CN219226579U - Microstrip hairpin band-pass filter based on alumina ceramics - Google Patents
Microstrip hairpin band-pass filter based on alumina ceramics Download PDFInfo
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- CN219226579U CN219226579U CN202222568931.4U CN202222568931U CN219226579U CN 219226579 U CN219226579 U CN 219226579U CN 202222568931 U CN202222568931 U CN 202222568931U CN 219226579 U CN219226579 U CN 219226579U
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Abstract
The application discloses microstrip hairpin band-pass filter based on alumina ceramics relates to electronic components manufacturing technology field, and wherein the front of alumina ceramics base plate is printed with a plurality of hairpin type resonance units of first direction arrangement, because the dielectric base plate that alumina ceramics made has various good performances and hairpin type resonance unit compact structure, helps realizing the high performance and the miniaturization of whole band-pass filter. In addition, the alumina ceramic substrate is internally provided with a conductive through hole which is communicated with the front metal sheet and the back lower metal layer of the alumina ceramic substrate, and by using the structure, the performance of the filter can be tested by using a probe. Two nested split rings are arranged on the lower metal layer, namely the band-pass filter structure is loaded with defected ground, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
Description
Technical Field
The application relates to the field of electronic component manufacturing processes, in particular to a microstrip hairpin-type band-pass filter based on alumina ceramics.
Background
The filter is used as a key device in a wireless communication system and has the functions of filtering useful signals and suppressing interference signals. With the rapid development of communication technology, there is an increasing demand for frequency characteristics and size of filters, that is, for the filter to have as small a size as possible while ensuring excellent performance. The filter frequency characteristics with ideal performance should be that the attenuation of the in-passband signal is as small as possible, the attenuation of the in-passband signal is as large as possible, and the transition band between passband and stopband should be as steep as possible.
The conventional band-pass filter is generally divided into a planar microstrip, a strip line structure filter and a metal waveguide structure filter, and the metal waveguide structure filter has a large volume and is difficult to integrate with other microwave circuits and realize miniaturization although the metal waveguide structure filter has a high Q value, a large power capacity and small loss. Therefore, how to design a bandpass filter with small size and excellent performance is a subject to be studied.
Disclosure of Invention
An object of the present application is to provide a microstrip hairpin-type band-pass filter based on alumina ceramics, which can improve the above-mentioned problems.
Embodiments of the present application are implemented as follows:
the application provides a microstrip hairpin-line band-pass filter based on alumina ceramics, it includes:
an alumina ceramic substrate, wherein an upper metal layer is printed on the front surface of the alumina ceramic substrate, and a lower metal layer is printed on the back surface of the alumina ceramic substrate;
the upper metal layer comprises a plurality of hairpin-type resonance units, a signal input line and a signal output line;
the upper metal layer is also provided with a plurality of metal sheets, each metal sheet is provided with a conductive through hole penetrating through the alumina ceramic substrate, and the conductive through holes are communicated with the metal sheets and the lower metal layer;
the lower metal layer is provided with a first split ring and a second split ring surrounded by the first split ring, and the opening directions of the first split ring and the second split ring are different.
In an alternative embodiment of the present application, a plurality of the hairpin-type resonance units are arranged along a first direction, the signal input line is connected to a first one of the hairpin-type resonance units, and the signal output line is connected to a last one of the hairpin-type resonance units.
It can be appreciated that the application discloses a microstrip hairpin-type band-pass filter based on alumina ceramics, wherein the front surface of an alumina ceramic substrate is printed with a plurality of hairpin-type resonance units arranged in a first direction, and the dielectric substrate made of the alumina ceramics has various excellent performances and the hairpin-type resonance units are compact in structure, so that the microstrip-type band-pass filter is beneficial to achieving high performance and miniaturization of the whole band-pass filter. In addition, the alumina ceramic substrate is internally provided with a conductive through hole which is communicated with the front metal sheet and the back lower metal layer of the alumina ceramic substrate, and by using the structure, the performance of the filter can be tested by using a probe. Two nested split rings are arranged on the lower metal layer, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
In an optional embodiment of the present application, four metal sheets are disposed on the upper metal layer, the first metal sheet and the second metal sheet are respectively disposed on two sides of the signal input line, and the third metal sheet and the fourth metal sheet are respectively disposed on two sides of the signal output line.
The centers of the first metal sheet, the second metal sheet, the third metal sheet and the fourth metal sheet are respectively provided with a first through hole, a second through hole, a third through hole and a fourth through hole which penetrate through the alumina ceramic substrate; and filling or coating conductive materials in the first through hole, the second through hole, the third through hole and the fourth through hole to communicate the corresponding metal sheet and the lower metal layer, so as to form four conductive through holes.
In an optional embodiment of the present application, the upper metal layer includes n hairpin-type resonance units arranged at intervals along a first direction, n is an odd number, the hairpin-type resonance units are in a U-shape, and openings of two adjacent hairpin-type resonance units face opposite directions and are perpendicular to the first direction.
Wherein, the structure data of the ith hairpin-type resonance unit and the (n+1-i) th hairpin-type resonance unit are the same, and i is a positive integer less than (n+1)/2; the structural data of the (n+1)/2 th hairpin-type resonance unit are different from the structural data of all other hairpin-type resonance units in the sequence along the first direction.
Wherein, the resonant lengths of the first (n+1)/2 hairpin resonant units are different in sequence along the first direction.
Wherein the pitches of the ith hairpin-shaped resonance unit and the (i+1) th hairpin-shaped resonance unit are first pitches, which are ordered along the first direction; the hairpin-shaped resonant units are ordered along the first direction, and the spacing between the (n-i) th hairpin-shaped resonant unit and the (n+1-i) th hairpin-shaped resonant unit is a second spacing; the first spacing is equal to the second spacing, the first spacing is not equal to each other, and i is a positive integer less than (n+1)/2.
In an alternative embodiment of the present application, the openings of the first split ring and the second split ring are facing opposite and are both perpendicular to the first direction.
In an alternative embodiment of the present application, the shapes of the first split ring and the second split ring are the same, and the shapes of the first split ring and the second split ring are split circular rings or split square rings.
It can be understood that two nested split rings are arranged on the lower metal layer, namely, the band-pass filter structure is loaded with defected ground, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
The beneficial effects are that:
the application discloses microstrip hairpin band-pass filter based on alumina ceramics, wherein the front of alumina ceramics base plate has printed a plurality of hairpin type resonance units of first direction arrangement, because the dielectric substrate that alumina ceramics made has various good performances and hairpin type resonance unit compact structure, helps realizing the high performance and the miniaturization of whole band-pass filter. In addition, the alumina ceramic substrate is internally provided with a conductive through hole which is communicated with the front metal sheet and the back lower metal layer of the alumina ceramic substrate, and by using the structure, the performance of the filter can be tested by using a probe. Two nested split rings are arranged on the lower metal layer, namely the band-pass filter structure is loaded with defected ground, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a microstrip hairpin-type band-pass filter based on alumina ceramics provided in the present application;
FIG. 2 is a schematic rear view of the alumina ceramic substrate of FIG. 1;
FIG. 3 is a graph of S parameter versus frequency for a bandpass filter structure simulation loaded with a defected ground;
fig. 4 is a graph of simulated S-parameters versus frequency for a bandpass filter structure without loading defects.
Reference numerals:
the alumina ceramic substrate 10, the front surface 11, the back surface 12, the signal input line 21, the signal output line 22, the 1 st hairpin resonator element 31, the 2 nd hairpin resonator element 32, the 3 rd hairpin resonator element 33, the 4 th hairpin resonator element 34, the 5 th hairpin resonator element 35, the 6 th hairpin resonator element 36, the 7 th hairpin resonator element 37, the first split ring 41, the second split ring 42, the first metal piece 51, the second metal piece 52, the third metal piece 53, the fourth metal piece 54, the first through hole 61, the second through hole 62, the third through hole 63, and the fourth through hole 64.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
As shown in fig. 1 and 2, the present application provides a microstrip hairpin-type band-pass filter based on alumina ceramics, which includes:
an alumina ceramic substrate 10, wherein the front surface 11 of the alumina ceramic substrate 10 is printed with an upper metal layer, and the back surface 12 of the alumina ceramic substrate 10 is printed with a lower metal layer; wherein the lower metal layer may be a metal silver layer;
the upper metal layer includes a plurality of hairpin resonance units 31-37, a signal input line 21, and a signal output line 22;
the upper metal layer is also provided with a plurality of metal sheets 51-54, wherein the metal sheets can be metal silver sheets, each metal sheet is provided with a conductive through hole 61-64 penetrating through the alumina ceramic substrate 10, and the conductive through holes are communicated with the metal sheets and the lower metal layer;
the lower metal layer is provided with a first split ring 41 and a second split ring 42 surrounded by the first split ring 41, and the first split ring 41 and the second split ring 42 have different opening orientations.
The alumina ceramic is used as a material with the widest application in advanced ceramics, and a dielectric substrate made of the alumina ceramic has excellent electrical insulation property, high insulation resistance and dielectric breakdown voltage, low thermal resistance, high heat conduction property, small dielectric loss, excellent soldering property and high adhesion strength, can etch various patterns like a printed circuit board (Printed Circuit Board, PCB), has great current carrying capacity, and is pollution-free and pollution-free, so the alumina ceramic is dominant in the fields of microelectronics, power electronics, hybrid microelectronics, power modules and the like and is widely applied.
In an alternative embodiment of the present application, a plurality of hairpin-type resonance units are arranged in a first direction (X direction in the drawing), the signal input line 21 is connected to the first hairpin-type resonance unit 31, and the signal output line 22 is connected to the last hairpin-type resonance unit 37.
It can be appreciated that the present application discloses a microstrip hairpin-type band pass filter based on alumina ceramic, in which a plurality of hairpin-type resonance units 31-37 are arranged in a first direction printed on a front surface 11 of an alumina ceramic substrate 10, and the dielectric substrate made of alumina ceramic has various excellent properties and the hairpin-type resonance units are compact in structure, which contributes to achieving high performance and miniaturization of the overall band pass filter. In addition, conductive through holes communicating the metal sheet on the front surface 11 and the lower metal layer on the back surface 12 of the alumina ceramic substrate 10 are also provided in the alumina ceramic substrate 10, and the performance of the filter of the present application can be tested with a probe using this structure. Two nested split rings are arranged on the lower metal layer, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
In an alternative embodiment of the present application, as shown in fig. 1, four metal sheets are disposed on the upper metal layer, the first metal sheet 51 and the second metal sheet 52 are disposed on two sides of the signal input line 21, and the third metal sheet 53 and the fourth metal sheet 54 are disposed on two sides of the signal output line 22.
Wherein, a first through hole 61, a second through hole 62, a third through hole 63 and a fourth through hole 64 penetrating the alumina ceramic substrate 10 are respectively formed at the centers of the first metal sheet 51, the second metal sheet 52, the third metal sheet 53 and the fourth metal sheet 54; the first through hole 61, the second through hole 62, the third through hole 63 and the fourth through hole 64 are filled or coated with conductive materials to communicate with the corresponding metal sheets and the lower metal layer, so that four conductive through holes are formed.
In an alternative embodiment of the present application, the upper metal layer includes n hairpin-type resonant units arranged at intervals along the first direction, n is an odd number, the hairpin-type resonant units are in a U-shape, and the openings of two adjacent hairpin-type resonant units face opposite directions and are perpendicular to the first direction.
For example, as shown in fig. 1, 7 hairpin-type resonance units are arranged at intervals along the first direction, and the openings of any two adjacent hairpin-type resonance units are opposite in orientation.
In an alternative embodiment of the present application, the structure data of the ith hairpin-type resonance unit and the (n+1-i) th hairpin-type resonance unit are the same, and i is a positive integer less than (n+1)/2, and are ordered along the first direction; the structural data of the (n+1)/2 th hairpin resonance unit is different from the structural data of all other hairpin resonance units in the first direction.
As shown in fig. 1, for example, 7 hairpin-type resonance units arranged at intervals along the first direction,
the structure data of the 1 st hairpin resonance unit 31 and the 7 th hairpin resonance unit 37 are the same,
the structural data of the 2 nd and 6 th hairpin resonance units 32 and 36 are identical,
the 3 rd hairpin resonance unit 33 and the 5 th hairpin resonance unit 35 have the same structural data,
the structural data of the 4 th hairpin resonator element 34 and the other 6 hairpin resonator elements are different.
In an alternative embodiment of the present application, the resonant lengths of the first (n+1)/2 hairpin resonant cells are all different, ordered along the first direction.
For example, as shown in fig. 1, 7 hairpin-type resonance units are arranged at intervals along the first direction, and the resonance lengths of the 1 st hairpin-type resonance unit 31, the 2 nd hairpin-type resonance unit 32, the 3 rd hairpin-type resonance unit 33, and the 4 th hairpin-type resonance unit 34 are all different.
In an alternative embodiment of the present application, the pitches of the ith hairpin-type resonance unit and the (i+1) th hairpin-type resonance unit are the first pitches, ordered along the first direction; the (n-i) th hairpin resonance unit and the (n+1-i) th hairpin resonance unit are ordered along the first direction, and the interval between the (n+1-i) th hairpin resonance unit and the (n+1-i) th hairpin resonance unit is a second interval; the first pitches are equal to the second pitches, the respective first pitches are not equal to each other, and i is a positive integer smaller than (n+1)/2.
As shown in fig. 1, for example, 7 hairpin-type resonance units arranged at intervals along the first direction,
when the pitches of the 1 st hairpin resonator element 31 and the 2 nd hairpin resonator element 32 are the first pitches, the pitches of the 7 th hairpin resonator element 37 and the 6 th hairpin resonator element 36 corresponding thereto are the second pitches, and at this time, the first pitches are equal to the second pitches;
when the pitches of the 2 nd and 3 rd hairpin resonance units 32 and 33 are the first pitches, the pitches of the 6 th and 5 th hairpin resonance units 36 and 35 are the second pitches, and at this time, the first pitches are equal to the second pitches;
when the pitches of the 3 rd and 4 th hairpin resonator units 33 and 34 are the first pitches, the pitches of the corresponding 5 th and 4 th hairpin resonator units 35 and 34 are the second pitches, and at this time, the first pitches are equal to the second pitches.
In an alternative embodiment of the present application, the openings of the first split ring 41 and the second split ring 42 are facing opposite and are both perpendicular to the first direction.
In an alternative embodiment of the present application, the first split ring 41 and the second split ring 42 have the same shape, and the first split ring 41 and the second split ring 42 have the shape of a split ring or a split square ring.
It can be understood that two nested split rings are arranged on the lower metal layer, namely, the band-pass filter structure is loaded with defected ground, so that the distributed capacitance and the distributed inductance between the hairpin-type resonance unit and the ground can be changed, and the performance of the filter is improved.
As shown in a graph of a change of S parameter along with frequency, in a frequency band ranging from 24.1GHz to 27.9GHz, the return loss is smaller than-17 dB, the loss in a passband is smaller than 1.8dB, the out-of-band rejection reaches-46 dB at 20.60GHz, and the out-of-band rejection reaches-41 dB at 30.40 GHz.
As shown in the graph of the change of S parameter along with frequency of the band-pass filter structure simulation without loading the defected ground, the return loss is only less than-15 dB in the frequency band of 24.1GHz-27.9GHz, the loss in the passband is less than 1.8dB, the out-of-band rejection reaches-46 dB at 20.60GHz, and the out-of-band rejection reaches-41 dB at 30.40 GHz.
By comparing fig. 3 and fig. 4, it can be found that the performance of the filter can be improved when two nested split rings are formed on the lower metal layer and the size of the split rings is adjusted to a proper size.
The terms "first," "second," "the first," or "the second," as used in various embodiments of the present disclosure, may modify various components without regard to order and/or importance, but these terms do not limit the corresponding components. The above description is only configured for the purpose of distinguishing an element from other elements. For example, the first user device and the second user device represent different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure.
When an element (e.g., a first element) is referred to as being "coupled" (operatively or communicatively) to "another element (e.g., a second element) or" connected "to another element (e.g., a second element), it is understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). In contrast, it will be understood that when an element (e.g., a first element) is referred to as being "directly connected" or "directly coupled" to another element (a second element), then no element (e.g., a third element) is interposed therebetween.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the element defined by the phrase "comprising one … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element, and furthermore, elements having the same name in different embodiments of the present application may have the same meaning or may have different meanings, a particular meaning of which is to be determined by its interpretation in this particular embodiment or by further combining the context of this particular embodiment.
The above description is only illustrative of the principles of the technology being applied to alternative embodiments of the present application. It will be appreciated by persons skilled in the art that the scope of the utility model referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the utility model. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A microstrip hairpin-type bandpass filter based on alumina ceramic, comprising:
an alumina ceramic substrate, wherein an upper metal layer is printed on the front surface of the alumina ceramic substrate, and a lower metal layer is printed on the back surface of the alumina ceramic substrate;
the upper metal layer comprises a plurality of hairpin-type resonance units, a signal input line and a signal output line;
the upper metal layer is also provided with a plurality of metal sheets, each metal sheet is provided with a conductive through hole penetrating through the alumina ceramic substrate, and the conductive through holes are communicated with the metal sheets and the lower metal layer;
the lower metal layer is provided with a first split ring and a second split ring surrounded by the first split ring, and the opening directions of the first split ring and the second split ring are different.
2. The alumina ceramic based microstrip hairpin bandpass filter of claim 1 wherein,
the plurality of hairpin-type resonance units are arranged along a first direction, the signal input line is connected with a first hairpin-type resonance unit, and the signal output line is connected with a last hairpin-type resonance unit.
3. The alumina ceramic based microstrip hairpin bandpass filter of claim 2 wherein,
four metal sheets are arranged on the upper metal layer, the first metal sheet and the second metal sheet are respectively arranged on two sides of the signal input line, and the third metal sheet and the fourth metal sheet are respectively arranged on two sides of the signal output line.
4. A microstrip hairpin bandpass filter based on alumina ceramic according to claim 3 wherein,
the centers of the first metal sheet, the second metal sheet, the third metal sheet and the fourth metal sheet are respectively provided with a first through hole, a second through hole, a third through hole and a fourth through hole which penetrate through the alumina ceramic substrate;
and filling or coating conductive materials in the first through hole, the second through hole, the third through hole and the fourth through hole to communicate the corresponding metal sheet and the lower metal layer, so as to form four conductive through holes.
5. The alumina ceramic based microstrip hairpin bandpass filter of claim 2 wherein,
the upper metal layer comprises n hairpin-shaped resonant units which are arranged at intervals along a first direction, n is an odd number,
the hairpin-type resonance units are U-shaped, and openings of two adjacent hairpin-type resonance units face opposite directions and are perpendicular to the first direction.
6. The alumina ceramic based microstrip hairpin bandpass filter of claim 5 wherein,
the structure data of the ith hairpin-type resonance unit and the (n+1-i) th hairpin-type resonance unit are the same, and i is a positive integer less than (n+1)/2;
the structural data of the (n+1)/2 th hairpin-type resonance unit are different from the structural data of all other hairpin-type resonance units in the sequence along the first direction.
7. The alumina ceramic based microstrip hairpin bandpass filter of claim 5 wherein,
the resonant lengths of the first (n+1)/2 hairpin resonant units are different from each other in the first direction.
8. The alumina ceramic based microstrip hairpin bandpass filter of claim 5 wherein,
the separation distance between the ith hairpin-shaped resonance unit and the (i+1) th hairpin-shaped resonance unit is a first separation distance, and the hairpin-shaped resonance units are ordered along the first direction;
the hairpin-shaped resonant units are ordered along the first direction, and the spacing between the (n-i) th hairpin-shaped resonant unit and the (n+1-i) th hairpin-shaped resonant unit is a second spacing;
the first spacing is equal to the second spacing, the first spacing is not equal to each other, and i is a positive integer less than (n+1)/2.
9. The alumina ceramic based microstrip hairpin bandpass filter of claim 2 wherein,
the openings of the first split ring and the second split ring are opposite in orientation and are perpendicular to the first direction.
10. The alumina ceramic based microstrip hairpin bandpass filter of claim 9 wherein,
the first split ring and the second split ring are identical in shape, and the first split ring and the second split ring are split rings or split square rings.
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