CN117127159A - Processing control system and method for glass sputtering layer - Google Patents

Abstract

The application discloses a processing control system and a processing control method for a glass sputtering layer, wherein the system is provided with a mounting frame, a support assembly and a movable pushing piece, a mounting table is arranged below the mounting frame, a sputtering cathode is arranged on the mounting table, the support assembly is provided with a bottom support and a top support, sputtering holes are formed in the bottom support, a mounting through groove is formed in the bottom support, a workpiece to be coated is arranged in the mounting through groove, at least part of the workpiece to be coated is opposite to the sputtering holes, the sputtering cathode is bombarded, metal atoms on the sputtering cathode are deposited on the workpiece to be coated through the sputtering holes to realize coating, and the movable pushing piece is used for pushing the top support to move so as to drive a shielded part of the workpiece to be coated to move close to a deposition area in the sputtering holes. According to the application, the movable pushing piece pushes the top support to move so as to drive the shielded part of the workpiece to be coated to move close to the deposition area in the sputtering hole, so that the shielded area/supporting part of the workpiece to be coated is coated, and the overall coating of the workpiece to be coated is realized.

Description

Processing control system and method for glass sputtering layer

Technical Field

The application relates to the technical field of glass coating, in particular to a processing control system and a processing control method for a glass sputtering layer.

Background

The magnetron sputtering coating method in the vacuum coating adopts the steps that electrons are emitted through a power-on anode, the electrons collide with gas molecules in a vacuum cavity under the acceleration action of an electric field, so that the gas molecules are ionized, the ionized gas molecules bombard metal particles on a cathode under the action of the electric field, the metal particles are ionized and sputtered, and the ionized metal ions are deposited on the surface of a target material to form a film, wherein in order to enable the electrons to collide with the gas molecules more efficiently, the ionization rate of the gas molecules is improved, a magnet is arranged in the cathode to form a magnetron cathode, and the electrons form a spiral track in the vacuum cavity under the combined action of the electric field and the magnetic field, so that the collision probability of the electrons and the gas molecules is increased.

In the prior art, a workpiece is coated by a supporting groove seat, and at least a part of edge parts of the workpiece are supported on the supporting groove seat and far away from a coating area in order to realize the support of the workpiece, so that the edge parts of the workpiece cannot be coated in the coating process, the coating of the workpiece cannot be completely realized, and the coating mode is not suitable for glass workpieces needing complete coating.

Therefore, the prior art has the technical problem that the edge support area of the workpiece cannot be coated with other parts of the workpiece at the same time, so that the workpiece cannot be completely coated.

Disclosure of Invention

Therefore, the application provides a processing control system and a processing control method for a glass sputtering layer, which effectively solve the problems that a workpiece is completely coated by a method in the prior art and a supporting area at the edge of the workpiece cannot be coated.

In order to solve the technical problems, the application specifically provides the following technical scheme: a system and method for controlling the processing of a glass sputtering layer are provided with:

the mounting rack is provided with a mounting table below, a sputtering cathode is mounted on the mounting table, and the sputtering cathode is right above and below the mounting rack;

the support assembly is arranged on the mounting frame and is provided with a bottom support, a sputtering hole is formed in the bottom support, a top support is arranged on the bottom support, a mounting through groove is formed in the top support, a workpiece to be coated is arranged in the mounting through groove, the size of the mounting through groove is consistent with that of the workpiece to be coated, at least part of the workpiece to be coated is opposite to the sputtering hole, and the sputtering cathode is bombarded, and metal atoms on the sputtering cathode are deposited on the workpiece to be coated through the sputtering hole to realize coating;

the movable pushing piece is arranged on the top support and is used for pushing the top support to move so as to drive the part, shielded by the workpiece to be coated, to move close to a deposition area in the sputtering hole;

the movable pushing piece is electrically connected with a control module, a time threshold is preset in the control module, and the control module sends a control signal to the movable pushing piece every time the time threshold passes.

Further, the width of the workpiece to be coated is larger than the width of the sputtering hole, and the length of the workpiece to be coated is not larger than the length of the sputtering hole;

the upper edge of the inner wall of the sputtering hole is provided with an inclined edge.

Further, the movable pushing piece comprises a movable shaft rod connected to the side edge of the top support, a driving groove seat arranged on the side edge of the top support and an electromagnetic coil arranged in the driving groove seat;

the electromagnetic coil is electrically connected with a power supply, a magnetic block is arranged at the end part of the movable shaft rod, the magnetic block is arranged in the driving groove seat in a sliding mode, and the movable shaft rod and the magnetic block are arranged along the moving direction of the workpiece to be coated.

Further, the sputtering hole consists of an upper round hole and a lower hole, and the upper round hole is arranged above the lower hole;

the shape and the size of the lower hole are consistent with those of the workpiece to be coated, the center positions of the upper round hole and the lower hole are overlapped, the corner positions of the lower hole are opposite to the edge line of the upper round hole, and the thickness of the workpiece to be coated is larger than that of the upper round hole.

Further, the inner wall of the lower hole is provided with four supporting blocks which are supported at the bottom of the workpiece to be coated and are respectively arranged on different edges of the lower hole;

the position of the support block corresponding to the bottom of one side of the workpiece to be coated is rotated by 90 degrees, no overlapping part exists between the position of the support block corresponding to the bottom of the side of the workpiece to be coated and the position of the adjacent support block corresponding to the bottom of the side of the workpiece to be coated, the height of the support block is consistent with the height of the lower hole, and the upper edge of the side surface of the support block is provided with an inclined edge.

Further, the sputtering holes are round, and the shapes and the sizes of the sputtering holes are consistent with those of the workpiece to be coated.

Further, the inner wall of the sputtering hole is provided with supporting blocks, the supporting blocks are supported at the bottom of the workpiece to be coated, the number of the supporting blocks is four, and the supporting blocks are arranged at the inner wall of the sputtering hole at equal intervals;

the height of the supporting block is the same as that of the sputtering hole, and the upper edge of the side edge of the supporting block is provided with an inclined edge.

Further, the inner wall of the mounting through groove is provided with a friction inner wall which is abutted with the outer wall of the workpiece to be coated;

the top support is circular.

Further, the movable pushing piece comprises a driving groove seat arranged outside the top support, an arc groove arranged in the driving groove seat, a driving groove symmetrically arranged in the arc groove and an electromagnetic coil arranged in the driving groove;

the electromagnetic coil is electrically connected with a power supply, a magnetic block is movably arranged in the arc groove, a movable shaft lever is connected to the magnetic block, and the movable shaft lever is arc-shaped;

and the central angle corresponding to the moving track of the magnetic block is larger than the central angle corresponding to the supporting block.

In order to solve the technical problems, the application further provides the following technical scheme: a method of processing a glass sputtered layer processing control system comprising the steps of:

step 100, placing a workpiece to be coated in a mounting through groove;

step 200, the sputtering cathode is bombarded, and metal atoms on the sputtering cathode are deposited on a workpiece to be coated through sputtering holes so as to form a first sputtering layer on the workpiece to be coated, which is opposite to the sputtering hole area;

step 300, the control module sends a control signal to the movable pushing piece after the time threshold value;

step 400, the movable pushing piece pushes the top support to move so as to drive the shielded part of the workpiece to be coated to move close to the deposition area in the sputtering hole, and the shielded part of the workpiece to be coated is shifted to be opposite to the sputtering hole to form a second sputtering layer;

step 500, repeating step 300 and step 400 for a plurality of times to form a final sputtering layer on the workpiece to be coated.

Compared with the prior art, the application has the following beneficial effects:

according to the application, the support assembly is provided with the bottom support and the top support, the workpiece to be coated is arranged in the top support, the bottom support and related results can support the workpiece to be coated, and the movable pushing piece pushes the top support to move so as to drive the shielded part of the workpiece to be coated to move close to the deposition area in the sputtering hole, so that the shielded area/support part of the workpiece to be coated is coated, and the overall coating of the workpiece to be coated is realized.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.

FIG. 1 is a schematic diagram of a system for controlling the processing of a glass sputtering layer according to an embodiment of the present application;

FIG. 2 is a schematic view of the structure of the stand assembly of the first embodiment;

FIG. 3 is a schematic view of a structure of a workpiece to be coated in a circular shape in the first embodiment;

FIG. 4 is a schematic view of a square structure of a workpiece to be coated in the first embodiment;

FIG. 5 is an enlarged schematic view of FIG. 2A;

FIG. 6 is a schematic structural view of a second embodiment of a stand assembly;

FIG. 7 is an enlarged schematic view of the structure of B in FIG. 7;

FIG. 8 is a schematic view showing the internal structure of a sputtering hole according to a second embodiment;

FIG. 9 is a schematic view of the structure of the movable pushing member in the second embodiment;

FIG. 10 is a schematic view of the magnet rotated 90 ° in FIG. 10;

FIG. 11 is a schematic structural view of a carrier assembly of the third embodiment;

FIG. 12 is an enlarged schematic view of FIG. 12C;

fig. 13 is a schematic view showing the internal structure of a sputtering hole according to a third embodiment;

FIG. 14 is a schematic view showing the structure of a movable pushing member in the third embodiment;

fig. 15 is a schematic view of the magnet block of fig. 14 rotated about 45 °.

Reference numerals in the drawings are respectively as follows:

1-mounting rack; a 2-support assembly; 3-a movable pushing piece; 4-a mounting table; 5-sputtering a cathode; 6, a workpiece to be coated;

21-a bottom support; 22-sputtering holes; 23-top support; 24-mounting through grooves; 25-inclined edges; 26-supporting blocks; 27-rubbing the inner wall;

31-a movable shaft; 32-driving a groove seat; 33-electromagnetic coils; 34-magnet; 35-arc groove; 36-a drive slot;

221-upper round hole; 222-lower hole.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

As shown in fig. 1, the application provides a processing control system for a glass sputtering layer, which comprises a mounting frame 1, a support assembly 2 and a movable pushing member 3.

The mounting bracket 1, its below is provided with mount table 4, installs sputtering cathode 5 on the mount table 4, and sputtering cathode 5 just above and be in the below of mounting bracket 1.

The support assembly 2 is arranged on the mounting frame 1, the support assembly 2 is provided with a bottom support 21, a sputtering hole 22 is formed in the bottom support 21, a top support 23 is arranged on the bottom support 21, a mounting through groove 24 is formed in the top support 23, a workpiece 6 to be coated is arranged in the mounting through groove 24, the mounting through groove 24 is consistent with the workpiece 6 to be coated in size, at least part of the workpiece 6 to be coated is opposite to the sputtering hole 22, the sputtering cathode 5 is bombarded, and metal atoms on the sputtering cathode are deposited on the workpiece 6 to be coated through the sputtering hole 22 to realize coating.

The movable pushing piece 3 is arranged on the top support 23, and the movable pushing piece 3 is used for pushing the top support 23 to move so as to drive the shielded part of the workpiece 6 to be coated to move close to the deposition area in the sputtering hole 22.

The movable pushing piece 3 is electrically connected with a control module, a time threshold value is preset in the control module, and the control module sends a control signal to the movable pushing piece 3 every time the time threshold value passes.

In the application, the support assembly 2 is provided with the bottom support 21 and the top support 23, the workpiece 6 to be coated is arranged in the top support, the bottom support and related results can support the workpiece to be coated, and the movable pushing piece pushes the top support to move so as to drive the shielded part of the workpiece to be coated to move close to the deposition area in the sputtering hole, so that the shielded area/support part of the workpiece to be coated is coated, and the overall coating of the workpiece to be coated is realized.

The application discloses three embodiments, wherein the first embodiment is applicable to a workpiece 6 to be coated with any shape, the second embodiment is applicable to a square workpiece 6 to be coated, and the third embodiment is applicable to a circular workpiece 6 to be coated.

As shown in fig. 2, 3 and 4, the width of the workpiece 6 to be coated is larger than the width of the sputtering hole 22, and the length of the workpiece 6 to be coated is not larger than the length of the sputtering hole 22.

The workpiece 6 to be coated moves along the width direction, and the part of the workpiece 6 to be coated in the length direction is always in the range of the deposition area of the sputtering hole 22 in the moving process, so that the movement in the width direction can drive the part of the workpiece 6 to be coated, which is blocked in the width direction, to move into the range of the deposition area of the sputtering hole 22 for coating.

In order to prevent the first sputtered layer from being blocked by the sputtered holes 22 during the moving process, as shown in fig. 5, an inclined edge 25 is provided at the upper edge of the inner wall of the sputtered holes 22, and the side edge of the first sputtered layer gradually moves upwards along the inclined edge 25 to drive the workpiece 6 to be coated to gradually move upwards in the mounting through groove 24.

Correspondingly, as shown in fig. 3 and 4, the movable pushing member 3 drives the workpiece 6 to be coated to move along the width direction, the movable pushing member 3 comprises a movable shaft rod 31 connected to the side edge of the top support 23, a driving slot seat 32 arranged on the side edge of the top support 23, and an electromagnetic coil 33 arranged in the driving slot seat 32, the electromagnetic coil 33 is electrically connected with a power supply, the end part of the movable shaft rod 31 is provided with a magnetic block 34, the magnetic block 34 is slidably arranged in the driving slot seat 32, and the movable shaft rod 31 and the magnetic block 34 are arranged along the moving direction of the workpiece 6 to be coated.

The power supply connection circuit is opened, the electromagnetic coil 33 is electrified to generate a magnetic field, and magnetic force is generated on the magnetic block 34, so that the magnetic block 34 moves close to one side of the electromagnetic coil 33, the movable shaft rod 31 drives the top support 23 to move along the width direction of the workpiece 6 to be coated, and accordingly the workpiece 6 to be coated is driven to move, and the shielded part of the workpiece 6 to be coated is moved to the deposition area of the sputtering hole 22.

The second embodiment is mainly applicable to a square workpiece 6 to be coated, and as shown in fig. 6 and 8, the second embodiment is as follows, in which the sputtering hole 22 is composed of an upper circular hole 221 and a lower hole 222, the upper circular hole 221 being disposed above the lower hole 222.

Wherein, the shape and the size of the lower hole 222 are consistent with those of the workpiece 6 to be coated, the center positions of the upper round hole 221 and the lower hole 222 are overlapped, the corner position of the lower hole 222 is opposite to the edge line of the upper round hole 221, and the thickness of the workpiece 6 to be coated is larger than that of the upper round hole 221.

The workpiece 6 to be coated is opposite to the lower hole 222, and metal atoms generated on the sputtering cathode 5 are formed in the lower hole 222, in the first embodiment, the workpiece 6 to be coated can perform linear movement to realize coating of a shielded part, in the present embodiment, the workpiece 6 to be coated is listed to perform circumferential movement to realize coating of the shielded part, wherein in order to avoid stopping the workpiece 6 to be coated when performing circumferential movement, the upper round hole 221 is also arranged to be circular so as to facilitate rotation of the workpiece 6 to be coated.

The bottom of the workpiece 6 to be coated is level with the bottom of the upper round hole 221, so that the workpiece 6 to be coated can be driven to rotate, the thickness of the workpiece 6 to be coated is larger than that of the upper round hole 221, and the upper end of the workpiece 6 to be coated extends out of the upper round hole 221 so as to drive the workpiece 6 to be coated to rotate.

In order to enable the bottom of the workpiece 6 to be coated to be flush with the bottom of the upper round hole 221, as shown in fig. 6, a supporting block 26 is disposed on the inner wall of the lower hole 222, the supporting block 26 is supported on the bottom of the workpiece 6 to be coated, four supporting blocks 26 are disposed on different edges of the lower hole 222, and the supporting block 26 is used for supporting the bottom of the workpiece 6 to be coated.

The position of the support block 26 corresponding to the bottom of one side of the workpiece 6 to be coated does not have an overlapping part with the position of the adjacent support block 26 corresponding to the bottom of the side of the workpiece 6 to be coated after rotating 90 degrees, the height of the support block 26 is consistent with the height of the lower hole 222, and as shown in fig. 7, the upper edge of the side surface of the support block 26 is provided with an inclined edge 25.

As shown in fig. 9 and 10, in order to rotate the shielding portion until it is exposed on the lower hole 222, it is common to rotate the workpiece 6 to be coated by 90 °, after 90 °, the edge of the workpiece 6 to be coated is still opposite to the edge of the lower hole 222 (the above case is mainly the case for the workpiece 6 to be coated being square), assuming that the upper edge of the workpiece 6 to be coated is close to the left in position corresponding to the support of the support block 26, after 90 ° counterclockwise rotation, the upper edge is rotated to the left, the support position corresponding to the support block 26 in the lower hole 222 is close to the upper edge, and the shielded position close to the left in the initial case is close to the lower edge in the case of 90 ° rotation, and therefore, the initially shielded region is far from the support portion after rotation, and the shielded position is exposed on the lower hole 222, and the coating is performed.

For the case that the workpiece 6 to be coated is rectangular, the workpiece needs to be rotated 180 ° to align the corresponding edge with the lower hole 222, and the position setting of the corresponding support block 26 also needs to satisfy that the position shielded by the support block 26 after the rotation of 180 ° will not have an overlapping portion with the support block 26 supported by the corresponding edge after the rotation.

Wherein the inclined edge 25 is arranged along the upper edge of the side surface of the supporting block 26 so that the first sputtering layer is not stopped by the supporting block 26 during the rotation of the workpiece 6 to be coated.

The third embodiment is applicable to the case where the workpiece 6 to be coated is circular, and as shown in fig. 11 and 13, the sputtering hole 22 is circular, and the sputtering hole 22 is identical in shape and size to the workpiece 6 to be coated.

Correspondingly, as shown in fig. 11, 12 and 13, the inner wall of the sputtering hole 22 is provided with four support blocks 26, the support blocks 26 are supported at the bottom of the workpiece 6 to be coated, the four support blocks 26 are arranged at the inner wall of the sputtering hole 22 at equal intervals, the height of the support blocks 26 is the same as that of the sputtering hole 22, and the upper edges of the side edges of the support blocks 26 are provided with inclined edges 25.

Wherein the inclined edge 25 is arranged along the upper edge of the support block 26 in order to facilitate that the first sputtered layer is not stopped by the support block 26 during rotation of the workpiece 6 to be coated.

The supporting blocks 26 are disposed on the inner wall of the sputtering hole 22 at equal intervals, that is, each time the workpiece 6 to be coated is rotated by 90 degrees, the blocked portion is blocked by the adjacent supporting blocks 26, so that the corresponding rotation angle needs to be controlled within 90 degrees, so that the workpiece 6 to be coated is not blocked by the supporting blocks 26 after rotating by a certain angle.

Because the workpiece 27 to be coated is circular, in order to drive the workpiece 6 to be coated to rotate in the rotation process of the top support 23, a large static friction force needs to exist between the workpiece 6 to be coated and the top support 23, therefore, the inner wall of the installation through groove 24 is provided with a friction inner wall 27, the friction inner wall 27 is abutted with the outer wall of the workpiece 6 to be coated, the top support 23 is circular, and the rotation of the top support 23 can drive the workpiece 6 to be coated to rotate under the drive of the friction inner wall 27.

Both the second embodiment and the third embodiment are to drive the workpiece 27 to be coated to rotate, so that the corresponding movable pushing member 3 adopts the following embodiments, as shown in fig. 9 and 14, the movable pushing member 3 includes a driving slot seat 32 disposed outside the top support 23, an arc slot 35 disposed in the driving slot seat 32, a driving slot 36 symmetrically disposed in the arc slot 35, and an electromagnetic coil 33 disposed in the driving slot 36; the electromagnetic coil 33 is electrically connected with a power supply, a magnetic block 34 is movably arranged in the arc groove 35, the magnetic block 34 is connected with a movable shaft lever 31, and the movable shaft lever 31 is arc-shaped.

The corresponding power connection circuit is opened, the electromagnetic coil 33 is electrified, a magnetic field is generated in the electromagnetic coil 33, and the magnetic block 34 gradually moves to the position of the electromagnetic coil 33 along the arc groove 35 under the action of magnetic force.

In the second embodiment, the rotation angle of the magnet 34 is 90 ° so that the edge of the workpiece 6 to be coated can still be aligned with the edge of the lower hole 222 after rotation.

In the third embodiment, the central angle corresponding to the moving track of the magnet 34 is larger than the central angle corresponding to the support block 26, that is, as shown in fig. 15, when the magnet 34 moves by about 45 °, the electromagnetic coil 33 is powered off, so that the whole moving angle of the magnet 34 is smaller than the central angle corresponding to the support block 26, and when the workpiece 6 to be coated rotates by about 45 °, the part shielded by the support block 26 in the initial state is exposed between the support blocks 26, so that coating can be performed.

According to the application, the size of the inclined edge 25 is determined according to the thickness of the coating, the thickness of the coating is fixed, and the height corresponding to the inclined edge 25 is larger than the thickness of the coating, so that the workpiece 6 to be coated directly rides up the inclined edge 25 in the moving process of the edge of the first sputtering layer.

The application also provides a processing method of the processing control system of the glass sputtering layer, which comprises the following steps:

step 100, placing a workpiece 6 to be coated in the mounting through groove 24;

step 200, the sputtering cathode 5 is bombarded, and metal atoms on the sputtering cathode are deposited on the workpiece 6 to be coated through the sputtering holes 22, so that a first sputtering layer is formed on the workpiece 6 to be coated in a region opposite to the sputtering holes 22;

step 300, the control module transmits a control signal to the movable pushing piece 3 after the time threshold value;

step 400, the movable pushing piece 3 pushes the top support 23 to move so as to drive the shielded part of the workpiece 6 to be coated to move close to the deposition area in the sputtering hole 22, and the shielded part of the workpiece 6 to be coated is displaced to be opposite to the sputtering hole 22 to form a second sputtering layer;

step 500, repeating step 300 and step 400 for a plurality of times to form a final sputtered layer on the workpiece 6 to be coated.

The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this application will occur to those skilled in the art, and are intended to be within the spirit and scope of the application.

Claims (10)

1. A system and method for controlling the processing of a glass sputtering layer are characterized by comprising:

the device comprises a mounting frame (1), wherein a mounting table (4) is arranged below the mounting frame, a sputtering cathode (5) is arranged on the mounting table (4), and the sputtering cathode (5) is right over and is positioned below the mounting frame (1);

the support assembly (2) is installed on the installation frame (1), the support assembly (2) is provided with a bottom support (21), a sputtering hole (22) is formed in the bottom support (21), a top support (23) is arranged on the bottom support (21), an installation through groove (24) is formed in the top support (23), a workpiece (6) to be coated is installed in the installation through groove (24), the installation through groove (24) is consistent with the workpiece (6) to be coated in size, at least part of the workpiece (6) to be coated is opposite to the sputtering hole (22), and the sputtering cathode (5) is bombarded, and metal atoms on the sputtering cathode are deposited on the workpiece (6) to be coated through the sputtering hole (22) to realize coating;

the movable pushing piece (3) is arranged on the top support (23), and the movable pushing piece (3) is used for pushing the top support (23) to move so as to drive the shielded part of the workpiece (6) to be coated to move close to a deposition area in the sputtering hole (22);

the movable pushing piece (3) is electrically connected with a control module, a time threshold value is preset in the control module, and the control module sends a control signal to the movable pushing piece (3) every time the time threshold value passes.

2. A glass sputtered layer processing control system according to claim 1 wherein the width of the workpiece (6) to be sputtered is greater than the width of the sputtered holes (22), the length of the workpiece (6) to be sputtered being no greater than the length of the sputtered holes (22);

the upper edge of the inner wall of the sputtering hole (22) is provided with an inclined edge (25).

3. A system for controlling the processing of a glass sputtering layer according to claim 2, characterized in that said movable pusher (3) comprises a movable shaft (31) connected to the side of said top support (23), a driving seat (32) arranged on the side of said top support (23), a solenoid (33) arranged inside said driving seat (32);

the electromagnetic coil (33) is electrically connected with a power supply, a magnetic block (34) is arranged at the end part of the movable shaft rod (31), the magnetic block (34) is arranged in the driving groove seat (32) in a sliding mode, and the movable shaft rod (31) and the magnetic block (34) are arranged along the moving direction of the workpiece (6) to be coated.

4. A system for controlling the processing of a sputtered layer of glass according to claim 1, wherein the sputtering hole (22) consists of an upper circular hole (221) and a lower hole (222), the upper circular hole (221) being arranged above the lower hole (222);

the shape and the size of the lower hole (222) are consistent with those of the workpiece (6) to be coated, the center positions of the upper round hole (221) and the lower hole (222) are overlapped, the corner positions of the lower hole (222) are opposite to the edge line of the upper round hole (221), and the thickness of the workpiece (6) to be coated is larger than that of the upper round hole (221).

5. The system for controlling the processing of the glass sputtering layer according to claim 4, wherein the inner wall of the lower hole (222) is provided with supporting blocks (26), the supporting blocks (26) are supported at the bottom of the workpiece (6) to be coated, and the number of the supporting blocks (26) is four and are respectively arranged on different edges of the lower hole (222);

the position of the support block (26) corresponding to the bottom of one side of the workpiece (6) to be coated is rotated by 90 degrees, no overlapping part exists between the position of the support block (26) corresponding to the bottom of the side of the workpiece (6) to be coated and the position of the support block (26) corresponding to the bottom of the side of the workpiece (6) to be coated, the height of the support block (26) is consistent with the height of the lower hole (222), and the upper edge of the side surface of the support block (26) is provided with an inclined edge (25).

6. A system for controlling the processing of a sputtered glass layer according to claim 1, wherein the sputtering holes (22) are round, and the sputtering holes (22) are in the same shape and size as the workpiece (6) to be coated.

7. The processing control system of a glass sputtering layer according to claim 6, wherein the inner wall of the sputtering hole (22) is provided with supporting blocks (26), the supporting blocks (26) are supported at the bottom of the workpiece (6) to be coated, the number of the supporting blocks (26) is four, and the supporting blocks are arranged at equal intervals on the inner wall of the sputtering hole (22);

the height of the supporting block (26) is the same as that of the sputtering hole (22), and the upper edge of the side edge of the supporting block (26) is provided with an inclined edge (25).

8. A system for controlling the processing of a glass sputtering layer according to claim 5 or 7, characterized in that the inner wall of the installation through groove (24) is provided with a friction inner wall (27), and the friction inner wall (27) is abutted with the outer wall of the workpiece (6) to be coated;

the top support (23) is circular.

9. A system for controlling the processing of a glass sputtering layer according to claim 8, characterized in that said movable pusher (3) comprises a driving socket (32) arranged outside said top support (23), an arc slot (35) arranged inside said driving socket (32), a driving slot (36) symmetrically arranged inside said arc slot (35) and an electromagnetic coil (33) arranged inside said driving slot (36);

the electromagnetic coil (33) is electrically connected with a power supply, a magnetic block (34) is movably arranged in the arc groove (35), a movable shaft lever (31) is connected to the magnetic block (34), and the movable shaft lever (31) is arc-shaped;

the central angle corresponding to the moving track of the magnetic block (34) is larger than the central angle corresponding to the supporting block (26).

10. A method of processing a glass sputtered layer processing control system according to claim 1 comprising the steps of:

step 100, placing a workpiece to be coated in a mounting through groove;

step 200, the sputtering cathode is bombarded, and metal atoms on the sputtering cathode are deposited on a workpiece to be coated through sputtering holes so as to form a first sputtering layer on the workpiece to be coated, which is opposite to the sputtering hole area;

step 300, the control module sends a control signal to the movable pushing piece after the time threshold value;

step 400, the movable pushing piece pushes the top support to move so as to drive the shielded part of the workpiece to be coated to move close to the deposition area in the sputtering hole, and the shielded part of the workpiece to be coated is shifted to be opposite to the sputtering hole to form a second sputtering layer;

step 500, repeating step 300 and step 400 for a plurality of times to form a final sputtering layer on the workpiece to be coated.