CN219475855U - Optical sensor - Google Patents
Optical sensor Download PDFInfo
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- CN219475855U CN219475855U CN202320627023.XU CN202320627023U CN219475855U CN 219475855 U CN219475855 U CN 219475855U CN 202320627023 U CN202320627023 U CN 202320627023U CN 219475855 U CN219475855 U CN 219475855U
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- lens
- light
- optical sensor
- photosensitive chip
- substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The utility model relates to an optical sensor, which comprises a substrate, wherein the surface of the substrate is provided with a first shading ring, and the first shading ring extends along the axial direction of the first shading ring; the photosensitive chip is arranged on the substrate and positioned in the first shading ring; the light-emitting chip is arranged on the substrate and is positioned outside the first shading ring; the optical packaging structure is arranged on the substrate and coats the photosensitive chip and the light-emitting chip, a first lens is arranged on the optical packaging structure, and the first lens is arranged opposite to the photosensitive chip; according to the optical sensor, the photosensitive chip is arranged in the first shading ring, stray light around the photosensitive chip is shielded by the first shading ring, and interference of the stray light on the optical sensor is reduced; the stability of the optical sensor is enhanced by the optical packaging structure; the first lens has a light condensing function, improves the light sensitivity of the light sensing chip, and further improves the performance of the optical sensor.
Description
Technical Field
The utility model relates to the technical field of packaging, in particular to an optical sensor.
Background
The optical sensor is provided with a light emitting chip and a photosensitive chip, and is packaged by an optical packaging structure, light emitted by the light emitting chip is incident to a detection object, and the light reflected by the detection object is received by the photosensitive chip, so that the effect of photosensitive detection is realized; the optical sensor can be applied to the fields of heart rate blood oxygen detection, rotating shaft sensing structures of intelligent watches, roller sensing structures of mice and the like; the optical package structure can improve the stability of the optical sensor. The traditional transparent molding packaging scheme is that the optical sensor is packaged in a one-step molding mode, so that the upper surface and the periphery of the photosensitive chip are transparent, shading treatment is not carried out on the periphery of the photosensitive chip, and when stray light enters the photosensitive chip, the photosensitive effect of the optical sensor can be interfered.
Disclosure of Invention
Therefore, the technical problem to be solved by the utility model is to overcome the defect that the prior optical sensor lacks a structure for shading the periphery of the photosensitive chip, so that the optical sensor is provided, the shielding of stray light on the periphery of the photosensitive chip is realized, and the performance of the optical sensor is improved.
In order to solve the technical problems, the utility model provides an optical sensor, which comprises a substrate, wherein the surface of the substrate is provided with a first shading ring, and the first shading ring extends along the axial direction of the first shading ring;
the photosensitive chip is arranged on the substrate and positioned in the first shading ring;
the light-emitting chip is arranged on the substrate and is positioned outside the first shading ring;
the optical packaging structure is arranged on the substrate and coats the photosensitive chip and the light-emitting chip, a first lens is arranged on the optical packaging structure, and the first lens is opposite to the photosensitive chip.
In one embodiment of the present utility model, the optical imaging device further comprises a second lens, wherein the second lens is arranged on the photosensitive chip, and the second lens is arranged opposite to the first lens.
In one embodiment of the present utility model, the optical lens further comprises a transparent plate integrally formed with the second lens, the transparent plate is disposed on the photosensitive chip, the transparent plate is located between the photosensitive chip and the second lens, and the transparent plate is provided with a mounting portion surrounding the second lens.
In one embodiment of the present utility model, the lens further includes a diaphragm provided on the mounting portion, the diaphragm being provided opposite to the first lens, the diaphragm being provided between the transparent plate and the second lens.
In one embodiment of the present utility model, the first lens and the second lens are both configured as convex lens structures.
In one embodiment of the present utility model, the optical filter further comprises a filter layer, and the filter layer is disposed between the transparent plate and the photosensitive chip.
In one embodiment of the utility model, the refractive index of the first lens is different from the refractive index of the second lens.
In one embodiment of the present utility model, at least one of the light emitting chips is disposed on both sides of the first light shielding ring.
In one embodiment of the present utility model, the first lens and the optical package structure are integrally formed.
In one embodiment of the present utility model, the light emitting device further includes a plurality of second light shielding rings, the plurality of second light shielding rings are disposed on the substrate, and the light emitting chip is disposed in the second light shielding rings.
In one embodiment of the present utility model, the photosensitive chip and the substrate are connected by gold wires.
In one embodiment of the present utility model, the first light shielding ring, the second light shielding ring, and the optical package structure are uniform in height.
Compared with the prior art, the technical scheme of the utility model has the following advantages:
the optical sensor comprises a substrate, wherein a first shading ring is arranged on the surface of the substrate, and extends along the axial direction of the first shading ring; the photosensitive chip is arranged on the substrate and positioned in the first shading ring; the light-emitting chip is arranged on the substrate and is positioned outside the first shading ring; the optical packaging structure is arranged on the substrate and coats the photosensitive chip and the light-emitting chip, a first lens is arranged on the optical packaging structure, and the first lens is arranged opposite to the photosensitive chip; the photosensitive chip is arranged in the first shading ring, and the height of the first shading ring is higher than that of the photosensitive chip, so that stray light around the photosensitive chip is shielded by the first shading ring, the interference of the stray light on the photosensitive chip is reduced, and the photosensitive sensitivity of the photosensitive chip is effectively improved; the optical packaging structure fixes the photosensitive chip and the light-emitting chip on the substrate, so that the stability of the optical sensor is improved; the first lens gathers the target light on the photosensitive chip through the effect of gathering the light, has further improved the performance of optical sensor.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
Fig. 1 is a schematic structure of a cross-sectional view of an optical sensor according to a preferred embodiment of the present utility model.
Fig. 2 is a schematic diagram of a top view of the optical sensor shown in fig. 1.
Description of the specification reference numerals: 1. a substrate; 2. a photosensitive chip; 3. an optical package structure; 4. a first shading ring; 5. a light emitting chip; 6. a transparent plate; 7. a first lens; 8. a second lens; 9. a filter layer; 10. an aperture; 11. gold wires; 12. a second shading ring.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the utility model and practice it.
Examples
In one embodiment of the present utility model, referring to fig. 1 and 2, an optical sensor includes a substrate 1, a surface of which is provided with a first light shielding ring 4, the first light shielding ring 4 extends along an axial direction thereof, so that a height of the first light shielding ring 4 is higher than a height of a photosensitive chip 2 disposed on the substrate 1, the first light shielding ring 4 has a square structure according to efficiency of a process, and can accommodate the photosensitive chip 2, and the first light shielding ring 4 shields stray light around by using a light-impermeable characteristic thereof to reduce interference with the photosensitive chip 2.
In one embodiment of the present utility model, referring to fig. 1 and 2, a photosensitive chip 2 is disposed on the substrate 1 and located in the first light shielding ring 4, the photosensitive chip 2 is adhered to the substrate 1 by an adhesive, and the photosensitive chip 2 is used for receiving the light emitted from the light emitting chip 5 to the probe and reflected, and generating an output signal according to the intensity of the light; when the photosensitive chip 2 receives stray light, its detection performance is lowered.
In one embodiment of the present utility model, referring to fig. 1 and 2, a light emitting chip 5 is disposed on the substrate 1, and the light emitting chip 5 is adhered to the substrate 1 by an adhesive and is located outside the first light shielding ring 4; the light emitting chip 5 emits light toward the object to be detected, and the light is received by the photosensitive chip 2 after being reflected.
In one embodiment of the present utility model, referring to fig. 1, an optical package structure 3 is provided as a transparent structure, and light passes through the optical package structure 3 to reach the photosensitive chip 2; the optical packaging structure 3 is arranged on the substrate 1 and coats the photosensitive chip 2 and the light-emitting chip 5, the optical packaging structure 3 can be transparent pouring sealant, and the pouring sealant has fluidity and can be solidified, can be fully contacted with the surfaces of the photosensitive chip 2, the light-emitting chip 5 and the substrate 1, and further improves the structural stability of the optical sensor; the optical packaging structure 3 is provided with a first lens 7 on the upper surface, the first lens 7 is opposite to the photosensitive chip 2, the first lens 7 has a light condensing function, and part of light reflected by the surface of the object irradiates on the first lens 7 to be condensed and is emitted to a second lens 8, so that the photosensitivity of the photosensitive chip 2 is further improved.
In one embodiment of the present utility model, as shown with reference to fig. 1, the optical imaging device further includes a second lens 8, where the second lens 8 is disposed on the photosensitive chip 2, and the second lens 8 is disposed opposite to the first lens 7; the second lens 8 has a condensing function, and is configured to receive the light from the first lens 7 and the two sides of the first lens 7, and further collect the light and direct the light to the photosensitive chip 2, so as to further improve the photosensitivity of the photosensitive chip 2.
In one embodiment of the present utility model, as shown in fig. 1, the optical sensor further comprises a transparent plate 6 integrally formed with the second lens 8, the transparent plate 6 is disposed on the photosensitive chip 2, the transparent plate 6 is located between the photosensitive chip 2 and the second lens 8, and the transparent plate 6 is provided with a mounting portion surrounding the second lens 8; the transparent plate 6 serves as a mounting base for the second lens 8, and forms a mounting portion for coaxially mounting the second lens 8 and the diaphragm 10, the mounting portion being a plane formed by the edges of the transparent plate 6 and the second lens 8.
In one embodiment of the present utility model, referring to fig. 1, the light guide plate further comprises an aperture 10 provided on the mounting portion, the aperture 10 being provided in an opaque structure, and light passing through only the middle of the aperture 10; the aperture 10 is arranged opposite to the first lens 7, the aperture 10 is arranged between the transparent plate 6 and the second lens 8, and the aperture 10 is arranged on the mounting part, and the aperture 10 only allows the light collected and refracted by the second lens 8 to pass through the center of the aperture 10 and irradiate the photosensitive chip 2, and blocks other stray light irradiating the photosensitive chip 2, so that the photosensitivity of the photosensitive chip 2 is further improved.
In an embodiment of the present utility model, referring to fig. 1, the first lens 7 and the second lens 8 are both configured as convex lens structures, and may be configured as other lenses having a light-gathering effect, where the refractive index and the material of the first lens 7 and the second lens 8 are different, and the two lenses are combined, so that the optical performance of the sensor may be further improved.
In one embodiment of the present utility model, referring to fig. 1, the optical filter device further comprises a filter layer 9, wherein the filter layer 9 is disposed between the transparent plate 6 and the photosensitive chip 2, and the light passing through the aperture 10 enters the photosensitive chip 2 after passing through the filter layer 9; the filter layer 9 can realize selective passing of different light rays and improve the photosensitivity of the photosensitive chip 2.
In one embodiment of the present utility model, referring to fig. 1 and 2, at least one, preferably two to five, light emitting chips 5 may be provided to the light emitting chips 5 to improve the detection capability of the optical sensor; and the light emitting chips 5 are arranged at two sides of the first shading ring 4; the light-sensitive chip 2 is separated from the light-emitting chip 5, so that light emitted by the light-emitting chip 5 is prevented from directly entering the light-sensitive chip 2, and the light-sensitive sensitivity of the light-sensitive chip 2 is reduced.
In one embodiment of the present utility model, referring to fig. 1, the first lens 7 is integrally formed with the optical package structure 3, so as to improve the stability of the optical sensor structure.
In one embodiment of the present utility model, referring to fig. 1, the optical package structure 3 is configured as a transparent potting adhesive, and the potting adhesive encapsulates the photosensitive chip 2 and the light emitting chip 5; after the photosensitive chip 2 and the light-emitting chip 5 are mounted on the substrate 1, pouring sealant on the substrate 1, realizing batch packaging of a plurality of optical sensors and improving packaging efficiency.
In one embodiment of the present utility model, as shown with reference to fig. 1 and 2, further comprising a plurality of second light-shielding rings 12, the second light-shielding rings 12 being provided as an opaque material; the plurality of second light shielding rings 12 are arranged on the substrate 1, and the light emitting chips 5 are arranged in the second light shielding rings 12; the second light shielding ring 12 can ensure that the light of the light emitting chip 5 is emitted along the axis direction of the second light shielding ring 12, and can not be emitted to the periphery, so that the light sensitivity of the optical sensor is improved.
Specifically, the first light shielding ring 4 and the second light shielding ring 12 are obtained by digging annular grooves on the optical packaging structure 3, injecting a light shielding material, and solidifying, and the annular grooves are communicated with each other, so that the production efficiency of the first light shielding ring 4 and the second light shielding ring 12 can be improved.
In one embodiment of the present utility model, referring to fig. 1, the photosensitive chip 2 is connected to the substrate 1 through a gold wire 11, and the gold wire 11 transmits a signal generated by the photosensitive chip 2 to the substrate 1.
The working principle of the optical sensor of the utility model is as follows:
the light emitting chips 5 emit light to the detection object, the light is incident to the detection object, and the light reflected by the detection object is received by the photosensitive chip 2, so that the effect of photosensitive detection is achieved; the first light shielding ring 4 is arranged around the photosensitive chip 2, the height of the first light shielding ring 4 is higher than that of the photosensitive chip 2, so that stray light around the photosensitive chip 2 is shielded, only light above the photosensitive chip 2 is allowed to enter, and the photosensitivity of the photosensitive chip 2 is improved; a first lens 7 and a second lens 8 are arranged above the photosensitive chip 2, so that light is gathered and refracted to the photosensitive chip 2, and the sensitivity of the photosensitive chip 2 is improved; the aperture 10 is arranged on the photosensitive chip 2, and only the light of the second lens 8 is allowed to enter the photosensitive chip 2 to block other stray light, so that the photosensitivity of the photosensitive chip 2 can be effectively improved; meanwhile, the filter layer 9 can realize selective passing of different light rays, and improves the photosensitivity of the optical sensor.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present utility model will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present utility model.
Claims (10)
1. An optical sensor, comprising,
the surface of the substrate is provided with a first shading ring, and the first shading ring extends along the axial direction of the substrate;
the photosensitive chip is arranged on the substrate and positioned in the first shading ring;
the light-emitting chip is arranged on the substrate and is positioned outside the first shading ring;
the optical packaging structure is arranged on the substrate and coats the photosensitive chip and the light-emitting chip, a first lens is arranged on the optical packaging structure, and the first lens is opposite to the photosensitive chip.
2. The optical sensor of claim 1, further comprising a second lens disposed on the photosensitive chip, the second lens disposed opposite the first lens.
3. The optical sensor of claim 2, further comprising a transparent plate integrally formed with the second lens, the transparent plate being disposed on the light-sensing chip, the transparent plate being located between the light-sensing chip and the second lens, and the transparent plate being provided with a mounting portion surrounding the second lens.
4. An optical sensor according to claim 3, further comprising an aperture provided on the mounting portion, the aperture being provided opposite the first lens, the aperture being provided between the transparent plate and the second lens.
5. An optical sensor according to claim 3, wherein the first lens and the second lens are each provided in a convex lens configuration.
6. An optical sensor according to claim 3, further comprising a filter layer disposed between the transparent plate and the photosensitive chip.
7. An optical sensor according to claim 3, wherein the refractive index of the first lens is different from the refractive index of the second lens.
8. The optical sensor of claim 1, wherein at least one of the light emitting chips is disposed on either side of the first light shielding ring.
9. The optical sensor of claim 1, wherein the first lens is integrally formed with the optical package.
10. The optical sensor of claim 1, further comprising a plurality of second light shielding rings disposed on the substrate, and the light emitting chips are disposed within the second light shielding rings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320627023.XU CN219475855U (en) | 2023-03-27 | 2023-03-27 | Optical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320627023.XU CN219475855U (en) | 2023-03-27 | 2023-03-27 | Optical sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219475855U true CN219475855U (en) | 2023-08-04 |
Family
ID=87434807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320627023.XU Active CN219475855U (en) | 2023-03-27 | 2023-03-27 | Optical sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219475855U (en) |
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2023
- 2023-03-27 CN CN202320627023.XU patent/CN219475855U/en active Active
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