CN220914378U - Cold and hot integrated temperature control partition wall - Google Patents
Cold and hot integrated temperature control partition wall Download PDFInfo
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- CN220914378U CN220914378U CN202322568271.4U CN202322568271U CN220914378U CN 220914378 U CN220914378 U CN 220914378U CN 202322568271 U CN202322568271 U CN 202322568271U CN 220914378 U CN220914378 U CN 220914378U
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- temperature control
- heat exchange
- partition wall
- shield
- cold
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- 238000005192 partition Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 238000009423 ventilation Methods 0.000 claims abstract description 22
- 238000005057 refrigeration Methods 0.000 claims abstract description 20
- 238000004146 energy storage Methods 0.000 abstract description 23
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to the technical field of energy storage, in particular to a cold and hot integrated temperature control partition wall, which comprises a temperature control layer, wherein a semiconductor refrigeration sheet is fixed on the temperature control layer, heat exchange fins are arranged on the front side and/or the back side of the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is connected with a power supply, and the anode and the cathode of the power supply can be switched to switch the current direction; the front and back surfaces of the temperature control layer are respectively covered with an inner shield and an outer shield, the two shields and the temperature control layer are enclosed to form an inner heat exchange cavity and an outer heat exchange cavity, and ventilation structures are arranged on the inner shield and the outer shield. The partition wall has the functions of refrigeration and heating, can be used for heating in winter and refrigerating in summer of the energy storage cabinet, and has extremely low space occupation rate.
Description
Technical Field
The utility model relates to the technical field of energy storage, in particular to a cold-hot integrated temperature control partition wall.
Background
The energy storage cabinet (energy storage container) has the functions of portability, strong flexibility, expandability, detachability and the like, can be used for storing electric energy generated by new energy sources such as wind energy, solar energy and the like, and has a certain practical value from the commercial angle and the technical angle. Because the wind energy, solar energy and other new energy sources are characterized by strong randomness, high intermittence and quick output change, the new energy sources are directly connected with the grid, particularly the high-capacity power grid can have certain influence on the dispatching and control of the power grid, and even can interfere the stability of the power grid. The energy storage cabinet and the renewable new energy source are jointly applied, so that the randomly-changed output power can be converted into relatively stable output, and the stability of a power grid system is ensured.
The energy storage cabinet can generate a large amount of heat during working, especially in the hot weather in summer, the energy storage cabinet is extremely easy to be influenced by high temperature and cannot work normally, and in the extremely cold weather in winter, when the energy storage cabinet is not charged or discharged, the low temperature can cause the aging of the battery core placed in the energy storage cabinet, the capacity of the battery core is reduced, and irreversible damage is caused; in order to overcome the above problems, as described in the publication number CN219459470U, the energy storage cabinet is usually equipped with a refrigerating and heating air conditioning system, however, the space occupied by the energy storage cabinet after the air conditioning system is added can be greatly increased, and the energy consumption is high, so that the problem needs to be solved.
Disclosure of Invention
In order to avoid and overcome the technical problems in the prior art, the utility model provides a cold and hot integrated temperature control partition wall. The partition wall has the functions of refrigeration and heating, can be used for heating in winter and refrigerating in summer of the energy storage cabinet, and has extremely low space occupation rate.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The temperature control partition wall comprises a temperature control layer, a semiconductor refrigeration sheet is fixed on the temperature control layer, heat exchange fins are arranged on the front side and/or the back side of the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is connected with a power supply, and the anode and the cathode of the power supply can be switched to switch the current direction; the front and back surfaces of the temperature control layer are respectively covered with an inner shield and an outer shield, the two shields and the temperature control layer are enclosed to form an inner heat exchange cavity and an outer heat exchange cavity, and ventilation structures are arranged on the inner shield and the outer shield.
As a further scheme of the utility model: the front surface of the semiconductor refrigeration sheet is provided with inner heat exchange fins along the vertical direction, and two adjacent groups of inner heat exchange fins are enclosed with the cover surface of the inner shield and the temperature control layer to form a heat exchange flow passage arranged along the vertical direction.
As still further aspects of the utility model: the ventilation structure on the inner shield is a centrifugal fan arranged at the bottom of the inner shield and used for sucking air, at least two groups of inner louver ventilation openings are arranged on the inner shield from top to bottom, the inner louver ventilation openings are horizontally arranged, and the blades can be stirred up and down to change the outlet flow direction.
As still further aspects of the utility model: the air inlet of the centrifugal fan is a spherical air inlet capable of changing the wind direction.
As still further aspects of the utility model: the widths of the inner shield and the outer shield are correspondingly equal to the widths of the heat exchange fins.
As still further aspects of the utility model: the back surface of the semiconductor refrigeration sheet is provided with outer heat exchange fins along the horizontal direction, and two adjacent groups of outer heat exchange fins are enclosed with the cover surface of the outer shield and the temperature control layer to form a heat exchange flow passage arranged along the horizontal direction.
As still further aspects of the utility model: the ventilation structure on the outer shield is an exhaust fan arranged in the middle of the outer shield, and outer blind ventilation openings are horizontally arranged on the side wall of the outer shield and/or the bottom of the outer shield, and the blades of the outer blind ventilation openings can be toggled up and down to change the air inlet flow direction.
Compared with the prior art, the utility model has the beneficial effects that:
1. The semiconductor refrigerating sheets of the temperature control partition wall are electrified, one side of the semiconductor refrigerating sheets heats and cools, the ventilation structure is arranged on the temperature control partition wall and can exchange heat with the external environment, after the direction of the electrified current is switched in two seasons of summer and winter, the two sides of the temperature control partition wall can be respectively cooled and heated, the cooling or heating temperature can be adjusted by adjusting the current, the whole structure is compact, the semiconductor refrigerating sheets can be used for heating in winter and cooling in summer of an energy storage cabinet, and the space occupation rate is extremely low; besides the energy storage cabinet, the temperature control partition wall can be used for a factory workshop, and the workshop is partitioned into a refrigerating area and a heating area through the partition wall, so that different requirements of refrigerating and heating in the same space are met.
2. According to the utility model, the heat exchange fins which are arranged in the vertical direction and the horizontal direction are respectively arranged on the front side and the back side of the semiconductor refrigeration sheet, so that internal and external heat exchange is formed in the cross direction, cold air is fully subjected to heat exchange and temperature reduction in a long path along the vertical direction, and the hot air rapidly passes through the temperature control partition wall in the horizontal direction, so that the temperature of the heating surface is prevented from rapidly rising, and the overall heat exchange efficiency is high.
3. According to the utility model, the centrifugal fan sucks air, the air inlet direction can be changed through the spherical air inlet, and finally, air is discharged at different heights through the shutter air inlets in the multiple layers, so that the effect of uniform cooling and heating is achieved.
4. The heat exchange fins are correspondingly equal to the shields in width, so that a plurality of groups of flow channels can be formed in the shields in a uniformly separated mode, and air flow can uniformly pass through the heat exchange fins.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a cross-sectional view of the present utility model.
In the figure:
1. temperature control partition wall; 11. a temperature control layer; 111. a semiconductor refrigeration sheet;
112. An inner heat exchange fin; 113. an outer heat exchange fin;
12. an inner shield; 121. a centrifugal fan; 122. an inner louver vent;
13. An outer shield; 131. an outer louver vent; 132. and an exhaust fan.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, in an embodiment of the present utility model, a temperature control partition wall with integrated heat and cold, wherein the temperature control partition wall 1 includes a temperature control layer 11, an inner shield 12 covering the front surface of the temperature control layer 11, and an outer shield 13 covering the back surface of the temperature control layer 11, and the cover areas of the inner shield 12 and the outer shield 13 are equal to the surface areas of the front and back surfaces of the temperature control layer 11, and can be fixed by welding.
The inner shield 12 and the temperature control layer 11 are enclosed to form an inner heat exchange cavity, and the outer shield 13 and the temperature control layer 11 are enclosed to form an outer heat exchange cavity.
The semiconductor refrigerating sheets 111 are uniformly arranged on the rectangular array on the temperature control layer 11, and the front and back surfaces of the semiconductor refrigerating sheets 111 face the inner heat exchange cavity and the outer heat exchange cavity respectively.
The front surface of the semiconductor refrigeration sheet 111 is provided with a plurality of groups of inner heat exchange fins 112 in the vertical direction, and the width of the inner heat exchange fins 112 is preferably equal to the width of the inner shroud 12. Adjacent two groups of inner heat exchange fins 112 are enclosed with the inner shield 12 and the temperature control layer 11 to form a heat exchange flow passage arranged along the vertical direction.
When the temperature control partition wall is used for the energy storage cabinet, the centrifugal fan 121 is installed at the bottom of the inner shield 12 and used for sucking air in the energy storage cabinet, and the fan opening of the centrifugal fan 121 is a spherical air opening and can rotate to adjust the air inlet direction. The cover surface of the inner shield 12 facing the cabinet cavity of the energy storage cabinet is provided with inner louver ventilation openings 122, the inner louver ventilation openings 122 are arranged along the horizontal direction, a plurality of groups of the inner louver ventilation openings 122 are arranged from top to bottom and are staggered in height, and the blades of the inner louver ventilation openings 122 can be toggled up and down to change the air outlet flow direction.
After entering the inner heat exchange cavity through the centrifugal fan 121, the air in the energy storage cabinet is discharged into the energy storage cabinet from the inner louver ventilation openings 122 with different heights after being subjected to heat exchange and temperature reduction through the heat exchange flow channels between the inner heat exchange fins 112 from bottom to top.
The opposite side of the semiconductor cooling fin 111 is provided with a plurality of sets of outer heat exchange fins 113 in the horizontal direction, and the width of the outer heat exchange fins 113 is preferably equal to the width of the outer shroud 13. Adjacent two groups of outer heat exchange fins 113 are enclosed with the outer shield 13 and the temperature control layer 11 to form a heat exchange flow passage arranged along the horizontal direction.
At least two groups of exhaust fans 132 are arranged above the cover surface of the outer shield 13 for exhausting air; the two sides of the outer shield 13 and the bottom of the shield are provided with outer blind ventilation openings 131. The blades of the outer louver air vents 131 can be toggled up and down to change the flow direction of the air inlet, and the outside air is discharged from the exhaust fan 132 after entering the outer heat exchange cavity from the outer louver air vents 131 and passing through the heat exchange flow channels between the adjacent outer heat exchange fins 113 along the horizontal direction.
The inner heat exchange cavity and the outer heat exchange cavity are arranged in the vertical mode, and heat exchange efficiency is better.
Each semiconductor refrigeration piece 111 is connected with a power supply, and the power supply can switch the anode and the cathode, so that the current flow direction is changed, and the cold and hot states of the front side and the back side of the semiconductor refrigeration piece 111 are changed. In summer, the front side of the semiconductor refrigerating sheet 111 is refrigerated and the back side is heated, so that the temperature in the energy storage cabinet is reduced; in winter, the front side of the semiconductor refrigerating sheet 111 heats and cools the back side, thereby heating the inside of the energy storage cabinet.
Besides the energy storage cabinet, the temperature control partition wall can be used for a factory workshop, and the workshop is partitioned into a refrigerating area and a heating area through the partition wall, so that different requirements of refrigerating and heating in the same space are met.
The basic principles of the present application have been described above in connection with specific embodiments, but it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not intended to be limiting, and these advantages, benefits, effects, etc. are not to be construed as necessarily possessed by the various embodiments of the application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not necessarily limited to practice with the above described specific details.
The block diagrams of the devices, apparatuses, devices, systems referred to in the present application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.
Claims (7)
1. The cold and hot integrated temperature control partition wall is characterized in that the temperature control partition wall (1) comprises a temperature control layer (11), a semiconductor refrigeration sheet (111) is fixed on the temperature control layer (11), heat exchange fins are arranged on the front side and/or the back side of the semiconductor refrigeration sheet (111), the semiconductor refrigeration sheet (111) is connected with a power supply, and the anode and the cathode of the power supply can be switched to switch the current direction; the front and back surfaces of the temperature control layer (11) are respectively covered with an inner shield (12) and an outer shield (13), the two shields and the temperature control layer (11) are enclosed to form an inner heat exchange cavity and an outer heat exchange cavity, and ventilation structures are arranged on the inner shield (12) and the outer shield (13).
2. The cold-hot integrated temperature control partition wall according to claim 1, wherein inner heat exchange fins (112) are arranged on the front surface of the semiconductor refrigeration sheet (111) along the vertical direction, and two adjacent groups of inner heat exchange fins (112) are enclosed with the cover surface of the inner shield (12) and the temperature control layer (11) to form a heat exchange flow channel arranged along the vertical direction.
3. The cold-hot integrated temperature control partition wall according to claim 1, wherein the ventilation structure on the inner shield (12) is a centrifugal fan (121) installed at the bottom of the inner shield (12) and used for sucking air, at least two groups of inner louver ventilation openings (122) are arranged on the inner shield (12) from top to bottom, the inner louver ventilation openings (122) are horizontally arranged, and the blades can be toggled up and down to change the outlet flow direction.
4. A cold and hot integrated temperature control partition wall according to claim 3, wherein the air inlet of the centrifugal fan (121) is a spherical air inlet capable of changing the wind direction.
5. A cold and hot integrated temperature control partition wall according to any one of claims 1 to 4, wherein the widths of the inner shroud (12) and the outer shroud (13) are correspondingly equal to the widths of the heat exchange fins.
6. A cold-hot integrated temperature control partition wall according to any one of claims 1 to 4, wherein the back surface of the semiconductor refrigeration sheet (111) is provided with outer heat exchange fins (113) along the horizontal direction, and two adjacent groups of outer heat exchange fins (113) are enclosed with the cover surface of the outer shield (13) and the temperature control layer (11) to form a heat exchange flow passage arranged along the horizontal direction.
7. The cold-hot integrated temperature control partition wall according to claim 6, wherein the ventilation structure on the outer shield (13) is an exhaust fan (132) installed in the middle of the outer shield (13), an outer louver ventilation opening (131) is horizontally arranged on the side wall of the outer shield (13) and/or the bottom of the outer shield (13), and blades of the outer louver ventilation opening (131) can be toggled up and down to change the air inlet flow direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568271.4U CN220914378U (en) | 2023-09-20 | 2023-09-20 | Cold and hot integrated temperature control partition wall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568271.4U CN220914378U (en) | 2023-09-20 | 2023-09-20 | Cold and hot integrated temperature control partition wall |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220914378U true CN220914378U (en) | 2024-05-07 |
Family
ID=90908038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322568271.4U Active CN220914378U (en) | 2023-09-20 | 2023-09-20 | Cold and hot integrated temperature control partition wall |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220914378U (en) |
-
2023
- 2023-09-20 CN CN202322568271.4U patent/CN220914378U/en active Active
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