CN212820801U - Take temperature control device's point gum machine cylinder fixing base - Google Patents
Take temperature control device's point gum machine cylinder fixing base Download PDFInfo
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- CN212820801U CN212820801U CN202020951436.XU CN202020951436U CN212820801U CN 212820801 U CN212820801 U CN 212820801U CN 202020951436 U CN202020951436 U CN 202020951436U CN 212820801 U CN212820801 U CN 212820801U
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- heat exchanger
- semiconductor refrigeration
- fixing seat
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- heat
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Abstract
The utility model relates to a take temperature control device's point gum machine cylinder fixing base belongs to electron product processing equipment field. The semiconductor refrigerating sheet is connected with a temperature controller through a lead; the semiconductor refrigeration piece is arranged between the fixing seat body and the heat exchanger, and two poles of the semiconductor refrigeration piece are respectively connected with the fixing seat body and the heat exchanger; the temperature probe is arranged on the fixing seat body and is in signal connection with the temperature controller, the heat insulation sheet is further arranged between the fixing seat body and the heat exchanger and is arranged between the two poles of the semiconductor refrigeration sheet, the through hole for the semiconductor refrigeration sheet to pass through is formed in the heat insulation sheet, and the heat insulation sheet is installed on the semiconductor refrigeration sheet through the through hole. The utility model discloses can cool down the fixing base body, make the temperature of interior silver colloid of cylinder keep invariable. The refrigeration and heat dissipation effect is good, the heat exchange efficiency is high, the equipment structure is simple, and the reliability is high.
Description
Technical Field
The utility model belongs to electron product processing equipment field relates to a take temperature control device's point gum machine cylinder fixing base.
Background
The silver colloid is a common material in the field of electronic processing, and is generally coated by a dispenser which generally comprises a needle cylinder fixing seat so as to fix a needle cylinder filled with the silver colloid. The temperature of the silver paste may change due to heat transfer during the coating process. After the temperature of the silver adhesive changes, the physical properties of the silver adhesive can change correspondingly, so that the silver adhesive plug is easily glued, and then the dispenser is shut down, the dispensing yield is low, and the like.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a take temperature control device's point gum machine cylinder fixing base can control the temperature of silver glue in the solid cylinder, prevents that the plug that silver glue temperature variation leads to from gluing.
In order to achieve the above purpose, the utility model provides a following technical scheme: a dispenser needle cylinder fixing seat with a temperature control device comprises a fixing seat body, a semiconductor refrigeration piece, a heat exchanger and a temperature controller, wherein the semiconductor refrigeration piece is connected with the temperature controller through a lead; the semiconductor refrigeration piece is arranged between the fixing seat body and the heat exchanger, and two poles of the semiconductor refrigeration piece are respectively connected with the fixing seat body and the heat exchanger; the temperature probe is arranged on the fixing seat body and is in signal connection with the temperature controller.
Optionally, a heat insulation sheet is further disposed between the fixing base body and the heat exchanger, and the heat insulation sheet is disposed between two poles of the semiconductor refrigeration sheet.
Optionally, the heat insulating sheet is provided with a through hole for the semiconductor refrigeration sheet to pass through, and the heat insulating sheet is installed on the semiconductor refrigeration sheet through the through hole.
Optionally, silicone grease for heat conduction is further separately filled between the semiconductor refrigeration sheet and the fixing seat body and between the semiconductor refrigeration sheet and the heat exchanger.
Optionally, the heat exchanger is an air-cooled heat exchanger, a plurality of heat exchange fins are arranged in the heat exchanger, the heat exchanger is connected with an air source, and air flows between the heat exchange fins in the heat exchanger.
Optionally, the thermal insulation sheet is a teflon sheet.
Optionally, the temperature controller and the semiconductor refrigeration piece both adopt external power supplies.
The beneficial effects of the utility model reside in that:
(1) the utility model discloses be provided with the semiconductor refrigeration piece, heat exchanger and temperature controller, the semiconductor refrigeration piece sets up between fixing base body and heat exchanger, the semiconductor refrigeration piece is connected with the temperature controller wire, be provided with the temperature probe who is used for detecting the temperature on the fixing base body, temperature probe can real-time detection fixing base body's temperature and feed back to the temperature controller in, the temperature controller can compare the temperature of fixing base body with the settlement temperature, the electric current through the semiconductor refrigeration piece is changed, control semiconductor refrigeration piece is cooled down the fixing base body, make the interior silver of cylinder glue the temperature keep invariable.
(2) The heat insulation sheet is arranged between the two poles of the semiconductor refrigeration sheet, so that heat transfer between the two poles of the semiconductor refrigeration sheet can be reduced, and the refrigeration and heating effects of the semiconductor refrigeration sheet are improved; the semiconductor refrigeration piece is filled with the silicone grease with fixing base body and heat exchanger between respectively, can increase the semiconductor refrigeration piece respectively with fixing base body and heat exchanger between the heat transfer, improve refrigeration and radiating effect.
(3) The heat exchanger is the air-cooled heat exchanger, is provided with a plurality of heat exchanger fins in the heat exchanger, increases heat transfer area, improves heat exchange efficiency, and air-cooled heat exchanger heat transfer medium is sufficient, and equipment structure is simple, and the reliability is high.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the means of the instrumentalities and/or combinations particularly pointed out in the appended claims.
Drawings
For the purposes of promoting a better understanding of the objects, features and advantages of the invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic structural view of a dispenser needle cylinder fixing seat with a temperature control device;
FIG. 2 is an exploded view of a dispenser needle cylinder holder with a temperature control device;
fig. 3 is a schematic cross-sectional view of a heat exchanger.
Reference numerals: the device comprises a fixing seat body 1, a heat exchanger 2, a semiconductor refrigeration piece 3, a needle cylinder 4, a temperature probe 5, a temperature controller 6, a power supply 7, a gas source 8, a gas conveying pipeline 9, a temperature insulation piece 10 and a heat exchange piece 11.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the features in the following embodiments and examples may be combined with each other without conflict.
Wherein the showings are for the purpose of illustrating the invention only and not for the purpose of limiting the same, and in which there is shown by way of illustration only and not in any way limiting the scope of the invention; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "front", "back", etc., indicating directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limiting the present invention, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
Referring to fig. 1 to 3, a fixing seat of a dispenser needle cylinder 4 with a temperature control device comprises a fixing seat body 1, a semiconductor refrigeration piece 3, a heat exchanger 2 and a temperature controller 6, wherein the semiconductor refrigeration piece 3 is connected with the temperature controller 6 through a lead; the semiconductor refrigerating sheet 3 is arranged between the fixing seat body 1 and the heat exchanger 2, the semiconductor refrigerating sheet 3 comprises a refrigerating electrode and a heat dissipation electrode, the refrigerating electrode of the semiconductor refrigerating sheet 3 is connected with the fixing seat body 1, and the heat dissipation electrode of the semiconductor refrigerating sheet 3 is connected with the heat exchanger 2; the fixing seat body 1 is provided with a temperature probe 5, and the temperature probe 5 is in signal connection with a temperature controller 6.
In this embodiment, a thermal insulation sheet 10 is further disposed between the fixing base body 1 and the heat exchanger 2, the thermal insulation sheet 10 is a teflon sheet, and the thermal insulation sheet 10 is disposed between two poles of the semiconductor chilling plate 3. The heat insulation sheet 10 is provided with a through hole for the semiconductor refrigeration sheet 3 to pass through, and the heat insulation sheet 10 is installed on the semiconductor refrigeration sheet 3 through the through hole. The heat insulation sheet 10 can reduce heat transfer between the two poles of the semiconductor refrigeration sheet 3 and improve the refrigeration and heating effects of the semiconductor refrigeration sheet 3; and silicone grease for heat conduction is respectively filled between the semiconductor refrigerating sheet 3 and the fixing seat body 1 and between the semiconductor refrigerating sheet and the heat exchanger 2 in a separating way. The silicone grease can increase the heat transfer efficiency between the semiconductor refrigerating sheet 3 and the fixing seat body 1 and the heat exchanger 2 respectively, and improve the refrigerating and radiating effects.
The heat exchanger 2 is an air-cooled heat exchanger, a plurality of heat exchange fins 11 are arranged in the heat exchanger 2, the heat exchanger 2 is connected with an air source 8 through an air conveying pipeline 9, and air flows among the heat exchange fins 11 in the heat exchanger 2. The heat exchange fins 11 can increase the heat exchange area and improve the heat exchange efficiency, and the air-cooled heat exchanger 2 has sufficient heat exchange medium, simple equipment structure and high reliability.
The temperature controller 6 and the semiconductor refrigerating sheet 3 both adopt an external power supply 7, and the external power supply 7 is stable and reliable and is applied to industrial use.
During the in-service use, temperature probe 5 detects the temperature of fixing base body 1 in real time and feeds back to temperature controller 6 in, and temperature controller 6 compares the temperature of fixing base body 1 with the temperature of settlement. When the temperature of fixing base body 1 is higher than the settlement temperature, the work of 6 control semiconductor refrigeration pieces 3 of temperature controller, the refrigeration utmost point of semiconductor refrigeration pieces 3 is connected with fixing base body 1, absorb the heat of fixing base body 1 through the heat transfer, reduce the temperature of fixing base body 1, the heat dissipation utmost point of semiconductor refrigeration pieces 3 is connected with heat exchanger 2, air supply 8 is constantly to carrying air in the heat exchanger 2, absorb the heat of the heat dissipation utmost point of semiconductor refrigeration pieces 3 through heat exchanger fin 11, do benefit to the further refrigeration of semiconductor refrigeration pieces 3.
Finally, the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions, and all of them should be covered by the scope of the claims of the present invention.
Claims (5)
1. The utility model provides a take temperature control device's point gum machine cylinder fixing base which characterized in that: the semiconductor refrigerating sheet is connected with the temperature controller through a lead;
the semiconductor refrigeration piece is arranged between the fixing seat body and the heat exchanger, and two poles of the semiconductor refrigeration piece are respectively connected with the fixing seat body and the heat exchanger;
the temperature probe is arranged on the fixing seat body and is in signal connection with the temperature controller.
2. The dispenser syringe fixing seat with the temperature control device according to claim 1, characterized in that: the heat insulation plate is arranged between the fixing seat body and the heat exchanger and arranged between two poles of the semiconductor refrigeration plate.
3. The dispenser syringe fixing seat with the temperature control device according to claim 2, characterized in that: the heat insulation sheet is provided with a through hole for the semiconductor refrigeration sheet to pass through, and the heat insulation sheet is installed on the semiconductor refrigeration sheet through the through hole.
4. The dispenser syringe fixing seat with the temperature control device according to claim 2, characterized in that: and silicone grease for heat conduction is respectively filled between the semiconductor refrigeration sheet and the fixing seat body as well as between the semiconductor refrigeration sheet and the heat exchanger in a separating way.
5. The dispenser syringe fixing seat with the temperature control device according to claim 1, characterized in that: the heat exchanger is an air-cooled heat exchanger, a plurality of heat exchange fins are arranged in the heat exchanger, the heat exchanger is connected with an air source, and air flows among the heat exchange fins in the heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020951436.XU CN212820801U (en) | 2020-05-29 | 2020-05-29 | Take temperature control device's point gum machine cylinder fixing base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020951436.XU CN212820801U (en) | 2020-05-29 | 2020-05-29 | Take temperature control device's point gum machine cylinder fixing base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212820801U true CN212820801U (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020951436.XU Active CN212820801U (en) | 2020-05-29 | 2020-05-29 | Take temperature control device's point gum machine cylinder fixing base |
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| Country | Link |
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| CN (1) | CN212820801U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113399218A (en) * | 2021-07-26 | 2021-09-17 | 福州高意通讯有限公司 | Hand-held type control by temperature change adhesive deposite device |
-
2020
- 2020-05-29 CN CN202020951436.XU patent/CN212820801U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113399218A (en) * | 2021-07-26 | 2021-09-17 | 福州高意通讯有限公司 | Hand-held type control by temperature change adhesive deposite device |
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