CN218158058U - Separate chip adsorption test fixture - Google Patents

Abstract

The utility model belongs to the technical field of chip testing, in particular to a discrete chip adsorption testing clamp, which comprises a metal sucker and a positioning ring, wherein the lower surface of the metal sucker is provided with an air groove, the shape of the air groove corresponds to the shape formed by all vacuum holes of a probe station objective table, and all vacuum holes of the probe station objective table are covered; vacuum suction holes penetrating through the upper surface and the lower surface of the metal sucker are formed in the air groove, and the size of each vacuum suction hole is smaller than that of the discrete chip; the upper surface of the metal sucker is covered with a positioning film, and a positioning hole matched with the size of the discrete chip is formed in the position, corresponding to the vacuum suction hole of the metal sucker, on the positioning film; the upper surfaces of the positioning ring and the metal sucker are both provided with alignment scale marks along the radial direction. The utility model discloses can adsorb the chip of separating, separate the emergence of the condition that the chip was taken up by the probe when having avoided the chip test of separating. The utility model is suitable for a test of discrete chip.

Description

Separate chip adsorption test fixture

Technical Field

The utility model belongs to the technical field of the chip test, specifically speaking are a discrete chip adsorbs test fixture.

Background

With the development of science and technology, electronic chips have been widely used in various electronic products. After the production of the chips is completed, the qualification of the chips needs to be detected by a probe station, so that unqualified chips are selected and qualified chips are reserved. When the probe station tests, the whole wafer of the chip is adsorbed on the surface of a probe station object stage (Chuck) so as to realize the whole wafer test of the chip.

Along with the appearance and the rapid development of novel multi-chip structures such as micro-electro-mechanical system, multi-chip module, system level packaging and three-dimensional integrated circuit, the use of discrete chip is more and more extensive, lead to carrying out the demand of discrete chip test evaluation more and more, but probe platform objective table surface vacuum adsorption hole number is limited and the distribution is dispersed, be unsuitable for the test of discrete chip batch, so in order to realize the batch test of discrete chip, need put discrete chip array in a test fixture, adsorb test fixture on probe platform objective table surface again, thereby realize the batch test of discrete chip.

The existing discrete chip test fixture is an epoxy PCB (printed Circuit Board), the flatness of the discrete chip test fixture is poor, the grounding is poor, and particularly, the chip cannot be adsorbed on the surface of the fixture. In the testing process, the chip can not be adsorbed on the surface of the testing fixture, so that the situation that the chip is taken up by the probe can occur, and at the moment, when the probe moves to the next chip for testing, the chip and the radio frequency probe can be damaged.

Disclosure of Invention

The utility model aims at providing a separate chip adsorbs test fixture to the condition that the chip was taken up by the probe is separated when avoiding taking place to separate the chip test.

The utility model discloses a realize above-mentioned purpose, the technical method who adopts as follows:

a discrete chip adsorption test fixture is arranged on the basis of a probe station and comprises a metal sucker and a positioning ring, wherein an air groove is formed in one surface, which is in contact with a probe station objective table, of the metal sucker, the shape of the air groove corresponds to the shape formed by all vacuum holes of the probe station objective table, and the air groove covers all the vacuum holes of the probe station objective table; a plurality of vacuum suction holes penetrating through the upper surface and the lower surface of the metal sucker are formed in the air groove, and the size of each vacuum suction hole is smaller than that of the discrete chip; the surface of the metal sucker, which is not in contact with the objective table of the probe table, is covered with a transparent positioning film, positioning holes which are matched with the size of the discrete chips and have the same number as the vacuum suction holes are formed in the positioning film at the positions corresponding to the vacuum suction holes of the metal sucker, and the discrete chips are placed in the positioning holes of the positioning film and are positioned on the vacuum suction holes on the upper surface of the metal sucker; the metal sucker is sleeved on the inner ring of the positioning ring, the positioning ring and the metal sucker are positioned on the same plane, and the diameter of the outer ring of the positioning ring is matched with the diameter of the objective table of the probe table; the upper surface of the positioning ring is provided with first contraposition scale marks along the radial direction, the upper surface of the metal sucker is provided with second contraposition scale marks along the radial direction, the first contraposition scale marks and the second contraposition scale marks are the same in quantity, and the included angle between the adjacent first contraposition scale marks is the same as the included angle between the adjacent second contraposition scale marks.

As a limitation: the inner circle of the one side that the position circle and probe platform objective table contacted is equipped with at least one buckle, and the one side that metal sucking disc and probe platform objective table contacted is equipped with at least one draw-in groove, and the buckle of position circle and metal sucking disc's draw-in groove looks adaptation when the first counterpoint scale mark of position circle and metal sucking disc's the second counterpoint scale mark correspond, and the quantity of draw-in groove is the same with the quantity of buckle on the position circle on the metal sucking disc.

As a limitation: the number of the first alignment scale marks and the second alignment scale marks is eight, and the included angle between every two adjacent first alignment scale marks and the included angle between every two adjacent second alignment scale marks are 45 degrees.

As a limitation: the positioning film is a blue film made of polyvinyl chloride, and the blue film is adhered to the surface, which is not contacted with the objective table of the probe table, of the metal sucker.

As a limitation: the metal sucker is a tungsten steel sucker.

The utility model discloses owing to adopted above-mentioned scheme, compare with prior art, the beneficial effect who gains is:

(1) The utility model provides a discrete chip adsorbs test fixture, the vacuum in the vacuum hole of probe station objective table is led to the discrete chip below through the air groove and the vacuum suction hole of the lower surface of the metal sucker by the metal sucker, adsorbs the discrete chip, thereby the metal sucker has the vacuum adsorption function, the discrete chip is prevented from being brought up by the probe when the discrete chip is tested; through the arrangement of the positioning film and the positioning holes, the discrete chips are placed and positioned, and the discrete chips are prevented from deviating; by arranging the positioning ring and the alignment scale lines, the metal sucker is accurately positioned on the probe table object stage, so that the air groove completely covers the vacuum hole of the probe table object stage, and the vacuum hole of the probe table object stage is prevented from deviating out of the air groove;

(2) The utility model provides a discrete chip adsorbs test fixture, through setting up mutually adapted buckle and draw-in groove on position circle and metal sucking disc, avoided after the accurate location of metal sucking disc to the probe station objective table, the metal sucking disc takes place to remove, leads to the location inaccurate;

(3) The utility model provides a pair of discrete chip adsorbs test fixture, all sets up eight alignment scale marks on position circle and the metal sucking disc, guarantees that the counterpoint precision is higher, and the contained angle of adjacent alignment scale mark sets up to 45, and convenient machine tooling has improved the precision of machine tooling, has guaranteed the precision of counterpoint scale mark;

(4) The utility model provides a discrete chip adsorbs test fixture, metal sucking disc adopts the tungsten steel sucking disc, and the roughness is higher, and when the tungsten steel material was at thickness 1.5mm, the roughness can reach within 5 mu m, and the earthing nature of tungsten steel material is better moreover, makes the test index can reach good state when discrete chip tests;

(5) The utility model provides a pair of discrete chip adsorbs test fixture makes things convenient for machining and operating personnel to process, and the batch of being convenient for, assembly line, mechanized production in batches, production efficiency is high, has reduced the manufacturing cost of anchor clamps, is fit for extensive industrial production.

The utility model is suitable for a test of discrete chip.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

FIG. 1 is a schematic view of an upper surface structure of a discrete chip adsorption test fixture according to an embodiment of the present invention;

FIG. 2 is a schematic view of a lower surface structure of a discrete chip adsorption test fixture according to an embodiment of the present invention;

in the figure: 1. positioning the film; 2. positioning rings; 3. positioning holes; 4. vacuum suction holes; 5. a first alignment scale line; 6. a second alignment scale line; 7. a metal suction cup; 8. an air tank; 9. and (5) buckling.

Detailed Description

The present invention is further described with reference to the following examples, but it should be understood by those skilled in the art that the present invention is not limited to the following examples, and any modifications and equivalent changes made on the basis of the specific examples of the present invention are within the scope of the claims of the present invention.

Embodiment a discrete chip adsorbs test fixture

A discrete chip adsorption test fixture is arranged on the basis of a probe station and comprises a metal sucker 7 and a positioning ring 2, wherein one surface of the metal sucker 7, which is in contact with an objective table of the probe station, is a lower surface, and the other surface of the metal sucker 7 is an upper surface; the lower surface of the metal sucker 7 is provided with an air groove 8, the shape of the air groove 8 corresponds to the shape formed by all vacuum holes of the probe table object stage, and the air groove 8 covers all the vacuum holes of the probe table object stage; 100 vacuum suction holes 4 penetrating through the upper surface and the lower surface of the metal sucker 7 are formed in the air groove 8, and the size of each vacuum suction hole 4 is smaller than that of each discrete chip; the upper surface of the metal sucker 7 is covered with a transparent positioning film 1, the positioning film 1 is provided with positioning holes 3 corresponding to the vacuum suction holes 4 of the metal sucker 7 in size, the number of the positioning holes 3 is 100, and the discrete chips are placed in the positioning holes 3 of the positioning film 1 and positioned on the vacuum suction holes 4 on the upper surface of the metal sucker 7; the metal sucker 7 is sleeved on the inner ring of the positioning ring 2, the positioning ring 2 and the metal sucker 7 are positioned on the same plane, and the diameter of the outer ring of the positioning ring 2 is matched with the diameter of the objective table of the probe station; the upper surface of the positioning ring 2 is provided with first contraposition scale marks 5 along the radial direction, the upper surface of the metal sucker 7 is provided with second contraposition scale marks 6 along the radial direction, the number of the first contraposition scale marks 5 and the number of the second contraposition scale marks 6 are eight, and the included angle between every two adjacent first contraposition scale marks 5 and the included angle between every two adjacent second contraposition scale marks 6 are 45 degrees; the inner ring of 2 lower surfaces of position circle is equipped with at least one buckle 9, and the 7 lower surfaces of metal sucking disc are equipped with at least one draw-in groove, and the buckle 9 of position circle 2 and the draw-in groove looks adaptation of metal sucking disc 7 when the first counterpoint scale mark 5 of position circle 2 and the second counterpoint scale mark 6 of metal sucking disc 7 correspond, the quantity of draw-in groove is the same with the quantity of buckle 9 on the position circle 2 on the metal sucking disc 7.

In the embodiment, four buckles 9 are arranged on the positioning ring 2, and four clamping grooves are arranged on the metal sucker 7; the positioning film 1 is a transparent blue film made of polyvinyl chloride, the thickness of the positioning film is 0.08mm, positioning holes 3 are formed by laser grooving according to the size of a discrete chip, the blue film is adhered to the upper surface of the metal sucker 7 to play a role in positioning and placing the discrete chip, and second alignment scale marks 6 on the surface of the metal sucker 7 can be seen through the blue film; the metal sucker 7 is a tungsten steel sucker, the flatness of a tungsten steel material can reach within 5 mu m when the thickness is 1.5mm, the requirement of discrete chip testing flatness is met, and the tungsten steel material belongs to metal and has good grounding performance, so that testing indexes can reach a good state when discrete chips are tested.

The utility model provides a during operation of discrete chip adsorbs test fixture, place discrete chip in rather than the discrete chip of looks adaptation adsorbs test fixture locating hole 3 on the locating film 1, place position circle 2 on probe stage objective table surface again, the position of adjustment metal sucking disc 7, make every second counterpoint scale mark 6 of metal sucking disc 7 upper surface align with the first counterpoint scale mark 5 of its corresponding position circle 2 upper surface and when on a straight line, then metal sucking disc 7 has accurately positioned the surface of probe stage objective table, buckle 9 on the position circle 2 and the draw-in groove lock on the metal sucking disc 7 again, position circle 2 and metal sucking disc 7 are fixed each other, make the air duct 8 of metal sucking disc 7 lower surface cover the vacuum hole on the probe stage objective table completely, vacuum passes through the vacuum hole on the probe stage objective table, enter into air duct 8, rethread vacuum suction hole 4 on metal sucking disc 7, guide the vacuum below the discrete chip, the absorption of discrete chip has been realized, the probe that uses the probe of probe stage again tests discrete chip, the discrete chip adsorbs on the metal sucking disc 7, only the chip can not taken place the test chip after the radio frequency probe, the test chip can not taken place the chip, the condition.

Claims (8)

1. A discrete chip adsorption test fixture is arranged on the basis of a probe station and is characterized by comprising a metal sucker and a positioning ring, wherein an air groove is formed in one surface, which is in contact with a probe station objective table, of the metal sucker, the shape of the air groove corresponds to the shape formed by all vacuum holes of the probe station objective table, and the air groove covers all the vacuum holes of the probe station objective table; a plurality of vacuum suction holes penetrating through the upper surface and the lower surface of the metal sucker are formed in the air groove, and the size of each vacuum suction hole is smaller than that of the discrete chip; the surface of the metal sucker, which is not in contact with the objective table of the probe table, is covered with a transparent positioning film, positioning holes which are matched with the discrete chips in size and have the same number as the vacuum suction holes are formed in the positioning film at positions corresponding to the vacuum suction holes of the metal sucker, and the discrete chips are placed in the positioning holes of the positioning film and positioned on the vacuum suction holes on the upper surface of the metal sucker; the metal sucker is sleeved on the inner ring of the positioning ring, the positioning ring and the metal sucker are positioned on the same plane, and the diameter of the outer ring of the positioning ring is matched with the diameter of the objective table of the probe table; the upper surface of the positioning ring is provided with first contraposition scale marks along the radial direction, the upper surface of the metal sucker is provided with second contraposition scale marks along the radial direction, the first contraposition scale marks and the second contraposition scale marks are the same in quantity, and the included angle between the adjacent first contraposition scale marks is the same as the included angle between the adjacent second contraposition scale marks.

2. The discrete chip adsorption test fixture of claim 1, wherein at least one fastener is disposed on an inner ring of a surface of the positioning ring contacting the probe stage, at least one slot is disposed on a surface of the metal chuck contacting the probe stage, the fasteners of the positioning ring are adapted to the slots of the metal chuck when the first alignment scale of the positioning ring and the second alignment scale of the metal chuck correspond to each other, and the number of the slots on the metal chuck is the same as the number of the fasteners on the positioning ring.

3. The discrete chip adsorption test fixture of claim 1 or 2, wherein the first alignment marks and the second alignment marks are eight in number, and an included angle between adjacent first alignment marks and an included angle between adjacent second alignment marks are 45 °.

4. The discrete chip absorption test fixture of claim 1 or 2, wherein the positioning film is a blue film made of polyvinyl chloride, and the blue film is adhered to a surface of the metal chuck not contacting with the stage of the probe stage.

5. The fixture of claim 3, wherein the positioning film is a blue film made of polyvinyl chloride, and the blue film is adhered to a surface of the metal chuck not contacting with the stage of the probe station.

6. The discrete chip absorption test fixture as claimed in any one of claims 1, 2 and 5, wherein the metal chuck is a tungsten steel chuck.

7. The discrete die attachment test fixture of claim 3 wherein the metal chuck is a tungsten steel chuck.

8. The discrete die attachment test fixture of claim 4 wherein the metal chuck is a tungsten steel chuck.

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