CN219322845U

CN219322845U - Heat dissipation type semiconductor structure

Info

Publication number: CN219322845U
Application number: CN202223314887.0U
Authority: CN
Inventors: 郝军雷
Original assignee: Shenzhen Kuanyue Technology Co ltd
Current assignee: Chu Xiaoneng Technology Shenzhen Co ltd
Priority date: 2022-12-09
Filing date: 2022-12-09
Publication date: 2023-07-07
Anticipated expiration: 2032-12-09

Abstract

The utility model discloses a heat dissipation type semiconductor structure, and relates to the technical field of semiconductors. The utility model provides a heat dissipation type semiconductor structure, includes the semiconductor framework, the top activity joint of semiconductor framework has heat abstractor, heat abstractor includes the heat dissipation shell, the thermovent has been seted up to the side of heat dissipation shell, the outside of thermovent is provided with the dust screen, the inboard of thermovent is provided with the cooling fan. Through setting up dust screen, electric jar structure and cleaning brush, utilize the electric jar structure to promote the cleaning brush through connecting the sliding sleeve and carry out reciprocating motion for the cleaning brush can clear up and strike off the surface dust of heat dissipation net, has avoided the dust to block up the condition of dust screen, makes the ventilation effect of ventilation mouth obtain long-term keeping, has guaranteed the inside and outside air flow of heat dissipation shell, and then helps improving the radiating effect of semiconductor chip, makes semiconductor chip can normal use and has prolonged semiconductor chip's life.

Description

Heat dissipation type semiconductor structure

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a heat dissipation type semiconductor structure.

Background

A semiconductor is a substance having conductivity between an insulator and a conductor, and its conductivity is easily controlled, and it can be used as a material of an element for information processing. Semiconductors are very important from a technological or economic point of view. Many electronic products, such as computers, mobile phones, digital recorders, use the conductivity variations of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential in commercial applications among various semiconductor materials.

In the radiating structure of a power semiconductor device with the patent publication number of CN217426728U, it is proposed that' through arranging a radiator on the semiconductor device, the radiator can absorb heat generated by the semiconductor device during operation, the absorbed heat is radiated out through the radiating fins, and cooling liquid in the radiator can cool the radiator in a water-cooling way, so that the radiator can radiate heat well;

the semiconductor packaging structure with the heat radiation module is provided in the patent publication No. CN216980545U, so that the heat radiation effect inside the equipment is realized, the electric elements inside the equipment are protected, the equipment failure caused by the aging of the electric elements is avoided, and the service life of the equipment in actual use is prolonged;

in the above two comparison documents, the heat generated in the structure is circulated through the ventilation opening by the heat dissipation fan to achieve the heat dissipation effect, but the external dust is attached to the ventilation opening by the way, so that the ventilation effect of the ventilation opening is affected, the heat dissipation effect of the semiconductor chip is greatly reduced, and the normal use and the service life of the semiconductor chip are affected.

Disclosure of Invention

The utility model provides a heat dissipation type semiconductor structure for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat dissipation type semiconductor structure, includes the semiconductor framework, the top activity joint of semiconductor framework has heat abstractor, heat abstractor includes the radiating shell, the thermovent has been seted up to the side of radiating shell, the outside of thermovent is provided with the dust screen, the inboard of thermovent is provided with the cooling fan, the spout has been seted up in the outside of radiating shell, the inner wall of spout is provided with the electric jar structure, the expansion end sliding connection of electric jar structure has the connection sliding sleeve, the other end of connection sliding sleeve extends to the outside of spout and is provided with the clearance brush, the clearance brush is located the front side of dust screen.

Further, the semiconductor framework comprises a circuit board, a semiconductor chip is placed at the top of the circuit board, a lock catch is rotatably connected to the top of the circuit board, and the semiconductor chip is movably clamped with the top of the circuit board through the lock catch.

Further, a heat sink is adhered to the top end of the semiconductor chip through heat dissipation silicone grease, and the heat sink is positioned behind the heat dissipation port.

Further, a recovery port is formed in the bottom of the heat dissipation port, a recovery box is lapped on the side face of the heat dissipation shell, and the heat dissipation port is communicated with the recovery box through the recovery port.

Further, the screw hole is offered to the side of cleaning brush, the one end that keeps away from the electric jar structure of connection sliding sleeve is provided with the screw thread, cleaning brush and the end threaded connection who connects the sliding sleeve.

Compared with the prior art, the utility model provides a heat dissipation type semiconductor structure, which comprises the following components

The beneficial effects are that:

this heat dissipation type semiconductor structure through setting up dust screen, electric jar structure and cleaning brush, utilizes the electric jar structure to promote the cleaning brush through connecting the sliding sleeve and carries out reciprocating motion for the cleaning brush can clear up and strike off the surface dust of heat dissipation net, has avoided the dust to block up the condition of dust screen, makes the ventilation effect of scavenge port obtain long-term keeping, has guaranteed the inside and outside air flow of heat dissipation shell, and then helps improving the radiating effect of semiconductor chip, makes semiconductor chip can normal use and has prolonged the life of semiconductor chip.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a semiconductor structure according to the present utility model;

FIG. 3 is a schematic diagram of a heat dissipating device according to the present utility model;

fig. 4 is a schematic diagram of a chute structure according to the present utility model.

In the figure: 1. a semiconductor structure; 2. a heat sink; 3. a circuit board; 4. locking; 5. a semiconductor chip; 6. a heat sink; 7. a heat dissipation shell; 8. a heat radiation port; 9. a dust screen; 10. a recovery box; 11. a chute; 12. an electric cylinder structure; 13. the sliding sleeve is connected; 14. and (5) cleaning the brush.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the utility model discloses a heat dissipation type semiconductor structure, which comprises a semiconductor structure 1, wherein a heat dissipation device 2 is movably clamped at the top of the semiconductor structure 1.

The semiconductor framework 1 comprises a circuit board 3, a semiconductor chip 5 is placed at the top of the circuit board 3, a lock catch 4 is rotatably connected to the top of the circuit board 3, and the semiconductor chip 5 is movably clamped with the top of the circuit board 3 through the lock catch 4.

The heat dissipation device 2 comprises a heat dissipation shell 7, the side of heat dissipation shell 7 has been seted up and has been had the heat dissipation mouth 8, the outside of heat dissipation mouth 8 is provided with dust screen 9, the inboard of heat dissipation mouth 8 is provided with the cooling fan, spout 11 has been seted up in the outside of heat dissipation shell 7, the inner wall of spout 11 is provided with electric jar structure 12, the expansion end sliding connection of electric jar structure 12 has a connection sliding sleeve 13, the other end of connection sliding sleeve 13 extends to the outside of spout 11 and is provided with cleaning brush 14, cleaning brush 14 is located the front side of dust screen 9, through setting up dust screen 9, electric jar structure 12 and cleaning brush 14, utilizes electric jar structure 12 to promote cleaning brush 14 to carry out reciprocating motion through connecting sliding sleeve 13 for cleaning brush 14 can clear up and strike off the surface dust of heat dissipation screen, has avoided the dust to jam dust screen 9's the condition, makes the ventilation effect of changing the gas port keep for a long-term, has guaranteed the inside and outside air flow of heat dissipation shell 7, and then helps improving the effect of semiconductor chip 5, makes semiconductor chip 5 can use and prolong the life of semiconductor chip 5 normally.

Specifically, the top end of the semiconductor chip 5 is adhered with a heat sink 6 through heat dissipation silicone grease, and the heat sink 6 is positioned behind the heat dissipation port 8.

In the present embodiment, heat transfer efficiency can be improved by applying heat conductive silicone grease between the semiconductor chip 5 and the heat sink 6.

Specifically, the bottom of thermovent 8 has seted up the recovery mouth, the side overlap joint of thermovent shell 7 has recovery box 10, thermovent 8 is linked together with recovery box 10 through the recovery mouth.

In this embodiment, the cleaned dust falls into the recovery box 10 through the recovery port and waits for the worker to recover.

Specifically, the side of cleaning brush 14 has seted up the screw, the one end that keeps away from electric jar structure 12 of connection sliding sleeve 13 is provided with the screw thread, cleaning brush 14 and the end threaded connection of connection sliding sleeve 13.

In this embodiment, the cleaning brush 14 is made to be quickly detachable by screw connection.

When the heat radiator is used for a long time, a large amount of dust is attached to the heat radiating net after the heat radiator 2 is used for a long time, the electric cylinder structure 12 is started at the moment, the movable end of the electric cylinder structure 12 drives the cleaning brush 14 to slide horizontally in a reciprocating mode through the connecting sliding sleeve 13, the cleaning brush 14 cleans the dust screen 9, and dust attached to the dust screen 9 is cleaned;

the bottom of the heat dissipation port 8 is provided with a recovery port, so that cleaned dust can fall into the recovery box 10 through the recovery port and wait for the recovery of staff.

To sum up, this heat dissipation type semiconductor structure, through setting up dust screen 9, electric jar structure 12 and cleaning brush 14, utilize electric jar structure 12 to promote cleaning brush 14 through connecting sliding sleeve 13 and carry out reciprocating motion, make cleaning brush 14 clear up and strike off the surface dust of heat dissipation net, avoided the dust to block up dust screen 9's condition, make the ventilation effect of scavenge port obtain long-term keeping, the inside and outside air flow of heat dissipation shell 7 has been guaranteed, and then help improving the radiating effect of semiconductor chip 5, make semiconductor chip 5 can normal use and prolonged the life of semiconductor chip 5.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat-dissipating semiconductor structure comprising a semiconductor structure (1), characterized in that: the top activity joint of semiconductor framework (1) has heat abstractor (2), heat abstractor (2) are including heat dissipation shell (7), thermovent (8) have been seted up to the side of heat dissipation shell (7), the outside of thermovent (8) is provided with dust screen (9), the inboard of thermovent (8) is provided with cooling fan, spout (11) have been seted up in the outside of heat dissipation shell (7), the inner wall of spout (11) is provided with electric jar structure (12), the expansion end sliding connection of electric jar structure (12) has connection sliding sleeve (13), the other end of connection sliding sleeve (13) extends to the outside of spout (11) and is provided with cleaning brush (14), cleaning brush (14) are located the front side of dust screen (9).

2. The heat-dissipating semiconductor structure of claim 1, wherein: the semiconductor framework (1) comprises a circuit board (3), a semiconductor chip (5) is placed at the top of the circuit board (3), a lock catch (4) is rotatably connected to the top of the circuit board (3), and the semiconductor chip (5) is movably clamped with the top of the circuit board (3) through the lock catch (4).

3. The heat-dissipating semiconductor structure of claim 2, wherein: the top end of the semiconductor chip (5) is adhered with a radiating fin (6) through heat dissipation silicone grease, and the radiating fin (6) is positioned behind the radiating opening (8).

4. The heat-dissipating semiconductor structure of claim 1, wherein: the bottom of the heat dissipation opening (8) is provided with a recovery opening, the side surface of the heat dissipation shell (7) is lapped with a recovery box (10), and the heat dissipation opening (8) is communicated with the recovery box (10) through the recovery opening.

5. The heat-dissipating semiconductor structure of claim 1, wherein: screw holes are formed in the side faces of the cleaning brushes (14), threads are formed in one ends, far away from the electric cylinder structures (12), of the connecting sliding sleeve (13), and the cleaning brushes (14) are in threaded connection with the end heads of the connecting sliding sleeve (13).