CN219499653U

CN219499653U - Novel vacuum etching machine

Info

Publication number: CN219499653U
Application number: CN202320357574.9U
Authority: CN
Inventors: 林萬禮; 鄭嘉振; 鄭人方; 陳聖為
Original assignee: Jingpeng Changshu Electronic Co ltd
Current assignee: Jingpeng Changshu Electronic Co ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-08-08
Anticipated expiration: 2033-03-01

Abstract

The utility model provides a novel vacuum etching machine relates to etching machine technical field, including the liquid storage tank, be equipped with the support frame on the liquid storage tank, be equipped with on the support frame and carry roller and lower carry roller, be equipped with pumping mechanism on the last carry roller, pumping mechanism includes fixed unit and a plurality of suction unit, at least two with last carry roller matched with arc groove has been seted up to the bottom of fixed unit, the suction unit sets up the both sides of arc groove, the utility model is through arc groove with fixed unit joint on last carry roller, pumps through the "pond" that the suction unit produced the etching solution, and upward carry roller to hold the PCB board simultaneously, when preventing to increase the suction of suction unit and suck away "pond" fast, inhale the PCB board, effectively guarantees production.

Description

Novel vacuum etching machine

Technical Field

The application relates to the technical field of etchers, in particular to a novel vacuum etcher.

Background

The formation of the PCB needs to be etched, namely, the developed copper surface is etched to form a circuit by using etching liquid. The current mainstream etching mode is horizontal conveying spraying type, so that the production automation can be realized to the greatest extent, and the cost is reduced, but the mode can lead to a 'pool effect', namely, the phenomenon caused by the accumulation of the etchant on the top of the PCB when the etchant is sprayed, and the etchant on the lower surface of the PCB and the upper surface of the PCB near the edge is easy to flow away when the PCB is horizontally conveyed, so that new etchant and old etchant are easier to exchange; the center of the board is easy to form a 'pool', the flow of etching liquid is limited, and the exchange of new etching liquid and old etching liquid is difficult, so that the etching effect of the circuit in the middle of the upper surface of the PCB is poorer than that of other positions, and the etching is uneven.

The common practice is that the suction unit is arranged at the position between the spray pipes, which is relatively close to the surface of the circuit board, and the suction unit enables the operation area to form negative pressure, and the 'pond' generated by etching liquid is sucked away through suction, however, the 'pond' generated by etching liquid in the actual production process is thicker, and when the 'pond' is sucked away rapidly through increasing the suction of the suction unit, the PCB board is easily sucked up by the suction unit, and the production is affected.

Disclosure of Invention

An object of the embodiment of the application is to provide a novel vacuum etching machine, which can solve the technical problem proposed by the background technology.

The embodiment of the application provides a novel vacuum etching machine, which comprises a liquid storage tank, be equipped with the support frame on the liquid storage tank, be equipped with on the support frame and carry roller and lower carry roller, upward be equipped with pumping mechanism on the carry roller, pumping mechanism includes fixed unit and a plurality of pumping unit, at least two with upward carry roller matched with arc groove has been seted up to the bottom of fixed unit, pumping unit sets up the both sides of arc groove.

Further, a suction pump is arranged on one side of the liquid storage tank, the suction pump is communicated with the liquid storage tank, the suction pump is connected with a circulating pipe, and the circulating pipe is connected with the suction unit.

Further, the opposite side of reservoir is equipped with first delivery pump and second delivery pump, first delivery pump with the second delivery pump all with the reservoir intercommunication, first delivery pump is connected with first pipeline, first delivery pipeline is connected with a plurality of first shower nozzle, first shower nozzle is located go up the top of conveying roller, the second delivery pump is connected with second delivery pipeline, second delivery pipeline is connected with a plurality of second shower nozzle, the second shower nozzle is located the below of conveying roller down.

Further, the first spray head and the second spray head are both installed on the supporting frame, and the nozzle of the first spray head and the nozzle of the second spray head are arranged up and down oppositely.

Further, a baffle is installed on the supporting frame, and the baffle encloses the upper conveying roller.

Further, the first delivery pump and the second delivery pump are both variable pressure pumps.

The utility model has the beneficial effects that:

the utility model is provided with the support frame on the liquid storage tank, the support frame is provided with the upper conveying roller and the lower conveying roller, a PCB conveying line is formed between the upper conveying roller and the lower conveying roller, the conveying of the PCB is ensured, the upper conveying roller is provided with the pumping mechanism, a 'pool' formed by etching liquid is pumped away, the uneven etching caused by the 'pool effect' is prevented, the pumping mechanism comprises a fixing unit and a plurality of pumping units, at least two arc grooves matched with the upper conveying roller are formed at the bottom of the fixing unit, the pumping units are arranged at two sides of the arc grooves, the fixing units are clamped on the upper conveying roller through the arc grooves, the inspection of the PCB and the maintenance of the pumping units are facilitated, the pumping units pump the 'pool' on the PCB at two sides of the arc grooves, and meanwhile, the upper conveying roller can press the PCB, so that when the pumping force of the pumping units is prevented from being increased, the 'pool' is sucked away, the PCB is sucked up, and the production is effectively ensured.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the structure of some embodiments of the present application;

FIG. 2 is a schematic diagram of the structure of some embodiments of the present application;

fig. 3 is a front view of a pumping mechanism in some embodiments of the present application.

The reference numerals are respectively:

1. a liquid storage tank; 2. a support frame; 3. an upper conveying roller; 4. a lower conveying roller; 5. a suction mechanism; 51. a fixing unit; 511. an arc groove; 52. a suction unit; 6. a suction pump; 7. a circulation pipe; 8. a first transfer pump; 9. a second transfer pump; 10. a first delivery conduit; 11. a first nozzle; 12. a second delivery conduit; 13. a second nozzle; 14. and a baffle.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships that are conventionally put in use of the product of the application, are merely for convenience of description of the present application and simplification of description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The following are specific examples of the present application:

the application provides a novel vacuum etching machine, including reservoir 1, be equipped with support frame 2 on the reservoir 1, be equipped with on the support frame 2 and carry roller 3 and carry roller 4 down, go up and carry roller 3 and form the PCB board transfer chain down between carry roller 4, guarantee the transportation of PCB board, be equipped with pumping mechanism 5 on going up carry roller 3, the "pond" that forms etching solution is taken away, prevent "pond effect" and lead to etching inhomogeneous, pumping mechanism 5 includes fixed unit 51 and a plurality of suction unit 52, at least two arc grooves 511 with last carry roller 3 matched with are offered to the bottom of fixed unit 51, suction unit 52 sets up in the both sides of arc groove 511, through arc groove 511, with fixed unit 51 joint on carry roller 3, the inspection to the PCB board is convenient with the maintenance to suction unit 52, the suction unit 52 is pumped "pond" on the PCB board to the both sides of arc groove 511, upward carry roller 3 can hold the PCB board simultaneously, prevent to increase the suction of suction unit 52 and inhale the board when "pond", effectively guarantee production.

One side of the liquid storage tank 1 is provided with a suction pump 6, the suction pump 6 is communicated with the liquid storage tank 1, the suction pump 6 is connected with a circulating pipe 7, the circulating pipe 7 is connected with a suction unit 52, and the suction pump 6 provides suction power for the suction unit 52 to suck etching liquid into a 'pool' formed on a PCB (printed circuit board) back into the liquid storage tank 1.

The opposite side of reservoir 1 is equipped with first delivery pump 8 and second delivery pump 9, first delivery pump 8 and second delivery pump 9 all communicate with reservoir 1, first delivery pump 8 is connected with first delivery pipe 10, first delivery pipe 10 is connected with a plurality of first shower nozzle 11, first shower nozzle 11 is located the top of last conveying roller 3, second delivery pump 9 is connected with second delivery pipe 12, second delivery pipe 12 is connected with a plurality of second shower nozzle 13, second shower nozzle 13 is located the below of lower conveying roller 4, first delivery pump 8 carries the etching solution in the reservoir 1 to first shower nozzle 11 in by first shower nozzle 11 blowout, second delivery pump 9 carries the etching solution in the reservoir 1 to second shower nozzle 13 in by second shower nozzle 13 blowout, set up first delivery pump 8 and second delivery pump 9, conveniently control first shower nozzle 11 and second shower nozzle 13 blowout etching solution respectively.

The first spray head 11 and the second spray head 13 are both arranged on the support frame 2, and the spray nozzle of the first spray head 11 and the spray nozzle of the second spray head 13 are arranged up and down oppositely, so that spray of liquid on the PCB is facilitated.

The baffle 14 is arranged on the support frame 2, and the baffle 14 encloses the upper conveying roller 3 to prevent sprayed etching liquid from splashing from the side and polluting the surrounding environment.

The first delivery pump 8 and the second delivery pump 9 are both variable-pressure pumps, so that the pressure of etching liquid sprayed out by the first spray head 11 and the second spray head 13 is conveniently controlled, and the PCB is conveniently etched according to actual situation requirements.

The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A novel vacuum etching machine, which is characterized in that: the automatic feeding device comprises a liquid storage tank, wherein a supporting frame is arranged on the liquid storage tank, an upper conveying roller and a lower conveying roller are arranged on the supporting frame, a suction mechanism is arranged on the upper conveying roller and comprises a fixing unit and a plurality of suction units, at least two arc grooves matched with the upper conveying roller are formed in the bottom of the fixing unit, and the suction units are arranged on two sides of the arc grooves.

2. The novel vacuum etching machine according to claim 1, wherein: one side of the liquid storage tank is provided with a suction pump, the suction pump is communicated with the liquid storage tank, the suction pump is connected with a circulating pipe, and the circulating pipe is connected with the suction unit.

3. The novel vacuum etching machine according to claim 1, wherein: the opposite side of reservoir is equipped with first delivery pump and second delivery pump, first delivery pump with the second delivery pump all with the reservoir intercommunication, first delivery pump is connected with first pipeline, first delivery pipe is connected with a plurality of first shower nozzle, first shower nozzle is located go up the top of conveying roller, the second delivery pump is connected with second delivery pipe, second delivery pipe is connected with a plurality of second shower nozzle, the second shower nozzle is located the below of conveying roller down.

4. A novel vacuum etcher as claimed in claim 3, wherein: the first spray head and the second spray head are both arranged on the supporting frame, and the nozzle of the first spray head and the nozzle of the second spray head are arranged up and down oppositely.

5. The novel vacuum etching machine according to claim 1, wherein: and a baffle is arranged on the supporting frame and encloses the upper conveying roller.

6. A novel vacuum etcher as claimed in claim 3, wherein: the first conveying pump and the second conveying pump are both variable-pressure pumps.