CN219534517U

CN219534517U - Diode with passive heat radiation structure

Info

Publication number: CN219534517U
Application number: CN202320461746.7U
Authority: CN
Inventors: 周伟伟; 邰兆娟
Original assignee: Nanjing Weipan Microelectronics Co ltd
Current assignee: Nanjing Weipan Microelectronics Co ltd
Priority date: 2023-03-13
Filing date: 2023-03-13
Publication date: 2023-08-15
Anticipated expiration: 2033-03-13

Abstract

The utility model provides a diode with a passive heat dissipation structure, which relates to the technical field of diodes and comprises a diode body and a cylindrical shell, wherein a first heat conduction silica gel pad is sleeved on the side wall of the diode body, an aluminum sheet is connected to the outer wall of the first heat conduction silica gel pad, a second heat conduction silica gel pad is connected to one side of the diode body, a heat conduction block is connected to one side of the second heat conduction silica gel pad, fan grooves are formed in one side of the cylindrical shell, two groups of fan grooves are formed, and the two groups of fan grooves are symmetrically arranged. According to the LED, heat generated by the diode body is firstly transferred to the first heat-conducting silica gel pad and the second heat-conducting silica gel pad, the first heat-conducting silica gel pads distributed in a linear array can uniformly transfer heat from the side walls to the aluminum plate, the second heat-conducting silica gel pads can transfer heat from two sides to the heat-conducting blocks, the heat of the side walls is transferred from the aluminum plate to the first heat-radiating fins for heat radiation, and the heat of the two sides is transferred from the heat-radiating blocks to the second heat-radiating fins for heat radiation.

Description

Diode with passive heat radiation structure

Technical Field

The utility model relates to the technical field of diodes, in particular to a diode with a passive heat dissipation structure.

Background

A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). The diode has two electrodes, an anode, also called anode; the negative electrode, called the negative electrode, turns on the diode when a forward voltage is applied between two stages of the diode, and turns off the diode when a reverse voltage is applied. The on and off of the diode corresponds to the on and off of the switch.

The diode has unidirectional conductivity, and the current flows from the anode to the cathode through the tube when conducting. Diodes are one of the earliest emerging semiconductor devices and are very widely used. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, so that the functions of rectifying alternating current, detecting modulated signals, limiting amplitude, clamping, stabilizing power supply voltage and the like can be realized. The current directionality of most diodes is generally called as a rectifying function, the diodes generate heat in the rectifying process, particularly, the large current has larger power consumption in the rectifying process, so that the heating value of the diodes is increased, the performance of the diodes is influenced, in the prior art, the common diodes are wrapped by insulating plastic materials, the heat dissipation performance is poor, and the temperature of the diode chips is easily too high, so that the working performance of the diodes is influenced. Therefore, a diode with a passive heat dissipation structure is provided.

Disclosure of Invention

The utility model aims to solve the defects existing in the technical field of diodes. In the prior art, a common diode is wrapped by an insulating plastic material, so that the heat dissipation performance is poor, and the working performance of the diode chip is easily influenced due to the fact that the temperature of the diode chip is too high.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the diode with the passive heat dissipation structure comprises a diode body and a cylindrical shell, wherein one side of the diode body is connected with a positive electrode pin, one side, far away from the positive electrode pin, of the diode body is connected with a negative electrode pin, the side wall of the diode body is sleeved with a first heat-conducting silica gel pad, an outer wall of the first heat-conducting silica gel pad is connected with an aluminum sheet, one side of the diode body is connected with a second heat-conducting silica gel pad, one side of the second heat-conducting silica gel pad is connected with a heat-conducting block, one side of the cylindrical shell is provided with a fan groove, and the fan grooves are symmetrically arranged in two groups.

As a preferred implementation mode, the first heat-conducting silica gel pads are distributed on the outer wall of the diode body in a linear array.

As a preferred implementation mode, two heat-conducting silica gel pads are arranged, and the two heat-conducting silica gel pads are respectively arranged on one side far away from and close to the positive electrode pin.

As a preferable implementation mode, a fan groove is formed in one side of the cylindrical shell, two groups of fan grooves are formed, and the two groups of fan grooves are symmetrically arranged.

As a preferred implementation mode, an arc groove is formed in the outer wall of the cylindrical shell, a first radiating fin is connected to the inner wall of the arc groove, and one side, away from the first heat-conducting silica gel pad, of the aluminum sheet is connected with the inner wall of the first radiating fin.

As a preferred implementation mode, the inner wall of the fan groove is connected with a second radiating fin, and one side, far away from the first hot silica gel pad, of the heat conducting block is connected with the inner wall of the second radiating fin.

Compared with the prior art, the utility model has the advantages and positive effects that:

according to the utility model, the first heat-conducting silica gel pads are distributed on the outer wall of the diode body in a linear array, so that heat generated by the diode body can be uniformly transferred from the side wall to the aluminum plate. The two heat conduction silica gel pads II are respectively located at one side far away from and close to the positive electrode pin, and can transfer heat generated by the diode body to the heat conduction block from two sides. The arc groove has been seted up to cylinder casing outer wall, and arc groove inner wall is connected with fin one, and one side and fin one inner wall connection that the heat conduction silica gel pad was kept away from to the aluminum sheet, and heat is given on the fin one from the aluminum sheet transfer and is dispelled the heat. A fan groove is formed in one side of the cylindrical shell, two groups of fan grooves are symmetrically formed in the fan groove, a second radiating fin is connected to the inner wall of the fan groove, one side, away from the first hot silica gel pad, of the heat conducting block is connected with the inner wall of the second radiating fin, and heat is transferred from the heat radiating block to the second radiating fin to radiate.

Drawings

Fig. 1 is a schematic structural diagram of a diode with a passive heat dissipation structure according to the present utility model.

Fig. 2 is a cross-sectional view of a diode cylindrical housing with a passive heat dissipation structure according to the present utility model.

Fig. 3 is a schematic structural diagram of a diode body of a diode with a passive heat dissipation structure according to the present utility model.

Fig. 4 is a schematic structural diagram of a diode cylindrical shell with a passive heat dissipation structure according to the present utility model.

Legend description:

1. a diode body; 11. a first heat-conducting silica gel pad; 12. an aluminum sheet; 13. a second heat-conducting silica gel pad; 131. a round groove I; 14. a heat conduction block; 141. a heat sink;

2. a positive electrode pin;

3. a negative electrode pin;

4. a cylindrical housing; 41. an arc groove; 42. a first radiating fin; 43. a fan groove; 44. a second radiating fin; 45. a round groove II; 46. an insulating sleeve.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

As shown in fig. 1 to 4, the present utility model provides a technical solution: the utility model provides a diode with passive heat radiation structure, including diode body 1 and cylindrical shell 4, diode body 1 one side is connected with anodal pin 2, diode body 1 is kept away from one side of anodal pin 2 and is connected with negative pole pin 3, diode body 1 lateral wall has cup jointed heat conduction silica gel pad one 11, heat conduction silica gel pad one 11 is the linear array and distributes at diode body 1 outer wall, heat conduction silica gel pad one 11 outer wall connection has aluminum sheet 12, diode body 1 one side is connected with heat conduction silica gel pad two 13, heat conduction silica gel pad two 13 has two, two heat conduction silica gel pads two 13 are located respectively and keep away from and be close to one side of anodal pin 2, heat conduction silica gel pad two 13 one side is connected with heat conduction block 14, heat conduction block 14 has been seted up the radiating groove 141 in one side of diode body 1, arc groove 41 has been seted up to cylindrical shell 4 outer wall, arc groove 41 inner wall connection has fin one 42, one side and radiating fin one 42 inner wall connection of heat conduction silica gel pad one 11 are kept away from to aluminum sheet 12, cylindrical shell 4 one side has fan groove 43, two sets of fan groove 43 symmetry sets up, two fan groove 43 are connected with fan groove 43 inner wall connection 44, heat conduction block 14 is kept away from one side of heat conduction silica gel pad 11.

In this embodiment, the heat generated by the diode body 1 is firstly transferred to the first heat-conducting silica gel pad 11 and the second heat-conducting silica gel pad 13, the first heat-conducting silica gel pad 11 distributed in a linear array can uniformly transfer the heat from the side wall to the aluminum plate, the second heat-conducting silica gel pad 13 can transfer the heat from two sides to the heat-conducting block 14, the heat of the side wall is transferred from the aluminum plate 12 to the first heat-radiating fin 42 for heat radiation, and the heat of two sides is transferred from the heat-radiating block to the second heat-radiating fin 44 for heat radiation.

Example 2

As shown in fig. 2-4, a first round groove 131 is formed on one side of the second heat-conducting silica gel pad 13, a second round groove 45 is formed on one side of the cylindrical shell 4, two round grooves 45 are symmetrically formed on the second round groove 45, the first round groove 131 and the second round groove 45 are matched with the positive electrode pin 2 and the negative electrode pin 3, an insulating sleeve 46 is connected to one side of the second round groove 45, and the inner diameter of the insulating sleeve 46 is identical to the outer diameters of the positive electrode pin 2 and the negative electrode pin 3.

In this embodiment, the first circular groove 131 and the second circular groove 45 are engaged with the positive electrode pin 2 and the negative electrode pin 3, and the positive electrode pin 2 and the negative electrode pin 3 pass through the first circular groove 131 and the second circular groove 45. The inner diameter of the insulating sleeve 46 is the same as the outer diameters of the positive electrode pin 2 and the negative electrode pin 3, and the insulating sleeve 46 wraps the joint of the positive electrode pin 2, the negative electrode pin 3 and the cylindrical shell 4 to play an insulating effect.

Working principle:

as shown in fig. 1 to 4, the heat generated by the diode body 1 is firstly transferred to the first heat-conducting silica gel pad 11 and the second heat-conducting silica gel pad 13, the first heat-conducting silica gel pad 11 distributed in a linear array can uniformly transfer the heat from the side wall to the aluminum plate, the second heat-conducting silica gel pad 13 can transfer the heat from two sides to the heat-conducting block 14, the heat of the side wall is transferred from the aluminum plate 12 to the first heat-radiating fin 42 for heat radiation, and the heat of the two sides is transferred from the heat-radiating block to the second heat-radiating fin 44 for heat radiation. The round groove I131 and the round groove II 45 are matched with the positive electrode pin 2 and the negative electrode pin 3, and the positive electrode pin 2 and the negative electrode pin 3 penetrate out of the round groove I131 and the round groove II 45. The inner diameter of the insulating sleeve 46 is the same as the outer diameters of the positive electrode pin 2 and the negative electrode pin 3, and the insulating sleeve 46 wraps the joint of the positive electrode pin 2, the negative electrode pin 3 and the cylindrical shell 4 to play an insulating effect.

The drawings of the present utility model are merely to show specific structural positions to aid understanding, and are not limited to scale dimensions, specifications, and the like.

The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.

Claims

1. The utility model provides a diode with passive heat radiation structure, its characterized in that, including diode body (1) and cylinder casing (4), diode body (1) one side is connected with anodal pin (2), diode body (1) one side of keeping away from anodal pin (2) is connected with negative pole pin (3), diode body (1) lateral wall has cup jointed heat conduction silica gel pad one (11), heat conduction silica gel pad one (11) outer wall connection has aluminum sheet (12), diode body (1) one side is connected with heat conduction silica gel pad two (13), heat conduction silica gel pad two (13) one side is connected with heat conduction block (14), heat dissipation groove (141) have been seted up to one side that diode body (1) was kept away from to heat conduction block (14).

2. A diode with passive heat sink structure as defined in claim 1, wherein: the first heat-conducting silica gel pads (11) are distributed on the outer wall of the diode body (1) in a linear array.

3. A diode with passive heat sink structure as defined in claim 1, wherein: two heat conduction silica gel pads (13) are arranged, and the two heat conduction silica gel pads (13) are respectively positioned at one side far away from and close to the positive electrode pin (2).

4. A diode with passive heat sink structure as defined in claim 1, wherein: a fan groove (43) is formed in one side of the cylindrical shell (4), two groups of fan grooves (43) are formed, and the two groups of fan grooves (43) are symmetrically arranged.

5. A diode with passive heat sink structure as defined in claim 1, wherein: an arc groove (41) is formed in the outer wall of the cylindrical shell (4), a first radiating fin (42) is connected to the inner wall of the arc groove (41), and one side, away from the first heat-conducting silica gel pad (11), of the aluminum sheet (12) is connected with the inner wall of the first radiating fin (42).

6. A diode with passive heat sink structure as defined in claim 4, wherein: the inner wall of the fan groove (43) is connected with a second radiating fin (44), and one side, far away from the first hot silica gel pad (11), of the heat conducting block (14) is connected with the inner wall of the second radiating fin (44).