CN219303638U

CN219303638U - Baffle structure of wafer carrier

Info

Publication number: CN219303638U
Application number: CN202223494984.2U
Authority: CN
Inventors: 桑康; 陈龙保; 程实然; 耿斌; 高强; 王铖熠; 胡冬冬; 许开东
Original assignee: Jiangsu Leuven Instruments Co Ltd
Current assignee: Jiangsu Leuven Instruments Co Ltd
Priority date: 2022-12-27
Filing date: 2022-12-27
Publication date: 2023-07-04
Anticipated expiration: 2032-12-27

Abstract

The utility model discloses a baffle plate structure of a wafer carrier, which comprises a wafer carrier substrate, a wafer carrier and an electrode baffle plate mechanism, wherein the electrode baffle plate mechanism comprises a driving mechanism and a baffle plate; the power output end of the driving mechanism is connected with a baffle connecting block through a connecting rod chute mechanism, the baffle is connected with the upper end of the lifting guide mechanism through a baffle connecting block, and the baffle connecting block is rotatably arranged relative to the upper end of the lifting guide mechanism; under the power drive of the driving mechanism, the baffle connecting block drives the baffle to open and sink relative to the lifting guide mechanism through the synergistic effect of the lifting guide mechanism and the connecting rod chute mechanism until the baffle is at a preset position or rises and folds until the baffle is covered on the wafer carrying platform. Therefore, compared with other baffle structures, the utility model reduces the occupied space of the whole structure of the whole wafer carrier, thereby reducing the manufacturing cost of the whole chamber, and has low cost, simple, stable and reliable structure by using the lifting cylinder structure.

Description

Baffle structure of wafer carrier

Technical Field

The present utility model relates to the field of semiconductor device and chip fabrication. In particular to a baffle structure of a wafer carrier.

Background

Etching and deposition are very common and important processes among many processes in the previous manufacturing processes of semiconductor devices, chips, and the like. Among all etching and deposition processes, ion Beam Etching (IBE) and Ion Beam Deposition (IBD) processes are the most common and increasingly important processes, particularly as the chip integration level increases, the critical dimensions shrink, the process requirements for high selectivity and accurate pattern transfer increase, and the advantages of ion beam etching and ion beam deposition are more pronounced.

Ion Beam Etching (IBE) is to bombard the surface of material with ions of a certain energy to sputter material atoms, so as to achieve the purpose of etching, to charge inert gases such as Ar, kr or Xe into an ion source discharge chamber and ionize the ions to form plasma, to lead out ions in a beam shape by a grid and accelerate the ions, to enter a working chamber, to strike solid surface atoms towards the solid surface to sputter the material atoms, so as to achieve the purpose of etching, and belongs to a pure physical process. Ion Beam Deposition (IBD), which is a vapor deposition method, uses an ion source to ionize a material used for deposition, and irradiates the surface of a workpiece (substrate) to deposit a film layer under the action of an electric field, so as to change the surface properties of the workpiece. The ion source and the wafer carrier serve as core components in the process, but in the vacuum coating process, the ion source is easily affected by a target material, so that the wafer carrier is polluted, and the coating quality is affected. The conventional wafer carrier needs to be disassembled periodically to perform the procedures of cleaning, surface polishing treatment, secondary cleaning and the like, and finally is reassembled, but the conventional wafer carrier is time-consuming, labor-consuming and production efficiency-affecting, and has a certain damage to the core part of the wafer carrier, and the service effect and service life of the wafer carrier can be affected after a long time, so that a baffle is usually arranged on the upper surfaces of the electrode and the wafer. Baffle plate function: the wafer carrier can prevent the damage of ion beam current to the wafer, unnecessary particles are not generated by the bombardment of the ion beam, the vacuum environment is polluted, the use effect of the wafer carrier is enhanced, and the service life is prolonged.

The baffle device in the prior art utilizes motor drive to drive the baffle to rotate so as to realize shielding between the electrode and the upper surface of the wafer, namely, a motor shaft is connected with a coupler, the coupler is in butt joint with a magnetic fluid shaft, the magnetic fluid shaft has the function of isolating the electrode driving part of the baffle, the baffle is positioned in a vacuum environment, and the electrode drive is positioned in an atmosphere environment. The electrode baffle plate of the device can only realize functions through rotation, and occupies large space in the working process, so that the volume of the whole process chamber is increased, and the cost of a motor and magnetic fluid is high, thereby influencing the process effect and increasing the manufacturing cost.

Disclosure of Invention

In order to solve the problems in the use, the utility model provides the baffle structure of the wafer carrier, so that the occupied space of the whole structure of the wafer carrier is reduced, the manufacturing cost of the whole cavity is reduced, and the structure cost of using the lifting cylinder is low, and the structure is simple, stable and reliable.

In order to achieve the technical purpose, the utility model adopts the following technical scheme:

the baffle plate structure of the wafer carrier comprises a wafer carrier substrate, a wafer carrier and an electrode baffle plate mechanism, wherein the wafer carrier and the electrode baffle plate mechanism are respectively arranged on the wafer carrier substrate, the electrode baffle plate mechanism comprises a driving mechanism and a baffle plate connected with a power output end of the driving mechanism, and the driving mechanism is a linear reciprocating driving mechanism; the power output end of the driving mechanism is connected with the baffle connecting block through the connecting rod chute mechanism, the baffle is connected with the upper end of the lifting guide mechanism through the baffle connecting block, and the baffle connecting block is rotatably arranged relative to the upper end of the lifting guide mechanism;

under the power drive of the driving mechanism, the baffle connecting block drives the baffle to open and sink relative to the lifting guide mechanism through the synergistic effect of the lifting guide mechanism and the connecting rod chute mechanism until the baffle is at a preset position or rises and folds until the baffle is covered on the wafer carrying platform.

Preferably, the lifting mechanism comprises a lifting shaft and a corrugated pipe; the upper end of the corrugated pipe is connected with the baffle connecting block in a positioning way through the lifting shaft, and the lower end of the corrugated pipe is supported through the connecting fixing seat; the connection fixing seat is arranged below the wafer carrying platform substrate and can be arranged in a lifting manner relative to the wafer carrying platform substrate.

Preferably, a connecting support is arranged at the upper end of the lifting shaft; the end part of the baffle connecting block is arranged in the connecting support and is in positioning connection with the connecting support through a pin shaft.

Preferably, the connecting rod sliding chute mechanism comprises a sliding fixed shaft and a sliding chute; the chute is arranged on the baffle connecting block, the sliding shaft sleeves are assembled on two sides of the upper end of the sliding fixed shaft, the part of the upper end of the sliding fixed shaft between the sliding shaft sleeves on two sides is movably arranged in the chute, and the lower end of the sliding fixed shaft is connected with the power output end of the driving mechanism.

Preferably, the sliding groove is an arc groove.

Preferably, the fixed part of the driving mechanism is mounted on the connection fixing base.

Preferably, two fixing tables are arranged on the connecting fixing seat, and are a fixing table A and a fixing table B correspondingly; the fixed part of the driving mechanism is arranged on the fixed table A, and the lower end of the corrugated pipe is arranged on the fixed table B; and the projection in the height direction, the fixed stage A is positioned below the fixed stage B.

Preferably, a position sensor is arranged below the wafer carrier substrate; the position sensor is used for sensing the position change of the connecting fixing seat.

Preferably, the driving mechanism is a lifting cylinder.

Preferably, the upper part of the wafer carrying platform substrate is a vacuum environment, and the lower part is an atmospheric environment; the wafer carrier, the baffle and the baffle connecting block are all arranged above the wafer carrier substrate, and the driving mechanism is arranged below the wafer carrier substrate.

Based on the technical objects, compared with the prior art, the utility model has the following advantages:

compared with other baffle structures, the utility model reduces the occupied space of the whole structure of the whole wafer carrying platform, thereby reducing the manufacturing cost of the whole chamber, and has low cost of using the lifting cylinder structure and simple, stable and reliable structure.

Drawings

FIG. 1 is a schematic view of a baffle structure (first state) of a wafer carrier according to the present utility model;

fig. 2 is a schematic view of a baffle structure (second state) of a wafer carrier according to the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. The relative arrangement, expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values.

As shown in fig. 1 to 2, the wafer carrier baffle structure of the present utility model includes a wafer carrier substrate 012, a wafer carrier 001 and an electrode baffle mechanism respectively mounted on the wafer carrier substrate 012, wherein the electrode baffle mechanism includes a driving mechanism and a baffle 002 connected with a power output end of the driving mechanism, and the driving mechanism is a linear reciprocating driving mechanism; the power output end of the driving mechanism is connected with a baffle connecting block 011 through a connecting rod chute mechanism, the baffle 002 is connected with the upper end of the lifting guide mechanism through the baffle connecting block 011, and meanwhile, the baffle connecting block 011 is rotatably arranged relative to the upper end of the lifting guide mechanism; under the power drive of the driving mechanism, the baffle connecting block 011 drives the baffle 002 to open and sink relative to the lifting guide mechanism through the synergistic effect of the lifting guide mechanism and the connecting rod chute mechanism until the baffle is at a preset position or rises and folds until the baffle is covered on the wafer carrier 001.

Specifically, in the present utility model, the lifting mechanism includes a lifting shaft 007 and a bellows 005; the upper end of the corrugated pipe 005 is connected with a baffle connecting block 011 in a positioning way through a lifting shaft 007, and the lower end of the corrugated pipe 005 is supported through a connecting fixing seat 006; the connection fixing base 006 is installed below the wafer stage substrate 012 and can be installed to be liftable and lowerable with respect to the wafer stage substrate 012. The connecting rod sliding chute mechanism comprises a sliding fixed shaft 003 and a sliding chute; the spout sets up on baffle connecting block 011, and the upper end both sides of slip fixed axle 003 are furnished with slip axle sleeve 009, the part that is located between the slip axle sleeve 009 of both sides on the slip fixed axle 003 is movably installed in the spout, and the lower extreme of slip fixed axle 003 is connected with actuating mechanism's power take off end.

A preferred embodiment of the present utility model will be described in detail below with reference to the accompanying drawings.

Fig. 1 shows a structure of the present utility model, which is a shielding state of a wafer stage shutter, and main components shown in the drawing are a wafer stage 001, a shutter 002, a sliding fixed shaft 003, a lifting cylinder 004, a bellows 005, a connection fixed seat 006, a lifting shaft 007, a position sensor 008, a sliding shaft sleeve 009, a pin shaft 010, a shutter connection block 011 and a wafer stage substrate 012.

The wafer carrier base plate 012 divides the whole wafer carrier device into a vacuum environment and an atmospheric environment, wherein the upper part of the wafer carrier base plate 012 is divided into the vacuum environment, the lower part of the wafer carrier base plate 012 is divided into the atmospheric environment, under the vacuum environment, the wafer carrier 001 is a carrier for placing wafers, the baffle 002 is connected with the lifting shaft 007 through the pin shaft 010 as a rotating shaft, the baffle can realize rotating motion by taking the pin shaft 010 as the rotating shaft, the baffle connecting block 011 is provided with an arc groove, the notch surface of the arc groove is smooth, a sliding section can be provided for the sliding fixed shaft 003, the effect of limiting the position of the baffle 002 can be achieved, the surface of the sliding fixed shaft 003 is smooth, the sliding shaft sleeves 009 are arranged on two sides of the sliding fixed shaft 003, and the sliding shaft sleeves 009 are arranged in the arc groove of the baffle connecting block 011 in a clearance fit manner, so that the baffle connecting block 011 can slide smoothly along the track of the arc groove. Under atmospheric environment, lift cylinder 004 is fixed in wafer carrier base plate 012 bottom position, connect fixing base 006 and connect lift cylinder 004 and lift axle 007, lift cylinder 004 during operation, the cylinder diameter is elongated, connect fixing base 006 and drive lift axle 007 concertina movement, when lift axle 007 moves down, drive baffle 002 and use round pin axle 010 to realize rotary motion as the rotation axis, baffle connecting block 011 slides along arc groove orbit under the effect of slip fixed axle 003, when slip fixed axle 003 is located baffle connecting block arc groove left and right sides limit state, fig. 1 is baffle position lower extreme, fig. 2 baffle position upper limit, be two limit states of baffle 002, shelter from (fig. 1) and non-shelter from (fig. 2) state promptly.

As shown in fig. 2, the track of the baffle 002 rotates clockwise through the pin shaft 010, and meanwhile, the baffle 002 moves downwards along the track of the arc-shaped groove of the baffle connecting block 011, so that the automatic storage function of the baffle 002 is realized, compared with other baffle structures, the occupied space of the whole wafer carrying platform overall structure is reduced, the manufacturing cost of the whole chamber is reduced, the structure cost of the lifting cylinder is low, and the structure is simple, stable and reliable.

Claims

1. The baffle plate structure of the wafer carrier comprises a wafer carrier substrate, a wafer carrier and an electrode baffle plate mechanism, wherein the wafer carrier and the electrode baffle plate mechanism are respectively arranged on the wafer carrier substrate; the power output end of the driving mechanism is connected with the baffle connecting block through the connecting rod chute mechanism, the baffle is connected with the upper end of the lifting guide mechanism through the baffle connecting block, and the baffle connecting block is rotatably arranged relative to the upper end of the lifting guide mechanism;

2. The wafer carrier baffle structure of claim 1, wherein the lift guide mechanism comprises a lift shaft and a bellows; the upper end of the corrugated pipe is connected with the baffle connecting block in a positioning way through the lifting shaft, and the lower end of the corrugated pipe is supported through the connecting fixing seat; the connection fixing seat is arranged below the wafer carrying platform substrate and can be arranged in a lifting manner relative to the wafer carrying platform substrate.

3. The wafer carrier baffle structure of claim 2, wherein a connection support is provided at an upper end of the lifting shaft; the end part of the baffle connecting block is arranged in the connecting support and is in positioning connection with the connecting support through a pin shaft.

4. The wafer carrier baffle structure of claim 3, wherein the link and chute mechanism comprises a slide stationary shaft and a chute; the chute is arranged on the baffle connecting block, the sliding shaft sleeves are assembled on two sides of the upper end of the sliding fixed shaft, the part of the upper end of the sliding fixed shaft between the sliding shaft sleeves on two sides is movably arranged in the chute, and the lower end of the sliding fixed shaft is connected with the power output end of the driving mechanism.

5. The wafer carrier baffle structure of claim 4, wherein the chute is an arcuate slot.

6. The wafer carrier baffle structure of claim 5, wherein the fixed portion of the drive mechanism is mounted on a connection mount.

7. The baffle structure of wafer carrier according to claim 6, wherein two fixing tables are provided on the connection fixing base, corresponding to a fixing table a and a fixing table B; the fixed part of the driving mechanism is arranged on the fixed table A, and the lower end of the corrugated pipe is arranged on the fixed table B; and the projection in the height direction, the fixed stage A is positioned below the fixed stage B.

8. The wafer carrier baffle structure of claim 7, wherein a position sensor is disposed below the wafer carrier substrate; the position sensor is used for sensing the position change of the connecting fixing seat.

9. The wafer carrier baffle structure of claim 1, wherein the drive mechanism is a lift cylinder.

10. The wafer carrier baffle structure of claim 1, wherein a vacuum environment is above the wafer carrier substrate and an atmospheric environment is below the wafer carrier substrate; the wafer carrier, the baffle and the baffle connecting block are all arranged above the wafer carrier substrate, and the driving mechanism is arranged below the wafer carrier substrate.