CN110441031A - Compression bonding apparatus - Google Patents
Compression bonding apparatus Download PDFInfo
- Publication number
- CN110441031A CN110441031A CN201910681264.0A CN201910681264A CN110441031A CN 110441031 A CN110441031 A CN 110441031A CN 201910681264 A CN201910681264 A CN 201910681264A CN 110441031 A CN110441031 A CN 110441031A
- Authority
- CN
- China
- Prior art keywords
- die body
- bonding apparatus
- compression bonding
- bottom plate
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
This announcement provides a kind of compression bonding apparatus; compression bonding apparatus includes bottom plate and die body; die body is arranged on bottom plate and connect with bottom plate; wherein; it include multiple probes on bottom plate; it include multiple pin holes on die body; pin hole and probe correspond, while the material of die body is flexible material, when carrying out crimping test; probe is inserted into pin hole; since the rigidity of flexible die body is less than the rigidity of crimp head, when crimp head and pin hole dislocation, flexible deformation occurs for die body and crimp head remains unchanged; and then crimp head is effectively protected, improve the service life of product.
Description
Technical field
This announcement is related to field of display technology more particularly to a kind of compression bonding apparatus.
Background technique
Display panel is widely used in the electronic devices such as mobile phone, computer, in order to guarantee making for electronic device screen
With the service life, need to carry out a series of performance test to display panel, after the indices of display panel test meet the requirements,
Qualified products can be just determined as.
The performance test of display panel is usually that display panel is placed in test fixture, is led using crimp connection fixture connection
Continuing to test after logical.In the test step of existing display panel, test can be lighted by multi-pass, be used for pair
The yield of front process monitors or control, and per pass manufacturing process can then carry out lighting detection, some techniques after finishing
When even will do it 2 times, 3 times or repeatedly lighting detects, and detecting every time, the port to product, i.e. wiring board connector are required,
It is crimped, every flake products can all carry out 4~7 crimping process in mould group.And when being crimped to port, it every time can be to line
The connector of road plate causes to be lost, especially in the case where deviation or manual feeding position deviation occurs in aligning accuracy, crimping
The probe that is easy to appear at bayonet or even crimping of head is collapsed, is collapsed the problems such as scarce, and this defective products and loss product substantially all without
Method is repaired, and serious influence assembling product and service life reduce the yield of shipment, meanwhile, it need to also increase in producing line
Visual examination station, additional increase production cost.
In conclusion, when carrying out test connection to display panel, there is connecing for wiring board in existing compression bonding apparatus
Head is easy to appear bayonet, and when being attached with compression bonding apparatus, and test probe is easy to collapse, collapse the problems such as scarce, reduces product
Factory yield, increase production cost.
Summary of the invention
This announcement provides a kind of compression bonding apparatus, solves in existing compression bonding apparatus equipment to display panel connecting test
When, compression bonding apparatus is easily damaged the connector of wiring board, causes connector to buckle, while test probe being caused to collapse, collapse scarce, is produced into
The problems such as this is high.
In order to solve the above technical problems, the technical solution that this announcement embodiment provides is as follows:
According to this announcement embodiment in a first aspect, providing a kind of compression bonding apparatus, comprising:
Bottom plate；
Die body, the die body are arranged on the bottom plate and connect with the bottom plate；
Wherein, include multiple probes on the bottom plate, include multiple pin holes on the die body, the pin hole runs through the mould
Body, and the material stiffness of the die body is less than the material stiffness to pressure measuring tie-in, the pin hole and the probe correspond, when
When the compression bonding apparatus is closed, the probe is inserted into the pin hole.
According to one embodiment of this announcement, the material of the die body includes flexible material.
According to one embodiment of this announcement, the upper end of the pin hole includes the first stepped hole, the aperture of first stepped hole
Lower end along the upper end of first stepped hole to first stepped hole is gradually reduced.
According to one embodiment of this announcement, the total height of the pin hole and first stepped hole is greater than the length of the probe
Degree.
According to one embodiment of this announcement, the setting of the probe array is on the bottom plate, between the probe each other absolutely
Edge.
According to one embodiment of this announcement, the bottom plate is printed circuit board, and the printed circuit board and the probe are electrical
Connection.
According to one embodiment of this announcement, the distance between the die body and the bottom plate be it is adjustable, the die body is suitable
It is moved up and down in along the probe direction.
According to one embodiment of this announcement, the die body further includes bolt, described to be bolted the die body and the bottom plate.
According to one embodiment of this announcement, the die body further includes positioning component, the positioning component to position it is described to
Slowdown monitoring circuit plate.
According to one embodiment of this announcement, the positioning component includes locating slot, and the die body is arranged in the locating slot
Upper surface.
In conclusion this announcement embodiment has the beneficial effect that
This announcement provides a kind of compression bonding apparatus, and the compression bonding apparatus includes bottom plate and die body, and probe, mould are provided on bottom plate
Pin hole corresponding with probe is provided on body, in test, probe is inserted into pin hole, meanwhile, device under test passes through the pin hole
It is connected with the probe, and electrically conducts.In this announcement, die body is flexible die body, when device under test is crimped on the mould
When on body, since flexible material hardness is small, the parts to be tested will not be damaged, meanwhile, also ladder is arranged in one end of pin hole in this announcement
Hole, stepped hole can play guiding role, so that installation is easy, and can be well protected the interface of device under test in test,
And then improve the factory yield of product.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of announcement
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the compression bonding apparatus stereochemical structure decomposing schematic representation of this announcement embodiment；
Fig. 2 is the die body sectional view of this announcement embodiment；
Fig. 3 is that this discloses the die body structural schematic diagram of another embodiment；
Structural schematic diagram when Fig. 4 is connecting test in this announcement embodiment.
Specific embodiment
Below in conjunction with the attached drawing in this announcement embodiment, the technical solution in this announcement embodiment is carried out clear, complete
Site preparation description.Obviously, described embodiment is only this announcement a part of the embodiment, instead of all the embodiments.It is based on
Embodiment in this announcement, those skilled in the art's every other implementation obtained without creative efforts
Example belongs to the range of this announcement protection.
In this revealed embodiment, as shown in FIG. 1, FIG. 1 is the decomposition of the compression bonding apparatus stereochemical structure of this announcement embodiment
Schematic diagram.The crimping transposition 100 of this announcement includes bottom plate 101 and die body 103.It wherein, further include multiple on the bottom plate 101
Probe 102 is additionally provided with multiple pin holes 104 on die body 103, and pin hole 401 is through-hole, runs through entire die body 103.
The probe 102 can be vertical setting on bottom plate 101, in display device, bottom plate is mainly printed circuit board,
Such as flexible circuit board, by bottom plate 101, compression bonding apparatus 100 is connected with external test equipment.Probe 102 predominantly connects
Part, multiple probes 102 can array setting on bottom plate 101, with bottom plate 101 be electrically connected.According to the model of specific product, cloth
Set the position of probe 102 and the specification of probe 102.Meanwhile it is insulated from each other between each probe 102, compression bonding apparatus is being connected to
Afterwards, will not be short-circuit between probe 102, it ensure that the safety of device to be detected.
Specifically, the material of die body 103 is flexible material in this announcement embodiment, die body 103 is flexible die body.Mould
Multiple pin holes 104 are additionally provided on body 103, pin hole 104 is one-to-one relationship with probe 102, guarantees die body 103 and bottom plate
After 101 combine, each probe 102 can be inserted into pin hole 104.
Crimp head 106 is provided on device under test 107, it, first will be to be measured when device under test 107 carries out lighting test
Device 107 is connect with the compression bonding apparatus 100 in this announcement embodiment, by the pin hole 104 on die body 103, crimp head 106 and spy
Needle 102 is inserted into pin hole 104, and in turn, crimp head 106 is contacted with probe 102, forms complete test circuit.
In existing design, since each device under test 107 is required to repeatedly light test, and in test, due to crimping
Device design is unreasonable, and crimp head 106 is caused to damage, and then influences product yield, increase cost, and the pressure of this announcement embodiment
In connection device, die body 103 is flexible die body, and flexible die body 103 has certain flexibility, when the crimp head of device under test 107
106 when being crimped in pin hole 104, can proper testing；When crimp head 106 is that pin hole 104 aligns uneven, part crimp head
106 can be in the outside of pin hole 104, and the rigidity of crimp head 106 is greater than the rigidity of die body 103 flexible, the corresponding pressure of die body 103
Meeting place can prevent crimp head 106 from deforming, to effectively protect crimping by compressive deformation, without damaging crimp head 106 by pressure
First 106.
Also settable positioning component on die body 103, such as location hole 105, or the setting positioning on the upper surface of die body 103
Slot specifically may be provided on the fringe region of the upper surface of die body 103, in this way, carrying out lighting test to circuit board under test
When, easier the crimp head on circuit board under test can be installed in pin hole, improve the efficiency of detection.
Preferably, as shown in Fig. 2, Fig. 2 is the die body sectional view of this announcement embodiment.Die body 200 include pin hole 201 and
Location hole 202.Probe on pin hole 201 and bottom plate corresponds, meanwhile, the lower end surface of die body 200 and contacts baseplate, upper surface
It is contacted with device under test.
In order to improve the compression joint performance of compression bonding apparatus, as shown in figure 3, Fig. 3 is that this discloses the die body structure of another embodiment
Schematic diagram.Die body 300 includes pin hole 301, the first stepped hole 302, location hole 303 and connecting hole 304.
The setting of first stepped hole 302 is connected on pin hole 301, and with pin hole 301.Preferably, the first stepped hole 302
Upper end aperture be greater than 302 lower end of the first stepped hole aperture, from the upper end of first stepped hole 302 to the hole of its lower end
Diameter is gradually reduced, i.e., the section of the first stepped hole 302 is an oblique section, has a tilt angle.In this way, upper end aperture is big, under
The small structure of stomidium diameter, when same device under test connects, the crimp head of device under test easier can drop into the first ladder
In the large aperture of 302 upper end of hole, installation effectiveness is effectively improved.
Meanwhile the length of the probe on bottom plate is less than the total height of the pin hole 301 and first stepped hole 302.This
The die body 300 disclosed in embodiment is additionally provided with connecting hole 304, bolt is provided in connecting hole 304, die body 300 passes through bolt
It is connected with bottom plate.
Further, also settable guide rail in connecting hole 304, the distance between die body 300 and bottom plate are adjustable, die body
300 are moved up and down by the guide rail along the direction of pin hole 301 or probe.To the crimping in this announcement embodiment
Device can carry out crimping test to multiple product.
Specifically, as shown in figure 4, Fig. 4 be this announcement embodiment in connecting test when structural schematic diagram.Compression bonding apparatus includes
Bottom plate 400, die body 405, probe 401 and flexible circuit board 404.Wherein, pin hole 402, pin hole are additionally provided on die body 405
402 correspond with probe 401, and pin hole 402 further includes a stepped hole.Stepped hole can be well on flexible circuit board 404
Crimp head 403 is oriented to, and drops into it efficiently in pin hole 402.
There are errors when tested, due to crimping, and as shown in Figure 4, crimp head 403 fails accurately to drop into pin hole
The case where when in 402.Since the die body 405 in this announcement embodiment is flexible die body, the rigidity of crimp head 403 is much larger than die body
405 rigidity, after crimp head 403 and 405 contact closure of die body, flexible circuit board 404 is after firmly pushing, with crimp head
403 die bodys 403 being in contact will appear corresponding deformation, and deformation occurs for crimp head 403, can still crimp success, thus
Effectively crimp head 403 is protected.And under aligning accuracy same case, crimping success rate is promoted, rework rate is reduced,
Reduce production cost.
A kind of compression bonding apparatus provided by this announcement embodiment is described in detail above, the explanation of above embodiments
It is merely used to help understand the technical solution and its core concept of this announcement；Those skilled in the art should understand that: its
It is still possible to modify the technical solutions described in the foregoing embodiments, and these are modified or replaceed, and are not made corresponding
The essence of technical solution is detached from the range for the technical solution that this discloses each embodiment.
Claims (10)
1. a kind of compression bonding apparatus characterized by comprising
Bottom plate；
Die body, the die body are arranged on the bottom plate and connect with the bottom plate；
Wherein, including multiple probes on the bottom plate, include multiple pin holes on the die body, the pin hole runs through the die body,
And the material stiffness of the die body is less than the material stiffness to pressure measuring tie-in, the pin hole and the probe correspond, and work as institute
When stating compression bonding apparatus closure, the probe is inserted into the pin hole.
2. compression bonding apparatus according to claim 1, which is characterized in that the material of the die body includes flexible material.
3. compression bonding apparatus according to claim 1, which is characterized in that the upper end of the pin hole includes the first stepped hole, institute
The aperture for stating the first stepped hole is gradually reduced along the lower end of the upper end of first stepped hole to first stepped hole.
4. compression bonding apparatus according to claim 3, which is characterized in that the total height of the pin hole and first stepped hole
Greater than the length of the probe.
5. compression bonding apparatus according to claim 1, which is characterized in that the setting of the probe array on the bottom plate,
It is insulated from each other between the probe.
6. compression bonding apparatus according to claim 1, which is characterized in that the bottom plate is printed circuit board, the printing electricity
Road plate and the probe are electrically connected.
7. compression bonding apparatus according to claim 1, which is characterized in that the distance between the die body and the bottom plate are can
It adjusts, the die body is suitable for moving up and down along the probe direction.
8. compression bonding apparatus according to claim 1, which is characterized in that the die body further includes bolt, described to be bolted
The die body and the bottom plate.
9. compression bonding apparatus according to claim 1, which is characterized in that the die body further includes positioning component, the positioning
Component is to position circuit board under test.
10. compression bonding apparatus according to claim 9, which is characterized in that the positioning component includes locating slot, the positioning
The upper surface of the die body is arranged in slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910681264.0A CN110441031A (en) | 2019-07-26 | 2019-07-26 | Compression bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910681264.0A CN110441031A (en) | 2019-07-26 | 2019-07-26 | Compression bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110441031A true CN110441031A (en) | 2019-11-12 |
Family
ID=68431746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910681264.0A Pending CN110441031A (en) | 2019-07-26 | 2019-07-26 | Compression bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110441031A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114544076A (en) * | 2022-02-23 | 2022-05-27 | 中国航发沈阳发动机研究所 | Pressure measuring probe |
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|---|---|---|---|---|
| CN1815241A (en) * | 2005-02-03 | 2006-08-09 | 芽庄科技股份有限公司 | Loaded board test method |
| CN101504494A (en) * | 2009-03-04 | 2009-08-12 | 深圳市宇顺电子股份有限公司 | LCD substrates test device and method thereof |
| CN202330639U (en) * | 2011-11-30 | 2012-07-11 | 南京瀚宇彩欣科技有限责任公司 | Electric measuring fixture |
| CN206281881U (en) * | 2016-03-07 | 2017-06-27 | 威海韩力士电子有限公司 | A kind of guide tool for detecting circuit binding post break-make |
| CN206725114U (en) * | 2017-05-17 | 2017-12-08 | 付佳 | Novel thermometer fixing device |
| CN107449944A (en) * | 2017-07-29 | 2017-12-08 | 伯恩光学(惠州)有限公司 | Touch control display apparatus performance test needle mould |
| CN207965052U (en) * | 2018-01-17 | 2018-10-12 | 上海宸聪电子科技有限公司 | A kind of arrangement for testing integrated circuit |
-
2019
- 2019-07-26 CN CN201910681264.0A patent/CN110441031A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1815241A (en) * | 2005-02-03 | 2006-08-09 | 芽庄科技股份有限公司 | Loaded board test method |
| CN101504494A (en) * | 2009-03-04 | 2009-08-12 | 深圳市宇顺电子股份有限公司 | LCD substrates test device and method thereof |
| CN202330639U (en) * | 2011-11-30 | 2012-07-11 | 南京瀚宇彩欣科技有限责任公司 | Electric measuring fixture |
| CN206281881U (en) * | 2016-03-07 | 2017-06-27 | 威海韩力士电子有限公司 | A kind of guide tool for detecting circuit binding post break-make |
| CN206725114U (en) * | 2017-05-17 | 2017-12-08 | 付佳 | Novel thermometer fixing device |
| CN107449944A (en) * | 2017-07-29 | 2017-12-08 | 伯恩光学(惠州)有限公司 | Touch control display apparatus performance test needle mould |
| CN207965052U (en) * | 2018-01-17 | 2018-10-12 | 上海宸聪电子科技有限公司 | A kind of arrangement for testing integrated circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114544076A (en) * | 2022-02-23 | 2022-05-27 | 中国航发沈阳发动机研究所 | Pressure measuring probe |
| CN114544076B (en) * | 2022-02-23 | 2024-04-09 | 中国航发沈阳发动机研究所 | Pressure measurement probe |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191112 |