JP2020122207A - Treatment device, and operation method of treatment device - Google Patents

Abstract

To provide a technology capable of enlarging an adjustment range of a treatment pressure.SOLUTION: A treatment device in one embodiment, includes a treatment vessel having an exhaust port, capable of decompressing the inside, a valve element capable of covering the whole of the exhaust port, and a valve element driving mechanism for adjusting a distance between the exhaust port and the valve element by moving the valve element. The valve element driving mechanism has a lifting part for lifting the valve element, and a restriction part for restricting operation of the lifting part by having contact with the lifting part.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a processing device and a method of operating the processing device.

There is known a substrate processing apparatus in which a poppet type throttle valve is provided between a processing region for performing a process such as plasma processing on a substrate and a vacuum pump for depressurizing the processing region (for example, Patent Document 1, 2).

JP-A-8-172037 JP, 2013-84602, A

The present disclosure provides a technique capable of expanding the adjustment range of the processing pressure.

A processing apparatus according to an aspect of the present disclosure has a processing container that has an exhaust port and can decompress the inside, a valve body that can cover the entire exhaust port, and the exhaust port and the exhaust port by moving the valve body. A valve body drive mechanism for adjusting the distance to the valve body, the valve body drive mechanism raising and lowering the valve body, and a limit for contacting the raising and lowering section and limiting the operation of the elevating and lowering section. And a section.

According to the present disclosure, the adjustment range of the processing pressure can be expanded.

The figure which shows the example of composition of the processor The figure which shows the structural example of the processing chamber of the processing apparatus of FIG. The figure which shows the valve body drive mechanism of the 1st structural example. The figure which shows an example of operation|movement of the valve body drive mechanism of FIG. The figure which shows the valve body drive mechanism of the example of a 2nd structure. The figure which shows an example of the stopper mechanism of the valve body drive mechanism of FIG. Diagram showing the relationship between gas flow rate and processing pressure

Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding reference numerals are given to the same or corresponding members or parts, and duplicate explanations are omitted.

[Processing device]
A configuration example of the processing device will be described. FIG. 1 is a diagram illustrating a configuration example of a processing device.

As shown in FIG. 1, the processing apparatus 1 includes processing chambers 10 and 20, a vacuum transfer chamber 30, a load lock chamber 40, an atmospheric transfer chamber 50, a load port 60, and a control unit 70. ..

The processing chamber 10 is connected to the vacuum transfer chamber 30 via the gate valve G1. The inside of the processing chamber 10 is depressurized to a predetermined vacuum atmosphere, and the wafer W is processed therein. The processing chamber 10 is a sputtering device that forms a film by, for example, a sputtering method. However, the processing chamber 10 may be an apparatus that performs another processing, for example, a CVD apparatus that forms a film by a chemical vapor deposition (CVD) method.

The processing chamber 20 is connected to the vacuum transfer chamber 30 via the gate valve G2. The inside of the processing chamber 20 is depressurized to a predetermined vacuum atmosphere, and the wafer W is processed therein. The processing chamber 20 may be a device that performs the same processing as the processing chamber 10, for example. However, the processing chamber 20 may be a device that performs a different process from the processing chamber 10.

The vacuum transfer chamber 30 is connected to the processing chamber 10, the processing chamber 20, and the load lock chamber 40. The inside of the vacuum transfer chamber 30 is depressurized to a predetermined vacuum atmosphere. The vacuum transfer chamber 30 is provided with a transfer mechanism 31 capable of transferring the wafer W in a reduced pressure state. The transfer mechanism 31 transfers the wafer W among the processing chamber 10, the processing chamber 20, and the load lock chamber 40.

The load lock chamber 40 is connected to the vacuum transfer chamber 30 via the gate valve G3. The load lock chamber 40 can switch between an atmospheric atmosphere and a vacuum atmosphere.

The atmosphere transfer chamber 50 is connected to the load lock chamber 40 via the gate valve G4. The atmosphere transfer chamber 50 is in the atmosphere, and for example, a downflow of clean air is formed. A transfer mechanism 51 is provided in the atmosphere transfer chamber 50. The transfer mechanism 51 transfers the wafer W between the load lock chamber 40 and the carrier C of the load port 60.

The load port 60 is provided on the wall surface of the long side of the atmosphere transfer chamber 50. The carrier C containing the wafer W or an empty carrier C is attached to the load port 60. As the carrier C, for example, FOUP (Front Opening Unified Pod) can be used.

The control unit 70 controls each unit of the processing device 1. For example, the control unit 70 executes the operation of the processing chambers 10 and 20, the operation of the transfer mechanisms 31 and 51, the opening and closing of the gate valves G1 to G4, the switching of the atmosphere in the load lock chamber 40, and the like. The control unit 70 may be, for example, a computer.

[Processing room]
Next, the processing chamber 10 will be described. Although the description of the processing chamber 20 is omitted, it may be the same as that of the processing chamber 10. FIG. 2 is a diagram showing a configuration example of the processing chamber 10 of the processing apparatus 1 of FIG. As shown in FIG. 2, the processing chamber 10 includes a processing container 110.

The processing container 110 is made of, for example, aluminum. The processing container 110 is grounded. A transfer port 112 for loading or unloading the wafer W is provided on the sidewall of the processing container 110. The transfer port 112 is opened and closed by the gate valve G1. A mounting table 120 on which the wafer W is mounted is provided in the processing container 110.

The mounting table 120 includes a base portion 122 and an electrostatic chuck 124.

The base portion 122 is made of, for example, aluminum. The base portion 122 has, for example, a substantially disc shape.

The electrostatic chuck 124 is provided on the upper surface of the base 122 and holds the wafer W by electrostatic attraction. The electrostatic chuck 124 has, for example, a substantially disc shape similar to the base portion 122. The electrostatic chuck 124 includes an electrode 124a formed of a conductive film and a dielectric film 124b sandwiching the electrode 124a. A DC power supply (not shown) is connected to the electrode 124a. The electrostatic chuck 124 attracts and holds the wafer W on the electrostatic chuck 124 by an electrostatic force by a voltage applied from a DC power supply.

A heater 124c is embedded in the electrostatic chuck 124. Thereby, the mounting table 120 can be heated. The heater 124c may be embedded in the base portion 122, or may be a sheet-type heater that can be attached to the mounting table 120. Further, the heater 124c may be divided into a plurality of pieces. When the heater 124c is divided into a plurality of parts, the temperature of the mounting table 120 can be adjusted for each of the divided areas. An AC power supply (not shown) is connected to the heater 124c. By supplying power from the AC power supply to the heater 124c, the mounting table 120 (wafer W) can be adjusted to a predetermined temperature.

The mounting table 120 is connected to the drive mechanism 126. The drive mechanism 126 has a rotating shaft 128 and a drive device 130. The rotating shaft 128 is a substantially columnar member. The rotating shaft 128 extends from directly below the mounting table 120 to the outside of the processing container 110 through the bottom of the processing container 110. A sealing member 132 such as a magnetic fluid seal is provided between the bottom of the processing container 110 and the rotating shaft 128. The sealing member 132 seals the space between the bottom of the processing container 110 and the rotating shaft 128 so that the rotating shaft 128 can rotate and move up and down.

The mounting table 120 is attached to the upper end of the rotating shaft 128, and the driving device 130 is attached to the lower end of the rotating shaft 128. The drive device 130 generates power for rotating the rotary shaft 128 and moving it up and down. The mounting table 120 rotates as the rotating shaft 128 rotates by the power of the driving device 130. Further, the mounting table 120 moves up and down as the rotating shaft 128 moves up and down by the power of the driving device 130. The rotary shaft 128 may be formed integrally with the mounting table 120. The rotation speed of the mounting table 120 may be, for example, 60 rpm to 120 rpm.

A target 140, which is a film forming material, is provided above the mounting table 120. The target 140 is arranged to face the mounting table 120. However, the target 140 may be inclined with respect to the mounting table 120. Moreover, the number of the targets 140 may be one or plural.

The target 140 is held by a metal holder 142. The holder 142 is supported on the top of the processing container 110 via an insulating member (not shown). A power source 144 is connected to the target 140 via a holder 142. The power supply 144 applies a negative DC voltage to the target 140. A magnet 146 is provided outside the processing container 110 so as to face the target 140 via the holder 142. The magnet 146 is excited by the current supplied from the excitation power supply 148.

Further, the processing container 110 is provided with a port 150 for introducing gas into the processing container 110, and gas from the gas supply unit 152 is introduced into the processing container 110 via the port 150. The gas supply unit 152 includes a gas supply source, a flow rate controller, and the like.

When the gas is supplied from the gas supply unit 152 into the processing container 110 and a voltage is applied to the target 140 by the power supply 144, the gas supplied into the processing container 110 is excited. Further, a magnetic field is generated near the target 140 by the magnet 146. As a result, the plasma is concentrated near the target 140 and the positive ions in the plasma collide with the target 140, whereby the target material is released from the exposed target 140. The released target material is deposited on the wafer W to form a thin film.

An exhaust port 114 is formed at the bottom of the processing container 110. An exhaust device 160 is connected to the exhaust port 114. The exhaust device 160 includes a vacuum pump such as a cryopump and a water pump, and depressurizes the processing space in the processing container 110 to a predetermined vacuum degree.

Further, a valve body 210 and a valve body drive mechanism 220 are provided on the bottom of the processing container 110. The valve body 210 is formed in a size capable of covering the entire exhaust port 114. The valve body 210 moves between a position separated from the bottom of the processing container 110 (the position shown in FIG. 2) and a position in contact with the bottom of the processing container 110 via the seal member 212. When the valve body 210 has moved to a position separated from the bottom of the processing container 110, the inside of the processing container 110 and the exhaust device 160 communicate with each other through the exhaust port 114, and the inside of the processing container 110 is exhausted. On the other hand, in the state where the valve body 210 has moved to the position where it comes into contact with the bottom of the processing container 110 via the seal member 212, the exhaust port 114 is closed, so that the communication between the inside of the processing container 110 and the exhaust device 160 is cut off, The inside of the processing container 110 is not exhausted. The valve body drive mechanism 220 moves the valve body 210 up and down to adjust the distance between the exhaust port 114 and the valve body 210. The details of the valve body drive mechanism 220 will be described later.

[Valve drive mechanism]
The valve body drive mechanism of the first configuration example will be described. FIG. 3 is a diagram showing a valve body drive mechanism of the first configuration example.

As shown in FIG. 3, the valve body drive mechanism 220 has a first cylinder 221 and a second cylinder 222.

The first cylinder 221 is a fluid cylinder that moves the valve body 210 up and down. An air cylinder, for example, can be used as the fluid cylinder. The first cylinder 221 has a cylinder tube 221a, a piston 221b, a piston rod 221c, and a block member 221d.

The cylinder tube 221a is formed of a cylindrical body extending along the axial direction.

The piston 221b is accommodated in the cylinder tube 221a so as to be slidable in the axial direction, and partitions the inside of the cylinder tube 221a into a first pressure chamber R11 and a second pressure chamber R12. When air is supplied into the first pressure chamber R11 in the cylinder tube 221a, the piston 221b moves upward and stops at the upper end position (the position indicated by the chain double-dashed line in FIG. 3). On the other hand, the piston 221b moves downward and stops at the lower end position when air is supplied into the second pressure chamber R12 in the cylinder tube 221a.

The piston rod 221c is attached to the piston 221b and moves up and down together with the piston 221b. The valve body 210 is fixed to the upper end of the piston rod 221c, and the valve body 210 moves up and down as the piston rod 221c moves up and down. For example, when the piston rod 221c moves upward, the valve body 210 moves to a position separated from the bottom portion of the processing container 110, so that the inside of the processing container 110 and the exhaust device 160 communicate with each other via the exhaust port 114, and the processing container The inside of 110 is exhausted. On the other hand, when the piston rod 221c moves downward, the valve body 210 moves to a position where it comes into contact with the bottom of the processing container 110 via the seal member 212, so that the exhaust port 114 is closed. As a result, the communication between the inside of the processing container 110 and the exhaust device 160 is blocked, and the inside of the processing container 110 is not exhausted.

The block member 221d is attached to the lower end of the piston rod 221c. The block member 221d has, for example, a disc shape. The block member 221d moves up and down as the piston rod 221c moves up and down.

The second cylinder 222 is a fluid cylinder that comes into contact with the block member 221d of the first cylinder 221 to stop the piston rod 221c at an intermediate position between the upper end position and the lower end position (the position shown by the solid line in FIG. 3). Is. An air cylinder, for example, can be used as the fluid cylinder. The second cylinder 222 has a cylinder tube 222a, a piston 222b, and a piston rod 222c.

The cylinder tube 222a is formed by a tubular body extending along the axial direction.

The piston 222b is slidably accommodated in the cylinder tube 222a in the axial direction, and partitions the interior of the cylinder tube 222a into a first pressure chamber R21 and a second pressure chamber R22. When air is supplied to the first pressure chamber R21 in the cylinder tube 222a, the piston 222b moves in a direction in which the piston rod 222c extends with respect to the cylinder tube 222a and extends to an extended position (shown by a solid line in FIG. 3). Stop). On the other hand, when air is supplied to the second pressure chamber R22 in the cylinder tube 222a, the piston 222b moves in a direction in which the piston rod 222c contracts with respect to the cylinder tube 222a and moves to a contracted position (second position in FIG. 3). Stop at the position indicated by the dotted line).

The piston rod 222c is attached to the piston 222b and moves together with the piston 222b. The piston rod 222c has a contact position (position shown by a solid line in FIG. 3) at which it can contact at least the block member 221d of the first cylinder 221, and a non-contact position that does not contact (a position shown by a chain double-dashed line in FIG. 3). To move between.

Further, it is preferable that the vertical position of the second cylinder 222 with respect to the first cylinder 221 be variable. As a result, the position where the piston rod 222c that has moved to the extended position in the second cylinder 222 contacts the block member 221d of the first cylinder 221 changes up and down.

In the valve body driving mechanism 220, when the piston rod 221c is at the upper end position and the piston rod 221c is moved to the extended position and then the piston rod 221c is lowered, the piston rod 222c is moved to the upper end position and the lower end position. Stop at an intermediate position in between. As a result, the distance between the bottom of the processing container 110 and the valve body 210 is narrower than the distance between the bottom of the processing container 110 and the valve body 210 when the piston rod 221c is at the upper end position. Therefore, the exhaust conductance is reduced, and the pressure in the processing container 110 (hereinafter also referred to as “processing pressure”) can be controlled to the high pressure side. That is, the adjustment range of the processing pressure can be expanded to the high pressure side.

Next, the operation method of the valve body drive mechanism 220 will be described by taking as an example the case where the normal process and the high-pressure process are executed in this order in the processing chamber 10 of the processing apparatus 1 to shift to the idling state. FIG. 4 is a diagram showing an example of the operation of the valve body drive mechanism 220 of FIG.

Step S1 is a step of executing a normal process. The normal process is a step of adjusting the treatment pressure to, for example, 10 ⁻³ Pa or less and performing the treatment. In step S1, the control unit 70 moves the piston rod 221c of the first cylinder 221 to the upper end position. As a result, the valve body 210 moves to a position away from the bottom of the processing container 110, so that the inside of the processing container 110 and the exhaust device 160 communicate with each other through the exhaust port 114, and the inside of the processing container 110 is exhausted. In addition, in step S1, the piston rod 222c of the second cylinder 222 is moved to the contracted position.

Step S2 is a step of shifting from the normal process to the high pressure process. The high-pressure process is a process in which the treatment pressure is higher than that in the normal process, and the treatment pressure is adjusted to, for example, 10 ⁻³ Pa or more. In step S2, the control unit 70 moves the piston rod 222c of the second cylinder 222 to an extension position where it can contact the block member 221d of the first cylinder 221.

Step S3 is a step of executing a high pressure process. In step S3, the control unit 70 lowers the piston rod 221c of the first cylinder 221 while moving the piston rod 222c of the second cylinder 222 to the extended position. At this time, the block member 221d attached to the lower end of the piston rod 221c comes into contact with the piston rod 222c to stop at an intermediate position between the upper end position and the lower end position. As a result, the distance between the bottom of the processing container 110 and the valve body 210 is narrower than the distance between the bottom of the processing container 110 and the valve body 210 when the piston rod 221c is at the upper end position. Therefore, the exhaust conductance is reduced, and the processing pressure can be controlled to the high pressure side.

Steps S4 and S5 are steps for shifting from the high pressure process to the idling state. The idling state is a state in which processing is not being performed in the processing chamber 10. In step S4, the control unit 70 raises the piston rod 221c of the first cylinder 221. In step S5, the control unit 70 contracts the piston rod 222c of the second cylinder 222.

Step S6 is a step of executing idling. In step S6, the control unit 70 lowers the piston rod 221c of the first cylinder 221. At this time, the piston rod 222c of the second cylinder 222 has moved to the contracted position, so the piston rod 221c moves to the lower end position. As a result, the valve body 210 moves to a position where it comes into contact with the bottom of the processing container 110 via the seal member 212, and the exhaust port 114 is closed. Therefore, the communication between the inside of the processing container 110 and the exhaust device 160 is blocked, and the inside of the processing container 110 is not exhausted.

[Another example of valve body drive mechanism]
The valve body drive mechanism of the second configuration example will be described. FIG. 5 is a diagram showing a valve body drive mechanism of the second configuration example. 6 is a diagram showing an example of a stopper mechanism of the valve body drive mechanism of FIG. 5, and shows a cross section of the valve body drive mechanism taken along the alternate long and short dash line AA in FIG.

As shown in FIG. 5, the valve body drive mechanism 220A has a cam mechanism 225 and a stopper mechanism 226.

The cam mechanism 225 is a cylindrical cam that moves the valve body 210 up and down. The cam mechanism 225 has a housing 225a, a cam 225b, a cam follower 225c, a shaft 225d, and a rotating mechanism 225e.

The housing 225a is formed by a tubular body extending along the axial direction.

The cam 225b is accommodated in the housing 225a so as to be slidable in the circumferential direction. The cam 225b has a substantially cylindrical shape extending along the axial direction. A spiral cam groove 225f is formed in the cam 225b.

The cam follower 225c is a substantially cylindrical rotating body that slides along the cam groove 225f.

The shaft 225d is provided inside the cam 225b so as to be slidable in the axial direction with respect to the cam 225b. A columnar holding portion 225g that rotatably holds the cam follower 225c is provided on the outer periphery of the shaft 225d.

The rotation mechanism 225e rotates the cam 225b via the rotation shaft 225h.

In the cam mechanism 225, the cam follower 225c slides along the cam groove 225f by rotating the cam 225b via the rotating shaft 225h by the rotating mechanism 225e, and the shaft 225d moves vertically with respect to the cam 225b. .. For example, when the cam 225b is rotated clockwise with the shaft 225d in the position shown in FIG. 5, the cam follower 225c slides along the cam groove 225f, the shaft 225d moves upward, and the upper end position is reached. Stop. On the other hand, when the cam 225b is rotated counterclockwise with the shaft 225d in the upper end position, the cam follower 225c slides along the cam groove 225f, the shaft 225d moves straight downward, and stops at the lower end position.

The stopper mechanism 226 is a mechanism that acts on the cam mechanism 225 to stop the shaft 225d at an intermediate position between the upper end position and the lower end position. The stopper mechanism 226 includes a sensor arm 226a, a position adjusting plate 226b, an intermediate stop cylinder 226c, a stopper 226d, and an intermediate stop sensor 226e.

The sensor arm 226a is attached to the lower end of the rotating shaft 225h of the cam mechanism 225, and rotates together with the rotating shaft 225h.

The position adjustment plate 226b is provided below the sensor arm 226a and has a disc shape. The position adjustment plate 226b is configured to be rotatable relative to the sensor arm 226a.

The intermediate stop cylinder 226c is a fluid cylinder attached to the lower surface of the position adjusting plate 226b. An air cylinder, for example, can be used as the fluid cylinder. The intermediate stop cylinder 226c moves the stopper 226d up and down with respect to the position adjustment plate 226b.

The stopper 226d is connected to the intermediate stop cylinder 226c via a connecting member 226f, and moves up and down together with the intermediate stop cylinder 226c. The stopper 226d moves at least between a lower end position (a position indicated by a solid line in FIG. 5) not in contact with the sensor arm 226a and an upper end position (a position indicated by a chain double-dashed line in FIG. 5) in contact with the sensor arm 226a. To do. The stopper 226d comes into contact with the sensor arm 226a when the sensor arm 226a rotates to a predetermined rotation angle in the state of being moved to the upper end position, and stops the rotation of the sensor arm 226a.

The intermediate stop sensor 226e is a sensor that detects that the sensor arm 226a is stopped at the intermediate position. The intermediate stop sensor 226e may be, for example, a reflective optical sensor. In addition to the intermediate stop sensor 226e, a sensor that detects that the sensor arm 226a is stopped at the lower end position and a sensor that detects that the sensor arm 226a is stopped at the upper end position are provided. Good. These sensors may be, for example, reflective optical sensors, like the intermediate stop sensor 226e.

In the stopper mechanism 226, when the cam 225b is rotated after the stopper 226d is moved to the contact position, the sensor arm 226a connected to the cam 225b via the rotation shaft 225h comes into contact with the stopper 226d and stops. As a result, the rotation of the cam 225b is stopped, and the shaft 225d that moves up and down with the rotation of the cam 225b stops at an intermediate position between the upper end position and the lower end position. Therefore, the distance between the bottom of the processing container 110 and the valve element 210 is smaller than the distance between the bottom of the processing container 110 and the valve element 210 when the shaft 225d is at the upper end position. As a result, the exhaust conductance is reduced, and the processing pressure can be controlled to the high pressure side. That is, the adjustment range of the processing pressure can be expanded to the high pressure side.

Further, in the stopper mechanism 226, by rotating the position adjusting plate 226b, the relative angle of the stopper 226d with respect to the sensor arm 226a changes. As a result, the angle at which the rotation of the cam 225b connected to the sensor arm 226a via the rotation shaft 225h is restricted changes, so that the intermediate position where the shaft 225d stops can be changed.

Next, the operation method of the valve body drive mechanism 220A will be described by taking as an example the case where the normal process and the high-pressure process are executed in this order in the processing chamber 10 of the processing apparatus 1 to shift to the idling state.

In this case, in the normal process, the control unit 70 controls the valve body drive mechanism 220A to move the valve body 210 to a position separated from the bottom of the processing container 110. As a result, the inside of the processing container 110 and the exhaust device 160 communicate with each other through the exhaust port 114, and the inside of the processing container 110 is exhausted.

Further, in the high pressure process, the control unit 70 controls the valve body driving mechanism 220A to stop the shaft 225d at the intermediate position, so that the gap between the bottom of the processing container 110 and the valve body 210 is narrower than in the normal process. The body 210 is moved. As a result, the exhaust conductance becomes smaller than in the normal process, and the processing pressure can be controlled to the high pressure side.

Further, in the idling state, the control unit 70 controls the valve body drive mechanism 220A to move the valve body 210 to a position where it contacts the bottom of the processing container 110 via the seal member 212.

〔Example〕
Next, the change in the processing pressure when the distance L between the bottom of the processing container 110 and the valve body 210 was changed was evaluated. In the embodiment, the valve body 210 in the processing container 110 is set to the OPEN position and the intermediate stop position, and when gas is introduced into the processing container 110 from the gas supply unit 152 through the port 150 at a flow rate of 20 sccm to 500 sccm. The processing pressure was measured. The OPEN position is the position when the piston rod 221c of the valve body drive mechanism 220 is moved to the upper end position, and the intermediate stop position is the position when the piston rod 221c of the valve body drive mechanism 220 is moved to the intermediate position. Is.

FIG. 7 is a diagram showing the relationship between the gas flow rate and the processing pressure. In FIG. 7, the gas flow rate [sccm] is shown on the horizontal axis and the pressure [%] is shown on the vertical axis. Further, in FIG. 7, a triangle mark shows the result when the valve body 210 in the processing container 110 is set to the OPEN position, and a square mark shows the result when the valve body 210 in the processing container 110 is set to the intermediate stop position. Indicate.

As shown in FIG. 7, the processing pressure when the valve body 210 in the processing container 110 is set to the intermediate stop position is higher than the processing pressure when the valve body 210 in the processing container 110 is set to the OPEN position. I understand. From this, it can be said that the processing pressure can be controlled to the high pressure side by moving the piston rod 221c of the valve body drive mechanism 220 to the intermediate position.

In addition, in the above-described embodiment, the first cylinder 221 and the cam mechanism 225 are an example of a lifting unit, and the second cylinder 222 and the stopper mechanism 226 are an example of a limiting unit. Further, the cam 225b, the cam follower 225c, and the rotary shaft 225h are examples of a rotating portion, the shaft 225d is an example of a linear moving portion, and the stopper 226d is an example of an abutting portion. The intermediate stop cylinder 226c is an example of a drive unit, the position adjustment plate 226b is an example of an adjustment unit, and the intermediate stop sensor 226e is an example of a detection unit.

The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The above-described embodiments may be omitted, replaced, or modified in various forms without departing from the scope and spirit of the appended claims.

In the above embodiments, the semiconductor wafer has been described as an example of the substrate, but the semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as GaAs, SiC, or GaN. The substrate is not limited to a semiconductor wafer, and may be a glass substrate used for an FPD (flat panel display) such as a liquid crystal display device or a ceramic substrate.

1 Processing Device 10 Processing Chamber 110 Processing Container 114 Exhaust Port 160 Exhaust Device 210 Valves 220, 220A Valve Body Drive Mechanism 221 First Cylinder 222 Second Cylinder 225 Cam Mechanism 225b Cam 225c Cam Follower 225d Shaft 225h Rotating Shaft 226 Stopper Mechanism 226c Intermediate stop cylinder 226d Stopper

Claims (13)

A processing container that has an exhaust port and can decompress the inside,
A valve body that can cover the entire exhaust port,
A valve body drive mechanism for moving the valve body to adjust the distance between the exhaust port and the valve body,
Equipped with
The valve body drive mechanism,
An elevating part for elevating the valve body,
A limiter that contacts the elevating part and limits the operation of the elevating part;
Has,
Processing equipment. The lifting unit is a fluid cylinder,
The limiting portion limits the operation of the fluid cylinder by contacting the fluid cylinder,
The processing device according to claim 1. The restriction is a fluid cylinder,
The processing device according to claim 2. The lifting unit is
A rotating part,
A linear motion section that linearly moves with the rotation of the rotary section and supports the valve body;
Have
The limiting portion limits rotation of the rotating portion by contacting the rotating portion,
The processing device according to claim 1. The limiting section includes an abutting section that can come into contact with the rotating section, and a driving section that moves the abutting section between a position that contacts the rotating section and a position that does not contact the rotating section.
The processing device according to claim 4. The contact portion contacts the rotating portion when the rotating portion is positioned at a predetermined rotation angle,
The processing device according to claim 5. The limiting portion has an adjusting portion that adjusts a rotation angle when the contact portion contacts the rotating portion,
The processing device according to claim 6. The limiting section has a detection section that detects that the rotating section is located at the predetermined rotation angle.
The processing device according to claim 6. The drive unit is a fluid cylinder,
The processing device according to claim 5. An exhaust device for exhausting the inside of the processing container through the exhaust port,
The exhaust device includes a cryopump,
The processing device according to any one of claims 1 to 9. A processing container that has an exhaust port and can decompress the inside,
A valve body that can cover the entire exhaust port,
A valve body drive mechanism for moving the valve body to adjust the distance between the exhaust port and the valve body,
Equipped with
The valve body drive mechanism,
An elevating part for elevating the valve body,
A limiter that contacts the elevating part and limits the operation of the elevating part;
A method of operating a processing device having:
In a state where the operation of the elevating part is restricted by the restricting part, the step of depressurizing the inside of the processing container and executing the process
Operating method of processing device. Without restricting the operation of the elevating part by the restricting part, depressurizing the inside of the processing container, and performing a process,
A method for operating the processing apparatus according to claim 11. In a state in which the operation of the elevating unit is restricted by the limiting unit, the step of depressurizing the inside of the processing container and performing the process is performed without restricting the operation of the elevating unit by the limiting unit. It is a step of increasing the pressure in the processing container and executing the step, rather than performing the step of reducing the pressure.
A method for operating the processing apparatus according to claim 12.

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