CN219476651U

CN219476651U - Wafer taking, placing and centering device

Info

Publication number: CN219476651U
Application number: CN202320339538.XU
Authority: CN
Inventors: 孙璞; 温海涛; 王金龙; 孙振聪
Original assignee: Kingsemi Co ltd
Current assignee: Shenyang Xinli Microelectronics Equipment Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-08-04
Anticipated expiration: 2033-02-28

Abstract

The utility model provides a wafer taking and placing centering device which comprises a taking and placing mechanism and an adjusting mechanism, wherein the adjusting mechanism is movably arranged on two sides of the taking and placing mechanism and used for adjusting the position of a wafer on the taking and placing mechanism, and the taking and placing mechanism is used for taking and placing the wafer. The utility model adopts the adjusting mechanism to adjust the position of the wafer when the picking and placing mechanism picks the wafer, so that the wafer is positioned in advance in the transportation process, and the picking and placing efficiency of the wafer is improved. In addition, after the device is used, the material caching device is not required to be additionally added, the equipment space is reduced, and the device is suitable for different wafer transfer robots, so that the equipment cost is reduced.

Description

Wafer taking, placing and centering device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer taking, placing and centering device.

Background

In the semiconductor process, the wafer needs to be centered in advance before being processed and transferred from one process to the next, and then the wafer transfer robot takes the wafer from the optical centering unit and transfers the wafer to the next processing station. However, in some cases, the transfer path centered in advance often requires multiple robot handoffs, or transfer is limited by the machine schedule and requires waiting, resulting in a lot of wasted time and reduced throughput.

In addition, the robot fingers applicable to the carriers of the two stations are different, for example, the sucking discs of the optical centering units can only use Y-shaped fingers for feeding and discharging, the other stations need I-shaped fingers for feeding and discharging, the robot needs to switch fingers after placing wafers in a buffer area for transferring materials between the two stations, time is consumed, the price of the multi-finger robot is high, and the whole equipment cost is increased.

Disclosure of Invention

The utility model aims to provide a wafer taking, placing and centering device, which improves the efficiency of taking and placing wafers and reduces the equipment cost.

In order to achieve the above object, in a first aspect, the present utility model provides a wafer picking and placing centering device, including a picking and placing mechanism and an adjusting mechanism;

the adjusting mechanism is movably arranged at two sides of the picking and placing mechanism and is used for adjusting the position of the wafer on the picking and placing mechanism;

the picking and placing mechanism is used for picking and placing wafers.

In some embodiments, the adjustment mechanism includes a first power generator, an oppositely disposed first connector, and an adjustment member;

one end of the first connecting piece is connected with the first power device so that the first power device drives the first connecting piece to move;

the adjusting piece is arranged at the other end of the first connecting piece and is positioned at the outer side edge of the picking and placing mechanism and used for abutting against the side wall of the wafer to adjust the position of the wafer.

In some embodiments, the adjusting member is a bearing, and the bearing is rotatably disposed at the other end of the first connecting member.

In some embodiments, the pick-and-place mechanism comprises a second power device, a second connecting piece and a pick-and-place piece which are oppositely arranged;

one end of the second connecting piece is connected with the second power device so that the second power device drives the second connecting piece to move;

the picking and placing piece is arranged at the other end of the second connecting piece and is close to the adjusting piece and used for picking and placing the wafer.

In some embodiments, the lifting device further comprises a lifting module and a connecting arm;

the lifting module is provided with the connecting arm and is used for driving the connecting arm to lift;

the first power device and the second power device are arranged on the connecting arm side by side.

In some embodiments, the pick-and-place member is an arc-shaped sucker, a groove is formed in the surface, which is in contact with the wafer, of the arc-shaped sucker, and a vent hole is formed in the groove and is used for communicating with the vacuum channel.

In some embodiments, the adjusting mechanism further comprises an extension piece, the extension piece is connected with the other end of the first connecting piece, and the two ends of the extension piece are respectively provided with the adjusting piece.

In some embodiments, the extension member is located between the first connector member and the pick-and-place member.

In some embodiments, the wafer carrier further comprises a carrier disposed concentric with the adjustment mechanism, the carrier for carrying the wafer.

In some embodiments, the first power generator and the second power generator are each jaw cylinders.

The wafer taking, placing and centering device provided by the utility model has the beneficial effects that: the position of the wafer when the wafer is grabbed by the picking and placing mechanism is adjusted by adopting the adjusting mechanism, so that the wafer is positioned in a centering way in advance in the transportation process, and the picking and placing efficiency of the wafer is improved. In addition, after the device is used, the material caching device is not required to be additionally added, the equipment space is reduced, and the device is suitable for different wafer transfer robots, so that the equipment cost is reduced.

Drawings

FIG. 1 is a schematic diagram of a wafer pick-and-place centering device according to an embodiment of the present utility model;

FIG. 2 is a bottom view of the pick-and-place mechanism and the adjustment mechanism according to the embodiment of the present utility model;

FIG. 3 is a top view of a pick-and-place mechanism and an adjustment mechanism according to an embodiment of the present utility model;

fig. 4 is a side view of a pick-and-place mechanism and an adjustment mechanism according to an embodiment of the present utility model.

Reference numerals:

the second power device 11, the second connecting piece 12, the picking and placing piece 13, the groove 131, the vent 132, the first power device 21, the first connecting piece 22, the adjusting piece 23, the extending piece 24, the lifting module 3, the connecting arm 4, the wafer 5, the carrier 6 and the robot 7.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.

In view of the problems existing in the prior art, an embodiment of the present utility model provides a wafer pick-and-place centering device, which includes a pick-and-place mechanism (not labeled in the figure) and an adjustment mechanism (not labeled in the figure). The adjusting mechanism is movably arranged on two sides of the picking and placing mechanism and is used for adjusting the position of the wafer 5 on the picking and placing mechanism. The picking and placing mechanism is used for picking and placing the wafer 5.

In this embodiment, the robot 7 that grabs the wafer 5 brings the wafer 5 to the pick-and-place mechanism, and then the adjustment mechanism adjusts the position of the wafer 5 to center the wafer 5, and then the pick-and-place mechanism grabs the wafer 5 and places the wafer 5 on the carrier 6. It should be noted that, in this embodiment, the carrier 6 is concentrically disposed with the adjustment mechanism, and after the position of the wafer 5 is adjusted by the adjustment mechanism, the position alignment of the wafer 5 on the carrier 6 is ensured, so that the picking and placing efficiency of the wafer 5 is improved.

In some embodiments, the adjustment mechanism includes a first power generator 21, an oppositely disposed first connector 22, and an adjustment member 23. One end of the first connecting piece 22 is connected to the first power device 21, so that the first power device 21 drives the first connecting piece 22 to reciprocate. The adjusting member 23 is disposed at the other end of the first connecting member 22 and is disposed at an outer side of the pick-and-place mechanism, and is configured to abut against a sidewall of the wafer 5 when moving back to adjust a position of the wafer 5.

Optionally, the first power device 21 is a clamping jaw cylinder, clamping jaws capable of extending towards two ends are relatively arranged on the clamping jaw cylinder, and the clamping jaws are respectively provided with the first connecting pieces 22, so that the two first connecting pieces 22 are relatively arranged, and the first power device 21 can enable the two first connecting pieces 22 to reciprocate at the same time. When the two first connecting members 22 move back, the adjusting members 23 are driven to abut against the side walls of the wafer 5 so as to adjust the position of the wafer 5.

Further, the adjusting mechanism further includes an extension member 24, a middle portion of the extension member 24 is connected to the other end of the first connecting member 22, and two ends of the extension member 24 are respectively provided with the adjusting member 23. The extending direction of the extending member 24 is perpendicular to the moving direction of the first connecting member 22 in the horizontal direction, and the extending member 24 is located between the first connecting member 22 and the picking and placing member 13.

Specifically, the adjusting members 23 are bearings rotatably disposed at two ends of the extending member 24, that is, in this embodiment, four adjusting members 23 are disposed symmetrically with respect to the adjusting members 23 at two sides.

In some embodiments, the pick-and-place mechanism includes a second power device 11, an oppositely disposed second connecting member 12, and a pick-and-place member 13. The second power device 11 may be a clamping jaw cylinder, clamping jaws capable of extending towards two ends are relatively arranged on the clamping jaw cylinder, the clamping jaws are respectively provided with a second connecting piece 12, so that the second power device 11 drives the second connecting pieces 12 which are relatively arranged to reciprocate, and the picking and placing piece 13 is arranged at the other end of the second connecting pieces 12 and is close to the adjusting piece 23 and used for picking and placing the wafer 5. The pick-and-place member 13 is located at the inner side of the adjustment member 23.

Optionally, the pick-and-place member 13 is an arc-shaped sucker, and the shape of the arc-shaped sucker is characterized by being arc-shaped, so that the arc-shaped sucker is defined as an arc-shaped sucker, a groove 131 is formed in the surface of the arc-shaped sucker, which is in contact with the wafer 5, a vent hole 132 is formed in the groove 131, the vent hole 132 is used for being communicated with a vacuum channel, so that the inside of the groove 131 is in a vacuum environment, and when the vacuum is opened, the effect of fixing the wafer 5 is realized.

In some embodiments, the wafer 5 picking and placing centering device further includes a lifting module 3 and a connecting arm 4, the lifting module 3 is provided with the connecting arm 4, the lifting module 3 is used for driving the connecting arm 4 to lift, the first power device 21 and the second power device 11 are arranged on the connecting arm 4 side by side, and the wafer 5 is placed on the carrier 6 through the lifting module 3.

Alternatively, the lifting module 3 may be a telescopic cylinder or an electric cylinder.

In this embodiment, in the initial state, the first power unit 21 is in an open state, the adjustment members 23 on both sides are in a large-pitch state, and the wafer 5 can be transferred in the pitch between the adjustment members 23 by the robot 7. At this time, the second power unit 11 is in a closed state, the pick-and-place members 13 on both sides are in a small-space state, and the wafer 5 is placed on the pick-and-place members 13, so that the pick-and-place members 13 support the outer edge of the bottom of the wafer 5.

In the adjustment state, the first power device 21 closes the clamping jaw thereof, the adjustment parts 23 at the two sides are mutually close to contact with the edge of the wafer 5, so that the wafer 5 slides on the picking and placing part 13 to automatically align and center, the picking and placing part 13 is opened in vacuum, the first power device 21 is slowly opened again, then the lifting module 3 moves the connecting arm 4 downwards until the wafer 5 is positioned on the upper surface of the carrier 6, then the vacuum of the picking and placing part 13 is disconnected, the carrier 6 can pass between the picking and placing parts 13 at the two sides, then the connecting arm 4 continuously and slowly descends, the wafer 5 falls on the upper surface of the carrier 6, the picking and placing part 13 is separated from the wafer 5, then the clamping jaw of the second power device 11 opens, the distance between the picking and placing parts 13 at the two sides is enlarged, the lifting module 3 moves the connecting arm 4 upwards, the wafer 5 can pass between the picking and placing parts 13 at the two sides, and the feeding at the preset position is completed.

The wafer 5 picking, placing and centering device provided by the utility model does not need to be transferred to the optical centering unit in advance for centering before transferring the wafer 5 between two stations, reduces the transmission path, saves time and improves the equipment efficiency and the productivity. In addition, the wafer 5 taking, placing and centering device is applicable to different robots 7, so that the robots 7 do not need to be switched, an additional material buffer device is not needed, the equipment cost is saved, and the equipment space is reduced. In addition, the device meets the requirement of the wafer 5 on the occasion with the vertical transmission, and improves the applicability.

The foregoing is merely a specific implementation of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.

Claims

1. The wafer taking-placing centering device is characterized by comprising a taking-placing mechanism and an adjusting mechanism;

the picking and placing mechanism is used for picking and placing wafers.

2. The wafer pick-and-place centering device of claim 1, wherein the adjustment mechanism comprises a first power device, a first connecting member and an adjustment member disposed opposite each other;

3. The wafer pick-and-place centering device of claim 2, wherein the adjustment member is a bearing rotatably disposed at the other end of the first connection member.

4. A wafer pick-and-place centering device according to claim 2 or 3, wherein the pick-and-place mechanism comprises a second power device, a second connecting member and a pick-and-place member, which are oppositely arranged;

5. The wafer pick-and-place centering device of claim 4, further comprising a lift module and a connecting arm;

6. The wafer pick-and-place centering device according to claim 4, wherein the pick-and-place member is an arc-shaped sucker, a groove is formed in a surface, which is in contact with the wafer, of the arc-shaped sucker, and a vent hole is formed in the groove and is used for communicating with a vacuum channel.

7. The wafer pick-and-place centering device according to claim 6, wherein the adjusting mechanism further comprises an extension member, the extension member is connected to the other end of the first connecting member, and the two ends of the extension member are respectively provided with the adjusting member.

8. The wafer pick-and-place centering device of claim 7, wherein the extension is located between the first connector and the pick-and-place member.

9. The wafer pick-and-place centering device of claim 1, further comprising a carrier disposed concentric with the adjustment mechanism, the carrier configured to carry the wafer.

10. The wafer pick-and-place centering device of claim 4, wherein the first power and the second power are each a jaw cylinder.