CN219414998U

CN219414998U - Semiconductor air conditioner

Info

Publication number: CN219414998U
Application number: CN202320721080.4U
Authority: CN
Inventors: 赵雷; 赵鼎鼎; 郑洪洋
Original assignee: Zhejiang Darong Electricity Co ltd
Current assignee: Zhejiang Darong Electricity Co ltd
Priority date: 2023-03-30
Filing date: 2023-03-30
Publication date: 2023-07-25
Anticipated expiration: 2033-03-30

Abstract

The utility model discloses a semiconductor air conditioner, comprising: fixing base, air conditioner main part and water conservancy diversion cap, air conditioner main part fixed mounting is in the surface of fixing base, water conservancy diversion cap fixed mounting is in the top of air conditioner main part and the surface is equipped with first cold air pipe, second cold air pipe, first hot air pipe and second hot air pipe, first cold air pipe and second cold air pipe symmetrical arrangement are in air conditioner main part's both sides and inside be equipped with first axial fan and second axial fan respectively, the tip of first cold air pipe and first hot air pipe runs through the surface of fixing base and is connected with the grid wind gap, air conditioner main part's inboard is equipped with a plurality of sealing baffle. According to the utility model, through arranging a plurality of cold flow channels and hot flow channel structures to be completely isolated under the action of the sealing partition plate, the mutual independence of cold and hot air channels is avoided, the heat transfer between two air flows is avoided, and the indoor refrigerating and heating mode switching is realized through the forward and reverse rotation mutual switching of the first axial flow fan and the second axial flow fan, so that the functions of regulating and controlling the temperature of the semiconductor air conditioner are realized.

Description

Semiconductor air conditioner

Technical Field

The utility model relates to the technical field of semiconductor air conditioners, in particular to a semiconductor air conditioner.

Background

With the development of society and the improvement of living standard of people, the demand of air conditioner is larger and larger, and the semiconductor air conditioner is equipment for adjusting and controlling parameters such as temperature, humidity, cleanliness and flow rate of air in a building/structure by using a semiconductor refrigerating sheet as a cold source, and compared with the traditional compressor type air conditioner, the semiconductor air conditioner has simpler structure and smaller volume.

However, the existing semiconductor air conditioner cannot effectively maintain the rapid transfer of heat at the other side of the semiconductor refrigeration piece in the refrigeration process, so that the heat of the heat source affects the refrigeration air flow, the refrigeration capacity of the air conditioner is low, and certain defects exist. In view of the above, the present utility model has been made in view of the above problems, and it is an object of the present utility model to provide a semiconductor air conditioner that solves the problems and improves the practical value.

Disclosure of Invention

The present utility model aims to solve one of the technical problems existing in the prior art or related technologies.

The technical scheme adopted by the utility model is as follows: a semiconductor air conditioner, comprising: fixing base, air conditioner main part and water conservancy diversion cap, air conditioner main part fixed mounting is in the surface of fixing base, water conservancy diversion cap fixed mounting is equipped with first cold air pipe, second cold air pipe, first hot air pipe and second hot air pipe in the top and the surface of air conditioner main part, first cold air pipe and second cold air pipe symmetrical arrangement are equipped with first axial fan and second axial fan respectively in the both sides and the inside of air conditioner main part, the tip of first cold air pipe and first hot air pipe runs through the surface of fixing base and is connected with the grid wind gap, the inboard of air conditioner main part is equipped with a plurality of sealing baffle, sealing baffle's surface embedding installs the semiconductor refrigeration piece, sealing baffle's both sides are equipped with cold runner and hot runner respectively, the both ends of hot runner are linked together with first hot air pipe and the tip of second cold air pipe respectively.

The present utility model may be further configured in a preferred example to: the sealing partition plates are of heat insulation plate structures, the number of the sealing partition plates is a plurality of the sealing partition plates and are sequentially arranged on the inner side of the air conditioner main body in a stacked mode, gaps are formed between the adjacent sealing partition plates, and the cold runner and the hot runner are located in the gaps.

The present utility model may be further configured in a preferred example to: the refrigerating surfaces of the semiconductor refrigerating sheets are arranged oppositely, the heating surfaces of the semiconductor refrigerating sheets are symmetrically arranged about the hot runner, and the refrigerating surfaces of the semiconductor refrigerating sheets are symmetrically arranged about the cold runner.

The present utility model may be further configured in a preferred example to: and the two sides of the semiconductor refrigerating sheet are respectively provided with a plurality of heat conducting fins positioned on the inner sides of the cold runner and the hot runner, and the heat conducting fins are arranged in parallel with the inner sides of the cold runner and the hot runner.

The present utility model may be further configured in a preferred example to: the first axial flow fan and the second axial flow fan have the same structure and comprise an outer rotor motor and fan blades sleeved on the outer side of the outer rotor motor, and the axes of the first axial flow fan and the second axial flow fan and the circle centers of the first cold air pipe and the second cold air pipe are positioned on the same straight line.

The present utility model may be further configured in a preferred example to: the air conditioner is characterized in that a heat insulation sleeve layer structure is arranged on the outer sides of the air conditioner main body and the diversion cap, and the top end of the air conditioner main body is fixedly sleeved on the inner side of the diversion cap and is in sealing connection with the diversion cap.

The present utility model may be further configured in a preferred example to: the inner sides of the cold runner and the hot runner are provided with temperature sensors, and the output ends of the temperature sensors are electrically connected with PID control modules connected with the first axial flow fan and the second axial flow fan.

The beneficial effects obtained by the utility model are as follows:

1. according to the utility model, through arranging a plurality of cold flow channels and hot flow channel structures to be completely isolated under the action of the sealing partition plate, the mutual independence of cold and hot air channels is avoided, the heat transfer between two air flows is avoided, and the indoor refrigerating and heating mode switching is realized through the forward and reverse rotation mutual switching of the first axial flow fan and the second axial flow fan, so that the functions of regulating and controlling the temperature of the semiconductor air conditioner are realized.

2. According to the utility model, the plurality of semiconductor refrigerating sheets are arranged in a lamination way to form the plurality of semiconductor refrigerating sheets and the cold runner structure, so that the refrigerating capacity and the heating capacity are improved, and the working effect of the semiconductor air conditioner is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model;

fig. 2 is a schematic view of an installation structure of an air conditioner body according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a deflector cap according to an embodiment of the present utility model;

fig. 4 is a schematic diagram of cold runner and hot runner structures according to an embodiment of the present utility model.

Reference numerals:

100. a fixing seat; 110. a grille tuyere;

200. an air conditioner main body; 210. a sealing separator; 220. a semiconductor refrigeration sheet; 230. a cold runner; 240. a hot runner; 221. a heat conduction fin;

300. a deflector cap; 310. a first cold air pipe; 320. a second cold air pipe; 330. a first hot air pipe; 340. a second hot air pipe; 350. a first axial flow fan; 360. a second axial fan.

Detailed Description

The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

A semiconductor air conditioner provided by some embodiments of the present utility model is described below with reference to the accompanying drawings.

Referring to fig. 1 to 4, the present utility model provides a semiconductor air conditioner, comprising: the air conditioner comprises a fixing seat 100, an air conditioner main body 200 and a flow guide cap 300, wherein the air conditioner main body 200 is fixedly arranged on the surface of the fixing seat 100, the flow guide cap 300 is fixedly arranged at the top end of the air conditioner main body 200 and is provided with a first cold air pipe 310, a second cold air pipe 320, a first hot air pipe 330 and a second hot air pipe 340 on the surface, the first cold air pipe 310 and the second cold air pipe 320 are symmetrically arranged on two sides of the air conditioner main body 200 and are internally provided with a first axial flow fan 350 and a second axial flow fan 360 respectively, the end parts of the first cold air pipe 310 and the first hot air pipe 330 penetrate through the surface of the fixing seat 100 and are connected with a grid air inlet 110, a plurality of sealing partition boards 210 are arranged on the inner side of the air conditioner main body 200, semiconductor refrigerating sheets 220 are embedded and arranged on the surface of the sealing partition boards 210, two sides of the sealing partition boards 210 are respectively provided with a cold air channel 230 and a hot air channel 240, and two ends of the hot air channel 240 are respectively communicated with the end parts of the first hot air pipe 330 and the second cold air pipe 320.

In this embodiment, the sealing spacers 210 are heat insulating structures, the number of the sealing spacers 210 is several and sequentially stacked on the inner side of the air conditioner body 200, a gap is provided between adjacent sealing spacers 210, and the cold runner 230 and the hot runner 240 are located in the gap.

In this embodiment, the cooling surfaces of the adjacent semiconductor cooling fins 220 are arranged opposite to each other, and the heating surfaces of the semiconductor cooling fins 220 are symmetrically arranged about the hot runner 240, and the cooling surfaces of the semiconductor cooling fins 220 are symmetrically arranged about the cold runner 230.

Specifically, a plurality of semiconductor refrigerating sheets 220 are stacked to form a plurality of semiconductor refrigerating sheets 220 and cold runner 230 structures, so that refrigerating capacity and heating capacity are improved, and the working effect of the semiconductor air conditioner is improved.

In this embodiment, both sides of the semiconductor cooling fin 220 are provided with a plurality of heat conductive fins 221 located inside the cold runner 230 and the hot runner 240, and the heat conductive fins 221 are arranged in parallel with the inside of the cold runner 230 and the hot runner 240.

Specifically, the heat exchange efficiency of the air flow with the semiconductor refrigeration sheet 220 is improved by the heat conduction fins 221.

In this embodiment, the first axial flow fan 350 and the second axial flow fan 360 have the same structure and each include an outer rotor motor and blades sleeved on the outer side of the outer rotor motor, and the axes of the first axial flow fan 350 and the second axial flow fan 360 and the centers of the first cold air pipe 310 and the second cold air pipe 320 are located on the same straight line.

Specifically, the switching of the indoor cooling and heating modes is realized by the switching of the forward and reverse rotation of the first axial flow fan 350 and the second axial flow fan 360, and the functions of adjusting and controlling the temperature of the semiconductor air conditioner are performed.

In this embodiment, the air conditioner main body 200 and the diversion cap 300 are provided with a heat insulation sleeve layer structure on the outer side, and the top end of the air conditioner main body 200 is fixedly sleeved on the inner side of the diversion cap 300 and is in sealing connection with the diversion cap 300.

In this embodiment, temperature sensors are disposed at the inner sides of the cold runner 230 and the hot runner 240, and PID control modules connected to the first and second axial flow fans 350 and 360 are electrically connected to output ends of the temperature sensors, so that the rotational speeds of the first and second axial flow fans 350 and 360 are controlled by the PIDs to achieve constant temperature control.

The working principle and the using flow of the utility model are as follows:

heating stage: air flow is introduced from one end of the second cooling air pipe 320 through the rotation of the second axial flow fan 360, flows through the semiconductor refrigeration piece 220 and the heating surface of the sealing partition plate 210 for heat exchange, the heated air flow is guided out through the first hot air pipe 330 and is guided into a room through the grille air opening 110, and in the process, the first axial flow fan 350 does not work to perform indoor air flow heating operation;

refrigeration stage: the first axial flow fan 350 works to introduce outdoor air flow through the second hot air pipe 340, the outdoor air flow contacts the refrigerating surface of the semiconductor refrigerating sheet 220 through the cold flow channel 230 to exchange heat and cool, the low-temperature air flow enters the room after passing through the first axial flow fan 350 and the first cold air pipe 310 to realize indoor low temperature, in the process, the second axial flow fan 360 reversely introduces high-temperature heat flow after the indoor ascending motion through the first hot air pipe 330, the air flow contacts the heating surface of the semiconductor refrigerating sheet 220 through the hot flow channel 240, and the partial air flow is led out through the second axial flow fan 360 and the second cold air pipe 320, so that the heat flow is led out and the temperature of the heating surface of the semiconductor refrigerating sheet 220 is reduced, and the continuous and stable operation of the semiconductor refrigerating sheet 220 is ensured.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims

1. A semiconductor air conditioner, comprising: fixing base (100), air conditioning main part (200) and water conservancy diversion cap (300), air conditioning main part (200) fixed mounting is in the surface of fixing base (100), water conservancy diversion cap (300) fixed mounting is equipped with first cold air pipe (310), second cold air pipe (320), first hot air pipe (330) and second hot air pipe (340) in the top and the surface of air conditioning main part (200), first cold air pipe (310) and second cold air pipe (320) symmetrical arrangement are equipped with first axial fan (350) and second axial fan (360) respectively in the both sides and the inside of air conditioning main part (200), the tip of first cold air pipe (310) and first hot air pipe (330) runs through the surface of fixing base (100) and is connected with grid wind gap (110), the inboard of air conditioning main part (200) is equipped with a plurality of sealing baffle (210), semiconductor refrigeration piece (220) are installed in the surface-mounting of sealing baffle (210), both sides of sealing baffle (210) are equipped with cold runner (230) and hot runner (240) respectively, the both ends of hot runner (240) are linked together with cold runner (230) and second air pipe (320) both ends of cold runner (230) respectively.

2. The semiconductor air conditioner according to claim 1, wherein the sealing partition plates (210) are heat insulating plate structures, the number of the sealing partition plates (210) is several and are sequentially stacked on the inner side of the air conditioner main body (200), a gap is provided between adjacent sealing partition plates (210), and the cold runner (230) and the hot runner (240) are located in the gap.

3. The semiconductor air conditioner according to claim 1, wherein the cooling surfaces of the adjacent semiconductor cooling fins (220) are arranged oppositely, the heating surfaces of the semiconductor cooling fins (220) are arranged symmetrically with respect to the hot runner (240), and the cooling surfaces of the semiconductor cooling fins (220) are arranged symmetrically with respect to the cold runner (230).

4. The semiconductor air conditioner according to claim 1, wherein a plurality of heat conducting fins (221) located inside the cold runner (230) and the hot runner (240) are disposed on both sides of the semiconductor refrigerating sheet (220), and the heat conducting fins (221) are disposed in parallel with the inside of the cold runner (230) and the hot runner (240).

5. The semiconductor air conditioner according to claim 1, wherein the first axial flow fan (350) and the second axial flow fan (360) have the same structure and comprise an outer rotor motor and fan blades sleeved on the outer side of the outer rotor motor, and the axes of the first axial flow fan (350) and the second axial flow fan (360) and the centers of the first cold air pipe (310) and the second cold air pipe (320) are positioned on the same straight line.

6. The semiconductor air conditioner according to claim 1, wherein a heat insulation sleeve layer structure is arranged on the outer sides of the air conditioner main body (200) and the diversion cap (300), and the top end of the air conditioner main body (200) is fixedly sleeved on the inner side of the diversion cap (300) and is in sealing connection with the diversion cap (300).

7. The semiconductor air conditioner according to claim 1, wherein temperature sensors are arranged on the inner sides of the cold runner (230) and the hot runner (240), and PID control modules connected with the first axial flow fan (350) and the second axial flow fan (360) are electrically connected to the output ends of the temperature sensors.