CN219287480U

CN219287480U - Film sticking device for packaging substrate

Info

Publication number: CN219287480U
Application number: CN202223162789.XU
Authority: CN
Inventors: 郑文玮; 请求不公布姓名
Original assignee: Quanzhou San'an Integrated Circuit Co ltd
Current assignee: Quanzhou San'an Integrated Circuit Co ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-06-30
Anticipated expiration: 2032-11-28

Abstract

The utility model discloses a film pasting device for a packaging substrate, which comprises a shell, a cover plate, an air bag and a fixing piece, wherein the air bag is arranged in a cavity surrounded by the shell, the cover plate is fixedly arranged in the cavity and is opposite to the air bag, the fixing piece is used for fixing the end part of a film and is placed on the air bag, one side of the packaging substrate, which is to be pasted with the film, is placed on the film, the cavity is provided with a vacuumizing device, the air bag is provided with an inflating device, the vacuumizing device vacuumizes the cavity to enable the cavity to be in a vacuum state, the inflating device inflates the air bag to enable the air bag to expand, one side of the packaging substrate, which is to be pasted with the film, is provided with a resin film, and the film and the resin film are pasted on the packaging substrate under the lamination of the air bag and cover plate, and are covered in a gap on one side surface of the film to be pasted. When the cavity is in a vacuum state, the air bag is inflated to apply certain pressure to the adhesive film and the packaging substrate, so that the adhesive film and the resin film can be completely attached in the gap, and a good film attaching effect is realized.

Description

Film sticking device for packaging substrate

Technical Field

The utility model relates to the field of semiconductor packaging, in particular to a film sticking device for a packaging substrate.

Background

In the process of packaging the surface acoustic wave filter chip, a resin film is generally used to cover and attach to a packaging substrate, so that a cavity is formed between the chip and the substrate. The resin film is usually attached to the surface of the package substrate by means of an adhesive film.

Referring to fig. 1, a conventional adhesive film laminating method is to use a roller to gradually press the adhesive film onto the surface of the package substrate, so that the adhesive film is laminated with the package substrate. The method has the characteristics of convenience in operation, low cost and the like, and is widely used in the semiconductor packaging industry. However, the method has obvious defects that due to the lack of a vacuumizing process, the surface of the packaging substrate with gap deviation cannot be tightly attached to the surface of the packaging substrate, the gap deviation cannot be completely filled with the adhesive material, and the risks of cutting edge breakage and product adhesive residue are possibly caused.

In view of the above, it is important to provide a film laminating apparatus capable of completely laminating a film and a resin film on a package substrate having a gap difference.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art and provides a film sticking device for packaging a substrate.

In order to achieve the above object, the technical scheme of the present utility model is as follows:

the utility model provides a pad pasting device of encapsulation base plate, includes casing, apron, gasbag and mounting, the gasbag is located in the cavity that the casing encloses, apron fixed mounting in the cavity, and with the gasbag sets up relatively, the mounting is used for fixed glued membrane's tip, and place in on the gasbag, wait to paste one side of membrane and place in on the glued membrane on the encapsulation base plate, the cavity is equipped with evacuating device, the gasbag is equipped with aerating device, evacuating device right the cavity evacuation makes be in the vacuum state in the cavity, aerating device is right the gasbag is inflated and is made the gasbag inflation, one side of encapsulation base plate wait to paste the membrane is taken to have the resin diaphragm under the pressfitting of gasbag and apron makes glued membrane and resin diaphragm laminating in on the encapsulation base plate to cover in the clearance of waiting one side surface of pasting.

Preferably, the airbag inflates and drives the fixing piece fixed with the adhesive film and the packaging substrate to move towards the cover plate until the other side of the packaging substrate is abutted to the cover plate, and the adhesive film and the resin film are attached to the packaging substrate under the lamination of the airbag and the cover plate.

Preferably, the surface of one side of the packaging substrate to be adhered with the film is provided with an array type gap.

Preferably, the package substrate comprises a substrate and chips, and a plurality of the chips are arranged on the substrate.

Preferably, the adhesive film and the resin film are completely attached to the surface of the chip and the gaps between two adjacent chips under the extrusion of the air bag.

Preferably, the chip is a surface acoustic wave filter, and when the adhesive film and the resin film are completely attached to the surface of the surface acoustic wave filter and the gaps between two adjacent surface acoustic wave filters, a cavity is formed between the surface acoustic wave filter and the substrate.

Preferably, the fixing member is an annular structure with a through hole in the middle, and the adhesive film covers the through hole and is attached to the annular structure.

Preferably, the package substrate is placed on a glue film covering the through hole.

Preferably, the adhesive film comprises a UV film.

Preferably, the cover plate is a hard steel plate.

Compared with the prior art, the utility model has the beneficial effects that:

(1) Under the condition that the cavity is in a vacuum state, the film sticking device of the packaging substrate provided by the utility model enables the adhesive film to be pressed on the packaging substrate under the extrusion of the air bag, realizes good sticking effect in a gap of the packaging substrate, and avoids the problems of cutting edge breakage and residual adhesive residue caused by poor sticking.

(2) The film pasting device of the packaging substrate provided by the utility model has high automation degree and stable structure, and can ensure that the chip on the packaging substrate is not damaged while ensuring enough pasting pressure under the action of the air bag.

(3) The film pasting device of the packaging substrate provided by the utility model is not only suitable for the packaging process of the surface adhesive film of the surface acoustic wave filter, but also suitable for the adhesive film pasting process of other packaging substrates with the gap difference on the surfaces.

Drawings

FIG. 1 is a schematic diagram of a conventional adhesive film mode in the prior art;

fig. 2 is a schematic diagram of a film laminating apparatus of a package substrate according to an embodiment of the present application;

FIG. 3 is a side view of an array of standoff gaps of a package substrate according to an embodiment of the present application;

FIG. 4 is a top view of an array type standoff of a package substrate according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a package substrate before film lamination according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a package substrate after lamination according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a package substrate cut after film lamination according to an embodiment of the present application;

reference numerals: 1. a housing; 2. an air bag; 3. a fixing member; 4. an adhesive film; 5. packaging a substrate; 51. a substrate base; 52. a chip; 53. a resin film; 6. a cover plate; 7. a vacuum pumping device; 8. and an inflator.

Detailed Description

The utility model is further explained below with reference to the drawings and specific embodiments. The drawings of the present utility model are merely schematic to facilitate understanding of the present utility model, and specific proportions thereof may be adjusted according to design requirements. The definition of the context of the relative elements and the front/back of the figures described herein should be understood by those skilled in the art to refer to the relative positions of the elements and thus all the elements may be reversed to represent the same elements, which are all within the scope of the present disclosure.

Referring to fig. 2, an embodiment of the present application provides a film sticking device for packaging a substrate, including a housing 1, a cover plate 6, an air bag 2 and a fixing member 3, wherein the air bag 2 is disposed in a cavity enclosed by the housing 1, the air bag 2 is a soft air bag 2, and the volume of the inflated air bag is inflated. The fixing piece 3 is used for fixing the end part of the adhesive film 4 and is placed on the air bag 2, specifically, the fixing piece 3 is of a ring-shaped structure with a through hole in the middle, and the adhesive film 4 covers the through hole and is attached to the ring-shaped structure. One side of the packaging substrate 5 to be pasted with a film is arranged on the adhesive film 4 covered on the through hole, and the adhesive film 4 has a certain tension under the fixation of the fixing piece 3 and is arranged between one side surface of the packaging substrate 5 to be pasted with the film and the air bag 2. The fixing member 3 to which the adhesive film 4 is fixed and the package substrate 5 are provided between the airbag 2 and the cover plate 6, and preferably, the cover plate 6 is a hard steel plate. The cavity is equipped with evacuating device 7, and gasbag 2 is equipped with aerating device 8, evacuating device 7 vacuums the cavity, makes the cavity be in the vacuum state, and aerating device 8 inflates gasbag 2 and makes gasbag 2 inflation, and the resin diaphragm 53 has been taken to one side of waiting the pad pasting on the encapsulation base plate 5, makes glued membrane 4 and resin diaphragm 53 laminating on encapsulation base plate 5 under the pressfitting of gasbag 2 and apron 6 to cover in the clearance of waiting one side surface of pad pasting.

Referring to fig. 3 and 4, a package substrate 5 to which the film laminating apparatus according to the embodiment of the present application is applied has an array type offset gap on a side surface to be laminated. The adhesive film 4 is fixed by the fixing piece 3, has a certain tension, the packaging substrate 5 is directly placed on the adhesive film 4, the packaging substrate 5 and the fixing piece 3 fixed with the adhesive film 4 are placed on the air bag 2, one side of the packaging substrate 5 to be adhered with the film is placed on the surface of one side of the adhesive film 4 far away from the air bag 2, so that the adhesive film 4 and one side of the packaging substrate 5 to be adhered with the film are oppositely arranged, when the cavity is in a vacuum state, the air bag 2 is inflated to achieve a required pressure value, the adhesive film 4 and the resin film 53 can be completely adhered on the packaging substrate 5 under the extrusion of the air bag 2 and are filled in the gap, and the air between the gap and the adhesive film 4 and the resin film 53 is avoided, so that a good film adhering effect can be obtained.

In a specific embodiment, the fixing member 3 with the adhesive film 4 fixed thereon and the packaging substrate 5 are placed on the air bag 2, and after the air bag 2 is inflated, the fixing member 3 with the adhesive film 4 fixed thereon and the packaging substrate 5 are driven to move toward the cover plate 6 until the other side of the packaging substrate 5 abuts against the cover plate 6, and the adhesive film 4 and the resin film 53 are attached to the packaging substrate 5 under the lamination of the air bag 2 and the cover plate 6. The cover plate 6 mainly plays a role in reaction force, and is matched with the air bag 2 to realize the joint of the adhesive film 4, the resin film 53 and the packaging substrate 5.

In a specific embodiment, the package substrate 5 includes a substrate 51 and chips 52, and a plurality of chips 52 are disposed on the substrate 51, and a gap exists between two adjacent chips 52. Under the condition that the cavity is in a vacuum state, the air bag 2 is inflated through the inflation device 8 and then expands in volume, the adhesive film 4 is driven to move towards the packaging substrate 5, a certain pressure is applied, the adhesive film 4 is completely attached to the packaging substrate 5, meanwhile, the resin film 53 is also completely attached to the substrate 51 under the action of the adhesive film 4, gaps and air do not exist between the adhesive film 4 and the resin film 53 in the gap and the substrate 51, and a good film attaching effect is achieved. Specifically, the chip 52 is a surface acoustic wave filter, and when the adhesive film 4 and the resin film 53 are completely attached to the surface of the surface acoustic wave filter and the gap between two adjacent surface acoustic wave filters, a cavity is formed between the surface acoustic wave filter and the substrate 51, so as to realize the function of the surface acoustic wave filter. Specifically, the adhesive film 4 includes a UV film. In other embodiments, other suitable adhesive films 4 may be used.

The film pasting step of the film pasting device of the package substrate of the embodiment of the application is as follows:

(1) Referring to fig. 5, before the film is attached, a resin film 53 is mounted on the surface of the chip 52, and is not fully attached to the gap between two adjacent chips 52. Preferably, the fixing member 3 is an iron ring, the adhesive film 4 is fixed on the iron ring and covers the through hole in the middle of the iron ring, and the packaging substrate 5 is placed on the adhesive film 4 in the through hole.

(2) Referring to fig. 6, the adhesive film 4 and the resin film 53 are completely adhered to the surfaces of the chips 52 and the gaps between the adjacent two chips 52 under the extrusion of the airbag 2.

(3) Referring to fig. 7, the package substrate 5 is cut, specifically, on a gap, wherein the resin film 53 is completely cut off, and the adhesive film 4 is partially cut off, so that the adhesive film 4 is easily removed later. Finally, the adhesive film 4 is removed to form a single chip 52 with the resin film 53 attached thereto.

The embodiment of the application provides a pad pasting device of package substrate has evacuation and gasbag extrusion function, under the prerequisite of evacuation, take out the cavity with the bubble in array formula offset clearance, then adopt gasbag 2 extrusion, with the whole pressfitting of glued membrane 4 to package substrate 5 surface, can realize glued membrane 4 and resin diaphragm 53 and package substrate 5 surface formation closely laminating, glued membrane 4 and resin diaphragm 53 can effectively fill in the offset clearance, obtain good pad pasting effect, have very big benefit to the outward appearance of cutting quality and product.

The above embodiments are only for further illustrating the technical solution of the present utility model, but the present utility model is not limited to the embodiments, and any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present utility model falls within the protection scope of the technical solution of the present utility model.

Claims

1. The utility model provides a pad pasting device of encapsulation base plate which characterized in that: the packaging substrate comprises a shell, a cover plate, an air bag and a fixing piece, wherein the air bag is arranged in a cavity surrounded by the shell, the cover plate is fixedly arranged in the cavity and is opposite to the air bag, the fixing piece is used for fixing the end part of a film and is arranged on the air bag, one side of a packaging substrate to be adhered with the film is arranged on the film, the cavity is provided with a vacuumizing device, the air bag is provided with an inflating device, the vacuumizing device vacuumizes the cavity to enable the cavity to be in a vacuum state, the inflating device inflates the air bag to enable the air bag to expand, one side of the packaging substrate to be adhered with the film is provided with a resin film, and the film and the resin film are attached to the packaging substrate under the lamination of the air bag and the cover plate and are covered in a gap on one side surface of the film to be adhered with the film.

2. The film laminating device of the package substrate according to claim 1, wherein: the air bag is inflated to expand and then drives the fixing piece fixed with the adhesive film and the packaging substrate to move towards the cover plate until the other side of the packaging substrate is abutted to the cover plate, and the adhesive film and the resin film are completely attached to the packaging substrate under the lamination of the air bag and the cover plate.

3. The film laminating device of the package substrate according to claim 1, wherein: and one side surface of the packaging substrate to be adhered with the film is provided with an array type gap.

4. The film laminating device of the package substrate according to claim 1, wherein: the packaging substrate comprises a substrate and chips, and a plurality of chips are arranged on the substrate.

5. The film laminating apparatus for a package substrate according to claim 4, wherein: and the adhesive film and the resin film are completely attached to the surfaces of the chips and gaps between two adjacent chips under the extrusion of the air bags.

6. The film laminating apparatus for a package substrate according to claim 4, wherein: the chip is a surface acoustic wave filter, and when the adhesive film and the resin membrane are completely attached to the surface of the surface acoustic wave filter and gaps between two adjacent surface acoustic wave filters, a cavity exists between the surface acoustic wave filter and the substrate.

7. The film laminating device of the package substrate according to claim 1, wherein: the fixing piece is of an annular structure with a through hole in the middle, and the adhesive film covers the through hole and is attached to the annular structure.

8. The film laminating apparatus for a package substrate according to claim 7, wherein: the packaging substrate is placed on the adhesive film covering the through hole.

9. The film laminating device of the package substrate according to claim 1, wherein: the adhesive film comprises a UV film.

10. The film laminating device of the package substrate according to claim 1, wherein: the cover plate is a hard steel plate.