CN219285341U

CN219285341U - Signal testing device and pressure testing substrate

Info

Publication number: CN219285341U
Application number: CN202223610393.7U
Authority: CN
Inventors: 冯爱珍; 顾红伟; 胡晓辉; 薛玉妮
Original assignee: Shenzhen Shichuangyi Electronic Co ltd
Current assignee: Shenzhen Shi Creative Electronics Co.,Ltd.
Priority date: 2022-12-31
Filing date: 2022-12-31
Publication date: 2023-06-30
Anticipated expiration: 2032-12-31

Abstract

The application discloses a signal testing arrangement and pressure test base plate relates to the test fixture field. The signal testing device comprises a pressure testing substrate and a testing jig, wherein a positioning hole and a testing needle are arranged on the pressure testing substrate, a positioning column and a testing point are arranged on the testing jig, the positioning hole is matched with the positioning column, and the testing point is connected with the testing needle; the chip is mounted on the pressure test substrate, pins of the chip are connected with the test pins, and the pressure test substrate is mounted on the test fixture to perform signal test on the chip. The signal testing device improves the accuracy and the testing efficiency of the testing result.

Description

Signal testing device and pressure testing substrate

Technical Field

The application relates to the field of test jigs, in particular to a signal testing device and a pressure testing substrate.

Background

With the development of electronic technology, the integration degree of electronic products is higher and higher, the structure is finer and finer, the procedures are more and more, the manufacturing process is more and more complex, and defects generated in the manufacturing process can be amplified. For a qualified electronic product, not only is a higher performance index required, but also the stability of the electronic product is higher, and the stability of the electronic product depends on factors such as rationality of design, performance of components and the manufacturing process of the whole machine. At present, high-temperature aging technology is generally adopted at home and abroad to improve the stability and reliability of electronic products, and hidden dangers generated in the production processes of defects, welding, assembly and the like of components can be exposed in advance through high-temperature aging, so that the products leaving the factory can withstand time.

After packaging, the chip is usually subjected to multiple tests such as FT (Final Test) before batch production, so as to ensure the factory quality of the chip, when pressure Test and signal Test are performed, the chip is firstly subjected to the pressure Test, then the chip mounted on the substrate is required to be dismounted when the signal Test is performed, and then the chip is mounted in a Test fixture for internal Test and monitoring Test of various performance parameter changes of the chip.

Disclosure of Invention

The purpose of this application is to provide a signal testing device and pressure test base plate, has improved the accuracy and the test efficiency of test result.

The application discloses a signal testing device, which is used for carrying out signal testing on a chip and comprises a pressure testing substrate and a testing jig, wherein a positioning hole and a testing needle are arranged on the pressure testing substrate, a positioning column and a testing point are arranged on the testing jig, the positioning hole is matched with the positioning column, and the testing point is connected with the testing needle; the chip is mounted on the pressure test substrate, pins of the chip are connected with the test pins, and the pressure test substrate is mounted on the test fixture to perform signal test on the chip.

Optionally, the test needle penetrates through the pressure test substrate, and the thickness of the pressure test substrate is between 1.4 and 1.8 mm.

Optionally, the test fixture includes test circuit board and bed hedgehopping seat, reference column and test point set up on the bed hedgehopping seat, bed hedgehopping seat sets up on the test circuit board and with test circuit board connects.

Optionally, a universal serial interface is provided on the test circuit board, and the universal serial interface is used for connecting with an external test device.

Optionally, the test fixture further includes a test base and a cover plate, the cover plate is rotatably arranged, a containing groove is formed in the test base, the test circuit board and the heightening seat are arranged in the containing groove, and the cover plate rotates to cover the containing groove.

Optionally, an avoidance groove is formed in the cover plate, and the size of the avoidance groove is larger than or equal to that of the chip; when the cover plate rotates to cover the accommodating groove, the chip on the pressure test substrate is positioned in the avoidance groove.

Optionally, two positioning columns are provided, the two positioning columns are respectively arranged on the heightening seat and are obliquely aligned, and the heights of the two positioning columns are the same.

Optionally, the test base is provided with a threaded hole, the cover plate is provided with a bolt, and when the cover plate rotates to cover the accommodating groove, the bolt is connected with the threaded hole in a matched manner.

Optionally, the test base is made of an insulating material.

The application also discloses a pressure test substrate which is applied to the signal test device, wherein the pressure test substrate is provided with a positioning hole and a test needle, and the test needle and the positioning hole penetrate through the pressure test substrate; the chip is welded on the pressure test substrate, and pins of the chip are connected with the test pins.

The signal testing device of this application through setting up the chip on pressure test base plate, makes the chip install can carry out pressure test and signal test when pressure test base plate, only need change different testing arrangement can, the chip need not to dismantle and weld the process of installing when carrying out pressure test and signal test, and then the test result when making signal test is more accurate, can not receive the influence that brings when dismantling chip and welding installation chip, improve the accuracy of test, and need not to dismantle and weld the installation, also improve to a certain extent the efficiency of software testing.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:

fig. 1 is a schematic structural diagram of a signal testing device according to a first embodiment of the present application;

FIG. 2 is a schematic structural diagram of a test fixture according to a first embodiment of the present application;

FIG. 3 is a schematic diagram of a test fixture according to a first embodiment of the present application;

FIG. 4 is a schematic view of the structure of the signal testing device according to the first embodiment of the present application with the test base and cover plate removed;

fig. 5 is a schematic structural view of a pressure test substrate and a chip according to a first embodiment of the present application;

FIG. 6 is a schematic structural view of a pressure test substrate according to a first embodiment of the present application;

fig. 7 is a schematic structural view of a pressure test substrate according to a second embodiment of the present application.

100, a signal testing device; 110. a pressure test substrate; 111. positioning holes; 112. a test needle; 120. testing a jig; 121. testing the circuit board; 122. a heightening seat; 123. positioning columns; 124. a test point; 125. a universal serial interface; 130. a test base; 131. a receiving groove; 132. a threaded hole; 140. a cover plate; 141. an avoidance groove; 142. a bolt; 200. and a chip.

Detailed Description

It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.

In addition, terms of the azimuth or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on the azimuth or relative positional relationship shown in the drawings, are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.

Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

The present application will be described in detail below with reference to the drawings and optional embodiments, and it should be noted that, without conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

As shown in fig. 1 to 6, as a first embodiment of the present application, a signal testing device 100 is disclosed for performing a signal test on a chip 200, where the signal testing device 100 includes a pressure testing substrate 110 and a testing jig 120, a positioning hole 111 and a testing needle 112 are provided on the pressure testing substrate 110, a positioning column 123 and a testing point 124 are provided on the testing jig 120, the positioning hole 111 is matched with the positioning column 123, and the testing point 124 is connected with the testing needle 112; the chip 200 is mounted on the pressure test substrate 110, the test tube of the chip 200 is connected with the test needle 112, and the pressure test substrate 110 is mounted on the test fixture 120 to perform signal test on the chip 200.

When the signal testing device 100 is used, the chip 200 to be tested is firstly welded and mounted on the pressure testing substrate 110, the pressure testing substrate 110 can be firstly used for performing pressure testing, the pressure testing substrate 110 is firstly used for performing pressure testing, a force is applied by the pressure testing equipment, the pressure testing substrate 110 is bent at least 2mm or the bending degree of the pressure testing substrate 110 is defined according to the standard required by the pressure testing, the applied force is continued until the pressure testing is finished, then the pressure testing substrate 110 is taken out from the pressure testing equipment and mounted on the testing jig 120, at the moment, since the pins of the chip 200 are connected with the testing pins 112 on the pressure testing substrate 110, the testing jig 120 can be electrically connected with the chip 200 through the testing pins 112 on the pressure testing substrate 110 to perform signal testing on the chip 200, in this way, the chip 200 can be mounted on the pressure test substrate 110 by only providing one pressure test substrate 110, the pressure test can be performed by the pressure test substrate 110, and after the pressure test is performed, the pressure test substrate 110 can be directly mounted on the test jig 120, the test jig 120 is connected with the chip 200 by the test needle 112 on the pressure test substrate 110 to perform the signal test, the chip 200 on the pressure test substrate 110 is not required to be dismounted and mounted in the test jig 120 to perform the test, the process of dismounting the chip 200 is reduced, so that the result of the signal test is more accurate, the variation of the test parameters caused by the influence of the chip 200 during the dismounting and welding mounting process is not influenced, in general, the signal test device 100 in the embodiment is provided by arranging the chip 200 on the pressure test substrate 110, the chip 200 can be subjected to pressure test and signal test when being mounted on the pressure test substrate 110, only different test devices are required to be replaced, the chip 200 does not need to be dismounted and welded in the process of pressure test and signal test, the test result in the process of signal test is more accurate, the influence caused by dismounting the chip 200 and welding the chip 200 is avoided, the test accuracy is improved, the dismounting and welding are not required, and the test efficiency of the chip 200 test is improved to a certain extent.

In this embodiment, the test needle 112 penetrates the pressure test substrate 110, the test needle 112 is vertically arranged and penetrates, so that the designed test needle 112 is not easy to be damaged or broken when the pressure test is performed, of course, the test needle 112 can penetrate the pressure test substrate 110 in other arrangement modes, for example, the test needle 112 is designed into an L shape or a Z shape, only the test needle 112 can establish a connecting channel capable of connecting the front side and the back side of the pressure test substrate 110, a designer can select and design according to actual conditions, only the test needle 112 can bear the pressure during the pressure test, and damage or breakage is not easy to occur; the thickness of the pressure test substrate 110 is between 1.4 mm and 1.8mm, the size of the pressure test substrate 110 is 100mm×40mm, the chip 200 and the test needle 112 are mounted at the center of the pressure test substrate 110, so that the pressure test device only needs to apply pressure to the middle of the pressure test substrate 110 when the chip 200 and the pressure test substrate 110 are subjected to pressure test, and compared with other parts of the pressure test substrate 110, the pressure test substrate 110 is less prone to fracture when pressure is applied to the middle of the pressure test substrate 110.

As shown in fig. 2 and 3, the test fixture 120 includes a test circuit board 121 and a raised seat 122, the positioning columns 123 and test points 124 are disposed on the raised seat 122, the raised seat 122 is disposed on the test circuit board 121 and is connected with the test circuit board 121, one end of the test pins 112 of the pressure test substrate 110 is connected with the pins of the chip 200, the other end of the test pins is connected with the test points 124 of the raised seat 122, and when the pressure test substrate 110 is mounted on the test fixture 120, only the positioning holes 111 on the pressure test substrate 110 are required to be aligned with the positioning columns 123 on the raised seat 122, the operation is convenient, in this embodiment, the positioning columns 123 are disposed on the raised seat 122 and are obliquely aligned, the heights of the two positioning columns 123 are the same, the number of the positioning holes 111 is the same as the number of the positioning columns 123, and the positions of the test points 111 on the pressure test substrate 110 are also connected with the test points 124 of the test point, and when the test substrate 110 is mounted on the high seat 123, as shown in fig. 3, the test pins 123 are also required to be mounted on the high seat 122, and the test substrate 122 is electrically connected with the test circuit board 122, and the signal can be prevented from being damaged by the test substrate 122, and the signal can be only the positioning columns 124 when the test substrate is mounted on the test substrate 122, and the test seat is mounted on the test substrate 122, and the circuit board is electrically connected with the test board, and the test board is required to be electrically connected with the test board 122, and the test board is mounted on the test board and the test board 200.

Further, the test circuit board 121 is provided with a universal serial interface 125, and the universal serial interface 125 is used for being connected with an external test device, as shown in fig. 3, since the universal serial interface 125 is disposed at one end of the test circuit board 121, the test jig 120 needs to be provided with a raised seat 122, so that when the pressure test substrate 110 is mounted on the test jig 120, the pressure test substrate 110 will not be extruded to the universal serial interface 125 to damage the test circuit board, and it should be noted that if a designer adopts other interfaces or places the universal serial interface 125, if other interfaces or the universal serial interface 125 will not affect the flatness of the surface of the test circuit board 121 near the pressure test substrate 110, the test jig 120 may not be provided with the raised seat 122, the designer may select the design according to the actual situation without limitation.

As shown in fig. 2 and 3, the test fixture 120 further includes a test base 130 and a cover plate 140, the cover plate 140 is rotatably disposed, the test base 130 is provided with a receiving groove 131, the test circuit board 121 and the raised seat 122 are disposed in the receiving groove 131, and the cover plate 140 rotates to cover the receiving groove 131; when in use, the pressure test substrate 110 is firstly arranged on the heightening seat 122, then the cover plate 140 is rotated, the cover plate 140 covers the accommodating groove 131, and the cover plate 140 props against the pressure test substrate 110 to ensure that the pressure test substrate 110 is not easy to separate from the heightening seat 122, thereby avoiding parameter errors of signal test caused by the separation of the pressure test substrate 110 and the heightening seat 122 during the signal test; further, the test base 130 is provided with a threaded hole 132, the cover plate 140 is provided with a bolt 142, when the cover plate 140 rotates to cover the accommodating groove 131, the bolt 142 is cooperatively connected with the threaded hole 132, so that when the cover plate 140 rotates to cover the accommodating groove 131, the cover plate 140 can be prevented from being accidentally opened by the cooperative connection of the bolt 142 and the threaded hole 132, and the pressure test substrate 110 can be limited by the cooperation of the bolt 142 and the threaded hole 132, and the separation distance between the cover plate 140 and the pressure test substrate 110 can be controlled by rotating the bolt 142, so that the pressure test substrate 110 is prevented from being separated from the raised seat 122; in order to avoid damage to the chip 200 mounted on the pressure test substrate 110 caused by extrusion of the cover plate 140, the cover plate 140 is provided with an avoidance groove 141, the dimension of the avoidance groove 141 is greater than or equal to the dimension of the chip 200, and when the cover plate 140 rotates to cover the accommodating groove 131, the chip 200 on the pressure test substrate 110 is located in the avoidance groove 141, so as to prevent the cover plate 140 from extruding the chip 200 on the pressure test substrate 110; the test base 130 is made of an insulating material, so as to avoid the damage to the test circuit board 121 or the chip 200 or the influence on the accuracy of the parameters of the signal test caused by the conduction of the test base 130 when the pressure test is performed.

It should be noted that, the pressure test substrate 110 is a PCB substrate, and the material of the pressure test substrate 110 is a material with better elastic fatigue resistance, so that the pressure test substrate 110 can withstand the pressure during the pressure test without breaking.

As shown in fig. 7, as a second embodiment of the present application, a pressure test substrate 110 is disclosed and applied to the signal test device 100 as described above, a positioning hole 111 and a test needle 112 are provided on the pressure test substrate 110, the test needle 112 and the positioning hole 111 penetrate through the pressure test substrate 110, the chip 200 is soldered on the pressure test substrate 110, and pins of the chip 200 are connected with the test needle 112.

After the chip 200 is mounted on the pressure test substrate 110 of the embodiment, the pressure test substrate can be used in a pressure test device to perform pressure test on the chip 200, and can also be mounted on the test fixture 120 to perform signal test, so that the chip 200 does not need to be dismounted and welded for mounting when performing pressure test and signal test, further, the test instability caused by the steps of dismounting and welded for mounting when performing signal test on the chip 200 is reduced, and the test accuracy and test efficiency are improved.

It should be noted that, the inventive concept of the present application may form a very large number of embodiments, but the application documents have limited space and cannot be listed one by one, so that on the premise of no conflict, the above-described embodiments or technical features may be arbitrarily combined to form new embodiments, and after the embodiments or technical features are combined, the original technical effects will be enhanced.

The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.

Claims

1. The signal testing device is used for testing signals of chips and is characterized by comprising a pressure testing substrate and a testing jig, wherein a positioning hole and a testing needle are arranged on the pressure testing substrate, a positioning column and a testing point are arranged on the testing jig, the positioning hole is matched with the positioning column, and the testing point is connected with the testing needle;

the chip is mounted on the pressure test substrate, pins of the chip are connected with the test pins, and the pressure test substrate is mounted on the test fixture to perform signal test on the chip.

2. The signal testing device of claim 1, wherein the test needle penetrates the pressure testing substrate, and the thickness of the pressure testing substrate is between 1.4 and 1.8 mm.

3. The signal testing device of claim 1, wherein the test fixture comprises a test circuit board and a raised seat, the positioning posts and test points are disposed on the raised seat, and the raised seat is disposed on the test circuit board and connected to the test circuit board.

4. A signal testing device according to claim 3, wherein the test circuit board is provided with a universal serial interface for connection with an external testing device.

5. The signal testing device of claim 3, wherein the test fixture further comprises a test base and a cover plate, the cover plate is rotatably disposed, the test base is provided with a receiving groove, the test circuit board and the raised seat are disposed in the receiving groove, and the cover plate rotates to cover the receiving groove.

6. The signal testing device according to claim 5, wherein the cover plate is provided with an avoidance groove, and the dimension of the avoidance groove is greater than or equal to the dimension of the chip;

when the cover plate rotates to cover the accommodating groove, the chip on the pressure test substrate is positioned in the avoidance groove.

7. The signal testing device according to claim 3, wherein two positioning columns are provided, the two positioning columns are respectively arranged on the elevating seat and are arranged in an inclined alignment manner, and the heights of the two positioning columns are the same.

8. The signal testing device of claim 5, wherein the test base has a threaded hole, the cover plate has a bolt, and the bolt is cooperatively coupled with the threaded hole when the cover plate is rotated to cover the receiving slot.

9. The signal testing device of claim 5, wherein the test base is made of an insulating material.

10. A pressure test substrate for use in a signal testing device according to any one of claims 1 to 9, wherein the pressure test substrate is provided with a positioning hole and a test needle, and the test needle and the positioning hole penetrate through the pressure test substrate;

the chip is welded on the pressure test substrate, and pins of the chip are connected with the test pins.