CN219342332U

CN219342332U - Carrier for electroplating photovoltaic cell

Info

Publication number: CN219342332U
Application number: CN202320826739.2U
Authority: CN
Inventors: 胡磊; 施利君; 屠金玲; 蒋新
Original assignee: Suzhou Kzone Equipment Technology Co Ltd
Current assignee: Suzhou Kzone Equipment Technology Co Ltd
Priority date: 2023-04-14
Filing date: 2023-04-14
Publication date: 2023-07-14
Anticipated expiration: 2033-04-14

Abstract

The utility model relates to the technical field of photovoltaic cell electroplating and discloses a carrier for photovoltaic cell electroplating, which comprises a shielding plate, wherein the shielding plate is attached to a plate to be plated and used for shielding the edge part of a non-plating surface of the plate to be plated, the length and the width of the shielding plate are respectively larger than or equal to those of the plate to be plated, the shielding plate has a thickness, and the middle part of the shielding plate is provided with a through hole exposing the non-plating surface of the plate to be plated. According to the carrier for electroplating the photovoltaic battery, the shielding plate capable of shielding the edge of the non-plating surface is attached to the non-plating surface of the plate to be plated, when the roller is used for coating the plating surface, the shielding plate can be used for separating electroplating liquid which turns upwards or splashes onto the non-plating surface, so that the non-plating surface is prevented from being polluted, the situation that the plate to be plated is subjected to deplating is reduced, the yield is guaranteed, and the conveying speed of the plate to be plated is improved, so that the requirement of mass production capacity is met.

Description

Carrier for electroplating photovoltaic cell

Technical Field

The utility model relates to the technical field of photovoltaic cell electroplating, in particular to a carrier for photovoltaic cell electroplating.

Background

At present, the technology of screen printing silver paste is mainly adopted in industry to prepare a grid line electrode, and then organic matters in the rapid sintering silver paste are volatilized, and silver is solidified to form a metal electrode. The process method is simple and mature, and is applied in large scale. However, silver used in the process belongs to noble metals and has limited reserves, and along with further expansion of the solar energy market, silver cannot meet the market demand.

In order to reduce the silver consumption, mainly adopting a steel plate printing and laser transfer printing method from the equipment perspective; from the process perspective, silver-coated copper slurry is adopted to replace silver slurry, so that the consumption of silver is reduced, and the problem that the limited silver reserve cannot meet the market demand still cannot be solved. Copper, which has a conductivity close to that of silver, is a good candidate for replacing silver. However, copper slurry is limited in use because copper has a high melting point, is easily oxidized, and the formed copper oxide cannot be decomposed by high temperature. Therefore, another process route for preparing the copper grid line is an electroplating copper scheme, and the copper grid line with better crystallization performance can be prepared by adopting an electroplating process, so that the resistivity of the grid line is reduced, the shielding area of the grid line is reduced, and the copper grid line has a higher application prospect.

In the process of copper electroplating, electroplating equipment is needed to be used for implementation, the conventional electroplating equipment is selected from a vertical type electroplating mode and a horizontal type electroplating mode, namely an upper-connection and lower-plating mode is mainly adopted, namely electroplating liquid is adhered by a roller and then coated on a plating surface of a battery piece, but in the coating process, the electroplating liquid is easily brought to a non-plating surface of the battery piece, so that an upper electrode is corroded, the battery piece is subjected to a deplating phenomenon, and a product is poor; in addition, the problem of liquid carrying of the roller is less in liquid turning under the slow condition, and liquid turning is increased under the fast condition, so that the productivity of the equipment is limited. Therefore, there is a need to design a carrier for photovoltaic cells to improve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a carrier for electroplating a photovoltaic cell, which solves the problems that when an electroplating solution is brought to the plating surface of a cell by a roller, the roller turns over the solution to the non-plating surface of the cell, so that poor products appear, the moving speed of the roller is limited, and the productivity of equipment is limited.

To achieve the purpose, the utility model adopts the following technical scheme:

the carrier for photovoltaic cell electroplating provided by the utility model comprises:

the shielding plate is attached to the plate to be plated and used for shielding the edge part of the non-plating surface of the plate to be plated, the length and the width of the shielding plate are respectively larger than or equal to those of the plate to be plated, the shielding plate has a thickness, and a through hole exposing the non-plating surface of the plate to be plated is formed in the middle part of the shielding plate.

As a preferred embodiment of the carrier for electroplating the photovoltaic cell, the shielding plate is made of a hydrophobic material.

As a preferable mode of the carrier for photovoltaic cell electroplating, the shielding plate is made of silicon rubber.

As a preferable scheme of the carrier for photovoltaic cell electroplating, the shape of the shielding plate is matched with the shape of the plate to be plated.

As a preferable mode of the carrier for photovoltaic cell electroplating, the shielding plate is of a frame-shaped structure.

As a preferable scheme of the carrier for photovoltaic cell electroplating, the shielding plate is attached to the other surface of the plate to be plated, and a water blocking plate is arranged on the other surface of the plate to be plated, and the shape of the water blocking plate is matched with that of the shielding plate.

As a preferable scheme of the carrier for photovoltaic cell electroplating, the inner diameter of the water blocking plate is larger than the inner diameter of the shielding plate, and the outer diameter of the water blocking plate is smaller than the outer diameter of the shielding plate.

As a preferable scheme of the carrier for photovoltaic cell electroplating, the thickness of the water blocking plate is 3mm-30mm.

As a preferable scheme of the carrier for photovoltaic cell electroplating, the thickness of the shielding plate is 1mm-10mm.

As a preferred embodiment of the carrier for photovoltaic cell plating, the frame inner portion of the shielding plate is used for arranging brushes contacting with the non-plating surface of the plate to be plated.

The utility model has the beneficial effects that:

according to the carrier for photovoltaic cell electroplating, the shielding plate capable of shielding the edge of the non-plating surface is attached to the non-plating surface of the plate to be plated, and when the roller is used for coating the plating surface, the shielding plate can separate the electroplating liquid which is turned up or splashed onto the non-plating surface, so that the non-plating surface is ensured not to be polluted, the situation that the plate to be plated is subjected to deplating is reduced, the yield is ensured, and the conveying speed of the plate to be plated is improved, so that the requirement of mass production capacity is met.

Drawings

FIG. 1 is a top view of a carrier for photovoltaic cell electroplating in accordance with an embodiment of the present utility model;

fig. 2 is a cross-sectional view taken along line A-A of fig. 1.

In the figure:

100. a plate to be plated; 200. a brush;

1. a shielding plate; 11. a through hole; 2. and a water-blocking plate.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

In the process of copper electroplating, electroplating equipment is needed to be used for implementation, the conventional electroplating equipment is selected from a vertical type electroplating mode and a horizontal type electroplating mode, namely an upper-connection and lower-plating mode is mainly adopted, namely electroplating liquid is adhered by a roller and then coated on a plating surface of a battery piece, but in the coating process, the electroplating liquid is easily brought to a non-plating surface of the battery piece, so that an upper electrode is corroded, the battery piece is subjected to a deplating phenomenon, and a product is poor; in addition, the problem of liquid carrying of the roller is less in liquid turning under the slow condition, and liquid turning is increased under the fast condition, so that the productivity of the equipment is limited.

In order to solve the above-mentioned problems, as shown in fig. 1-2, the present embodiment provides a carrier for electroplating a photovoltaic cell, which includes a shielding plate 1, wherein the shielding plate 1 is attached to an edge portion of a non-plating surface of the to-be-plated plate 100 for shielding the to-be-plated plate 100, and the to-be-plated plate 100 in this embodiment is a cell. The length of the shielding plate 1 is greater than or equal to the length of the plate 100 to be plated, the width of the shielding plate 1 is greater than or equal to the width of the plate 100 to be plated, the shielding plate 1 has a thickness, and the middle part of the shielding plate 1 is provided with a through hole 11 exposing the non-plating surface of the plate 100 to be plated.

It can be understood that, by attaching a shielding plate 1 capable of shielding the edge of the non-plating surface on the non-plating surface of the plate 100 to be plated, when the roller coats the plating surface, the shielding plate 1 can separate the electroplating liquid turned up or splashed onto the non-plating surface, so that on one hand, the non-plating surface is ensured not to be polluted, on the other hand, the situation that the plate 100 to be plated is subjected to deplating is reduced, the yield is ensured, and on the other hand, the transmission speed of the plate 100 to be plated is improved, thereby meeting the requirement of mass production capacity.

Optionally, the inside of the frame of the shielding plate 1, that is, the through hole 11 is provided with the electric brush 200 contacting the non-plating surface of the plate 100, when the shielding plate 1 is attached to the plate 100, the electric brush 200 is located in the through hole 11 of the shielding plate 1, and the electric brush 200 and the plate 100 move synchronously along the horizontal direction, so that friction between the electric brush 200 and the non-plating surface of the plate 100 is avoided, and the power connection is more stable.

Preferably, as shown in fig. 1, the shielding plate 1 is made of a hydrophobic material, the contact angle of the hydrophobic material to water is larger than 90 degrees, and cohesion between water molecules is larger than attraction between molecules on the surface of the material, so that the material has the characteristic that the surface of the material is not soaked by water, and the plating solution reaches the surface of the shielding plate 1 and is not soaked and absorbed, thereby having a good effect of shielding the plating solution. The specific hydrophobic material is silicon rubber, the silicon rubber has good hydrophobicity and good flexibility, can be tightly attached to the plate 100 to be plated when the shielding plate 1 is pressed on the surface of the plate 100 to be plated, and is not easy to crush the plate 100 to be plated.

Further, the shape of the shielding plate 1 is matched with the shape of the plate 100 to be plated, the plate 100 to be plated and the shielding plate 1 in this embodiment are rectangular, and other embodiments may be round, oval, rectangular with processed edges, and other shapes, which are not limited in that shielding of the non-plating surface can be achieved. The specific shielding plate 1 is in a frame-shaped structure, namely a rectangular frame (see fig. 2), the thickness of the shielding plate 1 is 1mm-10mm, the whole weight is light, and the pressing force of the plate to be plated 100 is small.

In order to further improve the shielding effect of the shielding plate 1 on the upturned electroplating solution, as shown in fig. 2, a water blocking plate 2 is arranged on the other surface of the shielding plate 1, which is attached to the plate 100 to be plated, the shape of the water blocking plate 2 is matched with that of the shielding plate 1, namely, a rectangular frame, the inner diameter of the water blocking plate 2 is larger than that of the shielding plate 1, the outer diameter of the water blocking plate 2 is smaller than that of the shielding plate 1, and the thickness of the water blocking plate 2 is 3-30 mm, so that the overall thickness of the carrier is increased, and the effect of shielding the electroplating solution is better. The upward turned electroplating liquid can be blocked by the shielding plate 1 facing one surface of the plate 100 to be plated, the periphery of the shielding plate 1 and the periphery of the water blocking plate 2, and the upward turned electroplating liquid is prevented from sinking to the non-plating surface after being upward turned through the through holes 11, so that the electric connection of the electric brush 200 is not influenced.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. The carrier for photovoltaic cell electroplating is characterized by comprising:

the shielding plate (1), shielding plate (1) is attached on waiting to plate (100) for shelter from waiting to plate the marginal portion of the non-face of plating of plate (100), the length and the width of shielding plate (1) are greater than or equal to respectively waiting to plate the length and the width of plate (100), shielding plate (1) has thickness, the mid portion of shielding plate (1) is provided with exposes wait to plate the through-hole (11) of the non-face of plating of plate (100).

2. The carrier for electroplating of photovoltaic cells according to claim 1, characterized in that said shielding plate (1) is made of a hydrophobic material.

3. The carrier for photovoltaic cell plating according to claim 2, characterized in that the shielding plate (1) is of silicone rubber.

4. The carrier for photovoltaic cell plating according to claim 1, characterized in that the shape of the shielding plate (1) matches the shape of the plate (100) to be plated.

5. The carrier for photovoltaic cell plating according to claim 4, characterized in that the shielding plate (1) is of frame-like structure.

6. The carrier for photovoltaic cell plating according to any one of claims 1 to 5, characterized in that a water blocking plate (2) is provided on the other surface of the shielding plate (1) attached to the board to be plated (100), and the shape of the water blocking plate (2) matches the shape of the shielding plate (1).

7. The carrier for photovoltaic cell plating according to claim 6, characterized in that the inner diameter of the water blocking plate (2) is larger than the inner diameter of the shielding plate (1), and the outer diameter of the water blocking plate (2) is smaller than the outer diameter of the shielding plate (1).

8. The carrier for electroplating of photovoltaic cells according to claim 6, characterized in that the thickness of the water-blocking plate (2) is 3-30 mm.

9. The carrier for electroplating of photovoltaic cells according to claim 1, characterized in that the thickness of the shielding plate (1) is 1mm-10mm.

10. The carrier for electroplating of photovoltaic cells according to claim 5, characterized in that the in-frame portion of the shielding plate (1) is used for arranging brushes (200) in contact with the non-plating face of the plate (100) to be plated.