CN219350190U - Multipurpose quick-change wafer sucker - Google Patents
Multipurpose quick-change wafer sucker Download PDFInfo
- Publication number
- CN219350190U CN219350190U CN202320125386.3U CN202320125386U CN219350190U CN 219350190 U CN219350190 U CN 219350190U CN 202320125386 U CN202320125386 U CN 202320125386U CN 219350190 U CN219350190 U CN 219350190U
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- panel module
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- base module
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- 230000008859 change Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 27
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer suction cups, in particular to a multipurpose type quick-change wafer suction cup, which comprises the following components: the wafer clamping device comprises a panel module, a base module and a fastening module for pressing the panel module and the base module, wherein one surface of the panel module is used for placing a wafer, the other surface of the panel module is provided with a plurality of annular negative pressure grooves a which are attached to the base module, and the annular negative pressure grooves a and the panel module surface form grooves/surfaces which are mutually alternated; the base module is provided with a plurality of annular negative pressure grooves b on one surface close to the panel module, the side surface of the base module is provided with a vacuum channel, and the annular negative pressure grooves b and the base module surface form grooves/surfaces which are mutually alternated; the fastening module compresses the panel module and the base module by adopting screws. According to the utility model, the fastening module is added on the prior art, and the panel module and the base module are fixed in a detachable connection mode by adopting the screws.
Description
Technical Field
The utility model relates to the field of wafer suction cups, in particular to a multipurpose type quick-change wafer suction cup.
Background
In semiconductor processing, it is often necessary to form a circuit element in a wafer having a recess in a sidewall thereof in order to determine the relative position of the circuit element to the wafer. In the wafer processing or inspection process, it is often necessary to fix the wafer to a processing apparatus, so as to facilitate the processing of the wafer.
The wafer chuck is mainly aimed at limiting the wafer during detection. In the prior art, the panel module and the base module are fixed in a gluing mode, so that the panel module and the base module are tightly attached.
Disclosure of Invention
The utility model aims to provide a multipurpose type quick-change wafer sucker, which solves the problem that the panel module and the base module are fixed by adopting an adhesive mode in the prior art, so that the replacement is inconvenient.
In order to achieve the above purpose, the embodiment of the present application provides the following technical solutions:
a multipurpose quick change wafer chuck comprising: the wafer clamping device comprises a panel module, a base module and a fastening module for pressing the panel module and the base module, wherein one surface of the panel module is used for placing a wafer, the other surface of the panel module is provided with a plurality of annular negative pressure grooves a which are attached to the base module, and the annular negative pressure grooves a and the panel module surface form grooves/surfaces which are mutually alternated; the base module is provided with a plurality of annular negative pressure grooves b on one surface close to the panel module, the side surface of the base module is provided with a vacuum channel, and the annular negative pressure grooves b and the base module surface form grooves/surfaces which are mutually alternated; the fastening module compresses the panel module and the base module by adopting screws. The utility model uses a vacuumizing mode to enable the panel module and the base module to be tightly attached. The face on the panel module is laminated with the groove of base module, and the groove on the panel module corresponds with the absorption hole of base module (absorption hole sets up on the face of base module), just so can realize vacuum adsorption through absorption hole for panel module, base module closely laminate. Secondly, the fastening module is added on the prior art, and the panel module and the base module are fixed in a detachable connection mode by adopting screws.
Furthermore, a plurality of positioning holes are formed in the center ring of the face, close to the base module, of the panel module, and positioning columns matched with the positioning holes are formed in the face, close to the panel module, of the base module. Through setting up locating hole and reference column, can realize panel module and base module quick positioning, and laminating stability is better.
Specifically, be equipped with annular base on the one side of panel module placement wafer, fastening module includes the retainer plate, the retainer plate can be placed on annular base, is equipped with a plurality of screw holes on the retainer plate, the top that the base module is close to the one side of panel module is equipped with a plurality of screw holes with the retainer plate intercommunication all around. The annular base is arranged on the panel module in a surrounding manner, a plurality of screw holes are formed in the fastening ring, the base module is also provided with the screw holes communicated with the fastening ring, the panel module, the fastening ring and the base module are fixed through screws, the connection fixation of the panel module and the base module is realized, the annular base is added on the panel module, and the wafer test cannot be influenced.
Further, the face of the panel module and the face of the base module are ground and flattened. The face of panel module, base module grinds to be leveled can make panel module, base module laminating inseparabler, does benefit to the test of wafer.
Further, the panel module is provided with grounding connectors around. The ground connector may be used for wafer testing needs.
The beneficial effects of the utility model are as follows:
1. the utility model uses a plurality of vacuum channels to correspond to different negative pressure holes so as to adapt to wafers with different sizes.
2. According to the utility model, the fastening module is added on the prior art, and the panel module and the base module are fixed in a detachable connection mode by adopting the screws.
3. According to the utility model, the annular base is arranged on the panel module in a ring manner, the fastening ring is provided with a plurality of screw holes, the base module is also provided with the screw holes communicated with the fastening ring, the panel module, the fastening ring and the base module are fixed through the screws, the connection and the fixation of the panel module and the base module are realized, and the annular base is added on the panel module, so that the wafer test is not influenced.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a partial structure of the present utility model;
FIG. 3 is a schematic view of a panel module structure of the present utility model;
FIG. 4 is a schematic view b of the panel module structure of the present utility model;
FIG. 5 is a schematic view of the structure of the fastening ring of the present utility model;
fig. 6 is a schematic view of the base module structure of the present utility model.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals or letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Examples
As shown in fig. 1 and 2, a multipurpose quick-change wafer chuck includes: a panel module 1, a base module 2 and a fastening module 3 for pressing the two. Wherein, fastening module 3 adopts the screw to compress tightly panel module 1, base module 2.
The structure of the panel module is shown in fig. 3 and 4, one surface of the panel module 1 is used for placing a wafer, a plurality of annular negative pressure grooves a11 are formed in the other surface of the panel module 1, one surface of the panel module 1 provided with the annular negative pressure grooves a11 is attached to the base module 2, the annular negative pressure grooves a11 and the panel module 1 form grooves/surfaces which are mutually alternated, the grooves are vacuum passing channels, a plurality of holes 12 are formed in the grooves, and the wafer is sucked on the panel module 1 by utilizing the negative pressure adsorption capacity. In the present utility model, the annular negative pressure grooves a11 are provided corresponding to the suction holes 23, the suction holes 23 are provided on the surface of the base module 2, and the suction holes 23 are not provided on the surface of the base module 2 corresponding to some of the annular negative pressure grooves a 11.
The structure of the base module is shown in fig. 2 and 6, one surface of the base module 2, which is close to the panel module 1, is also provided with a plurality of annular negative pressure grooves b21, the side surface of the base module is provided with a vacuum channel 5, and the annular negative pressure grooves b21 and the surface of the base module 2 form grooves/surfaces which are mutually alternated; a plurality of adsorption holes 23 are arranged on the surface of the base module 2 in a radial direction, and different adsorption holes 23 correspond to different vacuum channels 5.
In a further preferred embodiment, as shown in fig. 3 and 6, a plurality of positioning holes 13 are formed in a center ring of the side, close to the base module 2, of the panel module 1, and positioning columns 22 matched with the positioning holes 13 are formed in the side, close to the panel module 1, of the base module 2. The positioning holes 13 and the positioning columns 22 can be used for rapidly positioning the panel module 1 and the base module 2 and also can stabilize the fitting of the panel module 1 and the base module 2.
More specific embodiment, the panel module 1 is equipped with annular base 14 on placing the wafer one side, the fastening module 3 includes the retainer plate 31, the retainer plate 31 can be placed on annular base 14, is equipped with a plurality of screw holes 32 on the retainer plate 3, the top that the base module 3 is close to panel module 1 one side is equipped with a plurality of screw holes 32 all around with the retainer plate 31 intercommunication. The annular base 14 is annularly arranged on the panel module 1, a plurality of screw holes 31 are formed in the fastening ring 31, screw holes 32 communicated with the fastening ring 31 are also formed in the base module 2, the panel module 1, the fastening ring 31 and the base module 2 are fixed through screws, the panel module 1 and the base module 2 are fixedly connected, the annular base 14 is additionally arranged on the panel module 1, and the wafer test cannot be influenced.
In a further embodiment, the faces of the panel module 1 and the base module 2 are polished flat. So that the panel module 1 and the base module 2 are tightly attached.
In a further embodiment, the panel module 1 is provided with a grounding connector around. The ground connector 4 is used for testing wafers.
The utility model uses a plurality of vacuum channels 5 to correspond to different negative pressure holes 23 so as to adapt to wafers with different sizes, the negative pressure holes 23 are communicated with corresponding annular negative pressure grooves a11, the annular negative pressure grooves a11 are communicated with holes 12 to form vacuum adsorption, and the adsorption of sucking discs with different sizes is realized according to different positions of the negative pressure holes 23.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. A multipurpose quick change wafer chuck, comprising: the wafer clamping device comprises a panel module, a base module and a fastening module for pressing the panel module and the base module, wherein one surface of the panel module is used for placing a wafer, the other surface of the panel module is provided with a plurality of annular negative pressure grooves a which are attached to the base module, and the annular negative pressure grooves a and the panel module surface form grooves/surfaces which are mutually alternated; the base module is provided with a plurality of annular negative pressure grooves b on one surface close to the panel module, the side surface of the base module is provided with a vacuum channel, and the annular negative pressure grooves b and the base module surface form grooves/surfaces which are mutually alternated; the fastening module compresses the panel module and the base module by adopting screws.
2. The multipurpose quick change wafer chuck as set forth in claim 1, wherein the center ring of the panel module near the side of the base module has a plurality of positioning holes, and the side of the base module near the panel module has positioning posts adapted to the positioning holes.
3. The multipurpose quick-change wafer chuck as set forth in claim 1, wherein the panel module is provided with an annular base on one side on which the wafer is placed, the fastening module comprises a fastening ring, the fastening ring is placed on the annular base, the fastening ring is provided with a plurality of screw holes, and the periphery of the top of the side of the panel module, which is close to the panel module, is provided with a plurality of screw holes communicated with the fastening ring.
4. The multipurpose quick change wafer chuck of claim 1, wherein the face of the panel module and the base module are polished flat.
5. A multipurpose quick change wafer chuck as claimed in any one of claims 1 to 4 wherein ground contacts are provided around said panel module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320125386.3U CN219350190U (en) | 2023-01-13 | 2023-01-13 | Multipurpose quick-change wafer sucker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320125386.3U CN219350190U (en) | 2023-01-13 | 2023-01-13 | Multipurpose quick-change wafer sucker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219350190U true CN219350190U (en) | 2023-07-14 |
Family
ID=87108684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320125386.3U Active CN219350190U (en) | 2023-01-13 | 2023-01-13 | Multipurpose quick-change wafer sucker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219350190U (en) |
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2023
- 2023-01-13 CN CN202320125386.3U patent/CN219350190U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231026 Address after: Room 1308, Floor 17, Unit 2, Building 1, No. 27, Qinglong Street, Qingyang District, Chengdu, Sichuan 610000 Patentee after: Chengdu Changfan Technology Co.,Ltd. Address before: 518000 Julong plant a501, No. 24, cuibao Road, Baolong community, Baolong street, Longgang District, Shenzhen, Guangdong Patentee before: Shenzhen Jingzhun Semiconductor Technology Co.,Ltd. |