CN217305246U

CN217305246U - Wafer test objective table and wafer test equipment

Info

Publication number: CN217305246U
Application number: CN202220340294.2U
Authority: CN
Inventors: 谢世敏
Original assignee: Jingxin Intelligent Equipment Suzhou Co ltd
Current assignee: Jingxin Intelligent Equipment Suzhou Co ltd
Priority date: 2022-02-18
Filing date: 2022-02-18
Publication date: 2022-08-26
Anticipated expiration: 2032-02-18

Abstract

The utility model discloses a wafer test objective table and wafer test equipment, wafer test objective table includes workstation, base, first connector and second connector, the both ends of first connector and second connector are equallyd divide and are connected with workstation, base respectively, the number sum of first connector and second connector is no less than three, first connector and second connector evenly distributed in the base, wherein, first connector sets up to linear electric motor, the second connector sets up to the uide bushing; the wafer test apparatus includes a wafer test stage. The utility model discloses in, go up and down through linear electric motor direct drive workstation, have higher lifting precision and drive response speed, can pinpoint the workstation to corresponding test height, be convenient for visit the test to the wafer, linear electric motor and uide bushing connect in the different positions of workstation to the combination supports the workstation, is favorable to improving the accuracy of wafer test.

Description

Wafer test objective table and wafer test equipment

Technical Field

The utility model relates to a wafer detection technology field especially relates to a wafer test objective table and wafer test equipment.

Background

The chip is integrated in the wafer, for avoiding the chip defective products appearing in subsequent production, improve the production yield, need detect the wafer before the chip uses, in the correlation technique, the wafer is placed on the workstation, wafer test equipment's probe point presses the wafer, detect the wafer, because the position that the wafer was pressed to the probe is uneven, the plane degree of workstation mesa is influenced, influences the prick needle precision of probe, and, the workstation is usually through lead screw or sloping block drive lift, the lift precision of workstation is low, influences the test accuracy of wafer.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a wafer test objective table can improve the lifting precision of workstation and the test accuracy of wafer.

The utility model discloses still provide a wafer test equipment who has above-mentioned wafer test objective table.

According to the utility model discloses a wafer test objective table of first aspect embodiment for wafer test, include:

the workbench is used for placing the wafer;

the base is arranged below the workbench at intervals;

the base is connected with the workbench, the first connecting body and the second connecting body are connected at two ends respectively, the number sum of the first connecting body and the second connecting body is not less than three, the first connecting body and the second connecting body are uniformly distributed on the base, the first connecting body is a linear motor, and the second connecting body is a guide sleeve.

According to the utility model discloses wafer test objective table has following beneficial effect at least:

the embodiment of the utility model provides an in wafer test objective table, go up and down through linear electric motor direct drive workstation, compare in lead screw or sloping block driven mode, higher lifting precision and drive response speed have, can pinpoint the workstation to corresponding test height, the probe of being convenient for is to the test of wafer, and because linear electric motor and uide bushing connect in the different positions of workstation, and the combination supports the workstation, avoid appearing because the workstation pressurized inequality and slope, lead to the phenomenon that the probe can not stabilize the contact with the wafer, thereby be favorable to improving the accuracy of wafer test.

According to some embodiments of the present invention, there are at least three first connecting bodies, the second connecting body is connected to the center of the base, and the first connecting bodies are uniformly distributed on the periphery of the second connecting body; or, the number of the second connecting bodies is at least three, the first connecting bodies are connected to the center of the base, and the second connecting bodies are uniformly distributed on the periphery of the first connecting bodies.

According to the utility model discloses a some embodiments still include the plummer, the workstation is fixed in the plummer top, first connector with the top of second connector with the plummer is connected.

According to some embodiments of the utility model, still include the keysets, the keysets is located the workstation with between the plummer, the second connector with the junction of plummer is located the outside of workstation.

According to some embodiments of the utility model, the second connector is provided with four, first connector connect in the central point of workstation puts.

According to the utility model discloses a some embodiments, the top surface of workstation is provided with a plurality of recesses, the recess is the annular, the recess encircles the setting in proper order, can form the negative pressure and adsorb in the recess the wafer.

According to the utility model discloses a some embodiments, the inside of workstation is provided with a plurality of gas pockets, each recess and at least one the gas pocket intercommunication, the gas pocket be used for to the recess carries the negative pressure.

According to the utility model discloses a some embodiments, the workstation still includes the intercommunication groove, the intercommunication inslot is located the bottom of workstation, the gas pocket with intercommunication groove intercommunication, the intercommunication groove be used for with negative pressure air supply pipeline intercommunication.

According to the utility model discloses a wafer test equipment of second aspect embodiment includes:

the wafer test stage of the first aspect embodiment;

and the detection module comprises a probe, and the probe is used for pressing the wafer so as to detect the wafer.

According to the utility model discloses a some embodiments still include drive arrangement, wafer test objective table with drive arrangement connects, drive arrangement is used for driving wafer test objective table removes or rotates in the horizontal plane.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention will be further described with reference to the following drawings and examples, in which:

FIG. 1 is a schematic diagram of a wafer test stage according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of a wafer test stage according to the present invention;

FIG. 3 is a cross-sectional view of one embodiment of the wafer test stage of FIG. 2;

fig. 4 is an enlarged view of a portion a in fig. 3.

Reference numerals:

the working table 100, the groove 110, the air hole 120 and the communicating groove 130; a base 200; a first connector 300; a second connector 400; a carrier table 500; an interposer 600.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiment of the present invention provides a wafer test stage for testing a wafer, as shown in fig. 1 and fig. 2, the wafer test stage comprises a worktable 100, a base 200, a first connector 300 and a second connector 400, the upper surface of the worktable 100 is used for placing a wafer, the base 200 is arranged below the worktable 100 at intervals, the first connector 300 and the second connector 400 are located between the worktable 100 and the base 200, two ends of the first connector 300 and the second connector 400 are respectively connected with the worktable 100 and the base 200, the number of the first connector 300 and the number of the second connector 400 are at least three, the first connector 300 and the second connector 400 are uniformly connected with the base 200, so that the worktable 100 is supported by the first connector 300 and the second connector 400 together, and the lifting stability of the worktable 100 and the flatness of the upper surface of the worktable 100 can be improved by a multi-point supporting manner, the inclination, sinking, etc. of the stage 100 when being pressed by the probe are reduced.

The above distribution of the first connector 300 and the second connector 400 enables different positions of the worktable 100 to be stably supported, when the wafer is pressed by the probe, different areas of the worktable 100 are supported by the first connector 300 or the second connector 400, and the defects that the flatness of the worktable 100 is affected due to the inclination of the worktable 100 caused by the uneven pressing positions of the probe are overcome, so that the whole worktable 100 is maintained at the same height, and the improvement of the test accuracy of the wafer is facilitated.

In addition, in this embodiment, one of the first connecting body 300 and the second connecting body 400 is provided as a linear motor, and the other is provided as a guide sleeve, the linear motor is used for driving the workbench 100 to vertically ascend and descend so as to match with the detection height of the probe, the guide sleeve extends in the vertical direction and is used for guiding the ascending and descending of the workbench 100, and the ascending and descending smoothness of the workbench 100 is improved.

It should be noted that the first connecting body 300 and the second connecting body 400 may be enclosed to form a circle, and the intervals between the adjacent connecting bodies are the same, or may be enclosed to form other shapes, such as a rectangle, a polygon, etc., or both of them are distributed in a divergent manner, so that the center and the edge of the workbench 100 are both supported, for example, one connecting body is arranged at the center of the base, and the other connecting bodies are enclosed to the periphery of the connecting body.

Specifically, as shown in fig. 1, at least three first connection bodies 300 are provided, the second connection bodies 400 are connected to the center of the base, the first connection bodies 300 are disposed around the second connection bodies 400, and the plurality of second connection bodies 400 are uniformly distributed on the periphery of the first connection bodies 300. As shown in fig. 1, the first connecting body 300 is a linear motor, the second connecting body 400 is a guide sleeve, the guide sleeve ring is arranged on the periphery of the linear motor, the linear motor drives the workbench 100 to ascend and descend, the guide sleeve is distributed on the outer side of the linear motor, and through the guide of the guide sleeve, different parts of the workbench 100 synchronously ascend and descend, so that the surface of the workbench 100 is guaranteed to have good flatness.

Alternatively, the number of the second connectors 400 is at least three, the first connectors 300 are connected to the center of the base, the second connectors 400 are arranged around the first connectors 300, and the plurality of first connectors 300 are uniformly distributed on the periphery of the second connectors 400. As shown in fig. 2, the first connector 300 is a guide sleeve, the second connector 400 is a linear motor, the linear motors are annularly disposed on the periphery of the guide sleeve, and the plurality of linear motors synchronously drive the work table 100 to synchronously lift different positions of the work table 100, so that the lift of the work table 100 is guided by the guide sleeve, thereby improving the stability of the lift of the work table 100.

Therefore, the embodiment of the utility model provides a wafer test objective table, go up and down through linear electric motor direct drive workstation 100, compare in lead screw or sloping block driven mode, higher lifting accuracy and drive response speed have, can pinpoint workstation 100 to corresponding test height, the probe of being convenient for is to the test of wafer, and because linear electric motor and uide bushing connect in the different positions of workstation 100, and the combination supports workstation 100, avoid appearing because workstation 100 pressurized inequality and slope, lead to the probe can not with the phenomenon of wafer steady contact, thereby be favorable to improving the accuracy of wafer test.

It should be noted that the upper surface of the worktable 100 should have a better flatness, and the worktable 100 should be made of a material with better rigidity, so as to avoid the influence on the flatness of the worktable 100 caused by the depression when being pressed by the probe; alternatively, a surface layer with good rigidity is attached to the upper surface of the table 100, and the surface layer is used for contacting with the wafer and has the characteristic of being not easy to dent under compression.

In one embodiment, the linear motor may be a voice coil motor, and the voice coil motor has the characteristics of small size, short stroke and high positioning accuracy, is suitable for the lifting driving of the workbench 100, and can improve the lifting accuracy of the workbench 100. The ball sliding sleeve can be selected for use to the uide bushing, and the ball sliding sleeve has good wearability, mechanical efficiency height, can set up the spring in the ball sliding sleeve, and the spring is used for the impact that buffering workstation 100 goes up and down, makes workstation 100's removal more steady.

In addition, at least three second connecting bodies 400 are provided, and the three second connecting bodies 400 can support the workbench 100 on one plane, which is beneficial to improving the flatness of the workbench 100; in one embodiment, as shown in fig. 1, four second connection bodies 400 are disposed, the four second connection bodies 400 are uniformly distributed at four corners, and the first connection body 300 is connected to the central position of the workbench 100, so that the supporting strength and the supporting position density of the workbench 100 by the first connection body 300 and the second connection body 400 are improved, and different areas of the workbench 100 are maintained at the same height. Of course, other numbers of the second connection units 400 may be selected to further improve the flatness of the table 100 after being lifted.

As shown in fig. 1, the wafer test stage further includes a susceptor 500, the stage 100 is fixed on the top of the susceptor 500, and the top ends of the first connector 300 and the second connector 400 are connected to the susceptor 500; the bearing table 500 is used for connecting the first connecting body 300 and the second connecting body 400, the lower ends of the first connecting body 300 and the second connecting body 400 can be locked on the base 200 through a threaded fastener, or fixed on the upper surface of the base 200 through welding and bonding, similarly, the upper ends of the first connecting body 300 and the second connecting body 400 can be fixed on the bottom of the bearing table 500 through threaded connection, welding and bonding, and the workbench 100 can be lifted along with the lifting of the bearing table 500.

Through setting up plummer 500, can avoid first connector 300 and second connector 400 directly to be connected with workstation 100, prevent the influence of too much connecting piece installation, reduce the structural strength and the plane degree of workstation 100.

Further, the wafer test stage further comprises an adapter plate 600, the adapter plate 600 is located between the workbench 100 and the carrier table 500, the adapter plate 600 is used for connecting the workbench 100 and the carrier table 500, and the adapter plate 600 can be connected with the workbench 100 and the carrier table 500 in a threaded fastening manner; through setting up keysets 600, be convenient for distribute with the adapting unit of plummer 500 to and with the adapting unit's of workstation 100 position, avoid plummer 500 directly to be connected with workstation 100, cause the interference between the adapting unit, and can improve the holistic structural strength of objective table.

The adapter plate 600 may be contoured to conform to the platen 100 to provide a smooth finish to the entire platen, and in one embodiment, the adapter plate 600 and platen 100 are cylindrical to match the shape of the wafer. The area of plummer 500 upper surface sets up to be greater than the area of keysets 600 and workstation 100 upper surface, and in one embodiment, plummer 500 sets up to the quadrangular prism, and the junction of second connector 400 and plummer 500 is located the outside of workstation 100, has increased the distance between first connector 300 and the second connector 400, and first connector 300 and second connector 400 increase the support range of workstation 100, are favorable to improving the plane degree after workstation 100 goes up and down.

In order to stably place the wafer on the surface of the worktable 100 and prevent the wafer from deviating and affecting the pressing precision of the probe, in an embodiment, with reference to fig. 1 and 3, a plurality of grooves 110 are disposed on the top surface of the worktable 100, the grooves 110 are annular, the grooves 110 are sequentially arranged in a surrounding manner, the grooves 110 are spaced apart and nested with each other, so as to improve the contact uniformity between the wafer and the grooves 110, and a negative pressure can be formed in the grooves 110, and is used for adsorbing the wafer, so that the wafer is stably placed on the upper surface of the worktable 100.

It should be noted that the negative pressure formed in the annular groove 110 can adsorb the wafer in the entire circumferential direction of the wafer, and different grooves 110 are arranged at intervals along the radial direction of the worktable 100, so that different positions of the wafer are adsorbed by the negative pressure in the grooves 110, thereby ensuring the adsorption strength of the worktable 100 to the wafer.

In addition, a plurality of air holes 120 are formed in the workbench 100, each groove 110 is communicated with at least one air hole 120, the air holes 120 are used for conveying negative pressure to the groove 110, and a negative pressure air source provides negative pressure to the groove 110 through the air holes 120. In addition, a communicating groove 130 may be disposed at the bottom of the working table 100, the communicating groove 130 is used for communicating one end of the air hole 120 away from the groove 110, the air holes 120 are simultaneously communicated with the communicating groove 130, the communicating groove 130 is communicated with the negative pressure air source pipeline, the negative pressure air source may simultaneously form negative pressure in the air holes 120 through the communicating groove 130, and the efficiency of forming negative pressure in the groove 110 is improved.

The utility model discloses in still provide a wafer test preparation, including foretell wafer test objective table, still include detection module, detection module includes the probe and is used for driving the manipulator that the probe removed, and the manipulator drives the probe and removes to the corresponding detection position of wafer, makes the probe press the wafer and detect the wafer. The robot may consist of a multi-axis mechanical module that enables the probe to move or rotate in different directions.

In addition, the wafer test equipment also comprises a driving device, the wafer test object stage is carried on the driving device, and the driving device is used for driving the wafer test object stage to move or rotate in the horizontal plane, for example, the wafer test object stage moves along the X axis and the Y axis respectively, or rotates around the Z axis, and the wafer synchronously rotates or moves along with the object stage so as to change the test position of the wafer, so that the probe can comprehensively detect the wafer. It should be noted that the driving device should include an X-axis driving module, a Y-axis driving module and an R-axis driving module to respectively drive the stage to move along the X-axis and the Y-axis and rotate around the Z-axis.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims

1. Wafer test objective table for wafer test, its characterized in that includes:

the workbench is used for placing the wafer;

the base is arranged below the workbench at intervals;

the base is connected with the workbench and the two ends of the first connecting body, the number of the first connecting body and the number of the second connecting body are not less than three, the first connecting body and the second connecting body are uniformly distributed on the base, the first connecting body is a linear motor, and the second connecting body is a guide sleeve.

2. The wafer test stage of claim 1, wherein there are at least three first connectors, the second connector is connected to the center of the base, and the first connectors are evenly distributed around the periphery of the second connector; or the number of the second connecting bodies is at least three, the first connecting bodies are connected to the center of the base, and the second connecting bodies are uniformly distributed on the periphery of the first connecting bodies.

3. The wafer test stage of claim 1, further comprising a susceptor, wherein the stage is fixed to a top of the susceptor, and wherein top ends of the first and second connectors are connected to the susceptor.

4. The wafer test stage of claim 3, further comprising an adapter plate positioned between the stage and the susceptor, wherein a connection of the second connector to the susceptor is positioned outside the stage.

5. The wafer test stage of claim 1, wherein there are four second connectors, and wherein the first connector is attached to a central portion of the stage.

6. The wafer test stage according to any one of claims 1 to 5, wherein the top surface of the stage is provided with a plurality of annular grooves, the grooves are sequentially arranged around the stage, and a negative pressure can be formed in the grooves to attract the wafer.

7. The wafer test stage of claim 6, wherein a plurality of air holes are disposed in the interior of the stage, each of the grooves being in communication with at least one of the air holes, the air holes being configured to deliver negative pressure to the grooves.

8. The wafer test stage of claim 7, wherein the stage further comprises a communication groove located at a bottom of the stage, the air hole is in communication with the communication groove, and the communication groove is configured to communicate with a negative pressure air source pipeline.

9. Wafer test equipment, its characterized in that includes:

the wafer test stage of any one of claims 1 to 8;

10. The wafer test apparatus as claimed in claim 9, further comprising a driving device, wherein the wafer test stage is connected to the driving device, and the driving device is configured to move or rotate the wafer test stage in a horizontal plane.