upper cover (200), and the tail ends of the first support columns (210) are abutted to the first capillary structure.

3. The common-cavity temperature-equalizing plate according to claim 2, wherein the first capillary structure comprises a first copper mesh (220), the first copper mesh (220) is clamped between the first support column (210) and the middle cover (100), avoidance gaps (221) are formed in two sides of the first copper mesh (220), and an auxiliary air channel (202) is formed at the avoidance gaps (221).

4. The common-chamber temperature equalization plate according to claim 1, wherein at least one vent hole (130) is provided on said middle cover (100), said vent hole (130) communicating said first chamber with said second chamber.

5. The common-chamber temperature-equalizing plate according to claim 4, wherein the vent holes (130) are provided in one of a circle, a square, a rectangle, or a triangle.

6. The common-chamber temperature equalization plate according to claim 4, wherein said second capillary structure comprises long grooves (110 a) and short grooves (110 b) etched on said middle cover (100), said short grooves (110 b) are provided at both ends of said middle cover (100) in a length direction thereof and form an evaporation zone or a condensation zone, said long grooves (110 a) are provided in a middle of said middle cover (100) in a length direction thereof, and said vent holes (130) are provided at said evaporation zone and/or said condensation zone.

7. The common-chamber temperature-equalizing plate according to claim 4 or 6, wherein the second capillary structure comprises a second copper mesh (310), and the second copper mesh (310) is sandwiched between the lower cover (300) and the middle cover (100) and is respectively abutted against the lower cover (300) and the middle cover (100).

8. The common-chamber temperature equalization plate according to claim 7, wherein a plurality of second support columns (320) are arranged at intervals on the inner side end surface of the lower cover (300), and the tail ends of the second support columns (320) are abutted to the second copper mesh (310).

9. The common-cavity temperature-equalizing plate according to claim 7, wherein a plurality of bridge support columns (330) are arranged in a partial area of the inner side end surface of the lower cover (300), the partial area is arranged corresponding to the opening position of the vent hole (130), and the tail ends of the bridge support columns (330) are abutted to the second copper net (310).

10. The common-chamber temperature equalization plate of claim 1, wherein the common-chamber temperature equalization plate comprises a liquid injection port in communication with the first chamber or the second chamber.